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KVR24N17S8K2/16 16GB DDR4 Memory Kit

This document provides specifications for the KVR24N17S8K2/16 16GB memory module kit. The kit contains two 8GB DDR4-2400 memory modules with a CL of 17. Each module has 8GB of memory using 64-bit components. The modules operate at 1.2V and have features like on-die termination and low power auto self refresh. Dimensions and timing specifications are provided.

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Juan David Gutierrez Jimenez
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7 views2 pages

KVR24N17S8K2/16 16GB DDR4 Memory Kit

This document provides specifications for the KVR24N17S8K2/16 16GB memory module kit. The kit contains two 8GB DDR4-2400 memory modules with a CL of 17. Each module has 8GB of memory using 64-bit components. The modules operate at 1.2V and have features like on-die termination and low power auto self refresh. Dimensions and timing specifications are provided.

Uploaded by

Juan David Gutierrez Jimenez
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Memory Module Specifications

KVR24N17S8K2/16
16GB (8GB 1Rx8 1G x 64-Bit x 2pcs.) PC4-2400
CL17 288-Pin DIMM Kit

DESCRIPTION SPECIFICATIONS
ValueRAM's KVR24N17S8K2/16 is a kit of two 1G x 64-bit (8GB) CL(IDD) 17 cycles
DDR4-2400 CL17 SDRAM (Synchronous DRAM), 1Rx8, memory Row Cycle Time (tRCmin) 45.75ns(min.)
module, based on eight 1G x 8-bit FBGA components per module. 350ns(min.)
Refresh to Active/Refresh
Total kit capacity is 16GB. The SPD is programmed to JEDEC Command Time (tRFCmin)
standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin
Row Active Time (tRASmin) 32ns(min.)
DIMM uses gold contact fingers. The electrical and mechanical
Maximum Operating Power TBD W*
specifications are as follows:
UL Rating 94 V - 0
Operating Temperature 0o C to +85o C
FEATURES Storage Temperature -55o C to +100o C
• Power Supply: VDD=1.2V Typical
*Power will vary depending on the SDRAM used.
• VDDQ = 1.2V Typical

• VPP - 2.5V Typical

• VDDSPD=2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for


data, strobe, and mask signals

• Low-power auto self refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM

• 16 internal banks; 4 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8


via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• PCB: Height 1.23” (31.25mm)

• RoHS Compliant and Halogen-Free

Continued >>

[Link] Document No. VALUERAM1594-001.A00 03/09/17 Page 1


continued HyperX

MODULE DIMENSIONS

Front

Back

All measurements are in millimeters.


(Tolerances on all dimensions are ±0.12 unless otherwise specified)

133.35

129.55

2.10±
±0.15
31.25

3.00
11.00
14.60
17.60
2.70±0.15

8.00

Pin 1

3.35
64.60 56.10
28.90 22.95

[Link] Document No. VALUERAM1594-001.A00 Page 2

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