MPXV7002

Integrated silicon pressure sensor, on-chip signal

conditioned, temperature compensated and calibrated
Rev. 5 — 5 May 2021 Product data sheet

1 General description
The MPXV7002 series piezoresistive transducers are monolithic silicon pressure
sensors. The MPXV7002 is designed for a wide range of applications, particularly
applications employing a microcontroller, or microprocessor with analog-to-digital inputs.
This transducer combines advanced micromachining techniques, thin-film metallization,
and bipolar processing to provide an accurate, high-level analog output signal that is
proportional to the applied pressure.

2 Features and benefits

• Ideally suited for microprocessor or microcontroller-based systems
• Thermoplastic (PPS) surface mount package
• Temperature compensated over +10 °C to +60 °C
• Patented silicon shear stress strain gauge
• Available in differential and gauge configurations

3 Applications
• Hospital beds
• HVAC
• Respiratory systems
• Process control

4 Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
MPXV7002DP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-1
7.62 mm body
MPXV7002GC SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67 mm x 10.67 mm x SOT1854-1
12.96 mm body
MPXV7002GP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-3
8.38 mm body
NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

4.1 Ordering options

Table 2. Ordering options
Package SOT # of Ports Pressure type Device
Device name
options no. None Single Dual Gauge Differential Absolute marking

Small Outline Package (MPXV7002 Series)

MPXV7002DP Trays SOT1693-1 • • MPXV7002DP
MPXV7002DPT1 Tape & Reel SOT1693-1 • • MPXV7002DP
MPXV7002GC6U Rails SOT1854-1 • • MPXV7002G
MPXV7002GP Trays SOT1693-3 • • MPXV7002G

Small outline packages

MPXV7002DP/DPT1 MPXV7002GC6U/C6T1 MPXV7002GP

CASE 1351-01 CASE 482A-01 CASE 1369-01
SOT1693-1 SOT1854-1 SOT1693-3

5 Block diagram
VS
2

THIN FILM GAIN STAGE #2

TEMPERATURE AND 4
Sensing
COMPENSATION GROUND Vout
element
AND REFERENCE
GAIN STAGE #1 SHIFT CIRCUITRY

3 Pins 1, 5, 6, 7 and 8 are NO CONNECTS

for small outline package device
GND aaa-040606

Figure 1. Integrated pressure sensor schematic

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

6 Pinning information

6.1 Pinning

5 4 5 4 5 4

6 3 6 3 6 3

7 2 7 2 7 2

8 1 8 1 8 1

aaa-040604

aaa-037858 aaa-037857

Figure 2. MPXV7002DP/DPT1 pin Figure 3. MPXV7002GC6U/C6T1 pin Figure 4. MPXV7002GP pin diagram
diagram diagram

6.2 Pin description

This device family uses the style 2 pin configuration documented in Table 3 and shown in
Figure 10.

Table 3. Pin description

[1]
Symbol Pin Description
[2]
n.c. 1 —
Vs 2 Supply voltage
GND 3 Ground
Vout 4 Voltage output
[2]
n.c. 5 —
[2]
n.c. 6 —
[2]
n.c. 7 —
[2]
n.c. 8 —

[1] The notch in the lead indicates pin 1.

[2] Internal device connection. Do not connect to external circuitry or ground

7 Maximum Ratings
[1]
Table 4. Maximum Ratings
Rating Symbol Value Unit
Maximum pressure (P1 > P2) Pmax 75 kPa
Storage temperature Tstg –30 to +100 °C
Operating temperature TA 10 to 60 °C

[1] Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor
chip.

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Product data sheet Rev. 5 — 5 May 2021

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

8 Operating Characteristics
Table 5. Operating Characteristics
(VS = 5.0 Vdc, TA = 25 °C unless otherwise noted. Decoupling circuit shown in Figure 6 required to meet specification.)
Characteristic Symbol Min Typ Max Unit
[1]
Pressure rRange POP –2.0 — 2.0 kPa
[2]
Supply voltage VS 4.75 5.0 5.25 Vdc
Supply current Io — — 10 mAdc
[3]
Pressure offset (10 °C to 60 °C) @ VS = 5.0 Volts Voff 0.25 0.5 0.75 Vdc
[4]
Full scale output (10 °C to 60 °C) @ VS = 5.0 Volts VFSO 4.25 4.5 4.75 Vdc
[5]
Full Scale Span (10 °C to 60 °C) @ VS = 5.0 Volts VFSS 3.5 4.0 4.5 V Vdc
[6] [7]
Accuracy (10 °C to 60 °C) — — ± 2.5 ± 6.25 %VFSS
Sensitivity V/P — 1.0 —- V/kPa
[8]
Response time tR — 1.0 —- ms
Output source current at full scale output IO+ — 0.1 —- mAdc
[9]
Warm-up time — — 20 —- ms

[1] 1.0 kPa (kiloPascal) equals 0.145 psi.

[2] Device is ratiometric within this specified excitation range.
[3] Offset (Voff) is defined as the output voltage at the minimum rated pressure.
[4] Full scale output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
[5] Full scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated
pressure.
[6] Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight-line relationship with pressure over the specified pressure range.
• Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the
minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum
rated pressure, at 25 °C.
• TcSpan: Output deviation over the temperature range of 10° to 60 °C, relative to 25 °C.
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60 °C, relative to 25 °C.
• Variation from Nominal: The variation from nominal values, for offset or full scale span, as a percent of VFSS, at 25 °C.
[7] Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero
pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal
[1]
operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5 °C between auto zero
and measurement.
[8] Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step
change in pressure.
[9] Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.

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Product data sheet Rev. 5 — 5 May 2021

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

9 Characteristics

9.1 On-chip temperature compensation, calibration, and signal

conditioning
The performance over temperature is achieved by integrating the shear-stress strain
gauge, temperature compensation, calibration, and signal conditioning circuitry onto a
single monolithic chip.
Figure 5 illustrates the differential or gauge configuration in the basic chip carrier (Case
482). A fluorosilicone gel isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the sensor diaphragm.
The MPXV7002 series pressure sensor operating characteristics, and internal reliability
and qualification tests are based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor performance and long-term reliability.
Contact the factory for information regarding media compatibility in your application.
Figure 6 shows the recommended decoupling circuit for interfacing the integrated sensor
to the analog-to-digital input of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 7 shows the sensor output signal relative to pressure input. Typical, minimum,
and maximum output curves are shown for operation over a temperature range of 10° to
60° C using the decoupling circuit shown in Figure 6. The output saturates outside the
specified pressure range.
Fluoro silicone Stainless
gel die coat Die steel cap

P1
Wire bond Thermoplastic
case

Lead
frame

P2
Differential sensing Die bond
element aaa-040607

Figure 5. Cross-Sectional Diagram SOP (not to scale)

+5 V

Vout OUTPUT
VS

IPS
1.0 µF 0.01 µF GND 470 pF

aaa-040608

Figure 6. Recommended Power Supply Decoupling and Output Filtering

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated
[1]
For additional output filtering, refer to Application Note AN1646 .
aaa-041822
5
Output Transfer function:
(V) 4.5
Vout = VS x (0.2 x P(kPa)+0.5) ±6.25% VFSS
VS = 5.0 Vdc
4
TA = 10 °C to 60 °C
3.5

2.5
max
2 typical
min
1.5

0.5

0
-2 -1 0 1 2
Differential pressure (kPa)

Figure 7. Output versus Pressure Differential

9.2 Pressure (P1)/Vacuum (P2) Side Identification Table

NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the
Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
The Pressure (P1) side may be identified by using Table 6.

Table 6. Pressure side identification

Pressure (P1)
Part Number Case Type
Side Identifier
MPXV7002GC6U/GC6T1 482A-01 Side with Port Attached
MPXV7002GP 1369-01 Side with Port Attached
MPXV7002DP 1351-01 Side with Part Marking

9.3 Minimum Recommended Footprint for Surface Mounted Applications

Surface mount board layout is a critical portion of the total design. The footprint for the
surface mount packages must be the correct size to ensure proper solder connection
interface between the board and the package. With the correct footprint, the packages
self-align when subjected to a solder reflow process. NXP recommends designing boards
with a solder mask layer to avoid bridging and shorting between solder pads.

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

0.100 TYP 8X
0.660 2.54
16.76

0.060 TYP 8X
1.52 0.300
7.62

0.100 TYP 8X inch

2.54 mm SCALE 2:1
aaa-040612

Figure 8. Small outline package footprint

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

10 Package outline

Figure 9. SOT1693-1, 8 Lead sensor, dual port package outline, 98ASA99255D, Rev. B

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

Figure 10. SOT1693-1, 8 Lead sensor, dual port package outline notes, 98ASA99255D, Rev. B

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Product data sheet Rev. 5 — 5 May 2021

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

Figure 11. SOT1854-1, Unibody sensor package outline, 98ASB17757C, Rev. C

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

Figure 12. SOT1854-1, Unibody sensor package outline notes, 98ASB17757C, Rev. C

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Product data sheet Rev. 5 — 5 May 2021

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

Figure 13. SOT1693-3, 8 Lead SOP, Side port package out line, 98ASA99303D, Rev. E

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

Figure 14. SOT1693-3, 8 Lead SOP, Side port package out line notes, 98ASA99303D, Rev. E

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

11 References
[1] AN1646 – Noise considerations for integrated pressure sensors
[Link]

12 Revision History
Table 7. Revision History
Document ID Release Date Data sheet status Change notice Supercedes
MPXV7002 Rev. 5 20210505 Product — MPXV7002 Rev. 4
Modifications • The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors, N.V. Legal texts have been adapted to the new company name where
appropriate.
• Global changes, revised as follows:
– Revised all images including the package outline drawings to comply with NXP
Semiconductor graphic standards.
– Performed minor grammar, content, and typographical changes throughout.
• Section 1, revised the first paragraph.
• Section 2, removed two bullets starting with "2.5 % typical..." and "6.25 % maximum" from the
list of features.
• Section 3, added new section.
• Section 4.1, removed row for "MPXV7002GC6T1".
• Section 6.2, added clarification stating this device family uses the style 2 pin configuration as
shown in Figure 10.
• Section 9.1, revised "A gel die coat..." to "A fluorosilicone gel...."
• Section 10, updated the package information section.
• Section 11, added new reference section.
• Cover page and Section 12, revised data sheet status to use current terminology "Product"
which replaces the term "Technical data" to describe the data sheet status. This change is a
terminlogy update.
MPXV7002 Rev. 4 2017 March Technical data — MPXV7002 Rev. 3.0
MPXV7002 Rev. 3.0 2015 January Technical data — MPXV7002 Rev. 2.0
MPXV7002 Rev. 2.0 2009 January Technical data — MPXV7002 Rev. 1.0
MPXV7002 Rev. 1.0 2008 September Technical data — MPXV7002 Rev. 0
MPXV7002 Rev. 0 2005 September Technical data — —

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

13 Legal information

13.1 Data sheet status

[1][2] [3]
Document status Product status Definition
Objective [short] data sheet Development This document contains data from the objective specification for product
development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL [Link]

notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated
limitation, all damages referenced above and all direct or general damages), in customer’s applications. NXP accepts no liability for any vulnerability.
the entire liability of NXP Semiconductors, its affiliates and their suppliers Customer should regularly check security updates from NXP and follow up
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Security — Customer understands that all NXP products may be subject 13.4 Trademarks
to unidentified or documented vulnerabilities. Customer is responsible
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applications and products. Customer’s responsibility also extends to other
open and/or proprietary technologies supported by NXP products for use
NXP — wordmark and logo are trademarks of NXP B.V.

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

Tables
Tab. 1. Ordering information ..........................................1 Tab. 5. Operating Characteristics ..................................4
Tab. 2. Ordering options ................................................2 Tab. 6. Pressure side identification ............................... 6
Tab. 3. Pin description ...................................................3 Tab. 7. Revision History .............................................. 14
Tab. 4. Maximum Ratings ............................................. 3

Figures
Fig. 1. Integrated pressure sensor schematic .............. 2 Fig. 10. SOT1693-1, 8 Lead sensor, dual port
Fig. 2. MPXV7002DP/DPT1 pin diagram ..................... 3 package outline notes, 98ASA99255D,
Fig. 3. MPXV7002GC6U/C6T1 pin diagram .................3 Rev. B ................................................................9
Fig. 4. MPXV7002GP pin diagram ............................... 3 Fig. 11. SOT1854-1, Unibody sensor package
Fig. 5. Cross-Sectional Diagram SOP (not to outline, 98ASB17757C, Rev. C ....................... 10
scale) ................................................................. 5 Fig. 12. SOT1854-1, Unibody sensor package
Fig. 6. Recommended Power Supply Decoupling outline notes, 98ASB17757C, Rev. C ..............11
and Output Filtering .......................................... 5 Fig. 13. SOT1693-3, 8 Lead SOP, Side port
Fig. 7. Output versus Pressure Differential .................. 6 package out line, 98ASA99303D, Rev. E ........ 12
Fig. 8. Small outline package footprint ......................... 7 Fig. 14. SOT1693-3, 8 Lead SOP, Side port
Fig. 9. SOT1693-1, 8 Lead sensor, dual port package out line notes, 98ASA99303D,
package outline, 98ASA99255D, Rev. B ........... 8 Rev. E ..............................................................13

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NXP Semiconductors
MPXV7002
Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and
calibrated

Contents
1 General description ............................................ 1
2 Features and benefits .........................................1
3 Applications .........................................................1
4 Ordering information .......................................... 1
4.1 Ordering options ................................................ 2
5 Block diagram ..................................................... 2
6 Pinning information ............................................ 3
6.1 Pinning ............................................................... 3
6.2 Pin description ................................................... 3
7 Maximum Ratings ............................................... 3
8 Operating Characteristics .................................. 4
9 Characteristics .................................................... 5
9.1 On-chip temperature compensation,
calibration, and signal conditioning ....................5
9.2 Pressure (P1)/Vacuum (P2) Side
Identification Table ............................................. 6
9.3 Minimum Recommended Footprint for
Surface Mounted Applications ........................... 6
10 Package outline ...................................................8
11 References ......................................................... 14
12 Revision History ................................................14
13 Legal information .............................................. 15

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.

© NXP B.V. 2021. All rights reserved.

For more information, please visit: [Link]
For sales office addresses, please send an email to: salesaddresses@[Link]
Date of release: 5 May 2021
Document identifier: MPXV7002