SM05 through SM36

TVS Diode Array

PROTECTION PRODUCTS
Description Features
The SM series of transient voltage suppressors (TVS) ‹ 300 watts peak pulse power (tp = 8/20μs)
are designed to protect components which are ‹ Transient protection for data & power lines to
connected to data and transmission lines from voltage IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
surges caused by electrostatic discharge (ESD), IEC 61000-4-4 (EFT) 40A (5/50ns)
electrical fast transients (EFT), and lightning. IEC 61000-4-5 (Lightning) 12A (8/20μs)
TVS diodes are characterized by their high surge ‹ Protects one bidirectional line or two unidirectional
capability, low operating and clamping voltages, and lines
fast response time. This makes them ideal for use as ‹ Working Voltages: 5V, 12V, 15V, 24V and 36V
board level protection of sensitive semiconductor ‹ Low clamping voltage
components. The dual-junction common-anode design ‹ Solid-state silicon avalanche technology
allows the user to protect one bidirectional data line or
two unidirectional lines. The low profile SOT23 Mechanical Characteristics
package allows flexibility in the design of “crowded” ‹ JEDEC SOT-23 package
circuit boards.
‹ Molding compound flammability rating: UL 94V-0
The SM series may be used to meet the ESD immunity ‹ Marking : Marking Code
requirements of IEC 61000-4-2, Level 4, “Human Body ‹ Packaging : Tape and Reel
Model” for air and contact discharge. ‹ Lead Finish: Matte tin
‹ RoHS/WEEE Compliant
Applications
‹ Cellular Handsets and Accessories
‹ Portable Electronics
‹ Industrial Controls
‹ Set-Top Box
‹ Servers, Notebook, and Desktop PC

Circuit Diagram Schematic & PIN Configuration

SOT-23 (Top View)

Revision 05/26/09 1 [Link]

 SM05 through SM36

PROTECTION PRODUCTS
Absolute Maximum Rating
R ating Symbol Value Units

Peak Pulse Power (tp = 8/20μs) Pp k 300 Watts

Thermal Resistance, Junction to Ambient θJ A 556 °C/W

Lead Soldering Temp erature TL 260 (10 sec.) °C

Op erating Temp erature TJ -55 to +125 °C

Storage Temp erature TSTG -55 to +150 °C

Electrical Characteristics
SM05

Par ame te r Symbo l Co nditio ns Minimum Typical Maximum Units

Reverse Stand-Off Voltage VRWM 5 V

Reverse Breakdown Voltage V BR It = 1mA 6 V

Reverse Leakage Current IR VRWM = 5V, T=25°C 20 μA

Clamp ing Voltage VC IPP = 1A, 9.8 V

tp = 8/20μs

Peak Pulse Current IP P tp = 8/20μs 17 A

Junction Cap acitance Cj Pi n 1 to 2 350 pF

VR = 0V, f = 1MHz

Junction Cap acitance Cj Pin 1 to 3 and 400 pF

Pi n 2 to 3
VR = 0V, f = 1MHz

SM12

Par ame te r Symbo l Co nditio ns Minimum Typical Maximum Units

Reverse Stand-Off Voltage VRWM 12 V

Reverse Breakdown Voltage V BR It = 1mA 13.3 V

Reverse Leakage Current IR VRWM = 12V, T=25°C 1 μA

Clamp ing Voltage VC IPP = 1A, 19 V

tp = 8/20μs

Peak Pulse Current IP P tp = 8/20μs 12 A

Junction Cap acitance Cj Pi n 1 to 2 120 pF

VR = 0V, f = 1MHz

Junction Cap acitance Cj Pin 1 to 3 and 150 pF

Pi n 2 to 3
VR = 0V, f = 1MHz

© 2009 Semtech Corp. 2 [Link]

 SM05 through SM36

PROTECTION PRODUCTS
Electrical Characteristics (Continued)
SM15

Parameter Symbol Conditions Minimum Typical Maximum Units

Reverse Stand-Off Voltage VRWM 15 V

Reverse Breakdown Voltage V BR It = 1mA 16.7 V

Reverse Leakage Current IR VRWM = 15V, T=25°C 1 μA

Clamp ing Voltage VC IPP = 1A, tp = 8/20μs 24 V

Peak Pulse Current IP P tp = 8/20μs 10 A

Junction Cap acitance Cj Pi n 1 to 2 75 pF

VR = 0V, f = 1MHz

Junction Cap acitance Cj Pin 1 to 3 and 2 to 3 100 pF

VR = 0V, f = 1MHz

SM24

Parameter Symbol Conditions Minimum Typical Maximum Units

Reverse Stand-Off Voltage VRWM 24 V

Reverse Breakdown Voltage V BR It = 1mA 26.7 V

Reverse Leakage Current IR VRWM = 24V, T=25°C 1 μA

Clamp ing Voltage VC IPP = 1A, tp = 8/20μs 43 V

Peak Pulse Current IP P tp = 8/20μs 5 A

Junction Cap acitance Cj Pi n 1 to 2 50 pF

VR = 0V, f = 1MHz

Junction Cap acitance Cj Pin 1 to 3 and 2 to 3 60 pF

VR = 0V, f = 1MHz

SM36

Parameter Symbol Conditions Minimum Typical Maximum Units

Reverse Stand-Off Voltage VRWM 36 V

Reverse Breakdown Voltage V BR It = 1mA 40 V

Reverse Leakage Current IR VRWM = 36V, T=25°C 1 μA

Clamp ing Voltage VC IPP = 1A, tp = 8/20μs 60 V

Peak Pulse Current IP P tp = 8/20μs 4 A

Junction Cap acitance Cj Pi n 1 to 2 40 pF

VR = 0V, f = 1MHz

Junction Cap acitance Cj Pin 1 to 3 and 2 to 3 45 pF

VR = 0V, f = 1MHz

© 2009 Semtech Corp. 3 [Link]

 SM05 through SM36

PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve
10 110
100
Peak Pulse Power - Ppk (kW)

90

% of Rated Power or IPP

80
1 70
60
50
40
0.1 30
20
10
0
0.01 0 25 50 75 100 125 150
0.1 1 10 100 1000 o
Ambient Temperature - TA ( C)
Pulse Duration - tp (µs)

Pulse Waveform

110
W aveform
100 Parameters:
90 tr = 8µs
td = 20µs
80

70
Percent of IPP

e -t
60

50

40 td = I PP /2
30

20

10

0
0 5 10 15 20 25 30
T im e (µs)

ESD Pulse Waveform (Per IEC 61000-4-2) IEC 61000-4-2 Discharge Parameters

Level First Peak Peak Test Test

Peak Current Current Voltage Voltage
Current at 30 ns at 60 ns (Contact (A ir
Discharge) Discharge)
(A ) (A ) (A ) ( kV ) (kV)

1 7.5 4 8 2 2

2 15 8 4 4 4

3 22.5 12 6 6 8

4 30 16 8 8 15

© 2009 Semtech Corp. 4 [Link]

 SM05 through SM36

PROTECTION PRODUCTS
Applications Information
Device Connection Options Device Schematic & Pin Configuration
The SM series is designed to protect one bidirectional
or two unidirectional data or I/O lines operating at 5 to
36 volts. Connection options are as follows:
z Bidirectional: Pin 1 is connected to the data line
and pin 2 is connected to ground (Since the device
is symmetrical, these connections may be re-
versed). The ground connection should be made
directly to a ground plane. The path length should
be kept as short as possible to minimize parasitic
inductance. Pin 3 is not connected.
z Unidirectional: Data lines are connected to pin 1
and pin 2. Pin 3 is connected to ground. For best
results, this pin should be connected directly to a
ground plane on the board. The path length should RS-232 Transceiver Protection Example
be kept as short as possible to minimize parasitic
inductance.

Circuit Board Layout Recommendations for Suppres-

sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended (Refer to application note
SI99-01 for more detailed information):
z Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.

Matte Tin Lead Finish

Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
© 2009 Semtech Corp. 5 [Link]
 SM05 through SM36

PROTECTION PRODUCTS
Outline Drawing - SOT23

e1
DIMENSIONS
3 MILLIMETERS
B DIM
MIN NOM MAX
A 0.89 - 1.20
A1 0.01 - 0.10
A2 0.88 - 1.10
E b 0.30 - 0.51
E1 c 0.08 - 0.18
D 2.80 2.90 3.04
E1 1.20 1.30 1.40
E 2.10 - 2.64
e 1.90 BSC
e1 0.95 BSC
1 2 L 0.40 0.50 0.60
L1 (0.55)
bxN N 3
0 0° - 8°
bbb C A B
e aaa 0.10
bbb 0.20

D A

aaa C A2 A

SEATING
PLANE
C A1 H

GAUGE PLANE 0 c
SEATING
PLANE
C
L
0.25
SIDE VIEW L1
SEE DETAIL A DETAIL A
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.

Land Pattern - SOT23

DIMENSIONS
DIM MILLIMETERS
C (2.20)
Z
(C) G G 0.80
E1 0.95
E 1.90
X 1.00
Y 1.40
Z 3.60
Y

E1

NOTES:

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. REFERENCE IPC-SM-782A.

© 2009 Semtech Corp. 6 [Link]

 SM05 through SM36

PROTECTION PRODUCTS
Marking Codes Ordering Information
Marking Qty per
Part Number Part Number R eel Size
Code Reel

SM05 M05 [Link] 3,000 7 Inch

SM12 M12 [Link] 3,000 7 Inch

SM15 M15 [Link] 3,000 7 Inch
SM24 M24
[Link] 3,000 7 Inch
SM36 M36
[Link] 3,000 7 Inch

Tape and Reel Specification

Pin 1 Location

User Direction of feed

A0 B0 K0

3.15 +/-0.15 mm 2.77 +/-0.15 mm 1.22 +/-0.15 mm

Tape K
B, (Max) D D1 E F P P0 P2 T(MAX) W
Width (MAX)

8.0 mm
1.0 mm 1.750±.10
4.2 mm 1.5 + 0.1 mm 3.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 + 0.3 mm
8 mm ±0.05 mm 2.4 mm 0.4 mm
(.165) - 0.0 mm mm mm mm mm - 0.1 mm

Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804

© 2009 Semtech Corp. 7 [Link]