Difference between the additive and subtractive manufacturing.

Parameter Additive Manufacturing (AM) Subtractive Manufacturing

(SM)

Basic principle Material is added layer-by-layer to Material is removed from a bulk

create a component workpiece to create a component

Material flow Feedstock → deposited/solidified Raw stock → machining/removal

material → component → component + chips

Starting material Powder, filament, resin, wire, sheet, Billet, bar, plate, block, casting,
slurry, etc. forging, etc.

Manufacturing Near-net-shape / net-shape Material-removal manufacturing

approach manufacturing

Material utilization Generally high; material is deposited Lower; significant material may be
primarily where required removed as chips

Material waste Low to moderate depending on Generally high, especially for

process and support structures complex geometries

Typical processes FDM/FFF, SLA, DLP, SLS, Turning, milling, drilling, boring,
SLM/LPBF, EBM, WAAM, Binder grinding, broaching, EDM
Jetting, DED

Tool requirement Often no dedicated cutting tool; uses Requires cutting tools, abrasives,
print head, laser, electron beam, electrodes, or other removal tools
nozzle, etc.

Tool–workpiece Usually non-contact or limited Frequently direct mechanical

contact contact contact between cutting tool and
workpiece

Manufacturing Usually layer-wise / volumetric Usually surface-by-surface

direction addition material removal

Geometry Excellent for complex, lattice, hollow Limited by tool accessibility and
capability and topology-optimized structures cutting-tool geometry

Internal cavities Can produce enclosed/internal Difficult if the cutting tool cannot
structures depending on process access the internal region

Undercuts Generally easier to manufacture Often require multi-axis

machining, special tooling, or
multiple setups

Lattice structures Highly suitable Difficult and time-consuming

Topology Highly compatible Manufacturable only if the

optimization optimized geometry is accessible
to the tool

Part consolidation Several components can potentially Often requires multiple parts and
be integrated into one part assembly
Customization Excellent; digital model can be Possible but may require new
modified easily tooling/programming and setups

Tooling cost Generally low because dedicated Can be significant for fixtures,
tooling is often unnecessary cutting tools, dies, etc.

Programming CAD → STL/3MF → CAD → CAM → machining

slicing/toolpath generation toolpath/G-code

Process planning Layer orientation, support generation, Tool selection, cutting sequence,
slicing, scan strategy, infill, etc. workholding, speeds, feeds, depth
of cut, etc.

Primary process Laser power, scan speed, layer Cutting speed, feed rate, depth of
variables thickness, hatch spacing, feed rate, cut, spindle speed, tool geometry,
extrusion temperature, exposure time, coolant, etc.
etc.

Cutting forces Usually negligible in laser/e-beam Major consideration in

AM; significant in extrusion-based conventional machining
AM only in a different sense

Thermal effects Often significant because of melting, Heat generated mainly by plastic
sintering, curing, or bonding deformation and friction during
cutting

Residual stresses Can be significant due to repeated Generally lower, although

heating/cooling cycles machining-induced residual
stresses can occur

Distortion/warpage Can be significant, particularly in Usually lower, but machining-

metal AM and polymer AM induced deformation may occur

Surface roughness Generally relatively high in as-printed Usually lower, particularly after
condition finishing operations

Dimensional Process-dependent; often requires Generally high, especially with

accuracy post-processing for tight tolerances precision CNC machining

Tolerances Typically lower than precision Typically tighter

machining

Surface finish Often requires post-processing Can achieve excellent surface

finish directly or through finishing

Anisotropy Frequently exhibits direction- Generally more isotropic,

dependent properties because of layer depending on material and prior
formation processing

Microstructure Strongly influenced by layer Usually inherited from

deposition and thermal history wrought/cast/forged stock and
modified locally by machining

Defects Porosity, lack of fusion, keyholing, Chatter, burrs, tool wear, cracks,
balling, delamination, warpage, dimensional errors, surface
residual stress damage
Material properties Can be highly process-dependent Usually relatively predictable from
conventional stock material

Build orientation Important design/process parameter Less important, although grain

direction and workpiece
orientation can matter

Support structures Often required for overhangs in many Not normally required in the AM
AM processes sense

Post-processing Heat treatment, support removal, Deburring, grinding, polishing,

machining, polishing, infiltration, heat treatment, coating, etc.
sintering, etc.

Production of Excellent Good, but may be expensive for

prototypes highly complex prototypes

Mass production Increasingly viable for selected Highly established and economical
applications for many conventional
components

Production rate Often relatively low, particularly for Generally high for conventional
layer-wise processes machining

Economical batch Small batches and customized parts Medium-to-large batches often
size can be advantageous more economical

Lead time Short for tooling-free customized Can increase due to tooling,
parts fixture, and setup requirements

Design freedom Very high Moderate to low depending on

process

Material Multi-material AM is possible in Multi-material machining is

combinations selected processes generally performed sequentially

Energy Energy is concentrated in Energy is primarily consumed by

consumption deposition/melting/curing machine operation, spindle,
cutting, coolant, etc.

Sustainability Potentially lower material waste More material waste due to chips

Chip generation Usually minimal Major output of machining

processes

Recyclability of Powder/filament may sometimes be Machining chips can often be

waste reused depending on process/material recycled after collection and
processing

Automation High potential through digital Highly automated through

workflow and in-process monitoring CNC/CAM

Digital workflow Strongly digital from CAD to Also digital, but machining
manufactured component requires toolpath and setup
planning

Design philosophy Design for Additive Manufacturing Design for

 (DfAM) Manufacturing/Machining
(DfM/DfMch)

Main limitation Accuracy, surface finish, build rate, Geometric accessibility, material
defects, residual stresses, material waste, tooling, and machining
availability constraints

Typical application Aerospace, biomedical implants, Automotive, aerospace,

lightweight structures, customized dies/molds, shafts, gears, precision
products, tooling components

Basic terminologies

Term Abbreviation Definition Unit Example

Additive AM Process of producing a 3D N/A LPBF of Ti-

Manufacturing geometry by successive 6Al-4V
addition of material

Additive AMS Complete system used to N/A LPBF machine

Manufacturing produce an AM part + powder +
System software

Additive Process — Manufacturing process based N/A Material

on addition of material extrusion

Build Platform — Surface/platform supporting mm, Metal build

the part during fabrication mm² platform

Build Plate — Plate onto which material is mm Stainless-steel

deposited or fused plate

Build Volume — Available volume in which mm³ 250 × 250 × 300

parts can be manufactured mm

Build Envelope — Defined spatial limits of the mm³ Machine build

AM manufacturing system envelope

Build Direction BD Direction of successive N/A Z direction

material addition

Build Orientation — Orientation of a part relative to ° 45° inclined

the build system part

Layer — Individual increment of mm/µm 50 µm layer

material generated during
fabrication

Layer Thickness LT Thickness associated with one µm 50 µm

deposited/processed layer

Layer-wise — Manufacturing by successive N/A LPBF

Manufacturing layers

Part — Physical object produced by N/A Printed bracket

 AM

AM Part — Part manufactured using AM N/A LPBF

AlSi10Mg part

Feedstock — Material supplied to an AM kg, mm Metal powder

process

Material Addition — Addition of material during N/A Deposition of

manufacturing wire

Material — Placement of feedstock at a kg/s, WAAM

Deposition desired location mm³/s deposition

Build Rate BR Rate at which material/volume mm³/s, 20 cm³/h

is produced cm³/h

Term Abbreviation Definition Example

Vat VPP Selective curing of liquid SLA

Photopolymerization photopolymer in a vat

Material Extrusion MEX Selective dispensing of material FFF

through an orifice/nozzle

Material Jetting MJT Selective deposition of material in PolyJet

droplets

Binder Jetting BJT Selective deposition of binder onto Metal binder

powder jetting

Powder Bed Fusion PBF Selective thermal fusion of regions of LPBF

a powder bed

Directed Energy DED Deposition and fusion of material Laser DED

Deposition using focused thermal energy

Sheet Lamination SHL Joining sheets/foils to create a part UAM

Seven standardized AM process categories

ISO/ASTM 52900 organizes AM into seven principal process categories.

Laser Powder Bed Fusion LPBF Laser-based metal/polymer PBF LPBF stainless
process steel

Electron Beam Powder E-PBF Electron-beam-based PBF process E-PBF Ti-6Al-4V

Bed Fusion

Fused Filament FFF Extrusion of thermoplastic filament PLA printing

Fabrication layer-by-layer

Fused Deposition FDM Commercial/historical terminology for FDM polymer

 Modeling filament extrusion printer

Stereolithography SLA Photopolymerization using a UV resin printing

focused/scanning light source

Digital Light Processing DLP Photopolymerization using projected DLP resin

light patterns printing

Direct Ink Writing DIW Extrusion-based deposition of Ceramic DIW

inks/pastes/slurries

Wire Arc Additive WAAM Arc-based wire-fed DED process WAAM Al5356
Manufacturing

Laser Directed Energy L-DED Laser-based DED Laser metal

Deposition deposition

Electron Beam DED EB- Electron-beam-based DED Titanium

DED deposition

Laser Metal Deposition LMD Laser-based material deposition Repair of turbine

process blade

Robocasting — Extrusion of ceramic/polymer Ceramic scaffold

suspensions

Laminated Object LOM Sheet-based layer fabrication Paper/polymer

Manufacturing sheet

Ultrasonic Additive UAM Solid-state ultrasonic joining of metal Al foil

Manufacturing foils consolidation

Design and data terminology

Term Abbreviation Definition Unit Example

Computer-Aided CAD Digital representation of a N/A SolidWorks

Design component model

3D Model — Digital three-dimensional mm³ CAD

representation component

Digital Model — Digital representation used to N/A CAD geometry

manufacture a part

CAD File — File containing geometric design MB STEP file

information

STL STL Triangulated surface representation N/A STL export

of a 3D model

AMF AMF Additive Manufacturing File Format N/A AMF file

3MF 3MF 3D Manufacturing Format N/A 3MF build file

STEP STEP Standard for Exchange of Product N/A STEP CAD file
 model data

Tessellation — Approximation of geometry using N/A STL

facets tessellation

Facet — Individual polygon/triangle N/A STL triangle

representing a surface

Slicing — Conversion of 3D geometry into N/A 50-µm slicing

layer information

Slice — Individual cross-sectional mm Layer cross-

representation generated during section
slicing

Toolpath — Planned path followed by mm Laser scan path

deposition/energy source

Build File — Digital file containing MB Machine build

manufacturing/build information file

Build Preparation — Preparation of geometry and process N/A Orientation +

information before fabrication supports

Nesting — Arrangement of multiple parts within N/A 20 parts/build

build volume

Part Orientation — Spatial orientation selected for ° 30° orientation

manufacturing

Machine MCS Coordinate system associated with N/A X-Y-Z axes

Coordinate AM equipment
System

Part Coordinate PCS Coordinate system associated with N/A Part X-Y-Z
System the component

Geometry and design terminology

Term Abbreviation Definition Unit Example

Design for Additive DfAM Design methodology exploiting N/A Lattice bracket
Manufacturing AM capabilities and constraints

Design Freedom — Ability to manufacture N/A Internal

geometrically complex forms channel

Design Constraint — Restriction imposed by N/A Minimum wall

material/process/machine thickness

Overhang — Geometry extending beyond °, 45° overhang

underlying support mm

Unsupported — Overhang manufactured without ° 40°

Overhang support unsupported
 feature

Support Structure — Temporary structure mm³ LPBF support

supporting/anchoring a part

Support Material — Material used to create temporary g Soluble

support polymer

Support Interface — Region connecting support to part mm² LPBF interface

Minimum Feature MFS Smallest reliably manufacturable mm 0.5 mm

Size feature

Minimum Wall MWT Minimum manufacturable wall mm 0.8 mm

Thickness thickness

Part Consolidation — Combining several components N/A Integrated

into one AM component manifold

Topology TO Computational optimization of N/A Lightweight

Optimization material distribution bracket

Generative Design GD Algorithmic generation of design N/A AI-generated

alternatives bracket

Lattice Structure — Periodic cellular structure mm Gyroid lattice

Cellular Structure — Structure consisting of N/A Honeycomb

interconnected cells

Porous Structure — Structure containing designed % Biomedical

pores/voids scaffold

Internal Channel — Channel enclosed within a mm Cooling

component passage

Conformal Channel — Channel following the shape of a mm Conformal

component cooling

Lightweighting — Reduction of component mass % 40% mass

while maintaining function reduction

Functionally FGS Structure with spatially varying N/A Graded lattice

Graded Structure material/geometry

Powder terminology for PBF, DED and Binder Jetting Process

Term Abbreviatio Definition Unit Example

n

Powder — Powder used as AM feed kg SS316L powder

Feedstock material

Virgin Powder — Powder that has not kg New SS316L

previously undergone AM powder
processing
 Used Powder — Powder recovered after an kg Recovered LPBF
AM build powder

Recycled Powder — Powder processed for reuse kg Reused Al

powder

Powder Particle — Individual particle in powder µm 30-µm particle

feedstock

Particle Size PS Characteristic dimension of µm 20–63 µm

powder particle

Particle Size PSD Statistical distribution of µm, % D10/D50/D90

Distribution particle sizes

Particle — Shape and surface N/A Spherical

Morphology characteristics of particles particles

Sphericity — Measure of how closely a — 0.95

particle resembles a sphere

Satellite Particle — Small particle attached to µm Satellite on

larger particle powder

Agglomeration — Clustering of particles N/A Powder

agglomerates

Apparent Density (\rho_a) Density of powder in loosely g/cm³ 2.5 g/cm³

packed condition

Tap Density (\rho_t) Powder density after g/cm³ 2.7 g/cm³

standardized tapping

Flowability — Ability of powder to flow s/50 g, Hall flow

etc.

Hall Flow Rate — Time required for powder to s/50 g 15 s/50 g

flow through standardized
funnel

Hausner Ratio HR Ratio of tap density to — 1.15

apparent density

Oxygen Content O Amount of oxygen in wt.% / 0.08 wt.%

feedstock ppm

Moisture Content — Water present in feedstock wt.% 0.03 wt.%

Powder — Unwanted chemical/physical ppm/wt.% Oxygen

Contamination contamination contamination

Powder Life — Sequence of powder use, N/A Virgin → used

Cycle recovery, testing and reuse → recycled

PBF Process parameters

Term Abbreviatio Definition Unit Example
n

Powder Bed — Layer of powder processed µm 50-µm bed

during PBF

Recoater — Mechanism that spreads powder mm/s Blade

across the build area recoater

Recoating — Deposition/spreading of a new s 5-s

powder layer recoating

Laser Power (P) Optical power delivered by laser W 350 W

Scan Speed (v) Speed of laser/electron beam mm/s 1400 mm/s

movement

Hatch Spacing (h) Distance between adjacent scan mm 0.10 mm

tracks

Layer Thickness (t) Thickness of processed powder µm 50 µm

layer

Beam Diameter (d_b) Effective diameter of energy µm 150 µm

beam

Scan Strategy — Pattern used to scan/fuse a layer N/A Zig-zag

Hatch Pattern — Arrangement of parallel scanning N/A Stripe hatch

tracks

Contour Scan — Scan along the boundary of a N/A Outer

part contour

Infill Scan — Scan used to fill internal regions N/A Hatch infill

Scan Vector — Individual energy-source path mm 10-mm

vector

Scan Rotation — Rotation of scan direction ° 67° rotation

between layers

Melt Pool — Localized molten region µm 150-µm

produced by energy input melt pool

Melt-Pool Width MPW Width of molten region µm 120 µm

Melt-Pool Depth MPD Depth of molten region µm 70 µm

Melt-Pool MPL Length of molten region µm 200 µm

Length

Melt Track — Solidified path produced by a mm Single laser

moving heat source track

Track Overlap — Overlap between adjacent tracks % 30%

 Volumetric VED Approximate energy input per J/mm³ 50 J/mm³
Energy Density unit volume

Areal Energy AED Energy delivered per unit area J/mm² 0.5 J/mm²
Density

Linear Energy LED Energy delivered per unit scan J/mm 0.25 J/mm
Density length

Energy Input (E) Energy supplied during J 100 J

processing

Energy Density ED Energy supplied per unit J/mm, VED

geometric measure J/mm²,
J/mm³

DED and extrusion process terminology

Term Definition Unit Example

Deposition Rate Rate at which material is deposited kg/h, 10 cm³/min
mm³/s
Feed Rate Rate of feedstock delivery or movement mm/min 500 mm/min
Wire Feed Rate Rate of wire delivery m/min 5 m/min
Powder Feed Rate Rate of powder delivery g/min 10 g/min
Nozzle Diameter Diameter of extrusion/deposition nozzle mm 0.4 mm
Extrusion Temperature of extruded polymer/feedstock °C 220°C
Temperature
Bed Temperature Temperature of build platform °C 80°C
Chamber Temperature of AM chamber °C 60°C
Temperature
Deposition Bead Individual deposited material track mm 1.0-mm WAAM
bead
Interpass Temperature between successive deposition °C 150°C
Temperature passes
Substrate Base material onto which material is mm Steel substrate
deposited
Deposition Height Height accumulated through deposition mm 20 mm
Layer Deposition Deposition of one layer of material mm 0.8-mm layer
Bead Width Width of deposited bead mm 2.5 mm
Bead Height Height of deposited bead mm 1 mm
Extrusion Width Width of deposited extrusion road mm 0.45 mm
Infill Density Fraction of internal volume occupied by % 40%
material
Raster Angle Orientation of extrusion paths relative to ° 45°
reference direction
Raster Repeated deposition path used to fill a mm ±45° raster
region
Infill Pattern Geometric pattern used inside a part N/A Honeycomb
Road Individual extruded material track mm 0.5-mm road
Interlayer Bonding between successive deposited N/A FFF layer adhesion
Bonding layers
Interlayer Molecular diffusion across polymer µm/s etc. Polymer-chain
Diffusion interfaces diffusion
 Deposition Fraction of supplied material incorporated % 90%
Efficiency into the part
Deposition Ratio of deposited material to supplied % 95%
Efficiency feedstock

Material Jetting and Vat Photopolymerization

Term Definition Unit Example

Photopolymer Polymer that undergoes light-induced N/A UV resin

polymerization

Resin Liquid photopolymer feedstock mPa·s 500 mPa·s

Vat Reservoir containing photopolymer L 2-L vat

Photoinitiator Chemical initiating photopolymerization wt.% 1 wt.%

Exposure Time Duration of light exposure s 5s

Exposure Light energy delivered during curing mJ/cm² 100 mJ/cm²

Energy

Cure Depth Depth of polymerized resin µm 100 µm

Degree of Cure Fraction/extent of polymerization achieved % 95%

Post-Curing Additional curing after primary fabrication min 10 min UV

Green Part Part before final curing/densification/post- N/A Binder-jetted green

processing part

Drop-on- Jetting method where droplets are generated N/A Inkjet deposition
Demand when required

Droplet Volume Volume of an individual deposited droplet pL 20 pL

Jetting Frequency of droplet generation Hz 10 kHz

Frequency

Printhead Device containing material-jetting nozzles N/A Inkjet printhead

Nozzle Orifice Opening through which material is ejected µm 30 µm

I. Binder Jetting and post-processing terminology

Term Definition Unit Example

Binder Liquid agent that joins powder particles wt.% Polymer binder
Binder Saturation Amount of binder relative to powder-bed pore % 80%
volume
Binder Deposition Selective placement of binder mL 5 mL
Green Strength Mechanical strength of unsintered/binder-bound MPa 2 MPa
part
Debinding Removal of binder from a component h 4h
Sintering Thermal consolidation of powder particles °C, h 1350°C, 2 h
Infiltration Filling pores with another material % Bronze
 infiltration
Sintering Dimensional reduction during sintering % 18%
Shrinkage
Densification Increase in density during processing % 98% density
Final Density Density after required post-processing g/cm³ 7.9 g/cm³
Relative Density Ratio of measured to theoretical density % 99.2%
Porosity Fraction of void volume in a material % 0.8%
Hot Isostatic High-pressure/high-temperature treatment used MPa, 100 MPa,
Pressing for densification °C 1200°C
Stress Relief Heat treatment to reduce residual stresses °C, h 650°C, 2 h
Heat Treatment Controlled heating/cooling to modify material °C, h Solution
properties treatment

Defect and failure terminology

Term Definition Unit Example

Porosity Void fraction within AM material % 0.5%

Lack of Fusion Insufficient bonding between adjacent µm LOF defect

regions/layers

Keyhole Porosity Porosity generated by unstable deep- µm Keyhole pore

penetration melting

Gas Porosity Pores caused by trapped gas µm Spherical pore

Balling Formation of discontinuous/spherical melt µm Balling defect

tracks

Cracking Formation of cracks during/after AM µm/mm Hot crack

Delamination Separation between layers/regions mm Interlayer

delamination

Warpage Unwanted geometric distortion mm 0.5-mm warpage

Distortion Deviation from intended geometry mm Build distortion

Residual Stress Stress remaining after AM processing MPa 300 MPa

Unmelted Particle Feedstock particle insufficiently fused µm Unmelted powder

Oxide Inclusion Entrapped oxide material µm Al oxide inclusion

Surface Defect Irregularity/deviation on part surface µm Surface pore

Stair-Stepping Layer-induced approximation of inclined µm 50-µm stair-step

surfaces

Delamination Crack along an interlayer/interface region mm Interlayer crack

Crack

Post-processing techniques for additively manufactured parts

No. Post- Brief description Main purpose / effect Typical AM

 processing processes
technique

1 Support Removal of temporary Removes unwanted PBF, VPP, MEX,

removal support structures after material and improves DED
printing. Can be manual, accessibility/surface
mechanical, thermal, or quality.
chemical.

2 Depowdering Removal of Cleans internal cavities PBF, BJT

loose/unfused powder and reduces residual
trapped inside or around powder.
the AM component.

3 Cleaning Removal of powder, Improves cleanliness and All AM

resin, binder, oils, prepares the part for
contaminants, and debris subsequent processing.
using air, solvents, water,
or ultrasonic cleaning.

4 Debinding Thermal or solvent- Prepares the component BJT, material

assisted removal of for sintering. extrusion of
polymeric binder from a feedstock
printed green part.

5 Sintering Heating a powder-based Increases density and BJT, MEX

green part below its mechanical strength. ceramics/metals
melting temperature to
promote particle bonding
and densification.

6 Infiltration Introduction of another Improves density, BJT

material into strength, and sometimes
interconnected pores of a surface finish.
porous AM part.

7 Hot Isostatic Simultaneous application Closes internal pores, Metal PBF, DED
Pressing (HIP) of high temperature and increases density and
isostatic gas pressure. fatigue performance.

8 Surface Removal of material Improves dimensional Metal/polymer

machining using conventional accuracy and surface AM
machining such as finish.
milling, turning, drilling,
or CNC machining.

9 Laser A laser locally remelts Reduces roughness Metal AM

polishing the surface, allowing without conventional
surface asperities to contact machining.
redistribute.

10 Laser shock High-energy laser pulses Improves fatigue and Metal AM

peening generate shock waves damage tolerance.
that induce compressive
 residual stress.

11 Laser surface Surface is locally melted Reduces surface defects Metal AM

remelting and rapidly resolidified and modifies
using a laser. microstructure.

12 UV post- Additional UV exposure Increases conversion, SLA, DLP, VPP

curing after printing completes stiffness, strength and
polymerization of dimensional stability.
photopolymer parts.

13 Solvent Controlled exposure to a Produces a smoother MEX/FFF

smoothing solvent partially dissolves surface and reduces layer polymers
the polymer surface. lines.

14 Corona poling High electric field Enhances polarization of PVDF AM

generated through corona polymeric materials.
discharge is applied to a
piezoelectric polymer.