Polymer Guide
[Link]
Vishay Polytech
Guide for Tantalum Solid Electrolyte Chip Capacitors
with Polymer Cathode
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum/tantalum oxide/manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as tantalite when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
valvemetals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Revision: 23-Mar-15
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance/volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance/volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC
Air or vacuum
Paper
Plastic
Mineral oil
Silicone oil
Quartz
Glass
Porcelain
Mica
Aluminum oxide
Tantalum pentoxide
Ceramic
e
DIELECTRIC CONSTANT
1.0
2.0 to 6.0
2.1 to 6.0
2.2 to 2.3
2.7 to 2.8
3.8 to 4.4
4.8 to 8.0
5.1 to 5.9
5.4 to 8.7
8.4
26
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
where
eA
C = ------t
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Document Number: 40076
1
For technical questions, contact: polytech@[Link]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT [Link]/doc?91000
Polymer Guide
[Link]
Vishay Polytech
SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte polymer capacitors utilizes high performance polymer as cathode system, which is formed on the tantalum
pentoxide dielectric layer.
The pellet is then coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the
pellet and the outer termination (leadframe or other).
Molded chip polymer tantalum capacitor encases the element in plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and reliability. It offers excellent reliability and high stability for consumer
and commercial electronics.
Surface mount designs of T55 solid tantalum polymer capacitors use lead frames.
TANTALUM CAPACITOR WITH POLYMER CATHODE TYPE T55
Epoxy encapsulation
Silver adhesive
Anode polarity bar
Solderable cathode termination
Polymer / carbon / silver coating
Solderable anode termination
Sintered tantalum pellet
Lead frame welded to Ta wire
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
T55
PRODUCT IMAGE
TYPE
TEMPERATURE RANGE
CASE SIZES
CAPACITANCE RANGE
VOLTAGE RANGE
CAPACITANCE TOLERANCE
DISSIPATION FACTOR
ESR
TERMINATION
Revision: 23-Mar-15
VPolyTanTM, molded case, high performance polymer
Operating temperature: -55 C to +105 C
(above 85 C, voltage derating is required)
J, P, A, T, B
3.3 F to 470 F
2.5 V to 25 V
20 %
10 % maximum
25 m to 500 m
Cases J, P, A: 100 % tin
Cases B, T: Ni/Pd/Au
Document Number: 40076
2
For technical questions, contact: polytech@[Link]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT [Link]/doc?91000
Polymer Guide
[Link]
Vishay Polytech
REEL PACKAGING in millimeters
Label
TAPE WIDTH
12
A+0/-3
180
B+1/0
60
C 0.2
13
D 0.5
21
E 0.5
2.0
W 0.3
9.0
13.0
Note
A reel diameter of 330 mm is also applicable.
TAPE SIZE in millimeters
Pocket
Perforation
1.5 + 0.10
F
B
P1
t
Direction of tape flow
4.0 0.1
2.0 0.1
Inserting direction
Perforation
Marking side (upper)
Mounting terminal side (lower)
Symbol: R
CASE CODE
A 0.2
B 0.2
W 0.3
F 0.1
E 0.1
P1 0.1
1.0
1.8
8.0
3.5
1.75
4.0
1.3
1.4
2.2
8.0
3.5
1.75
4.0
1.6
1.9
3.5
8.0
3.5
1.75
4.0
2.5
3.1
3.8
8.0
3.5
1.75
4.0
1.7
3.1
3.8
8.0
3.5
1.75
4.0
2.5
Revision: 23-Mar-15
tmax.
Document Number: 40076
3
For technical questions, contact: polytech@[Link]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT [Link]/doc?91000
Polymer Guide
[Link]
Vishay Polytech
PACKING AND STORAGE
T55 capacitors meet moisture sensitivity level rating (MSL) of 3 as specified in IPC/JEDEC J-STD-020D.1 and are dry
packaged in moisture barrier bags (MBB) per J-STD-033. Level 3 specifies a floor life (out of bag) of 168 hours at 30 C maximum
and 60 % relative humidity (RH). Unused capacitors should be re-sealed in the MMB with fresh desiccant. A moisture strip
(humidity indicator card) is included in the bag to assure dryness. To remove excess moisture, capacitors can be dried at 40 C
(standard dry box conditions).
For detailed recommendations please refer to J-STD-033.
RECOMMENDED REFLOW PROFILES
TP
tp
Max. ramp-up rate = 3 C/s
Max. ramp-down rate = 6 C/s
TL
TEMPERATURE
TS max.
tL
Preheat area
TS min.
tS
25
Time 25 C to peak
TIME
PROFILE FEATURE
LEAD (Pb)-FREE ASSEMBLY
Preheat/soak
Temperature min. (TS min.)
150 C
Temperature max. (TS max.)
200 C
Time (tS) from (TS min. to TS max.)
60 s to 120 s
Ramp-up rate (TL to TP)
3 C/s max.
Liquidus temperature (TL)
217 C
Time (tL) maintained above TL
60 s to 150 s
Peak package body temperature (TP) max.
260 C
Time (tP) within 5 C of the peak max. temperature
5 s max.
Ramp-down rate (TP to TL)
6 C/s max.
Time from 25 C to peak temperature
8 min max.
Note
T55 capacitors are process sensitive. PSL classification to JEDEC J-STD-075: R4G.
PAD DIMENSIONS in millimeters
L
Capacitor
Pattern
Y
G
Z
CAPACITOR SIZE
PAD DIMENSIONS
CASE /
DIMENSIONS
G (max.)
Z (min.)
X (min.)
1.6
0.8
0.7
2.5
1.0
0.9
2.0
1.25
0.5
2.6
1.2
1.05
3.2
1.6
1.1
3.8
1.5
1.35
T/B
3.5
2.8
1.4
4.1
2.7
1.35
Revision: 23-Mar-15
Y (Ref.)
Document Number: 40076
4
For technical questions, contact: polytech@[Link]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT [Link]/doc?91000
Polymer Guide
[Link]
Vishay Polytech
GUIDE TO APPLICATION
1.
AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
I R MS =
Reverse Voltage: these capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at +25 C, 5 % of the
DC rating at +25 C, 5 % of the DC rating at +85 C,
and 1 % of the DC rating at +105 C.
5.
Mounting Precautions:
5.1
Limit Pressure on Capacitor Installation with
Mounter: pressure must not exceed 4.9 N with a tool
end diameter of 1.5 mm when applied to the
capacitors using an absorber, centering tweezers, or
similar (maximum permitted pressurization time: 5 s).
An excessively low absorber setting position would
result in not only the application of undue force to the
capacitors but capacitor and other component
scattering, circuit board wiring breakage, and / or
cracking as well, particularly when the capacitors are
mounted together with other chips having a height of
1 mm or less.
P
-----------R ESR
where,
P=
4.
power dissipation in W at +25 C as given in
the tables in the product datasheets. (power
dissipation)
RESR = the capacitor equivalent series resistance at
the specified frequency.
2.
AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
P
V R MS = Z -----------R ESR
or, from the formula:
V RMS = I R MS x Z
where,
P=
power dissipation in W at +25 C as given in
the tables in the product datasheets. (power
dissipation)
RESR = The capacitor equivalent series resistance at
the specified frequency.
Z=
2.1
The capacitor impedance at the specified
frequency.
The tantalum capacitors must be used in such a
condition that the sum of the working voltage and
ripple voltage peak values does not exceed the rated
voltage as shown in figure below.
Voltage
Ripple Voltage
Rated Voltage
Operating
Voltage
Working Voltage
Time (s)
3.
Temperature Derating: power dissipation is
affected by the heat sinking capability of the
mounting surface. If these capacitors are to
be operated at temperatures above +45 C, the
permissible ripple current (or voltage) shall be
calculated using the derating coefficient as shown in
the table below:
5.2
Flux Selection
5.2.1 Select a flux that contains a minimum of chlorine and
amine.
5.2.2 After flux use, the chlorine and amine in the flux
remain must be removed.
5.3
Cleaning After Mounting: the following solvents are
usable when cleaning the capacitors after mounting.
Never use a highly active solvent.
Halogen organic solvent (HCFC225, etc.)
Alcoholic solvent (IPA, ethanol, etc.)
Petroleum solvent, alkali saponifying agent, water,
etc.
Circuit board cleaning must be conducted at a
temperature of not higher than 50 C and for an
immersion time of not longer than 30 minutes. When
an ultrasonic cleaning method is used, cleaning must
be conducted at a frequency of 48 kHz or lower, at
an vibrator output of 0.02 W/cm3, at a temperature of
not higher than 40 C, and for a time of 5 minutes or
shorter.
Notes
Care must be exercised in cleaning process so that the
mounted capacitor will not come into contact with any
cleaned object or the like or will not get rubbed by a stiff
brush or similar. If such precautions are not taken
particularly when the ultrasonic cleaning method is
employed, terminal breakage may occur.
When performing ultrasonic cleaning under conditions
other than stated above, conduct adequate advance
checkout.
MAXIMUM RIPPLE CURRENT TEMPERATURE
DERATING FACTOR
45 C
1.0
55 C
85 C
105 C
0.8
0.6
0.4
Revision: 23-Mar-15
Document Number: 40076
5
For technical questions, contact: polytech@[Link]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT [Link]/doc?91000