SiT9121 Datasheet
SiT9121 Datasheet
Features Applications
Any frequency between 1 MHz and 220 MHz accurate to 6 decimal 10GB Ethernet, SONET, SATA, SAS, Fibre Channel,
places PCI-Express
LVPECL and LVDS output signaling types Telecom, networking, instrumentation, storage, servers
0.6ps RMS phase jitter (random) over 12 kHz to 20 MHz bandwidth
Frequency stability as low as ±10 ppm
Industrial and extended commercial temperature ranges
Industry-standard packages: 3.2x2.5, 5.0x3.2 and 7.0x5.0 mmxmm
For frequencies higher than 220 MHz, refer to SiT9122 datasheet
Electrical Characteristics
Parameter and Conditions Symbol Min. Typ. Max. Unit Condition
LVPECL and LVDS, Common Electrical Characteristics
Supply Voltage Vdd 2.97 3.3 3.63 V
2.25 2.5 2.75 V
2.25 – 3.63 V Termination schemes in Figures 1 and 2 - XX ordering code
1.71 1.8 1.89 V Only for LVDS output
Output Frequency Range f 1 – 220 MHz
Frequency Stability F_stab -10 – +10 ppm
-20 – +20 ppm Inclusive of initial tolerance, operating temperature, rated power
-25 – +25 ppm supply voltage, and load variations
-50 – +50 ppm
First Year Aging F_aging1 -2 – +2 ppm 25°C
10-year Aging F_aging10 -5 – +5 ppm 25°C
Operating Temperature Range T_use -40 – +85 °C Industrial
-20 – +70 °C Extended Commercial
Input Voltage High VIH 70% – – Vdd Pin 1, OE or ST
Input Voltage Low VIL – – 30% Vdd Pin 1, OE or ST
Input Pull-up Impedance Z_in – 100 250 kΩ Pin 1, OE logic high or logic low, or ST logic high
2 – – MΩ Pin 1, ST logic low
Start-up Time T_start – 6 10 ms Measured from the time Vdd reaches its rated minimum value.
Resume Time T_resume – 6 10 ms In Standby mode, measured from the time ST pin crosses
50% threshold.
Duty Cycle DC 45 – 55 % Contact SiTime for tighter duty cycle
LVPECL, DC and AC Characteristics
Current Consumption Idd – 61 69 mA Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE Disable Supply Current I_OE – – 35 mA OE = Low
Output Disable Leakage Current I_leak – – 1 A OE = Low
Standby Current I_std – – 100 A ST = Low, for all Vdds
Maximum Output Current I_driver – – 30 mA Maximum average current drawn from OUT+ or OUT-
Output High Voltage VOH Vdd-1.1 – Vdd-0.7 V See Figure 1(a)
Output Low Voltage VOL Vdd-1.9 – Vdd-1.5 V See Figure 1(a)
Output Differential Voltage Swing V_Swing 1.2 1.6 2.0 V See Figure 1(b)
Rise/Fall Time Tr, Tf – 300 700 ps 20% to 80%, see Figure 1(a)
OE Enable/Disable Time T_oe – – 115 ns f = 212.5 MHz - For other frequencies, T_oe = 100ns + 3 period
RMS Period Jitter T_jitt – 1.2 1.7 ps f = 100 MHz, VDD = 3.3V or 2.5V
– 1.2 1.7 ps f = 156.25 MHz, VDD = 3.3V or 2.5V
– 1.2 1.7 ps f = 212.5 MHz, VDD = 3.3V or 2.5V
RMS Phase Jitter (random) T_phj – 0.6 0.85 ps f = 156.25 MHz, Integration bandwidth = 12 kHz to 20 MHz, all
Vdds
LVDS, DC and AC Characteristics
Current Consumption Idd – 47 55 mA Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE Disable Supply Current I_OE – – 35 mA OE = Low
Differential Output Voltage VOD 250 350 450 mV See Figure 2
SiTime Corporation 990 Almanor Avenue, Sunnyvale, CA 94085 (408) 328-4400 [Link]
Pin Description
Pin Map Functionality
H or Open: specified frequency output
OE Input
L: output is high impedance Top View
1 H or Open: specified frequency output
ST Input L: Device goes to sleep mode. Supply current reduces to OE/ST 1 6 VDD
I_std.
No Connect; Leave it floating or connect to GND for better NC 2 5 OUT-
2 NC NA
heat dissipation
3 GND Power VDD Power Supply Ground
GND 3 4 OUT+
4 OUT+ Output Oscillator output
5 OUT- Output Complementary oscillator output
6 VDD Power Power supply voltage
Absolute Maximum
Attempted operation outside the absolute maximum ratings may cause permanent damage to the part. Actual performance of
the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Parameter Min. Max. Unit
Storage Temperature -65 150 °C
VDD -0.5 4 V
Electrostatic Discharge (HBM) – 2000 V
Soldering Temperature (follow standard Pb free soldering guidelines) – 260 °C
Thermal Consideration
JA, 4 Layer Board JC, Bottom
Package (°C/W) (°C/W)
7050, 6-pin 142 27
5032, 6-pin 97 20
3225, 6-pin 109 20
Environmental Compliance
Parameter Condition/Test Method
Mechanical Shock MIL-STD-883F, Method 2002
Mechanical Vibration MIL-STD-883F, Method 2007
Temperature Cycle JESD22, Method A104
Solderability MIL-STD-883F, Method 2003
Moisture Sensitivity Level MSL1 @ 260°C
Waveform Diagrams
OUT-
80% 80%
OUT+
VOL
Tr Tf
GND
V _ S w in g
0 V
t
OUT-
80% 80%
VOD
20% 20%
OUT+
VOS
Tr Tf
GND
Termination Diagrams
LVPECL:
VDD
OUT+ Z 0 = 50 D+
OUT- Z0 = 5 0 D-
50 50
V T T = V D D – 2.0 V
R1 R1
50 50
VTT
Figure 4. LVPECL AC Coupled Termination
VDD R1 R3
OUT+ Z0 = 50 D+
OUT- Z0 = 50 D-
R2 R4
LVDS:
VDD
OUT+ Z0 = 50 D+
OUT- Z0 = 50 D-
3.2±0.05 2.20 2 .2 5
#6 #5 #4 #4 #5 #6
2.5±0.05
0.9
YXXXX
1.6
0.7
1.00
#1 #2 #3 #3 #2 #1
0.6
0.75±0.05 0 .6 5 1 .0 5
#6 #5 #4 #4 #5 #6
1.20
YXXXX
#1 #2 #3 #3 #2 #1
0.75±0.05
2.60
1.10
YXXXX
3.80
#1 #2 #3 #3 #2 #1
1.60
1.40
0.90 ±0.10
1.60
Notes:
1. Top Marking: Y denotes manufacturing origin and XXXX denotes manufacturing lot number. The value of “Y” will depend on the assembly location of the device.
2. A capacitor of value 0.1 F between Vdd and GND is recommended.
Ordering Information
SiT9121AC -1C2-33E125.000000T
Packaging:
Part Family “T”, “Y”, “X”, “D”, “E” or “G”
Refer to table below for packing
“SiT9121” method
Leave Blank for Bulk
Voltage Supply
Signalling Type “18” for 1.8V ±5% (only LVDS)
“1” = LVPECL “25” for 2.5V ±10%
“2” = LVDS “33” for 3.3V ±10%
“XX” for 2.25V to 3.63V
Revision History
Version Release Date Change Summary
1.01 2/20/13 Original
1.02 12/3/13 Added input specifications, LVPECL/LVDS waveforms, packaging T&R options
1.03 2/6/14 Added 8mm T&R option and ±10 ppm
1.04 4/8/14 Included 1.8V option for LVDS output only
1.05 7/30/14 Included Thermal Consideration table
1.06 10/20/14 Modified Thermal Consideration values. Preliminary removed from the title
© SiTime Corporation 2014. The information contained herein is subject to change at any time without notice. SiTime assumes no responsibility or liability for any loss, damage or defect of a
Product which is caused in whole or in part by (i) use of any circuitry other than circuitry embodied in a SiTime product, (ii) misuse or abuse including static discharge, neglect or accident, (iii)
unauthorized modification or repairs which have been soldered or altered during assembly and are not capable of being tested by SiTime under its normal test conditions, or (iv) improper
installation, storage, handling, warehousing or transportation, or (v) being subjected to unusual physical, thermal, or electrical stress.
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Supplemental Information
The Supplemental Information section is not part of the datasheet and is for informational purposes only.
SiTime Corporation 990 Almanor Avenue, Sunnyvale, CA 94085 (408) 328-4400 [Link]
The Smart Timing Choice
The Smart Timing Choice
SiTime Corporation 990 Almanor Avenue, Sunnyvale, CA 94085 (408) 328-4400 [Link]
Silicon MEMS Outperforms Quartz Rev. 1.1 Revised October 5, 2013
Silicon MEMS Outperforms Quartz
The Smart Timing Choice
The Smart Timing Choice
SiTime vs Quartz
Mean Time Between Failure (Million Hours)
Electro Magnetic Susceptibility (EMS)
- 30
500 - 39 - 40
SiTime - 40 - 42 - 43
- 45
- 70 - 73
TXC 16
- 80
Pericom 14
- 90
0 200 400 600 Kyocera Epson TXC CW SiLabs SiTime
8.0 4.0
8
SiTime
Aging (±PPM)
3.0
6 2X Better
2.0
4 3.5
3.0 SiTime
SiTime
1.0 3X Better
2 1.5
0.0
0 10 100 1,000 10,000
1-Year 10-Year Power Supply Noise Frequency (kHz)
12.6
12
10.00 10
8
SiTime
6 Up to 25x
1.00 SiTime Better
Up to 30x 3.9
4 2.9
Better 2.5
2
0.6
0.10
10 100 1000 0
Vibration Frequency (Hz) Kyocera Epson TXC CW SiLabs SiTime
Notes:
1. Data Source: Reliability documents of named companies.
2. Data source: SiTime and quartz oscillator devices datasheets.
3. Test conditions for Electro Magnetic Susceptibility (EMS):
• According to IEC EN61000-4.3 (Electromagnetic compatibility standard)
• Field strength: 3V/m
• Radiated signal modulation: AM 1 kHz at 80% depth
• Carrier frequency scan: 80 MHz – 1 GHz in 1% steps
• Antenna polarization: Vertical
• DUT position: Center aligned to antenna
Devices used in this test:
SiTime, SiT9120AC-1D2-33E156.250000 - MEMS based - 156.25 MHz
Epson, EG-2102CA 156.2500M-PHPAL3 - SAW based - 156.25 MHz
TXC, BB-156.250MBE-T - 3rd Overtone quartz based - 156.25 MHz
Kyocera, KC7050T156.250P30E00 - SAW based - 156.25 MHz
Connor Winfield (CW), P123-156.25M - 3rd overtone quartz based - 156.25 MHz
SiLabs, Si590AB-BDG - 3rd overtone quartz based - 156.25 MHz
4. 50 mV pk-pk Sinusoidal voltage.
Devices used in this test:
SiTime, SiT8208AI-33-33E-25.000000, MEMS based - 25 MHz
NDK, NZ2523SB-25.6M - quartz based - 25.6 MHz
Kyocera, KC2016B25M0C1GE00 - quartz based - 25 MHz
Epson, SG-310SCF-25M0-MB3 - quartz based - 25 MHz
5. Devices used in this test: same as EMS test stated in Note 3.
6. Test conditions for shock test:
• MIL-STD-883F Method 2002
• Condition A: half sine wave shock pulse, 500-g, 1ms
• Continuous frequency measurement in 100 μs gate time for 10 seconds
Devices used in this test: same as EMS test stated in Note 3
7. Additional data, including setup and detailed results, is available upon request to qualified customers. Please contact productsupport@[Link].
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