Lecture 29
Diffusion in
crystalline solids
Announcements
Next class will be on 19th Oct., Wednesday
No class on 14th and 18th Oct.
Minor-II Syllabus: Defects, phase diagrams
and diffusion (Lecture#16 to 29)
Minor-II: Seating plan will be uploaded on
Moodle. Strictly adhere to that.
Reach examination room at least 10 mins prior
to exam
Recap
For diffusion: Thermal energy and concentration gradient
Mathematical models to describe diffusion
Ficks Ist law:
dn
dc
DA
dt
dx
Flux proportional to
concentration gradient
Steady state diffusion: J#f(x,t)
2c
c
Ficks IInd law: D 2
x
t
Non steady state diffusion: J = f(x,t)
c
D 2
x
t
2
exp
u
du
Exp( u2)
Erf
x
c( x, t ) A B erf
2 Dt
Area
Properties of Error function
Erf () = 1
Erf (-) = -1
Erf (0) = 0
Erf (-x) = -Erf (x)
If required we can provide error function table
Error function table
Diffusion couple
Cu-Zn & pure Cu welded together and heated to high temperature
t2 > t1 | c(x,t1)
t1 > 0 | c(x,t1)
t = 0 | c(x,0)
Concentration
C2
C1
C(+x, 0) = C1
C(x, 0) = C2
Cavg
t
x
A = (C1 + C2)/2
B = (C2 C1)/2
Profile of concentration can be
deduced at any time of interest
Dependence of D on T and
Concentration: Experimentally
and theoretically
Diffusion and temperature
Diffusivity increases with T.
Experimental Data:
D has exp. dependence on T
Recall: Vacancy does also!
Dinterstitial >> Dsubstitutional
Cu in Cu
C in -Fe
Al in Al
C in -Fe
Fe in -Fe
Fe in -Fe
Zn in Cu
Atomistic mechanisms of Diffusion
Interstitial diffusion
1. Interstitial Mechanism
e.g. C in Fe
Thermal energy provides oscillations for atoms to jump in all
directions, it is the gradient in concentration that decides
the direction
Substitutional diffusion
2. Vacancy Mechanism
e.g. B or P in Si
applies to substitutional impurities
atoms exchange with vacancies
rate depends on:
--number of vacancies
--activation energy to exchange.
3. Direct interchange
4. Ring mechanism
Diffusion Application
Surface is often the most important part of the
component, which is prone to degradation
Surface hardening of steel components like gears is done
by carburizing or nitriding
Diffuse carbon atoms
into the host iron atoms
at the surface.
Example of interstitial
diffusion is a case
hardened gear.
Diffusion Application
Doping Silicon with P for n-type semiconductors:
Process:
1. Deposit P rich layers on surface.
silicon
2. Heat it.
3. Result: Doped semiconductor P regions.
silicon