SN74ALS166

PARALLEL-LOAD 8-BIT SHIFT REGISTER

SDAS156D – APRIL 1982 – REVISED AUGUST 2000

D Synchronous Load D, DB, OR N PACKAGE

D Direct Overriding Clear

(TOP VIEW)

D Parallel-to-Serial Conversion SER 1 16 VCC

D Package Options Include Plastic A 2 15 SH/LD
Small-Outline (D) and Shrink Small-Outline B 3 14 H
(DB) Packages and Standard Plastic (N) DIP C 4 13 QH
D 5 12 G
description CLK INH 6 11 F
CLK 7 10 E
The SN74ALS166 parallel-load 8-bit shift register
GND 8 9 CLR
is compatible with most other TTL logic families.
All inputs are buffered to lower the drive
requirements. Input clamping diodes minimize
switching transients and simplify system design.
These parallel-in or serial-in, serial-out registers have a complexity of 77 equivalent gates on the chip. They
feature gated clocks (CLK and CLK INH) inputs and an overriding clear (CLR) input. The parallel-in or serial-in
modes are established by the shift/load (SH/LD) input. When high, SH/LD enables the serial data (SER) input
and couples the eight flip-flops for serial shifting with each clock pulse. When low, the parallel (broadside) data
(A–H) inputs are enabled and synchronous loading occurs on the next clock pulse. During parallel loading, serial
data flow is inhibited. Clocking is accomplished on the low-to-high-level edge of the clock pulse through a
two-input positive-NOR gate, permitting one input to be used as a clock-enable or clock-inhibit function. Holding
either of the clock inputs high inhibits clocking; holding either low enables the other clock input. This allows the
system clock to be free running and the register can be stopped on command with the clock input. CLK INH
should be changed to the high level only when CLK is high. The buffered CLR overrides all other inputs, including
CLK, and sets all flip-flops to zero.
The SN74ALS166 is characterized for operation from 0°C to 70°C.

FUNCTION TABLE
INPUTS INTERNAL
OUTPUT
PARALLEL OUTPUTS
CLR SH/LD CLK INH CLK SER QH
A...H QA QB
L X X X X X L L L
H X L L X X QA0 QB0 QH0
H L L ↑ X a...h a b h
H H L ↑ H X H QAn QGn
H H L ↑ L X L QAn QGn
H X H ↑ X X QA0 QB0 QH0

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Copyright  2000, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

SN74ALS166
PARALLEL-LOAD 8-BIT SHIFT REGISTER
SDAS156D – APRIL 1982 – REVISED AUGUST 2000

logic symbol†
9 SRG8
CLR R
15
SH/LD M1 [Shift]
M2 [Load]
6
CLK INH ≥1
7 C3/1
CLK

1
SER 1, 3D
2
A 2, 3D
3
B 2, 3D
4
C
5
D
10
E
11
F
12
G
14 13
H QH

† This symbol is in accordance with ANSI/IEEE Standard 91-1984 and IEC Publication 617-12.

logic diagram (positive logic)

SER A B C D E F G H

1 2 3 4 5 10 11 12 14
15
SH/LD

9
CLR
R R R R R R R R
1A 1A 1A 1A 1A 1A 1A 1A 13
C1 C1 C1 C1 C1 C1 C1 C1 QH
7 1S 1S 1S 1S 1S 1S 1S 1S
CLK
CLK INH 6

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 SN74ALS166
PARALLEL-LOAD 8-BIT SHIFT REGISTER
SDAS156D – APRIL 1982 – REVISED AUGUST 2000

typical clear, shift, load, inhibit, and shift sequences

CLK

CLK INH

CLR

SER

SH/LD

A H

B L

C H

D L
Parallel
Inputs E H

F L

G H

H H

QH H H L H L H L H
Inhibit
Serial Shift Serial Shift
Clear Load

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Package thermal impedance, θJA (see Note 1): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions

MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
IOH High-level output current –0.4 mA
IOL Low-level output current 8 mA
TA Operating free-air temperature 0 70 °C

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

SN74ALS166
PARALLEL-LOAD 8-BIT SHIFT REGISTER
SDAS156D – APRIL 1982 – REVISED AUGUST 2000

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
VIK VCC = 4.5 V, II = –18 mA –1.5 V
VOH VCC = 4.5 V to 5.5 V, IOH = –0.4 mA VCC–2 V
IOL = 4 mA 0.25 0.4
VOL VCC = 4
4.5
5V V
IOL = 8 mA 0.35 0.5
II VCC = 5.5 V, VI = 7 V 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 µA
IIL VCC = 5.5 V, VI = 0.4 V –0.1 mA
IO‡ VCC = 5.5 V, VO = 2.25 V –30 –112 mA
ICC VCC = 5.5 V, See Note 2 14 24 mA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS.
NOTE 2: With 4.5 V applied to SER and all other inputs, except the clock, grounded, ICC is measured after a clock transition from 0 V to 4.5 V.

timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
MIN MAX UNIT
fclock Clock frequency 45 MHz
CLR low 9
tw Pulse duration CLK high 10 ns
CLK low 10
SH/LD 16
tsu ↑
Setup time before CLK↑ Data 7 ns
CLR inactive 11
th Hold time, data after CLK↑ 3 ns

switching characteristics over recommended operating conditions (unless otherwise noted)

(see Figure 1)
FROM TO
PARAMETER MIN TYP† MAX UNIT
(INPUT) (OUTPUT)
fmax 45 MHz
tPHL CLR QH 4 9 14 ns
tPLH 2 7 12
CLK QH ns
tPHL 2 9 13
† All typical values are at VCC = 5 V, TA = 25°C.

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 SN74ALS166
PARALLEL-LOAD 8-BIT SHIFT REGISTER
SDAS156D – APRIL 1982 – REVISED AUGUST 2000

PARAMETER MEASUREMENT INFORMATION

Test
Point
TEST TABLE FOR SYNCHRONOUS INPUTS
From Output
Under Test DATA INPUT OUTPUT TESTED
SH/LD
FOR TEST (see Note B)
CL = 50 pF H 0V QH at tn + 1
RL = 500 Ω
(see Note A) Serial input QH at tn + 1
4.5 V

LOAD CIRCUIT FOR OUTPUT UNDER TEST

tw(clear)
3.5 V
CLR
1.3 V 1.3 V
(see Note C)
0.3 V
tn + 1 (see Note D) tn + 1
tn tn 3.5 V
CLK
1.3 V 1.3 V 1.3 V 1.3 V
(see Note E)
0.3 V
tw(CLK) tsu th tsu th

3.5
Data Input
1.3 V 1.3 V 1.3 V 1.3 V
(see Test Table)
0.3 V
tPHL tPLH tPHL
VOH
Output QH
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Propagation delay times (tPLH and tPHL) are measured at tn+1. Proper shifting of data is verified at tn+8 with a functional test.
C. A clear pulse is applied prior to each test.
D. tn = bit time before clocking transition, tn+1 = bit time after one clocking transition, and tn+8 = bit time after eight clocking transitions.
E. The clock pulse has the following characteristics: tw(clock) ≤ 20 ns and PRR = 1 MHz. The clear pulse has the following
characteristics: tw(clear) ≤ 20 ns.
F. All pulse generators have the following characteristics: ZO ≈ 50 Ω; tr = tf = 2 ns. Duty cycle = 50% when testing fmax.

Figure 1. Load Circuit and Voltage Waveforms

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
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reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
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representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications
Amplifiers [Link] Audio [Link]/audio
Data Converters [Link] Automotive [Link]/automotive
DSP [Link] Broadband [Link]/broadband
Interface [Link] Digital Control [Link]/digitalcontrol
Logic [Link] Military [Link]/military
Power Mgmt [Link] Optical Networking [Link]/opticalnetwork
Microcontrollers [Link] Security [Link]/security
Low Power [Link]/lpw Telephony [Link]/telephony
Wireless
Video & Imaging [Link]/video
Wireless [Link]/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
 PACKAGE OPTION ADDENDUM
[Link] 18-Sep-2008

PACKAGING INFORMATION

Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
SN74ALS166D ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DBR ACTIVE SSOP DB 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DE4 ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DG4 ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DR ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166N ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
SN74ALS166NE4 ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
SN74ALS166NSR ACTIVE SO NS 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74ALS166NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
[Link] for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

Addendum-Page 1
 PACKAGE OPTION ADDENDUM
[Link] 18-Sep-2008

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION
[Link] 19-Mar-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 (mm) B0 (mm) K0 (mm) P1 W Pin1
Type Drawing Diameter Width (mm) (mm) Quadrant
(mm) W1 (mm)
SN74ALS166DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74ALS166DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74ALS166NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION
[Link] 19-Mar-2008

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ALS166DBR SSOP DB 16 2000 346.0 346.0 33.0
SN74ALS166DR SOIC D 16 2500 333.2 345.9 28.6
SN74ALS166NSR SO NS 16 2000 346.0 346.0 33.0

Pack Materials-Page 2
 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers [Link] Audio [Link]/audio
Data Converters [Link] Automotive [Link]/automotive
DLP® Products [Link] Broadband [Link]/broadband
DSP [Link] Digital Control [Link]/digitalcontrol
Clocks and Timers [Link]/clocks Medical [Link]/medical
Interface [Link] Military [Link]/military
Logic [Link] Optical Networking [Link]/opticalnetwork
Power Mgmt [Link] Security [Link]/security
Microcontrollers [Link] Telephony [Link]/telephony
RFID [Link] Video & Imaging [Link]/video
RF/IF and ZigBee® Solutions [Link]/lprf Wireless [Link]/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated