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Electronics Engineering Questions - Difficult

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Electronics Engineering Questions - Difficult

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ELECTRONICS ENGINEERING DIFFICULT QUESTION

1.

How many SCRs are required in a series string to withstand a


DC voltage of 3500 volts in steady state, if the SCRS have
steady state voltage rating of 1000V and steady state
derating factor of 30%? Assuming a difference in leakage
current of SCRs to be 10 mA, calculate the value of voltage
sharing resistances to be used.
ANSWER:

2.

It was a term coined in 1971 by circuit theorist Leon


Chua as a missing non-linear passive two-terminal electrical
component relating electric charge and magnetic flux
linkage. It is basically a fourth class of electrical
circuit, joining the resistor, the capacitor, and the
inductor, that exhibit their unique properties primarily at
the nanoscale.
ANSWER:

3.

MEMRISTOR

This type of memory is basically an arrangement of shift


registers. It is used in applications where two systems
communicate at different rates.

ANSWER:

4.

FIFO or FIRST IN FIRST OUT

It is the fastest switching speeds compared to any logic ICs. It


consumes more power than TTL and eliminates the turn-off delay.
Input logic levels are limited to a narrow voltage range to
reduce the large power dissipation resulting from the active
mode. Determine the type of current mode logic family.

ANSWER:

ECL or Emitter Coupled Logic

5.

Find the average drift velocity in a silicon semiconductor doped


with phosphorus. Assume doping density of 1 per million, a
cross-sectional area of 10-4 m2, a current of 4 A, and the
concentration of silicon atoms in a silicon crystal is nsi = 4.96
x 1028 atoms/m3.

ANSWER:

6.

5 m/s

Give the common name for what was later standardized as the IEEE
1149.1 or the Standard Test Access Port and Boundary-Scan
Architecture. It was initially devised for testing printed
circuit boards using boundary scan and is widely used for this
application.

ANSWER:

7.

JTAG OT JOINT TEST ACTION GROUP

What net flux crosses the closed surface S which contains a


charge distribution in the form of a plane disk of radius 4m with
a density

s=

ANSWER:

( sin )2 C
2r
m2

( )

2 C

8.

Find the output voltage

ANSWER:

9.

442 mV

In the circuit shown below, the outputs Y1 and Y2 for the given
initial condition Y1 = Y2 = 1 and after four input pulses will be

x
ANSWER:

Y1=1, Y2=1

10.

A three-phase half-controlled thyristor converter has an highly


inductive load of 10 ohms, and a supply of 240V at 50Hz.
Determine the value of the power factor for firing angle delay of
a = 30O.

ANSWER:

0.585

11. Determine the frequency of oscillation of a phase shift


oscillator with R1 = R2 = 15 k and C1 = C2 = C3 = 0.001 F.

ANSWER:
12.

4.33 kHz

It is the production of an electromotive force (emf) and


consequently an electric current in a loop of material
consisting of at least two dissimilar conductors when two
junctions are maintained at different temperatures.
ANSWER:

13.

SEEBECK EFFECT

Find E at P(1, 1, 1) caused by four identical 3 nC

point charges located at P1(1, 1, 0), P2(- 1, 1, 0), P3(- 1,


- 1, 0) P4(1, - 1, 0).
ANSWER:

6.82ax + 6.82ay + 32.89az V/m

14. A

three bit pseudo random number generator is shown.


Initially the value of output Y = Y 2 Y1 Y0 is set to 111. The
value of output Y after three clock cycles is

ANSWER:

100

Common questions

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For a phase shift oscillator with resistors R1 = R2 = 15 kΩ and capacitors C1 = C2 = C3 = 0.001 µF, the oscillation frequency is calculated to be 4.33 kHz, using the formula for phase shift oscillator frequency .

The Seebeck Effect involves the generation of an electromotive force (emf) across a loop made from at least two dissimilar conductors when junctions are kept at different temperatures. It is fundamental in thermoelectric generators and temperature measurement devices like thermocouples .

FIFO memory, or 'First In, First Out,' is used where two systems communicate at different rates. It acts as a buffer to manage data flow, ensuring the order of data entry is maintained upon retrieval, enabling smoother operation between systems with different processing speeds .

IEEE 1149.1, known as JTAG or the Joint Test Action Group, standardizes the Test Access Port and Boundary-Scan Architecture. It simplifies testing for printed circuit boards by allowing automated and systemic testing of connections and components .

The power factor for the thyristor converter with a given firing angle delay of 30 degrees is 0.585. This calculation considers the phase displacement introduced by the delay and its effect on reactive and active power components .

The term is 'memristor,' which completes the quartet with resistor, capacitor, and inductor. It uniquely relates electric charge to magnetic flux linkage and exhibits properties significant at the nanoscale .

The net flux calculation involves understanding the electric field changes as a function of surface area and charge distribution. For a charge distribution modeled as a plane disk, the net flux through the closed surface is determined using the Gauss’s law and charge density .

The number of SCRs required is determined by considering the derating factor, which reduces each SCR's effective voltage capability to 700 volts (1000V minus 30%). Therefore, 5 SCRs are needed to cover 3500 volts (3500V / 700V per SCR). Additionally, with a leakage current difference of 10 mA, resistors can be calculated using Ohm’s Law based on actual circuit conditions .

ECL has the fastest switching speed among logic ICs because it avoids the turn-off delay. However, this speed comes at the cost of higher power consumption. Its input logic levels are restricted to a narrow voltage range to manage power dissipation during active mode .

The average drift velocity under specified conditions is calculated using the relation between electron density, current, and semiconductor properties. For the doping density and given physical dimensions, the average drift velocity is found to be 5 m/s .

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