Table of Contents:

Forward.2
Why Use Flex?......................................3
Applicable Documents..4
Terms and Definitions...5-6
Flex Circuit Type/Class.....7-8
Flex Circuit Mechanical Design Steps..9-10
Conductor Width Nomograph11-12
Terminations......13
Standard Materials.14
Cost Drivers...15
Flex Circuit Design Guidelines..16
Handling/Assembly Guidelines.....17
Circuit Forming Guidelines...18
FCT Capabilities19-20
Info Required for Quote/Fab..21
FCT Contact Info..22
1

Forward:

Flexible Circuit Technologies (FCT)

Flexible circuit designs share many of the

9850 51st Ave N.

same challenges of rigid PCB designs, but

Plymouth, MN 55442

there are also many differences and

additional challenges. The very nature of a

(763) 545-3333 (main)

flex circuit being able to bend and flex

(888) 921-6167 (toll free)

make it as much a mechanical device as an

[Link]

electrical one. This creates a special set of

sales@[Link]

requirements unique to flexible circuitry.

Understanding how these requirements
interact will allow the PCB designer to
create a flex circuit that balances the
electrical and mechanical features into a
reliable, cost effective interconnect
solution. We hope you find this flex
circuit design guide a useful tool
throughout your design process. We also
encourage you to call one of our
knowledgeable, experienced Application
Engineers at any time during your design
process. They stand ready to assist you at
every step to ensure that your flex circuit
design is a successful one.

Why Use Flex?

*Termination optionsFlexible circuits
can accept PCB connectors, FFC
connectors, and insulation displacement
connectors. Plus, several options such as
unsupported fingers than can only be done
on flex.

There are many reasons to use flexible

circuitry as your interconnect choice.
Among these are:
*Low mass--Flexible circuits are only a
fraction of the mass of discreet wiring
making them ideal for high shock, high
vibration applications

*Lowest Total Cost of OwnershipUsing

flexible circuitry as your interconnect
solution gives your designers the freedom
to eliminate costly features such as board
to board connectors and jumper wires
while streamlining assembly time which
results in the lowest TCO.

*High wiring densityBecause the

conductors in a flexible circuit are photodefined like a rigid PCB, flexible circuits
are capable of very small conductors and
therefore ultra-high wiring density. They
can take up to 75% less space than a
similar wiring harness.
*The ability to bend and flexPerhaps the
single biggest reason for using flexible
circuits is their ability to bend and flex to
fit unique applications
*Ease of assemblyEvery flex circuit is
custom to its application, and if designed
properly, should fit perfectly and
repeatably
*No wiring errorsSince the conductors
on a flex circuit are photo-defined just like
a rigid a PCB, there will never be a wiring
error.

Applicable Documents

IPC-2221 Generic Standard on Printed

Board Design
IPC-2223 Sectional Design Standard for
Flexible Printed Boards
IPC-6011 Generic Performance Standard
for Printed Boards
IPC-6013 Qualification and Performance
Specification for Flexible Printed Boards
IPC-4101 Specification for Base Materials
for Rigid and Multilayer Printed Boards
IPC-4202 Flexible Bare Dielectrics for use
in Flexible Printed Wiring
IPC-4203 Adhesive Coated Dielectric Films
for use in Fabrication of Flexible Printed
Boards
IPC-4204 Metal-Clad Flexible Dielectrics
for use in Fabrication of Flexible Printed
Boards
IPC-SM-840 Qualification and
Performance of Permanent Solder Mask
*For more information on IPC specifications,
contact IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249 USA
Tel: 847.615.7100/FAX:847.615.7105
[Link]

Cover: The insulating material covering

the outer layers of a flexible circuit

Terms and Definitions

Covercoat: A liquid or semi-liquid

insulating material used a permanent cover
over the outer conductive layers

Access Hole: Opening in cover material to

allow electrical connection to a conductor.

Coverlay: A combination of insulating

material and adhesive on one side supplied
as a film

Acrylic Adhesive: Thermo-setting film

adhesive. The most common adhesive
used in the manufacture of flexible
circuits.

ENIG: Electroless Nickel Immersion

Gold

Adhesive Squeeze out: Adhesive that

flows out on to a conductive surface during
lamination

Fillets: A flaring of a conductor as it

connects to a pad. Used to minimize
stress.

Base Material: Copper clad flexible

dielectrics usually polyimide film with or
without acrylic adhesive.
Bend ratio: The ratio of bend radius to
circuit thickness

FR4: Common epoxy based hardboard

material used to make stiffeners (no copper
cladding), or base material in a rigid flex
circuit (copper clad)

Bondply: A combination of insulating

material and adhesive on both sides
supplied as a film

Hardboard: Resin impregnated glass

cloth, most commonly epoxy or polyimide
resin, with or without copper cladding

Circuit Class: Classes 1-3 based on

inspection, testing, and performance
requirements.

HASL: Hot Air Solder Level

Neutral Bend Axis: Imaginary planar
region of flex that does not experience any
tension of compression forces when the
circuit is bent or folded.

Circuit Type: Types 1-5 based on layer

count, material selection, and vias.

Pad: A conductive land, usually round,

and placed over holes drilled for electrical
connection.

Conductive ink: Conductive particles,

usually silver or copper, suspended in an
adhesive carrier, usually epoxy. Can be
used to make conductive traces, or as a
replacement for a copper shield. Typically
more flexible than copper foil.

PIC: Photo Imageable Cover (cover coat)

Terms and Definitions

Strain Relief: Usually refers to a bead or
semi-rigid adhesive bead applied along a
rigid/flex interface, but can also refer to
any of a number of features that can
reduce, or eliminate, stress concentration
features.

POP: Pads Only Plating. Refers to a

process where copper is plated only in
through holes and on pads. Used to reduce
thickness and increase flexibility. Also
referred to as selective or button plating

SMOBC: Solder Mask Over Bare Copper.

(covercoat)

Polyester: Low temp, low cost insulating

material.

SRD: Steel Rule Die, an inexpensive tool

used to punch covers, adhesives, final
circuit outlines, etc. Constructed from a
long blade that is formed to a desired shape
and then pressed into a laser cut plywood
base. Capable of hundreds or a few
thousand punches. Capable of moderate
accuracy.

Polyimide: High temp insulating material

available in film, hard board, or B-stage
adhesive. Polyimide film is the most
common insulating material used in flex
circuitry.
Prepreg: Uncured resin impregnated glass
cloth used as an adhesive in rigid flex
circuits. Resin can be any of a number of
types including epoxy, polyimide, BT, etc.

Stiffener: A rigid sheet material, usually

Epoxy/glass construction or thick
polyimide film (.005), used to rigidize
areas of the flex circuit that should not
flex.

PTH: Plated Through Hole

Punch and Die: a very expensive steel
tool used for punching covers, adhesives,
and final circuit outlines that is capable of
tens of thousands of punches between
sharpenings. Also capable of extreme
accuracy.

Termination: The method used to bring

electrical signals to/from the flexible
circuit. Most commonly connectors, pins,
or access holes.
Via: A plated through hole used to
interconnect multiple layers of circuitry

Rigid Flex: A circuit containing rigid

PCB boards connected by integral flexible
areas where the flexible materials and
circuitry run through both rigid and flex
areas.

IPC 6013 Type 3

Flex Circuit Types/Classes

Three or more conductive layers

Flexible insulating material
between layers

IPC 6013 Type 1

Plated interconnect holes

Single conductive layer

Insulating material one or both

sides

Insulating material one or both

sides

Access to conductors one or both

sides

Access to conductors on one or

both sides

IPC 6013 Type 4

IPC-6013 Type 2

Two or more conductive layers

Two conductive layers with

flexible insulate film between them

Insulating material may be rigid or

flexible

Plated interconnect holes

Plated interconnect holes through

flex and rigid materials

Insulating material on one or both

sides

Access to conductors one or both

sides through cover material or
SMOBC

Access to conductors one or both

sides

Flex Circuit Types/Classes

Circuit Class:
Circuit Type:

Flex circuits fall into 3 classes (1-3 per

IPC-6013) based on the level of inspection
and testing required, and also by the
performance requirements of the finished
product.

Flex circuit type is determined by the

number of conductive layers,
construction/materials, and the presence or
absence of plated through holes. The
common flex circuit types (1-4) are
illustrated on the opposite page. A fifth
flex circuit type (type 5) is very
uncommon and is not shown. Type 5
circuits are two or more layers without
plated through holes.

Class 1 circuits have the minimum

inspection, testing and performance
requirements. These circuits are the
least expensive and are typically used
in applications such as disposable
electronics (e.g. musical greeting
cards) and RFID tags
Class 2 circuits have moderate
inspection, testing, and performance
requirements. Class 2 circuits are more
expensive than class 1 and are typically
found in applications such as cameras,
medical diagnostic equipment, and cell
phones.
Class 3 circuits have the highest level
of inspection, testing and performance
requirements. Class 3 circuits are the
most expensive of the 3 classes, and
are typically found in applications that
involve the taking or maintaining of
life. Applications would include
implantable cardiac devices and
military/aerospace electronics.

Type 4 Rigid Flex

8

Flex Circuit Mechanical Design

Steps:
the assembly, and can be a reliability risk
due to possible damage to the circuit
during the installation.

*Review electrical schematic/net list to

estimate approximate layer count.
Account for all signal and plane layers.
Also, refer to the Conductor Width
Nomograph for any conductors with high
current requirements. Multiply the number
of layers by .0055 to get approximate
overall thickness of circuit (if your circuit
has controlled impedance requirements,
this multiplier may be larger).

*Re-create the paper doll using .010

mylar (polyester) sheet material. You can
usually use a standard copy machine to
print the circuit outline. Cut the model out
and check for form and fit and modify as
necessary. The mylar is a bit stiffer than
paper and will better represent the
mechanical properties of the flex circuit.
*Obtain a mechanical sample from your
flex circuit vendor. This sample will be
constructed from the same materials as the
final flex, but will not have any etched
circuitry (only solid copper). All
component holes and circuit outline
features should be represented.
Connectors can be glued in place with
epoxy to give a true sense of the final fit.
This will be the final opportunity to tweak
you design prior to order actual circuits. If
you have followed the steps above, the
mechanical sample should require little, if
any, modifications.

*Review mechanical requirements/solid

model to determine minimum bend radii.
Determine and evaluate bend ratio.
*Determine flex termination method(s)
*Create a paper doll of the proposed flex
circuit outline. The first paper doll outline
can be created with just a ruler and a
pencil, but subsequent iterations should
then be transferred to a CAD program so
that you can keep track of your
modifications. Place in assembly to check
form and fit. Dont forget to account for
the termination hardware. Make
modifications as required to optimize fit.
Keep the assembler in mind during the fit
check. If the paper doll tears during
installation, it may signal possible
assembly problems. A flex circuit that is
difficult to install will add time (cost) to

Flex Circuit Mechanical Design

Steps:

Mylar Mock Up Checked for Fit

Paper Doll Outline of Flex Circuit

Mechanical Sample Checked for Fit

Paper Doll Checked for Fit

10

Conductor Width Nomograph

The conductor width nomograph on the

opposite page will assist you in determining
the conductor widths necessary to carry
various current loads. The nomograph was
reprinted from IPC-2152. Refer to IPC-2152
for a more in-depth analysis of various features
and variables that affect current carrying
capacity of copper conductors.

Using the Nomograph

1.

Find the current matching your

requirements on the left side of the
upper chart.

2. Move to the right until you

intersect the curve that corrosponds
with the maximum temperature rise
allowed. Keep in mind that the
temperature rise is from system
operating temperature (not
necessarily room temp).
3. From the intersection point of the
current/temp rise, move straight
down to the lower graph to where
you intersect the copper weight of
the conductors.
4. Move to the left to determime
conductor width.

11

Conductor Width Nomograph

12

Terminations

Virtually any connector or component that

can be mounted on a rigid PCB can also be
mounted on a flex circuit. In addition, flex
circuitry offers many other options
including unsupported fingers and
insulation displacement connectors.
Contact your FCT Application Engineer to
discuss which termination option will work
best for your application.

13

Stiffener material:

Standard Materials

Glass reinforced FR4 (epoxy)

Polyimide film (nonreinforced) .005

Flexible Circuit Technologies can work with a

wide variety of flex circuit materials to give
you the electrical and mechanical performance
you require. However, to get the lowest
possible cost for your flexible circuit, it is
advisable to design your circuit using standard
materials whenever possible. Using
uncommon materials in your design can add
significantly to both the cost and the lead time
of your circuit.

Final finishes:
ENIG
HASL
Tin plate

Conductive material:
Copper foil 1/3 oz, 1/2 oz, 1
oz, 2 oz
Cupro-nickel
Inconel
Silver filled epoxy
Insulating material:
Polyimide film .001, .002,
.003
Polyester film
SMOBC
PIC

HASL Finish

Sheet adhesive:
Epoxy .001, .002
Modified Acrylic .001, .002

14

doubt, call your flexible circuit manufacturer

and ask.

Cost Drivers

Every designer is looking for ways to decrease

costs without sacrificing performance. IPC
research has shown that PCB designers drive over
75% of the circuit cost based on the decisions they
make. It is imperative that the flex designer
understand what features add value and what
features add only cost. Designers should never
sacrifice reliability to save costs, but at the same
time, many flex circuits are over specified
resulting in additional costs that add no additional
value. Here is a list of the features that drive the
majority of your circuit cost:
*Layer countAs the number of layers
increase, so does the cost. More layers will
require additional materials and processing
time. Processing high layer count flex or
rigid flex can also be very technically
challenging which may result in reduced
yields.
*Circuit size and shapeFlexible circuits are
constructed in panel form. The greater the
panel area a circuit occupies, the greater the
cost. There are instances where even a small
change in outline can result in a large cost
decrease.
* Circuit type (i.e. type 3 vs type 4)Rigid
flex circuits are typically more expensive than
multilayer flex with stiffeners. Scrutinize
your design to determine if your application
requires a rigid flex construction, or if a
multi-layerwith stiffeners will work. If in
15

*Circuit Class (i.e. class 3 vs class 2) Class 3

circuits require additional testing, inspection,
and construction requirements which make
them more expensive. Review the
requirements of your application to determine
the proper class for your flex circuit.
*Drawings that are overly or too tightly
dimensionedIt is important to remember
that you are purchasing a flexible circuit, not a
machined part. The materials used to
manufacture flexible circuits both permit and
require looser tolerances than rigid PCBs.
Each dimension paced on a drawing will have
to be verified, so ask yourself, is this
dimension adding value, or just cost?. All
non-critical dimensions on your flex circuit
drawing should be designated as reference.
*Dissimilar layer counts in PTH areas
*Multiple Final FinishesWhile multiple
final finishes can certainly be accomplished, it
usually requires a series of hand masking
operations that will add cost.
*Small featuresBecause of the inherent
dimensional instability of flex circuit
materials, small circuit features (i.e. via pads)
can cause processing difficulties and reduced
yields. There are instances where it would be
less expensive to add additional layers with
large features, than to design with very small
features. For this reason, it is advisable to
contact FCT early in the design stage for
guidance.

thickness thereby decreasing flexibility and

the circuits ability to bend reliably.

Flex Circuit Design Guidelines

*Scrutinize your design for stress
concentration features. Stress
concentration features are the predominant
single cause for mechanical failures in
flexible circuits (i.e. cracked/broken
conductors, torn insulating material, etc).
To avoid stress concentration points, the
construction of the circuit should not
change in, or immediately adjacent to, the
bend area. In a bend area, there should be
no change of conductor width or thickness
or direction, no termination of plating or
coatings, no openings in covers or outer
insulating materials, and no holes of any
kind in a bend zone. If you would like
your flex circuit design evaluated for stress
concentration features free of charge by an
FCT Application Engineer, call 888-9216167 or 763-545-3333, or submit your
design at [Link]

*Determine and evaluate the minimum

bend ratio of your design. This will be
your single best indicator of whether your
flex circuit may experience problems in
service.
*Run conductors through a bend area
perpendicular to the bend.
*When possible, rout small conductors on
the inside of a tight bend. Small
conductors (<.007 will tolerate
compression better than stretching.
Placing these conductors on the inside of a
bend will reduce or eliminate tension
forces.
*On rigid flex circuits, ensure that all
plated through holes are in a rigid area (no
PTHs in flex areas)
*Specify adhesiveless flex materials and
cut-back or bikini cover construction
for rigid flex designs. Acrylic adhesive is
the Achilles heel of a plated through
hole in a rigid flex circuit. Eliminating
acrylic adhesive from the plated through
hole area will greatly increase the
reliability of the PTHs.

Poor DesignFingers stop short of cover

*Do not stack conductors on top of each

other on multiple layers creating an I
beam effect. Stacking conductors will
essentially increase the overall circuit
Good DesignFingers extend under cover
16

with tight ratios will permanently stretch

the copper conductors on the outside of the
bend. If the circuit is flattened, the copper
will not recompress. Rather, the copper
will ripple. Reforming or exercising the
bend will make the conductors alternately
ripple and flatten causing the copper to
work harden and become brittle. Brittle
conductors will ultimately lead to cracks
and failures.

Handling/Assembly Guidelines

*Thoroughly bake flex circuits prior to

assembly. The materials used in flexible
circuit manufacture are very hygroscopic.
In the right humidity conditions, a flex
circuit can near saturation in less than an
hour. It is imperative that this moisture is
removed prior to the circuit being
subjected to elevated temperatures.
Moisture is typically removed through an
extended baking process (2-6 hours
dependent upon circuit thickness and
construction) at temperatures between
225F and 275F). After baking, the flex
circuits should be processed immediately.
If it is not feasible to process the circuits
immediately after they are baked, they
should be stored in a sealed dry box with
desiccant, or in a nitrogen chamber until
they can be processed (which should 24
hours or less).

*Make sure that your reflow temperature

profile is matched to flex circuit materials.
Due to their low mass and relatively low
temperature ratings, flex materials cannot
withstand, nor do they require, the elevated
temps and durations of standard rigid PCB
profiles.
*Utilize a carrier or transport system for
your flex circuit during the assembly
process. Flex circuits materials are not as
durable as rigid PCB materials, and are
more prone to damage due to careless
handling. FCT can provide custom
shipping containers that can also be used
as carrier trays during the assembly
process.

*Flex circuits should be formed at the very

end of the assembly process. After a
circuit is formed, it should not be subjected
to any elevated temperature. Elevated
temperatures will cause the circuit
materials to soften and the bend will relax.
*Any bend in a flex circuit that exceeds
10:1 bend ratio on single and double sided
circuits, or 20:1 on multilayers, should be
formed only once. Once the part has been
formed, it should not be opened and
reformed, or exercised in any way. Bends
17

Circuit Forming Guidelines

place in an oven for just long enough to

bring the forming tooling up to
temperature. The best oven temp is the
lowest temperature that works for your
application. The assembly should then be
removed and allowed to cool back to room
temperature before the circuit is removed
from the tooling.

Probably the single biggest reason for

using a flexible circuit for your
interconnect needs is that it gives you the
ability to form and shape the circuit to fit
in your application. However, simply
using flex materials does not guarantee that
the circuit can be formed to any shape. In
many cases, a custom forming tool is
required to ensure that the circuit can be
repeatably and reliably formed.
*If your required bend ratio is less
than 10:1 for single or double sided
circuits, or less than 20:1 for multilayers, you will want to create
custom forming tooling.
Depending upon the complexity of
the bending and forming, this
tooling can be constructed from
plastic or metal. An experienced
FCT engineer is available to assist
you in designing you forming tools.
*Circuits are best formed cold.
Flex circuits become very fragile
when they get hot, so it is advisable
to form your circuits cold whenever
possible.
*If a bend is relaxing too much after cold
forming, heat can be added to the process
to make the bends hold their shape better.
The circuit should still be loaded into the
forming fixture cold (room temperature),
and then the entire assembly should be
18

FCT Capabilities

Unbonded Flex
Single/Double Layer Flex

Heavy Copper Flex

Multi-layer Flex

Flexible Etched Coils

Rigid Flex
19

FCT Capabilities

Flat Flexible Cable

Soft facing material and over molding

Component Assembly

Membrane Switches

20

environmental concerns such as shock,

vibration, or elevated temperatures.
Sharing this information with your FCT
Application Engineer will allow him to
evaluate the circuit construction and final
configuration to determine if your design is
sound.

Requirements to have your circuit

quoted and fabricated:

Budgetary Quote:
Flexible Circuit Technologies can give you
a budgetary quote with a minimal amount
of information. We would need the
approximate layer count, part size and
shape, circuit type (i.e. type 1-4), and how
many circuits you want. If you have
additional information at this stage of your
design, include that as well. Keep in mind
that FCT is eager to assist you at this stage
of your flex circuit design. Many potential
design and performance problems can be
avoided by including your flex
manufacturer during the design stage.

To Fabricate your circuit:

In order to fabricate your circuit, FCT will
need to have a drawing, and CAD data that
define all features of the circuit including
all conductor layers, border outline, drill
layer, conductor access openings, SMOBC
(if required), and marking. This can be
supplied in several formats, but the most
common (and preferred) would be gerber,
ODB++. Drawings are usually
transmitted in DWG or DXF format.

Firm Quote:
A higher level of documentation is
required for a firm quote. We will need
your desired order quantity, plus a drawing
showing part size and shape, materials
used, drilled hole sizes and locations
(unless shown in accompanying gerber
files), and notes that specify all critical
features of your circuit. If you have CAD
files at this stage of your design, please
include those as well to ensure that you
receive the best possible price for your
circuit. At this point in your design, you
should have pretty good idea of how the
circuit will be formed, and any
21

Contact Info

For expert design assistance contact FCT

Applications Engineering Dept
[Link]@[Link]
[Link]@[Link]
[Link]@[Link]
[Link]@[Link]

For quotes on existing designs:

Phone: (763) 545-3333
Toll Free: (888) 921-6167
Email: sales@[Link]
On-Line:
[Link]

22