MT09 501 MICRO FABRICATION
PROCESS
Teaching scheme
Credits: 4
3 hours lecture and 1 hour
tutorial per week
• To impart the knowledge in micro machining techniques
Module I (13
hours)
Introduction to Micro System design, Material properties, micro
fabrication Technologies.
Structural behavior, sensing methods, micro scale transport – feed back
systems. Micromechanics: Microstructure of materials, its connection to
molecular structure and its consequences on macroscopic properties –
Phase transformations in crystalline solids including marten site,
ferroelectric, and diffusional phase transformations, twinning and
domain patterns, smart materials.
Modul
e II (14
hours)
Micro-fabrication: Bulk processes – surface processes – sacrificial
processes and Bonding processes – special machining: Laser beam
micro machining- Electrical Discharge Machining
– Ultrasonic Machining- Electro chemical Machining. Electron beam
machining. Clean room-
yield model – Wafer IC manufacturing – PSM – IC industry-New Materials-
Bonding and layer transfer devices.
Module III (13 hours)
Mechanical micromachining: Theory of micromachining-Chip formation-size
effect in
micromachining-microturning, micromilling, microdrilling- Micromachining
tool design. Precision Grinding-Partial ductile mode grinding- Ultraprecision
grinding- Binderless wheel – Free form optics.
Module IV (14 hours)
Micro electro mechanical system fabrication: Introduction – Advance in Micro
electronics –
characteristics and Principles of MEMS – Design and application of
MEMS: Automobile, defence, healthcare, Aerospace, industrial
properties etc., - Materials for MEMS – MEMS fabrication- Bulk Micro
Machining-LIGA – Microsystems packaging- Future of MEMS.
Text Book
1. Madore J, “fundamental of Micro fabrication”, CRC Press, 2002.
Reference Books
1. Sámi Franssila, “Introduction to Micro Fabrication”, John Wiley and
sons Ltd., UK,
2004.
2. Mark J. Jackson, “Micro fabrication and Nanomanufacturing”, CRC Press,
2006.
3. Peter Van Zant, “Microchip fabrication”, McGraw Hill, 2004.
4. Mohamed Gad-el-Hak, “The MEMS Handbook”, CRC Press, 2006.
Internal Continuous Assessment (Maximum Marks-30)
60% - Tests (minimum 2)
30% - Assignments (minimum 2) such as home work, problem solving, group
discussions,
quiz, literature survey, seminar, term-project, software exercises, etc.
10% - Attendance and Regularity in the class