RDA5850

BLUETOOTH SINGLE CHIP SOLUTION WITH MULTI-MEDIA

Rev.2.1

General Description

RDA5850 is a highly integrated single-chip turnkey Bluetooth radio transceiver and baseband processor
with multi-media capability. Bluetooth feature is compliant with Bluetooth 2.1 + EDR specification and
provides an optimal solution for data and music application.

1.1 Multi-media Feature

z External SPI Flash interface z Voice record

z Multi-media Support z Bluetooth profiles
♦ SBC ♦ HFP/HSP
♦ MP3 ♦ OPP
♦ WMA ♦ A2DP
♦ WAV ♦ AVRCP
z Stereo audio line input
z Supports Serial LCD interface/ LEDs
z Power management
1.2 Bluetooth Feature
♦ Power on reset control
z CMOS single-chip fully-integrated radio and
♦ Integrated Battery charger
baseband
♦ Integrated all internal voltage supply
z Compliant with Bluetooth 2.1 + EDR
from VBAT
specification
z Audio
z Bluetooth Piconet and Scatternet support
♦ Integrated 1W audio speaker driver
z Meet class2 and class3 transmitting power
z User Interface
requirement
♦ supports 3x3 keypad matrix detection
z Provides +7dbm transmitting power
♦ Real-time clock
z NZIF receiver with -80dBm sensitivity
♦ I2C
z Support DCXO with internal oscillator circuit
z FM Receiver Integrated
z Low power consumption
z MMC/SD support
z USB1.2 device only
z IR decode
z ECHO cancel for hands-free

Copyright © RDA Microelectronics Inc. 2012. All rights are reserved.

The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

2 Table of Contents
General Description ......................................................................................................................................... 1 
1.1  Multi-media Feature .......................................................................................................................... 1 
1.2  Bluetooth Feature ............................................................................................................................... 1 
2  Table of Contents ..................................................................................................................................... 2 
3  Multi-Media SOC Features ..................................................................................................................... 3 
3.1  Analog Module ................................................................................................................................... 3 
3.2  PMU .................................................................................................................................................... 3 
3.3  FM Tuner ............................................................................................................................................ 3 
3.4  System CPU (XCPU) ......................................................................................................................... 4 
3.5  Keypad ................................................................................................................................................ 4 
3.6  SD/MMC Card Controller ................................................................................................................ 4 
3.7  IR Controller ...................................................................................................................................... 4 
3.8  LCD Controller .................................................................................................................................. 4 
4  Bluetooth Section Features ................................................................................................................... 5 
4.1  Radio ................................................................................................................................................... 5 
4.2  Bluetooth Stack .................................................................................................................................. 5 
5  Electrical Characteristics ....................................................................................................................... 6 
6  Bluetooth Section Radio Characteristics .......................................................................................... 7 
7  Pins Description ..................................................................................................................................... 10 
8  Change List .............................................................................................................................................. 15 

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

3 Multi-Media SOC Features

Integrating all essential electronic components, including power management, FM receiver onto a single
system on chip, RDA5850 offers best in class bill of material, space requirement and cost/feature ratio for
complete Bluetooth enabled multi-media system.
Built around a cost effective 32-bit XCPU RISC core running at up to 312MHz with 4k of Instruction cache
and 4k of Data cache, RDA5850 offers plenty of processing power for multimedia applications. A high
performance proprietary 16/32-bit digital signal processing engine can further improve overall
performance and user experience when performing complex multimedia tasks.
It is also packed with impressive connectivity for easy scalability of the system, including SDMMC
Memory Cards, Serial LCD and USB (slave, full speed).

3.1 Analog Module

z Differential 13 bit Audio ADC and 16 bit stereo DAC

z 1W stereo loudspeaker amplifier
z Audio line in
z Full Speed USB PHY 1.1

3.2 PMU

z Complete integrated power management system

z Integrated LDO voltage regulators
z Implement both LCD back light and keypad LED drivers

3.3 FM Tuner

z Support worldwide frequency band 65-108MHz

z Digital low-IF tuner
z Fully integrated digital frequency synthesizer
z Autonomous search tuning
z Digital auto gain control (AGC)
z Digital adaptive noise cancellation
z Programmable de-emphasis (50/75 ms)
z Receive signal strength indicator (RSSI)
z Bass boost
z Volume control
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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

3.4 System CPU (XCPU)

z RDA RISC Core

♦ 32x32 bits Multiplier Accumulator (MAC)
♦ 16/32 bit instruction set
z 4 kByte Instruction Cache
z 4 kByte Data Cache

3.5 Keypad

z 3x3 matrix support with de-bouncing and interrupt generation

z Key On input with de-bouncing and interrupt generation

3.6 SD/MMC Card Controller

z SD Card specification Version 2.0

z SDIO Version 1.10
z MMC specification Version 3.1

3.7 IR Controller

z Support NEC protocol

z User code and key code programmable

3.8 LCD Controller

z SPI interface for LCM

z Max size 128x64

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

4 Bluetooth Section Features

4.1 Radio

♦ Build-in TX/RX switch

♦ Fully integrated synthesizer without any external component
♦ Class2 and class3 transmit output power supported and over 30dB dynamic control range
♦ Supports π/4 DQPSK and 8DPSK modulation
♦ High performance in receiver sensitivity and over 80dB dynamic range
♦ Integrated channel filter
♦ Support eSCO and AFH
♦ Support up to Bluetooth v2.1 + EDR

4.2 Bluetooth Stack

♦ Compliant with Bluetooth 2.1 + EDR specification

♦ Profile included AVRCP, A2DP, OPP, HSP/HFP

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part without prior written permission of RDA. Page 5 of 15
RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

5 Electrical Characteristics
Table 5-1 DC Electrical Specification (Recommended Operation Conditions):
SYMBOL DESCRIPTION MIN TYP MAX UNIT
Tamb Ambient Temperature -20 27 +50 ℃
VIL CMOS Low Level Input Voltage 0 0.3*VIO V
VIH CMOS High Level Input Voltage 0.7*VIO VIO V
VTH CMOS Threshold Voltage 0.5*VIO V
Notes: 1. VIO=1.8~3.3V

Table 5-2 DC Electrical Specification (Absolute Maximum Ratings):

SYMBOL DESCRIPTION MIN TYP MAX UNIT
Tamb Ambient Temperature -20 +50 °C
IIN Input Current -10 +10 mA
VIN Input Voltage -0.3 VIO+0.3 V
Vlna LNA Input Level +5 dBm
DC Charger 5 7 V
Notes: 1. VIO=1.8~3.3V

Table 5-3 DC Electrical Specification (Power Supply):

SYMBOL DESCRIPTION MIN TYP MAX UNIT
VBAT 3.8 4.2 V
VCORE 1.2 1.4 V
V_BUCK_2V4 2.4 V
ADD_2V4 2.4 V
V_BOOST_4V3 4.3 V
V_RTC 1.2 V
V_USB 3.3 V
V_PAD, 2.8 3.0 V
V_SPIMEM,
V_LCD,
V_MMC
Notes: 1. VIO=1.8~3.3V

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

6 Bluetooth Section Radio Characteristics

Table 6-1 Receiver Characteristics ------ Basic Data Rate
(VBAT = 4.0 V, TA = 27°C, unless otherwise specified)

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT

General specifications
Sensitivity @0.1% BER / -80 / dBm
Maximum received signal@0.1% BER 0 / / dBm
C/I c-channel / +10 / dB
F=F0 + 1MHz / / -5 dB
F=F0 - 1MHz / / 0 dB
F=F0 + 2MHz / / -33 dB
Adjacent channel selectivity C/I
F=F0 - 2MHz / / -30 dB

F=F0 + 3 MHz / / -45 dB

F=F0 - 3MHz / / -40 dB

Adjacent channel selectivity C/I F=Fimage / / 0 dB
30MHz–2000MHz -10 / / dBm
2000MHz–2400MHz -27 / / dBm
Out-of-band blocking performance
2500MHz–3000MHz -27 / / dBm
3000MHz–12.5GHz -10 / / dBm
Intermodulation -35 / / dBm
Spurious output level -150 / / dBm/Hz

Notes:

Table 6-2 Transmit Characteristics ------ Basic Data Rate

(VBAT = 4.0V, TA = 27 °C, unless otherwise specified)

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT

General specifications
Maximum RF transmit power / +4 7 dBm
RF power control range 25 / / dB

20dB band width / 0.9 / MHz

F=F0 + 1MHz / -20 / dBm
F=F0 - 1MHz / -20 / dBm
F=F0 + 2MHz / -35 / dBm
Adjacent channel transmit power F=F0 - 2MHz / -35 / dBm
F=F0 + 3MHz / -40 / dBm
F=F0 - 3MHz / -40 / dBm
F=F0 + >3MHz / / -46 dBm

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

F=F0 - >3MHz -46 / / dBm

△f1avg Maximum modulation / 164 / kHz
△f2max Minimum modulation / 145 / kHz
△f2avg/△f1avg 0.80 / / /
ICFT / +4 / kHz
Drift rate / 0.1 / kHz/50us

Drift (1 slot packet) / -2 / kHz

Drift (5 slot packet) / -2 / kHz

Notes:

Table 6-3 Receiver Characteristics ------ Enhanced Data Rate

(VBAT = 4.0 V, TA = 27°C, unless otherwise specified)

PARAMETER CONDITIONS MIN TYP MAX UNIT

π/4 DQPSK
Sensitivity @0.01% BER / -80 / dBm
Maximum received signal@0.1% BER 0 / / dBm
C/I c-channel / / +13 dB
F=F0 + 1MHz / / +5 dB
F=F0 - 1MHz / / 0 dB
F=F0 + 2MHz / / -20 dB
Adjacent channel selectivity C/I
F=F0 - 2MHz / / -20 dB
F=F0 + 3MHz / / -40 dB
F=F0 - 3MHz / / -40 dB
Adjacent channel selectivity C/I F=Fimage / / -7 dB

8DPSK
Sensitivity @0.01% BER / -80 / dBm
Maximum received signal@0.1% BER 0 / / dBm
C/I c-channel / / +18 dB
F=F0 + 1MHz / / +5 dB
F=F0 - 1MHz / / +5 dB
F=F0 + 2MHz / / -20 dB
Adjacent channel selectivity C/I
F=F0 - 2MHz / / -20 dB
F=F0 + 3MHz / / -35 dB
F=F0 - 3MHz / / -35 dB
Adjacent channel selectivity C/I F=Fimage / / 0 dB

Notes:

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part without prior written permission of RDA. Page 8 of 15
RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

Table 6-4 Transmit Characteristics ------ Enhanced Data Rate

(VBAT = 4.0 V, TA = 27°C, unless otherwise specified)

PARAMETER CONDITIONS MIN TYP MAX UNIT

General specifications
Maximum RF transmit power / +2 / dBm
Relative transmit control / -1.6 / dB
kHz
π/4 DQPSK max w0 / +7.4 / kHz
π/4 DQPSK max wi / +6.7 / kHz
π/4 DQPSK max |wi + w0| / +2.4 / kHz
8DPSK max w0 / +7.1 / kHz
8DPSK max wi / +4.4 / kHz
8DPSK max |wi + w0| / +2.7 / kHz
RMS DEVM / 4.7 / %
π/4 DQPSK Modulation Accuracy 99% DEVM / / 30 %
Peak DEVM / 8.8 / %
RMS DEVM / 4.6 / %
8DPSK Modulation Accuracy 99% DEVM / / 20 %
Peak DEVM / 11.3 / %
F=F0 + 1MHz / -25.0 / dBm
F=F0 - 1MHz / -25.0 / dBm
F=F0 + 2MHz / -25.0 / dBm
In-band spurious emissions F=F0 - 2MHz / -25.0 / dBm
F=F0 + 3MHz / -30.0 / dBm
F=F0 - 3MHz / -30.0 / dBm
F=F0 +/- > 3MHz / / -32 dBm
EDR Differential Phase Coding / 100 / %

Notes:

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

7 Pins Description

Figure7-1. RDA5850 BGA Ball map (bottom view)

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

Table 7-1 RDA5850 Pins Description

Pin Name I/O Type Usage Power Ball
Domain No
LCD Parallel Interface
LCD_DATA_0 I/O D Data Bus LCD K1
LCD_DATA_1 I/O D Data Bus LCD J4
LCD_RS O D Register Select LCD J5
LCD_RD O D Read Strobe LCD K5
LCD_CS1 O D Chip Select LCD G5

External Memory Controller

M_SPI_CLK O D CLK for SPI flash MEM A12
M_SPI_D0 I/O D Data0 for SPI flash MEM B12
M_SPI_D1 I/O D Data1 for SPI flash MEM A11
M_SPI_D2 I/O D Data2 for SPI flash MEM B11
M_SPI_D3 I/O D Data3 for SPI flash MEM B13
M_SPI_CS O D Chip Select 0 for SPI flash MEM C12
I2C2
I2C2_SCL I/O D I2C2 Clock STD N17
I2C2_SDA I/O D I2C2 Data STD P16
Memory Card Interface
SSD_CLK O D SD Clock MMC K10
SSD_CMD I/O D SD Command MMC M8
SDAT_0 I/O D SD data bit 0 MMC K9
SDAT_1 I/O D SD data bit 1 MMC J9
SDAT_2 I/O D SD data bit 2 MMC J10
SDAT_3 I/O D SD data bit 3 MMC H10
Debug Host
HST_RXD I D Host data receive. STD K12

HST_TXD O D Host data transmit. STD J11

KEYPAD
KEYIN_0 I D Key matrix input line 0 STD F2
KEYIN_1 I D Key matrix input line 1 STD F5
KEYIN_2 I D Key matrix input line 2 STD G4
KEYIN_3 I D Key matrix input line 3 STD E4
KEYOUT_0 O D Key matrix output line 0 STD D4
KEYOUT_1 O D Key matrix output line 1 STD E5
KEYOUT_2 O D Key matrix output line 2 STD F4
KEYOUT_3 O D Key matrix output line 3 STD D5
KEYOUT_4 O D Key matrix output line 4 STD F3

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

General Purpose I/O

GPIO_1 I/O D GPIO 1 STD N12
GPIO_3 I/O D GPIO 3 STD N11
GPIO_4 I/O D GPIO 4 STD B10
GPIO_7 I/O D GPIO 7 STD H5
General Purpose Output
GPO_0 O D GPO 0 STD P12
GPO_3 O D GPO 3 STD J2
GPO_5 O D GPO 5 STD M10
Miscellaneous Pins
TST_H ID D Test Mode ANALOG H11
PLL_TEST O D Digital CLK output for test ANALOG L3
USB
USB_DM I/O A USB D- ANALOG M3
USB_DP I/O A USB D+ ANALOG M2
AUDIO
AU_MIC_P I A MIC input ANALOG N6
AU_MIC_N I A MIC input ANALOG P5
AU_HPL O A Headset output L ANALOG N3
AU_HPR O A Headset output R ANALOG P3
LINE_IN_L I A Stereo Line input ANALOG N9
LINE_IN_R I A Stereo Line input ANALOG P8
AU_LSL_P O A Loudspeaker Left Out + ANALOG P7
AU_LSL_N O A Loudspeaker Left Out - ANALOG N8
AU_LSR_P O A Loudspeaker Right Out + ANALOG P6
AU_LSR_N O A Loudspeaker Right Out - ANALOG N7
VCOM_BAT I A Common mode voltage ANALOG P1
AU_VCOM I A Common mode voltage ANALOG N2
FM
FM_LINEOUT_R O A FM audio analog signal output FM G2
R channel
FM_LINEOUT_L O A FM audio analog signal output FM H1
L channel
FMIN I A FM RF differential input FM M16
FMIP I A FM RF differential input FM N15
BT
BT_RF O A Bluetooth RFIO BT P17
BT_DVDD O A Bluetooth DVDD BT L15
BT_VOUT18 O A Bluetooth VOUT18 BT M15
Power Management Control

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

IN_STROBE O A Analog IN for Test TEST G11

IP O A Analog IP for Test TEST G12
QP_RXTXEN I A For chip test TEST E12
QN_RXTXDATA I A For chip test TEST E13
XVR_XTAL1 I A 26MHz Crystal port Input TEST P15
XVR_XTAL2 O A 26MHz Crystal port Output TEST P14
ANA_TEST_EN I A XVR test mode TEST F12
XVR_AUXCLK_OUT O A CLK out test pint TEST L16
POWERKEY I A Power-on switch enable PMU C10
signal. Active High.
AC_R I A Input from the AC charger or PMU F10
USB inlet
GDRV O A Charger drive PMU C8
IS_CHG I A Current Sens for Charger PMU C7
Control
VBAT_SENSE I A Battery voltage ADC detect PMU E10
TS I A Battery connection detect PMU C9
SW_BUCK O A DC/DC control PMU A9
SW_BUCK2 O A DC/DC control PMU A8
VSPIM_SEL I A Selects V_MEM power supply PMU C13
('0':2.8V, '1':1.8V).
PROG_EFUSE I A High voltage input for PMU E11
OTP/EFUSE programming
LED Drivers
LED1 I A LED driver current sink PMU C2
LED2 I A LED driver current sink PMU C3
POWER
VBAT_ABB I A Analog Battery Power Supply ANALOG N1
AVDD_2V4 O A Supplies BT PMU A10
VBAT_PMU1 I A PMU Battery Power Supply PMU A1
VBAT_PMU2 I A PMU Battery Power Supply PMU A2
V_CORE O A Supplies Core. Out for PMU B9
decoupling / debug / backup
VBUCK2_2V4 O A DCDC power supply PMU B8
V_SPIMEM O A Supplies external SPI flash PMU A13
V_ANA O A Out for decoupling / debug / PMU L1
backup
V_PAD O A Supplies Standard PADs I/O PMU P10
ring. Out for decoupling /
debug / backup

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RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

V_LCD O A Supplies LCD PADs I/O ring PMU J1

and V_MEM output PAD
V_MMC O A Supplies MMC PADs I/O ring PMU M9
and V_MEM output PAD
V_USB O A Supplies USB PHY. Out for PMU M1
debug / backup / decoupling
V_RTC O A Supplies RTC domain PMU E1
V_BAT_RTC O A Charges Backup CAP PMU E2
GROUND
SW_GND A DC/DC Switch GND PMU B5
SW_GND A DC/DC Switch GND PMU B6
XVR_GND A XVR_GND PMU A16
XVR_GND A XVR_GND PMU B15
XVR_GND A XVR_GND PMU C15
XVR_GND A XVR_GND PMU D15
XVR_GND A XVR_GND PMU E15
XVR_GND A XVR_GND PMU F15
XVR_GND A XVR_GND PMU G15
XVR_GND A XVR_GND PMU G16
XVR_GND A XVR_GND PMU G17
XVR_GND A XVR_GND PMU H16
XVR_GND A XVR_GND PMU H17
CORE_GND A CORE_GND PMU G7
CORE_GND A CORE_GND PMU G8
CORE_GND A CORE_GND PMU G9
CORE_GND A CORE_GND PMU H7
CORE_GND A CORE_GND PMU H8
CORE_GND A CORE_GND PMU H9
CORE_GND A CORE_GND PMU J7
CORE_GND A CORE_GND PMU J8
CORE_GND A CORE_GND PMU K7
CORE_GND A CORE_GND PMU K8
CORE_GND A CORE_GND PMU M5
CORE_GND A CORE_GND PMU M6
CORE_GND A CORE_GND PMU M7

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part without prior written permission of RDA. Page 14 of 15
RDA Microelectronics, Inc. RDA5850 Datasheet V2.1

8 Change List
REV DATE AUTHOR CHANGE DESCRIPTION
V1.0 May 8, 2012 Richard C Initial version
V2.0 Jun 19, 2012 Richard C Add Ball map
V2.1 Jun 20,2012 Richard C Modified according to the latest schematics

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