PCB Design Process

Unit II
PCB Design Process
Introduction to ESDM

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PCB Design Process

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 PCB Design Process
• Board type: Single-layer / 2-layer / 4-layer / Multilayer
• Electrical constraints:
o Voltage levels
o Current capacity
o Controlled impedance (if any)
• Mechanical constraints:
o Board size and shape
o Mounting holes
o Connector locations

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 PCB Design Process
• Manufacturing constraints:
oMinimum trace width/spacing
oDrill sizes
oStack-up (FR4, copper thickness)
• Compliance:
oIPC class (Class 2 / Class 3)
oEMI/EMC considerations

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 PCB Design Process
Schematic Capture (Cadence OrCAD Capture)
Create a New Project
[Link] OrCAD Capture
[Link] → New → Project
[Link] PCB Design project
[Link] project directory and name
[Link] Blank Project or Template
Create / Verify Libraries
•Symbol libraries (.olb)
•Footprint libraries (.dra / .psm)

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 PCB Design Process
2.3 Schematic Entry
•Place components (Place → Part)
•Draw nets (Place → Wire)
•Use net aliases for clarity
•Add:
Power symbols
o

Ground symbols
o

Test points (recommended)

o

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 PCB Design Process

Electrical Rule Check (ERC)

Tools → Electrical Rules Check
[Link]:
o Unconnected pins
o Missing power pins
o Multiple drivers
[Link] schematic

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 PCB Design Process
Netlist Generation for Allegro • Select:
• Annotate Design Allegro
o

• Tools → Annotate • Configure:

• Ensure reference designators are unique Output directory
o

• Create Allegro Netlist Netlist format

o

• In Allegro PCB design software, Create Netlist generates a text- [Link] netlist
based file, typically used to export connectivity data from a
schematic (such as OrCAD Capture) into the PCB Editor Output files:
• Tools → Create Netlist •.brd (board file – if board creation is enabled)
•.[Link]
•Constraint data (optional)

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 PCB Design Process

Key Functions of "Create Netlist" in Allegro:

•Transfer Schematic to Layout: It converts schematic drawings into a format the PCB editor
understands, creating a list of components and nets.
•Initial Board Setup: Acts as the starting point for PCB layout by defining all electrical
connections between component pins.
•Design Synchronization: It updates existing PCB designs (.brd files) with changes made in the
schematic (e.g., adding components, changing connections).
•Error Checking: The process verifies the schematic for, or highlights, inconsistencies or errors in
connectivity before generating the final netlist file.
•Format Flexibility: It can generate different formats, such as Allegro's native format or industry-
standard formats, and is crucial for creating the "package" required for board layout.

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 PCB Design Process
Board Creation in Allegro PCB Editor
Open Allegro PCB Editor
•Launch Allegro PCB Editor
•Open the generated .brd file
(or create a new board and import netlist)
Define Board Outline
[Link] → Design Parameters → Design Outline
[Link] board shape using:
Line / Arc tools
o

[Link]:
Origin
o

Datum points
o

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 PCB Design Process
Stack-Up Definition
5.1 Define Cross-Section
[Link] → Cross Section
[Link]:
o Number of layers
o Copper layers (TOP, BOTTOM, INNER)
o Dielectric thickness
o Copper thickness
[Link] layer types:
o SIGNAL
o PLANE
o DIELECTRIC
Mandatory before routing

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 PCB Design Process
Footprint Placement
6.1 Import Components
• Components appear outside the board outline initially
6.2 Placement Process
[Link] → Manually
[Link]:
o Connectors first
o Large ICs
o Power components
o Sensitive analog parts
[Link]:
o Orientation consistency
o Assembly clearances
o Thermal considerations

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 PCB Design Process
Constraint Setup (DRC Rules)
7.1 Physical Constraints
[Link] → Constraints → Physical
[Link]:
o Trace width
o Spacing
o Via sizes
7.2 Electrical Constraints (Optional)
• Differential pairs
• Impedance control
• Length matching
7.3 Manufacturing Constraints
• Solder mask expansion
• Minimum annular ring
• Drill tolerances

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 PCB Design Process

Routing
Track Width in PCB Design (IPC-2221A)
Why Track Width Matters
A PCB track is a flat copper conductor. Its width governs:
. Current capacity: how much continuous current it can carry for a chosen
temperature rise.
. Voltage drop & power loss: resistance depends on cross-sectional area.
. Reliability: undersized traces overheat → delamination, darkening, electromigration.
. Manufacturability: very ne tracks increase cost and fabrication difficulty.

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 PCB Design Process

Parameters Affecting Track Width

1. Copper thickness (t): specified in oz/ft2. 1 oz ≈ 35 μm ≈ 1.37 mil.
Thicker copper → higher current for same width.
2. Current (I): continuous (RMS) current for thermal sizing.
3. Temperature rise (ΔT): allowable rise, typically 10 – 30 deg ºC.
4. Layer position: external traces (top/bottom) cool better than internal ones

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PCB Design Process

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PCB Design Process

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PCB Design Process

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PCB Design Process

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PCB Design Process

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PCB Design Process

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PCB Design Process

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PCB Design Process

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 PCB Design Process
Key points:
. External layers require more clearance (risk of arcing in air).
. Internal layers can be tighter (dielectric provides isolation).
Additional Considerations
. Creepage distance: along a surface, spacing may need to increase with contamination or
pollution degree.
. Environment: harsh conditions (humidity, altitude, pollution) demand larger clearances.
. Manufacturability: even if IPC allows small spacing, PCB fabricators often limit to 56 mil in low-
cost processes.
. Safety standards: stricter rules apply for medical, automotive, or aerospace designs (IEC-60950,
UL, ISO).
Example
For a 48 V DC power stage on an external layer:
. IPC-2221A requires 0.6 mm spacing.
. On an internal layer, only 0.1 mm spacing is required.
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 PCB Design Process

IPC-2221A vs IPC-2221B / IPC-2222

. IPC-2221A is a legacy standard.
. IPC-2221B and IPC-2222 move toward performance-based rules and
reference
IPC-9592B for power electronics.
. Modern designs often cross-check IPC with IEC-60664 or UL-60950.

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 PCB Design Process
Routing
8.1 Manual / Auto Routing
• Manual routing:
o Route → Connect
• Auto routing (if used):
o Route → Automatic
Recommended:
• Power & ground first
• High-speed signals next
• Remaining signals last
• 8.2 Via Optimization
• Reduce via count
• Avoid stubs
• Maintain return paths

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 PCB Design Process

Guidelines for Component Placement

Derived from industry standards (IPC-2221A, IPC-7351) and good design practices

1. Start with Constraints

. Place connectors and mechanical components first, based on chassis or enclosure
requirements.
. Ensure mounting holes, heatsinks, displays, and external ports align with the product
housing.

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 PCB Design Process

2. Functional Grouping
. Place components in functional blocks (power, analog, digital, RF).
. Keep related parts close together to minimize trace lengths.
. Arrange blocks in a logical order to match signal flow.

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 PCB Design Process

3. Power Supply Placement

. Place power regulators, SMPS ICs, and associated passives near the input connector.
. Minimize the loop area of switching nodes (hot loop).
. Keep decoupling capacitors as close as possible to IC power pins .

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 PCB Design Process
Design Rule Check (DRC)
9.1 Run DRC
[Link] → Design Rule Check
[Link]: Spacing violations, Unrouted nets, Short circuits

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 PCB Design Process
10. Pre-Manufacturing Checks
10.1 Artwork Review
• Silkscreen overlaps
• Polarity markings
• Reference designator visibility
10.2 Drill Check
• Tool sizes
• Plated vs Non-plated holes
10.3 Copper Balance
• Plane fill
• Acid traps
• Thermal reliefs

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 PCB Design Process
Gerber File Generation 11.2 Generate Gerbers
11.1 Setup Artwork Parameters [Link] format:
[Link] → Artwork o RS-274X (Extended Gerber)
[Link]:
[Link]:
Line width
Film control
o

o Units (mm / inch)

o Layers to output:
o Polarity
Top Copper
▪
[Link] Create Artwork
Bottom Copper
▪
Generated files:
Inner layers
▪ .GTL – Top Copper

Solder mask
▪
.GBL – Bottom Copper
.GTS – Top Solder Mask
Silkscreen
▪

.GBS – Bottom Solder Mask

.GTO – Top Silkscreen

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 PCB Design Process
NC Drill File Generation Final Manufacturing Outputs 14. Gerber Verification (Highly
12.1 Generate Drill Data 13.1 Complete Fabrication Recommended)
[Link] → NC → NC Drill Package Tools:
[Link]: •Gerber files • Gerbv
o Plated / Non-plated • NC Drill files • ViewMate
o Tool sizes • IPC-356 Netlist • CAM350
[Link]: • Readme / Fab notes • Online Gerber viewers
o .drl, Drill report • Stack-up drawing Check:
• BOM (from Capture) • Layer alignment
• Missing features
• Correct polarity

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