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LIC Complete Notes

The document provides comprehensive exam notes on Linear Integrated Circuits covering six units, including IC fabrication, op-amp characteristics, applications, and special ICs like the 555 timer and voltage regulators. It details important concepts, formulas, and repeated questions that frequently appear in exams. Key topics include op-amp parameters, fabrication steps, and design calculations for various applications.

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0% found this document useful (0 votes)
3 views16 pages

LIC Complete Notes

The document provides comprehensive exam notes on Linear Integrated Circuits covering six units, including IC fabrication, op-amp characteristics, applications, and special ICs like the 555 timer and voltage regulators. It details important concepts, formulas, and repeated questions that frequently appear in exams. Key topics include op-amp parameters, fabrication steps, and design calculations for various applications.

Uploaded by

amydrt7
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

BIHAR ENGINEERING UNIVERSITY · B.

TECH 5TH SEM · CODE 104504

Linear Integrated Circuits


& Applications
Complete exam notes — all 6 units · repeated questions · important derivations

OP-AMP IC FABRICATION FILTERS OSCILLATORS

555 TIMER VOLTAGE REGULATORS DAC/ADC

UNIT 1

IC Fabrication

IC Classification

BY FUNCTION BY INTEGRATION SCALE

• Analog/Linear ICs — op-amps, • SSI — <10 gates


amplifiers • MSI — 10–100 gates
• Digital ICs — logic gates, flip- • LSI — 100–1000 gates
flops
• VLSI — >1000 gates
• Mixed-signal — ADC, DAC

Monolithic IC Fabrication — 9 Steps

Monolithic = all components (transistors, resistors, capacitors, diodes) fabricated on a single


silicon chip simultaneously.

1. Silicon wafer preparation — Czochralski method, p-type silicon crystal, sliced into
0.25mm wafers, polished.
2. Epitaxial growth — Thin n-type silicon layer (1–2μm) on p-type substrate using CVD at
1150°C. Forms active device region. Provides isolation.
3. Oxidation — Furnace with O₂/H₂O at 1000°C. Forms SiO₂ (0.5–1μm). Acts as insulating
mask.
4. Photolithography (Masking) — Photoresist → UV exposure through mask →
development → SiO₂ etching with HF. Transfers circuit pattern.
5. Etching — Wet etching (HF) or dry etching (plasma). Creates windows for diffusion.
6. Diffusion of impurities — Boron (p-type) or phosphorus (n-type) at 900–1200°C. Forms
p-n junctions, base, emitter, collector.
7. Ion implantation — Precise alternative to diffusion. Lower temperature, better control of
doping profile.
8. Metallization — Aluminium sputtered and patterned by photolithography. Forms
interconnections and bonding pads.
9. Packaging — Individual dies tested, diced, wire-bonded in DIP/SOIC/QFP packages.

Component Fabrication in Monolithic IC

DIODE RESISTOR

Reverse-biased base-collector junction of Sheet resistance of p-type base diffusion. R


NPN transistor. Collector left open. Good = ρ·L/W. Typical range: 20Ω–50kΩ.
switching characteristics.

CAPACITOR MOSFET

Junction type (reverse-biased p-n) or MOS p-substrate, n+ source/drain, SiO₂ gate


type (SiO₂ between conductors). Limited to insulator, metal gate. Channel forms when
<100pF. Vgs > Vth.

MOST ASKED — 7 MARKS

Draw and explain fabrication steps. Always include cross-section showing: p-substrate → n-
epitaxial → SiO₂ → p+ isolation → n+ emitter. Draw at each step.

UNIT 2
Op-Amp Characteristics

Ideal vs Actual (µA741) Parameters

PARAMETER IDEAL VALUE ΜA741 TYPICAL

Open-loop gain (Aol) ∞ 200,000

Input impedance ∞ 2 MΩ

Output impedance 0 75 Ω

Bandwidth ∞ 1 MHz (ft)

CMRR ∞ 90 dB

Slew rate ∞ 0.5 V/µs

Input offset voltage 0 2 mV

Input bias current 0 80 nA

DC Characteristics

Output error due to Vos: Voe = Vos × (1 + Rf/R1)


Output error due to IB: Voe = IB × Rf
Compensation resistor: Rcomp = R1 || Rf (at non-inverting input)
Offset current: Ios = |IB1 − IB2| → output error = Ios × Rf

AC Characteristics

Slew rate: SR = dVo/dt|max (V/µs)


Max frequency (undistorted): fmax = SR / (2π × Vp)
e.g. SR=0.5V/µs, Vp=10V: fmax = 0.5×10⁶/(2π×10) = 7.96 kHz

GBW product: GBW = Aol × BW = ft = constant = 1 MHz (741)


CMRR: CMRR = Ad/Ac = 20·log(Ad/Ac) dB

Two Golden Rules (from ideal op-amp):


(1) V+ = V− (virtual short — when negative feedback present)
(2) I+ = I− = 0 (no current flows into input terminals)
These two rules solve EVERY op-amp circuit analysis problem.
UNIT 3

Basic Op-Amp Applications

INVERTING AMPLIFIER NON-INVERTING AMPLIFIER

Vout = −(Rf/Rin)×Vin Vout = (1+Rf/R1)×Vin


Av = −Rf/Rin Av = 1+Rf/R1 ≥ 1
Zin = Rin Zin = very high

Inverting summing amp: Vout = −Rf(V1/R1 + V2/R2 + V3/R3)


Integrator: Vout = −(1/RC)∫Vin dt → slope −20dB/dec
Differentiator: Vout = −RC·dVin/dt → slope +20dB/dec
Voltage follower (buffer): Rf=0, R1=∞ → Av = 1, Zin = ∞, Zout = 0

DESIGN TRICK — WEIGHTED SUMMER (PYQ Q8B)

Vo = 0.2V1 + 2V2 + 5V3: Set Rf=10kΩ → R1=50kΩ, R2=5kΩ, R3=2kΩ (inverting). Add unity
inverter for positive output.

UNIT 4

Advanced Op-Amp Applications

Instrumentation Amplifier

Vout = (1 + 2R/RG) × (V2−V1) × Rf/R1


Gain set by single resistor RG. Very high CMRR. Used in sensor/bridge
measurements.
Active Filters

TYPE TRANSFER FUNCTION ROLLOFF

1st order LPF H(s) = Ao·ωc/(s+ωc) −20 dB/dec

1st order HPF H(s) = Ao·s/(s+ωc) +20 dB/dec below ωc

2nd order LPF (Sallen- H(s) = Ao·ωn²/(s²+2ζωns+ωn²) −40 dB/dec


Key)

2nd order LPF cutoff: fo = 1/(2π√(R1·R2·C1·C2))


Butterworth: Q=0.707, ζ=0.707, Ao=1.586, Rf/R=0.586
Design for fo: Set R1=R2=R, C1=C2=C → C = 1/(2π·fo·R)

Comparator / Schmitt Trigger

Upper threshold: VUT = +Vsat·R1/(R1+R2)


Lower threshold: VLT = −Vsat·R1/(R1+R2)
Hysteresis = VUT − VLT = 2·Vsat·R1/(R1+R2)

R-2R Ladder DAC

Vout = −(Rf/R)·(Vref/2^N)·(b1·2^(N-1)+b2·2^(N-2)+...+bN)
Resolution (LSB) = Vref/2^N
Advantages over weighted: only 2 resistor values, scalable to any N
bits.

UNIT 5

Special ICs

555 Timer — Pin Diagram Memory

Pin 1=GND · 2=Trigger(−) · 3=Output · 4=Reset · 5=Control · 6=Threshold


· 7=Discharge · 8=Vcc
Astable Mode (Square wave generator)

tHigh = 0.693(RA+RB)C
tLow = 0.693·RB·C
f = 1.44/((RA+2RB)C)
Duty cycle D = (RA+RB)/(RA+2RB) [always >50% without diode trick]

Monostable Mode (One-shot)

Trigger: negative pulse at pin 2 (< Vcc/3)


tp = 1.1·RA·C (output HIGH pulse width)

IC 566 VCO / IC 565 PLL

VCO (566): fo = 2(Vcc−Vc)/(R1·C1·Vcc)


PLL (565) lock range: fL = ±8fo/Vcc
PLL free-running: fo = 1/(3.7·R1·C1)

UNIT 6

Application ICs — Voltage Regulators

LM78XX (FIXED +VE) LM79XX (FIXED −VE)

7805=+5V, 7808=+8V, 7812=+12V, 7905=−5V, 7912=−12V, 7915=−15V. Same


7815=+15V. 3-pin: IN(1), GND(2), OUT(3). pin layout as 78XX but for negative supply.
Min input = Vout+2.5V

LM317 — Adjustable Positive Regulator

Vout = 1.25(1 + R2/R1) [Vref = 1.25V between OUT and ADJ]


Range: 1.25V to 37V, up to 1.5A
Set R1=240Ω (standard). Then: R2 = R1(Vout/1.25 − 1)
Example — Vout=9V: R2 = 240(9/1.25−1) = 240×6.2 = 1488Ω ≈ 1.5kΩ
LM723 — Variable Regulator

Low voltage (Vo < 7.15V): Vo = Vref·R2/(R1+R2)


High voltage (Vo > 7.15V): Vo = Vref(1+R1/R2)
Current limit sense resistor: Rsc = 0.6/Imax

SMPS vs Linear Regulator Comparison

PARAMETER LINEAR REGULATOR SMPS

Efficiency 30–50% (Vout/Vin×100%) 70–95%

Size/Weight Heavy (large transformer) Small and light

Output noise Very low High (switching noise)

Cost Low Higher

Thermal dissipation High — needs large heatsink Low

ICL8038 Function Generator

Generates sine, square and triangle waves simultaneously


fo = 0.3/(R·C) (RA=RB=R, 50% duty cycle)
Range: 0.001 Hz to 300 kHz. Sine distortion <1%

LM380 AUDIO AMPLIFIER

Fixed gain Av=50 (34dB) · Supply 10–22V · Max output power 2.5W · Input impedance 150kΩ
Repeated Questions — Appear Almost Every Year

REPEATED Monolithic IC fabrication steps with cross-section diagram 7 marks

9 steps: Wafer prep → Epitaxial growth → Oxidation → Photolithography → Etching →


Diffusion → Ion implantation → Metallization → Packaging.

Cross-section layers (bottom to top): p-substrate → n-epitaxial layer → SiO₂ → p+


isolation walls → n-type collector → p-type base → n+ emitter → Al metallization.

Epitaxial growth detail: n-type layer grown by CVD at 1150°C using SiCl₄ + H₂ gas.
Provides electrical isolation between adjacent components in same substrate.

Diffusion detail: Two-step — pre-deposition at ~1000°C then drive-in at higher temp.


Base region: boron (p-type). Emitter: phosphorus (n+ type).

REPEATED DC characteristics of op-amp — Vos, IB, Ios and their 7 marks

compensation

Voe from Vos: Voe = Vos(1+Rf/R1) [amplified by closed-loop gain]


Voe from IB: Voe = IB × Rf [reduced by Rcomp = R1||Rf at +input]
Voe from Ios: Voe = Ios × Rf [due to mismatch IB1≠IB2]

Input Offset Voltage (Vos): ~2mV for 741. Caused by mismatch in diff pair transistors.
Compensated using 10kΩ pot between pins 1 and 5 (offset null pins).

Input Bias Current (IB): ~80nA for 741. Average of two base currents. Compensate by
adding Rcomp = R1||Rf at non-inverting input — makes error voltages equal and cancel.

Input Offset Current (Ios): ~20nA for 741. Difference |IB1−IB2|. Minimized by matched
transistors (JFET input op-amps have much lower IB and Ios).
REPEATED 555 timer monostable multivibrator — design with 7 marks

calculations (PYQ 2024 Q4(a))

Circuit: RA between Vcc and pins 6,7. Capacitor C between pin 6 and GND. Trigger at
pin 2 (active LOW). Output at pin 3. Pin 4 (Reset) to Vcc. Pin 5 via 0.01µF to GND.

Operation: Normally output LOW, C discharged. Negative trigger (<Vcc/3) at pin 2 →


flip-flop sets → output HIGH → discharge transistor OFF → C charges through RA
toward Vcc → when Vc reaches 2Vcc/3 → flip-flop resets → output LOW → C
discharges rapidly.

tp = 1.1 × RA × C
Example: RA=100kΩ, C=10µF → tp = 1.1×10⁵×10⁻⁵ = 1.1 seconds
Design for tp=5ms: Choose C=1µF → RA = tp/(1.1×C) = 5×10⁻³/(1.1×10⁻⁶) =
4.55kΩ ≈ 4.7kΩ

Applications: Time delay, frequency divider, missing pulse detector, touch switch,
debounce circuit.

REPEATED LM317 adjustable voltage regulator — working and design 7 marks

for given Vout

Pins: Input (1), Output (2), Adjustment/ADJ (3).

Working: Internal 1.25V Vref maintained between OUT and ADJ pins. Current through
R1 = Vref/R1. Adjusting R2 sets output level.

Vout = 1.25(1 + R2/R1) [Iadj negligible]

Design for Vout = 12V: R1=240Ω


R2 = R1(Vout/1.25−1) = 240×(12/1.25−1) = 240×8.6 = 2064Ω ≈ 2.2kΩ

Design for Vout = 5V: R2 = 240×(5/1.25−1) = 240×3 = 720Ω ≈ 750Ω


REPEATED Slew rate — definition, cause, effect, and max frequency 7 marks

calculation

SR = dVo/dt|max (V/µs) [741: 0.5 V/µs]


Max undistorted freq: fmax = SR/(2π×Vp)
At Vp=1V: fmax = 0.5M/(2π×1) = 79.6 kHz
At Vp=5V: fmax = 0.5M/(2π×5) = 15.9 kHz
At Vp=10V: fmax = 0.5M/(2π×10) = 7.96 kHz

Cause: Internal 30pF compensation capacitor charges at constant rate I/C where
I~19µA. SR = 19µA/30pF = 0.63V/µs.

Effect: If output tries to change faster than SR → output becomes triangular wave →
harmonic distortion. Called slew-rate limiting.

Solution: Use high-SR op-amps: TL071=13V/µs, LF351=10V/µs, AD811=2500V/µs.

REPEATED R-2R Ladder DAC — circuit, working, advantages over 7 marks

weighted resistor DAC

Weighted resistor DAC problem: N-bit requires resistors R, 2R, 4R, ... 2^(N-1)R. For 8-
bit: ratio 128:1 — impossible to match accurately.

R-2R Ladder: Only two values regardless of N bits. Each node sees Thevenin resistance
= R. Each bit switch contributes binary-weighted current.

4-bit R-2R output (Rf=R):


Vout = −Vref(b1/2 + b2/4 + b3/8 + b4/16)
For input 1010 (decimal 10): Vout = −Vref(1/2+0+1/8+0) = −Vref×0.625
Resolution = Vref/2^N = Vref/16 per bit

Advantages: Only R and 2R values (easy precision matching), scalable, monotonic,


high accuracy, used in all modern DACs.
REPEATED Compare SMPS and linear regulators — efficiency and 7 marks

thermal (PYQ 2024 Q9(c))

Linear efficiency: η = Vout/Vin × 100%


e.g. Vin=12V, Vout=5V → η = 5/12 = 41.7% (58.3% wasted as heat)
SMPS typical efficiency: 70–95%

Linear regulator: Pass transistor in active region. Excess voltage (Vin−Vout) dropped as
heat. Power loss = (Vin−Vout)×IL. Needs large heatsink. Low EMI, simple design.

SMPS: Transistor switches ON/OFF at 20kHz–1MHz. Energy stored in inductor/


transformer. Duty cycle controls output. Tiny heatsink needed. Generates switching noise
requiring EMI filters.

Summary: Use linear for low-noise audio/analog. Use SMPS for battery-powered
devices, high power applications where efficiency matters.
Important Questions — High Probability for Exam

IMPORTANT Design second-order LPF and derive transfer function 7 marks

(PYQ 2024 Q6(b))

Sallen-Key 2nd order LPF: Two RC sections with op-amp unity gain (or gain Ao).
Positive feedback from output to non-inverting input through C2.

H(s) = Ao·ωn² / (s² + (ωn/Q)·s + ωn²)


ωn = 1/√(R1·R2·C1·C2) [natural frequency]
Q = √(R1·R2·C1·C2)/[C2(R1+R2)] [quality factor]
Butterworth: Q=0.707, ζ=0.707, Ao=1.586, Rf/R=0.586

Design for fo=1kHz, R1=R2=10kΩ:


C = 1/(2π×10³×10⁴) = 15.9nF ≈ 16nF
Rf = 0.586×R = 0.586×10k = 5.86kΩ ≈ 5.6kΩ

IMPORTANT IC 723 variable voltage regulator — working and circuit 7 marks

(PYQ 2024 Q7(a))

LM723 internal blocks: Voltage reference (Vref=7.15V), error amplifier (compares Vref
with feedback), series pass transistor (NPN controls output current), current limiting
transistor.

Low voltage (Vo < 7.15V): Vo = Vref × R2/(R1+R2)


High voltage (Vo > 7.15V): Vo = Vref × (1+R1/R2)
Current limit resistor: Rsc = 0.6/Imax
e.g. Imax=500mA → Rsc = 0.6/0.5 = 1.2Ω

Advantages over 78XX: Adjustable output (2V–37V), programmable current limiting,


foldback protection possible, external pass transistor for higher current capability.
CALCULATION Design adder: Vo = 0.2V1 + 2V2 + 5V3 (PYQ 2024 Q8(b)) 7 marks

Two-stage approach (inverting summer + unity inverter):


Stage 1: Choose Rf = 10kΩ
Coefficient 0.2 → R1 = Rf/0.2 = 10k/0.2 = 50kΩ
Coefficient 2 → R2 = Rf/2 = 10k/2 = 5kΩ
Coefficient 5 → R3 = Rf/5 = 10k/5 = 2kΩ

Stage 1 output: V'o = −(0.2V1+2V2+5V3)


Stage 2 (unity gain inverter, R=Rf=10kΩ):
Vo = +(0.2V1+2V2+5V3) ✓

Verify: Rf/R1=10k/50k=0.2✓ Rf/R2=10k/5k=2✓ Rf/R3=10k/2k=5✓

IMPORTANT List ideal op-amp characteristics + two golden rules 7 marks

(PYQ 2024 Q9(b))

• Infinite open-loop gain (Aol=∞) — amplifies infinitesimally small differential


signals
• Infinite input impedance (Rin=∞) — no current drawn from source
• Zero output impedance (Ro=0) — drives any load without voltage drop
• Infinite bandwidth (BW=∞) — amplifies all frequencies equally
• Infinite CMRR — perfect common-mode rejection
• Zero input offset voltage — output=0 when both inputs=0
• Zero input bias current — no DC current into inputs
• Infinite slew rate — instantaneous response to input change
• Zero drift — parameters stable with temperature
• Infinite PSRR — output unaffected by supply variation

Two golden rules:


1. V+ = V− (virtual short — when negative feedback present)
2. I+ = I− = 0 (no current into either input terminal)
These two rules solve EVERY op-amp circuit analysis problem.
IMPORTANT Positive clamper using op-amp and diode — circuit and 7 marks

waveforms (PYQ 2024 Q2(b))

Clamper principle: Shifts DC level of waveform without changing shape. Positive


clamper shifts waveform up so minimum = 0 (or reference).

Precision clamper circuit: Input → series capacitor C → inverting input. Diode from op-
amp output to inverting input (feedback diode). Non-inverting input at Vref. When output
goes negative: diode conducts, charges C to peak-negative voltage. Virtual ground
maintained at summing point.

For sinusoidal input Vm·sin(ωt), positive clamper:


Vout = Vm·sin(ωt) + Vm
Minimum = 0V, Maximum = 2Vm

Waveforms: Input = sine from −Vm to +Vm. Output = sine from 0 to 2Vm (entire wave
above zero axis). Shape unchanged.

IMPORTANT Fabrication flow for monolithic IC with diode and resistor 7 marks

(PYQ 2024 Q3(b))

1. p-type substrate — 1–10 Ω·cm, 0.25mm thick


2. Epitaxial growth — 5µm n-type layer (phosphorus, 0.5Ω·cm), CVD at 1150°C
3. Oxidation — SiO₂ 0.5µm for first mask
4. Isolation diffusion — p+ boron diffusion to substrate — creates isolated n-type
islands
5. Second oxidation — regrow SiO₂ for component windows
6. Anode/base diffusion — p-type boron creates diode anode AND resistor body in
n-island
7. Cathode diffusion — n+ phosphorus creates diode cathode
8. Resistor contacts — ohmic contacts at two ends. R = ρ×L/(W×t)
9. Metallization — Al deposited and patterned to interconnect diode + resistor
10. Passivation — protective SiO₂/Si₃N₄ layer. Bonding pads exposed.
IMPORTANT ICL8038 triangular waveform generator circuit and 7 marks

calculations (PYQ 2024 Q2(a))

ICL8038 key pins: Pin 2=sine out, 3=square out, 9=triangle out, 8=Vcc, 4=RA, 5=RB,
10=C, 6=FM bias, 11,12=sine adjust.

For 50% duty cycle (RA=RB=R):


fo = 0.3/(R×C)
Example: R=10kΩ, C=1nF → fo = 0.3/(10⁴×10⁻⁹) = 30 kHz
Example: R=100kΩ, C=10nF → fo = 0.3/(10⁵×10⁻⁸) = 300 Hz

Triangle amplitude ≈ Vcc/3 (peak-to-peak)

Design steps: (1) Choose fo. (2) Select C (0.001µF–1µF). (3) Calculate R = 0.3/(fo×C).
(4) Set RA=RB=R. (5) Adjust pins 11,12 for minimum sine distortion. (6) Triangle at pin 9,
square at pin 3.
PYQ 2024 — MCQ Answers (Code 104504)

MCQ Q1 — All 10 MCQ answers with explanations 2×7=14

(a) High slew rate — SR > 2πfVp needed to avoid distortion at high
frequencies
(b) Forming high-purity single-crystal layers — epitaxial growth creates
pure active device region
(c) Ratio of feedback and input resistors — Av = −Rf/Rin for inverting
amplifier
(d) Comparator — compares analog voltage to reference, outputs digital
HIGH or LOW
(e) Built on a single crystal substrate — "monolithic" = single stone/
chip
(f) Common Mode Rejection Ratio — CMRR = Ad/Ac = 20·log(Ad/Ac) dB
(g) Adjustable voltage regulator — LM317 adjustable from 1.25V to 37V
(h) Switching Mode Power Supply — high efficiency switching regulator
(i) Square wave generator — 555 in astable mode generates square wave
(j) Integrator and comparator — integrator makes triangle from square;
comparator makes square from triangle

LINEAR INTEGRATED CIRCUITS & ALL 6 UNITS · REPEATED QUESTIONS ·


APPLICATIONS · CODE 104504 · BEU 5TH SEM IMPORTANT QUESTIONS · PYQ 2024 ANSWERS
2024

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