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Tessolve Fresher Interview Questions 3 Rounds-1

The document provides a comprehensive guide for preparing for interviews at Tessolve, detailing three rounds of interview questions and answers reported by candidates. It covers topics in electronics, programming, and embedded systems, along with essential concepts like circuit analysis, digital logic, and PCB design. Additionally, it includes a quick revision section highlighting key areas to focus on for interview preparation.

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0% found this document useful (0 votes)
0 views7 pages

Tessolve Fresher Interview Questions 3 Rounds-1

The document provides a comprehensive guide for preparing for interviews at Tessolve, detailing three rounds of interview questions and answers reported by candidates. It covers topics in electronics, programming, and embedded systems, along with essential concepts like circuit analysis, digital logic, and PCB design. Additionally, it includes a quick revision section highlighting key areas to focus on for interview preparation.

Uploaded by

kanikanishka056
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

TESSOLVE — FRESHER INTERVIEW

PREPARATION
3 Rounds • Real Candidate-Reported Questions • Answers

Important: These are questions reported by Tessolve candidates on Glassdoor, supplemented with closely related
core questions. The exact campus-drive pattern can vary by role and location. A July 2026 Post-Silicon Validation
report described 4 rounds (online technical test, 2 technical interviews, HR), while a 2025 Chennai GET report
described aptitude + C + basic electronics in an interactive interview. ■cite references omitted in PDF; source links
listed below.
ROUND 1 — ONLINE / WRITTEN TECHNICAL TEST
1. What is a diode?
Answer: A two-terminal semiconductor device that mainly allows current to flow in one direction.

2. What is a transistor?
Answer: A semiconductor device mainly used for switching and amplification.

3. What is a rectifier?
Answer: A circuit that converts AC into DC.

4. What is a PN junction?
Answer: The junction formed between P-type and N-type semiconductor materials.

5. What is the VI characteristic of a PN junction diode?


Answer: It shows the relationship between diode current and applied voltage in forward and reverse bias.

6. What is an op-amp?
Answer: A high-gain differential amplifier used for amplification, comparison and signal processing.

7. What is a filter?
Answer: A circuit that passes desired frequency components and attenuates unwanted ones.

8. What is ADC?
Answer: Analog-to-Digital Converter; it converts an analog signal into a digital value.

9. What is DAC?
Answer: Digital-to-Analog Converter; it converts digital data into an analog signal.

10. What is KCL?


Answer: The algebraic sum of currents at a node is zero; current entering equals current leaving.

11. What is KVL?


Answer: The algebraic sum of voltages around a closed loop is zero.

12. What is Ohm's law?


Answer: V = IR, at constant physical conditions such as temperature.

13. What is a flip-flop?


Answer: A sequential circuit capable of storing one bit of information.

14. What are universal gates?


Answer: NAND and NOR; either can be used to implement all basic logic gates.

15. What is a register?


Answer: A group of flip-flops used to store binary data.

16. What is a counter?


Answer: A sequential circuit that changes state in response to clock pulses to count events.

17. What is C programming used for in embedded systems?


Answer: C provides efficient, low-level control of memory and hardware with relatively small runtime overhead.

18. Write C logic to swap two numbers without a third variable.


Answer: For integers: a = a ^ b; b = a ^ b; a = a ^ b; assuming a and b are distinct variables. An arithmetic method is
also possible, but XOR avoids arithmetic overflow concerns.
19. Write a C program/logic for factorial.
Answer: Initialize fact = 1; loop i from 1 to n and multiply fact by i. For n=5, result = 120.
ROUND 2 — TECHNICAL INTERVIEW 1
1. Explain resistor, diode, transistor and rectifier.
Answer: Resistor limits current/sets voltage; diode conducts mainly one way; transistor provides
switching/amplification; rectifier converts AC to DC.

2. Explain BJT vs MOSFET.


Answer: BJT is primarily current-controlled; MOSFET is voltage-controlled and has very high input impedance.

3. What is forward bias and reverse bias?


Answer: Forward bias reduces the PN junction barrier and permits substantial current; reverse bias increases the
barrier and only small leakage flows until breakdown.

4. What is a capacitor used for?


Answer: Energy storage, filtering, coupling/decoupling and transient support.

5. What is a common-emitter amplifier?


Answer: A BJT amplifier configuration with emitter common to input/output reference; it provides voltage gain and
phase inversion.

6. What is a clipper and clamper?


Answer: A clipper removes/limits part of a waveform; a clamper shifts the DC level of a waveform.

7. What is a multiplexer?
Answer: A digital selector that chooses one of multiple inputs and connects it to a single output.

8. Latch vs flip-flop?
Answer: Latch is level-sensitive; flip-flop is edge-triggered.

9. What is propagation delay?


Answer: The time between an input transition and the corresponding output transition.

10. What is setup time?


Answer: Minimum time data must be stable before the active clock edge.

11. What is hold time?


Answer: Minimum time data must remain stable after the active clock edge.

12. What is K-map used for?


Answer: Boolean-function simplification to reduce logic gates and circuit complexity.

13. What is CMOS?


Answer: Complementary MOS technology using NMOS and PMOS devices; it is widely used because of low static
power consumption.

14. What is a pointer in C?


Answer: A variable that stores the memory address of another variable.

15. What is bit manipulation?


Answer: Operating on individual bits using operators such as &, |, ^, ~, << and >>.

16. How would you troubleshoot a circuit?


Answer: Start with visual inspection, then verify power and ground, check shorts/opens, measure key nodes, isolate
the faulty block, and verify the repair.
ROUND 3 — TECHNICAL INTERVIEW 2 / ADVANCED TECHNICAL
1. Why are decoupling capacitors placed near IC power pins?
Answer: They provide local transient current and reduce high-frequency supply noise, helping keep the IC supply
stable.

2. What is a ground plane?


Answer: A large copper region connected to ground that provides a low-impedance return path and can reduce
noise/EMI.

3. What is EMI?
Answer: Electromagnetic interference: unwanted electromagnetic energy that can disturb circuit operation.

4. What is PCB routing?


Answer: Creating copper-trace connections between components while satisfying electrical and manufacturing
constraints.

5. What is a via?
Answer: A plated connection that electrically joins copper layers in a PCB.

6. What is DRC?
Answer: Design Rule Check; verifies PCB layout rules such as clearance, trace width and spacing.

7. What is ERC?
Answer: Electrical Rule Check; identifies potential electrical/schematic connection problems.

8. What is a Gerber file?


Answer: A standard manufacturing data file describing PCB layers such as copper, solder mask and silkscreen.

9. What is BOM?
Answer: Bill of Materials: the component list needed to build the product/PCB, including part information and
quantities.

10. Microprocessor vs microcontroller?


Answer: A microprocessor generally relies on external memory/peripherals; a microcontroller integrates CPU, memory
and peripherals in one IC.

11. What are UART, SPI and I2C?


Answer: UART is asynchronous serial communication; SPI is synchronous multi-wire communication; I2C is a
two-wire synchronous bus using SDA and SCL.

12. What is PWM?


Answer: Pulse Width Modulation; varying duty cycle controls average voltage/power in many applications.

13. What is an interrupt?


Answer: A hardware/software event that causes the processor to temporarily service an urgent task before returning
to normal execution.

14. What is semiconductor testing?


Answer: Verifying that a chip/device meets required functional and electrical specifications.

15. What is validation?


Answer: Checking that the product works as intended in its target use and satisfies requirements.

16. Explain your project.


Answer: My project is a Battery Health Monitoring and Life Prediction System with Smart Thermal Management for
EVs. We monitor battery parameters such as voltage and temperature using sensors and a controller, estimate battery
state such as SOC/SOH, and use thermal management to control temperature. IoT can provide remote monitoring,
while prediction methods such as LSTM and state-estimation methods such as EKF can be used for life/health
estimation.

17. Why did you choose the EV battery project?


Answer: Battery safety, ageing, temperature and remaining useful life are important for reliable EV operation. The
project combines EEE, sensors, embedded control and data-based monitoring.

18. What is SOC?


Answer: State of Charge: an estimate of the battery's remaining charge, usually expressed as a percentage.

19. What is SOH?


Answer: State of Health: an indication of the battery's present condition/capacity relative to a healthy reference
battery.

20. Why monitor battery temperature?


Answer: High temperature can accelerate ageing, reduce performance and create safety risks; monitoring enables
protective thermal control.
QUICK REVISION — MUST PREPARE
• Digital: logic gates, NAND/NOR, K-map, MUX/DEMUX, flip-flops, counters, registers, setup/hold time, propagation
delay.

• Analog: diode, PN junction, BJT, MOSFET, op-amp, rectifier, filters, clipper/clamper.

• Network: Ohm's law, KCL, KVL, RLC, basic circuit analysis.

• C: pointers, arrays, functions, bitwise operators, factorial, swap, palindrome, prime/Fibonacci.

• Embedded: microcontroller, GPIO, ADC, DAC, PWM, interrupts, UART, SPI, I2C.

• PCB: trace, via, footprint, SMD/THT, ground plane, DRC/ERC, Gerber, BOM, grounding, decoupling, EMI.

• Project: block diagram, components, your exact contribution, working, SOC/SOH/SOP, temperature control, IoT,
LSTM/EKF.

SOURCE NOTE
Questions were selected from candidate-reported Tessolve interview experiences, especially recent 2026 reports.
Exact questions and round structure can change by role, campus and location.
Glassdoor Tessolve interviews (updated 29 Jul 2026): [Link]

Glassdoor Tessolve Chennai GET interview:


[Link]

Glassdoor Tessolve Coimbatore interview:


[Link]

Glassdoor Tessolve Visakhapatnam interview:


[Link]

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