Topic Title Full Details

Basic Fundamentals • Introduction to different iPhone models from 4 to 17 Pro Max

and Tool
Familiarization
• Physical specifications (size, body material, button placement, sensors)

• Identifying the model from the model number (Axxxx) and serial number

• History of hardware changes (board architecture, connector types, location

of key ICs)

• Differences between regular, Pro, and Pro Max models within the same
generation

• Introduction and use of basic tools:

- Screwdrivers: Pentalobe (for bottom screws), Tri-point (for internal
shield screws), Phillips #00/#000 (for the board), Flathead (for some
shields) – learning the proper force to avoid stripping threads
- Tweezers: sharp-point standard tweezers (for holding components),
curved tweezers (to reach difficult angles), anti-static tweezers (for
working on a live board), wide-tip tweezers (for holding flex cables)
- Spudger and plastic opening tools: technique for locking and
unlocking connectors without damaging the surrounding plastic
- Heating pad: proper temperature setting to soften display adhesive
(70-80°C for older models, 90-100°C for newer ones)
- Astiglass film and suction pump: using them together to create a
vacuum and lift the screen without cracking it

• Basic electronics principles:

- Definition of voltage (V), current (A), resistance (Ω), power (W),
and Ohm's law (V=IR)
- Short circuit: when it is bad and when it is normal (e.g., main power
lines)
- Capacitor: function of filtering noise, identifying a damaged
capacitor (short or open) with a multimeter
- Diode and Zener diode: reverse voltage protection
- Zero-ohm resistor: function as a fuse or jumper
Topic Title Full Details

• How to use a multimeter:

- Understanding buttons and ranges (DC voltage, resistance,
continuity)
- Measuring voltage on the battery connector, main power lines
(VCC_Main, VDD_BOOST)
- Continuity testing to diagnose trace breaks (beep means connection
is established)
- Measuring resistance to GND to find a soft short
- Using diode mode to test ICs and crystals

Disassembly and • Proper technique for opening different iPhones:

Professional
- Correct order of removing screws (with a reinstallation placement
Assembly
guide)
- Using a heating pad and Astiglass film for iPhones after X (IP68
adhesive)
- Method of opening with suction pump and plastic opener without
touching the home button / Face ID flex
- Specific tips for iPhone 17: stronger adhesive and narrower bezel
screen → requires more heat and high precision when inserting the
plastic opener
• Connecting and disconnecting connectors:
- Identifying different types of connectors (ZIF, board-to-board, press-
type)
- Using a spudger to unlock the battery connector (the first thing to do)
- Technique to avoid fraying the pins of connectors (antenna, LCD,
touch)
- Working with new connectors on iPhone 12 and later (very tiny
screen and wireless connectors)

• Replacing common components (practical details):

- Screen: removing the shield cover, opening flex cables, installing a
new screen and transferring the earpiece speaker, proximity sensor,
metal shields. Testing touch, 3D Touch, brightness, color, dead pixels.
- Battery: removing the special pull tabs – correct pulling method and
possibility of tearing. Gentle heat if the tab tears. Using flux and
isopropyl alcohol for safe removal. Installing a new battery with
double-sided adhesive tape.
- Rear and front camera: diagnosing failure (not focusing, shaking,
Topic Title Full Details

blurriness, colored lines). Replacing without damaging the TrueDepth

sensor. Testing 4K/HDR recording.
- Speaker and microphone: removing with heat (strong adhesive).
Replacing the protective mesh if sound is muffled.
- Flex cables for power, volume, silent buttons: troubleshooting
unresponsive buttons. Replacing the flex without touching the main
antenna.
- Charging port flex (Lightning / USB-C): diagnosing failure (cable
recognized but not charging). Method of removal in different models
(some require heating the back cover).
- Back cover and wireless charging ring (MagSafe): replacing the
entire glass back (hazardous). Replacing the MagSafe ring and
wireless charging coil with soldering.
• Re-sealing and final testing:
- Cleaning old adhesive with alcohol and plastic tweezers
- Installing a new waterproof adhesive specific to each model (screen
perimeter ring). Using a press mold for better adhesion.
- Final test: pressing the screen to lock all clips, optional water ingress
test with IP testing device. Testing all functions (WiFi, Bluetooth,
microphone, speaker, wireless charging, Face ID, buttons).

Working with • Introduction to schematic reading software (ZXW Tools):

Schematics and
- Installation and cracking (Windows/Mac version). Obtaining
Boardview
schematic and boardview files monthly or permanently.
- User interface: searching by IC name, component number, voltage,
signal.
• Reading schematic diagrams:
- Identifying main blocks: Power Management, Audio, Display,
Camera, RF, Baseband.
- Following lines: VCC, VDD, I2Cn, SPI, UART.
- Markings: "PP_" for power lines, "GPIO" for general-purpose ports,
pull-up resistors.
- Finding test points for measurements.
• Reading boardview files:
- Locating components: capacitor Cxxxx, resistor Rxxxx, IC Uxxxx.
- Seeing layer-to-layer distance (two-layer board topology). Using
layer filters.
- Identifying vias that go from one layer to another.
Topic Title Full Details

• Using a DC power supply for troubleshooting:

- Setting voltage to battery level (3.8V-4.5V) and current to max (2A-
3A). Connecting to the battery connector via a special cable.
- Reading the ammeter: sleep mode (0.00A-0.005A), boot mode
(fluctuating 0.2A to 1A), normal consumption (0.3A).
- Finding a hard short: connecting the supply at low voltage (1V) and
gradually increasing current to 2A, then finding the hot component
with a thermal pen (or back of hand).
- Diagnosing a soft short: high current draw in sleep mode or
incomplete boot.

Component • Introduction to programmers and adapters:

Programming – Level
- QianLi iCopy Plus 2.1 / JC V1S Pro: for battery, screen, vibrator,
1
touch, wireless charging.
- JCID P15 (or P13): specifically for NAND flash, equipped with
BGA110 and BGA70 sockets.
- Face ID adapter: for connecting the TrueDepth module to the
programmer.
- EEPROM adapter: for serial storage ICs.
• Working with iCopy (step-by-step details):
- Copying True Tone: connect the defective screen (which has the
original serial) to the programmer → press Read → take the serial →
connect the new screen → Write. Result: auto-brightness and color
adjustment next to True Tone become active.
- Rewriting the battery: backup from the old battery (even if
defective). Connect the new battery (can be cheap Chinese) → Write
→ health status is reported and "Unknown Part" message is removed.
- Copying vibrator / 3D Touch: sometimes after replacing these
components, the touch screen does not work. Serial copying is
mandatory.
• Backing up and writing the Face ID serial (TrueDepth module):
- Open the phone and locate the Face ID module (top of screen).
Disconnect the connector.
- Connect to the special adapter and then to the iCopy programmer
(Pro version). Read the data (contains serials for Dot Projector,
Infrared Camera, Flood Illuminator).
- If replacing the module with another working module, you cannot
write directly (because the CPU does not allow it). Instead, you must
Topic Title Full Details

use the tag-on flex method (explained later).

• Advanced equipment – selection and setup:

- Soldering station like Hakko FX-951 or TS100: different tips (D32
for BGA work, C4 for dense boards). Temperature setting (320-350°C
for standard solder, 380-400°C for leaded)
- Hot air rework station like Quick 861DW: airflow setting (slow for
board-level work), temperature (350°C for removing ICs, 320°C for
installation). Proper distance (1-2 cm with a small nozzle)
- 3D microscope with at least 10x zoom. Adjusting eyepiece distance.
Using an LED ring light.
- Preheater from below: to warm the whole board to 150°C before
removing large ICs, preventing board warpage.
• Soldering techniques (practical):
- Tinning pads: soldering station + flux-core solder → a thin layer of
solder on the copper pad. Cleaning with wick.
- Removing an IC with hot air: cover the area around the IC with
liquid flux. Apply heat in a circular motion until the solder melts. Lift
Microsoldering – with tweezers.
Foundation - Cleaning pads: using solder wick and soldering station + flux. For
small ICs, place the wick on the pad and apply heat.
- Installing a new IC: precisely align the pins/pads. Gentle hot air →
solder melts and the IC settles on the pads.
- Trace repair with magnet wire:
- Remove the IC and observe the broken trace under the microscope.
- Scratch the solder mask over the board layer with a syringe needle or
special tool to expose the copper trace.
- Cut magnet wire to appropriate length, tin both ends, solder to the
original trace and the destination trace (IC pad). Then secure with UV
glue.
- Pad repair with epoxy:
- Clean the torn area (solder mask, glue, organic residue).
- Create a piece of copper foil (from PCB scrap). Cut to the size of the
original pad.
- Glue it with two-part epoxy onto the pad location. Cure with 80°C
heat (or UV epoxy).
- Solder the copper piece to the remaining trace (with magnet wire or
solder). Then re-tin it.

Working with • Separating the layers of a sandwich board (from X to 17):

Topic Title Full Details

- Examining the boardview: top layer contains CPU, NAND, audio IC.
Bottom layer contains baseband, modem, antenna.
- Using a board separator machine (e.g., JCID V2SE). Place the board
on the fixture, set temperature (around 300°C), apply heat and slowly
turn the separating screw.
- Manual method for professionals: hot air with a wide nozzle over the
whole board, then a thin blade between the layers to twist.
• Cleaning and preparing the layers:
- Removing excess solder from the pads of both layers with wick and
soldering iron.
- Flattening pads (if tilted) with a soft plastic card.
- Reballing the bottom layer pads with a dedicated stencil (0.35mm
ball size for iPhone X to 11, 0.25mm for 12 and above).
• Re-laminating the layers while maintaining alignment:
- Place the bottom layer on the fixture, arrange the top layer using
guide holes.
- Use plenty of flux. Apply hot air from above and preheat from below
Sandwich Boards and (150°C). When the solder melts, the top layer gently settles.
BGA ICs - Test connectivity with a multimeter (main connectors). If incomplete,
repeat.

• Installing and removing BGA ICs (advanced details):

- Reballing: clean old solder from the IC, use a stencil (matching the
IC size), spread solder balls (Sn63/Pb37), apply hot air to melt the
balls.
- Using underfill glue for large ICs like CPU: after soldering, inject
liquid glue from the side of the IC, apply heat to draw it under the IC,
then UV or heat to cure.
- Replacing common ICs:
- Power IC (PMU): typically shorted or not distributing voltage.
Replace using BGA method with underfill.
- Audio IC: causes reset loop or no sound. Replace and reball.
- Touch IC: famous on iPhone 6 Plus. Replace with new IC and
jumper routing.
- Charging IC: failure leads to no charging or high battery drain.
- WiFi + Bluetooth: often paired with CPU; replacement only with
software pairing (using a programmer).

Most Specialized • Face ID repair – advanced:

Topic Title Full Details

Skills
- Diagnosing component failure: if Face ID gives "Face ID not
available" error, which sensor is faulty? Read with a Face ID
programmer: if it doesn't read data → Dot Projector. If it reads but IR
camera doesn't work → IR camera.
- Using a tag-on flex: remove the defective module from the board.
Connect a blank tag-on flex to the programmer and write the backed-
up data onto it. Then solder the tag-on flex with ultra-thin wires in
place of the defective module. Face ID will work.
- Dot projector IC-level repair: open the top laser shield of the dot
projector, re-solder the internal cable or replace the driver IC.
• Replacing and upgrading NAND flash memory:
- Backup data from old NAND: using JCID P15 to a computer. Data
includes: phone serial number, model number, WiFi/BT MAC address,
Syscfg settings.
- Removing the NAND: hot air at 350°C, 6mm nozzle. Flux under
NAND. Lift with tweezers.
- Preparing new NAND: reball with stencil (0.35 or 0.3mm). Clean
pads on the board.
- Writing data to new NAND: place NAND in P15 socket, use ZiDong
Write program. Select the backup file.
- Soldering and restoring: install NAND on the board, connect to
iTunes/Finder. Restore the phone when it enters DFU mode. After
restoration, the phone boots with the new storage.
• Signal troubleshooting with an oscilloscope:
- Difference of a digital oscilloscope (2-channel + FFT function).
Setting Volts/div and Time/div.
- Measuring clock on I²C lines: frequency should be 100kHz or
400kHz. Observe the waveform (square wave).
- Troubleshooting data lines: circuit with zero signal or noise. Identify
faulty filter capacitor or defective IC.
• Hardware-level data recovery:
- Triple pairing (CPU + NAND + EEPROM):
- From a burnt board (fire damage, water damage, corrosion), carefully
remove the CPU chip, NAND chip, and EEPROM IC (model-
specific).
- Select a healthy donor board of the same model. Remove its CPU,
NAND, and EEPROM.
Topic Title Full Details

- Solder the original chips (from the burnt board) onto the donor board
(after cleaning).
- Result: the phone boots with all user data (photos, videos, messages).
- This method requires a powerful microscope and soldering skills at a
miraculous level.

Systematic Diagnosis • Known issues for each model (with practical details):
and Model-Specific
- iPhone 6/6 Plus – Touch Disease: cause: two touch ICs (U2402/M1)
Fault Repair
loosen on the board. Replace ICs and add jumpers (extend the trace
with magnet wire).
- iPhone 7/7 Plus – Loop Disease (Audio IC): cause: audio IC (U3301)
creates a short or loses communication. Solution: remove the IC,
jumper specific power and signal lines according to ZXW
documentation.
- iPhone X – Green line on display: cause: impact to the board and
partially disconnected flex cable. If gentle pressure doesn't fix, replace
entire screen.
- iPhone 12 and above – MagSafe not charging: cause: wireless
charging controller IC (U2100 or U2200) burns out. Replace the IC
and also the protection diode.
- iPhone 13/14 – "Unknown Part" message: after replacing battery or
screen, you must copy the serial with iCopy. In some cases, entering
DFU and restoring is needed to remove the message.
- iPhone 15/16/17 – USB-C port failure: cause: dirt or oxidation on the
port pins. If not resolved, replace the port flex which includes the
controller IC (difficult soldering).
• Board-level diagnosis without replacing the whole board:
- Finding a global short (VCC Main short): connect power supply to
VCC_main line at 1V. Increase current draw up to 5A. Use a thermal
pen (FLIR) to find the hot capacitor. Remove that capacitor with hot
air (often a 22µF capacitor). The short is resolved.
- Replacing faulty capacitors and ICs: identifying a shorted capacitor:
multimeter on continuity, if both sides of the capacitor are shorted to
GND, the capacitor is bad (be careful that the power line doesn't
inherently have low resistance).
- Repairing antenna and GPS lines: troubleshoot with oscilloscope and
antenna testing. Replace the antenna switch on the board.
• Working with advanced diagnostic software:
- PurplePro: for iPhone X to 13, can reset the Secure Enclave (in case
Topic Title Full Details

of iCloud lock with forgotten password or NAND replacement).

Requires special hardware (Medusa or PurpleBox).
- MagicCFG: Windows software for reading and writing NAND
configuration without removing it (via license and JTAG).
- iDeviceForums Tool: collection of diagnostic scripts for testing
components via SSH in DFU mode.
• Final testing and phone delivery:
- Running Apple Hardware Test: connect power supply and cable,
enter diagnostic mode using key combinations (e.g., D+ and D- while
connecting to iTunes). All sensors and components are checked.
- Checking water resistance (if IP testing equipment is available):
vacuum bag or specialized device (e.g., HJ-136). Negative pressure of
-60 kPa for 30 seconds. If no pressure drop, sealing is perfect.
- Writing a repair report and warranty: record model, serial number,
initial fault, replaced parts, repair date. Deliver to customer with
explanation of tested functions.

Complementary and • Parts pairing policies in iOS 18 and practical workarounds:

Up-to-Date
- Details of new issues in iPhone 17: reports of the phone completely
Workshop Skills
shutting down after battery charge completion ("brick" state) –
requires understanding of Apple's policies.
- Method of IC swap from old part to new for display (moving touch
driver IC or internal flex).
- Method of battery management board (BMS) swap from old battery
to new to remove "Unknown Part" message and preserve health
metering.
- Identifying cases that are not solved by simply copying the serial
(iCopy) and require DFU restore or physical IC transfer.
• Analyzing panic log files:
- Access path: Settings > Privacy & Security > Analytics &
Improvements > Analytics Data
- Finding files prefixed with panic-full or panic-base
- Reading the "PanicString" section and identifying the cause of
frequent restarts (reset loop) without opening the phone.
- Recognizing common errors: SMC PANIC (power issue), CPU-
MON (overheating or CPU voltage), SPDM (cable or sensor issue),
I2C (data line break).
- Using online tools like PanicLog Analyzer for automatic error
Topic Title Full Details

translation.
• Specialized antenna and baseband (network) troubleshooting:
- Diagnosing "No Service", "Searching", "Invalid SIM" errors caused
by hardware.
- Examining baseband power and signal lines with oscilloscope and
schematics (BB_VCC, VDD_BB, BB_SWI lines).
- Replacing baseband IC and RF IC (for Intel and Qualcomm models).
- Repairing antenna switch lines and antenna filters on the board.
- Reballing or replacing baseband power IC (BB_PMU) on iPhone X
to 12 models.
• Professional online tools and resources:
- Working with Applesentials and GSX (Apple warranty and repair
history information system) – for authorized repairers and similar tools
for independent repairers.
- Using [Link] (open-source technical resource containing step-
by-step guides, free schematics, and a specialist forum).
- Working with a manual charger (Trbo charger or DC power supply
with direct charging capability): technique to wake up "deep
discharge" batteries that won't respond to a regular charger.
- Introduction to 3uTools and iMazing software for full component
and log reporting without needing a jailbreak.
• Advanced data recovery techniques (beyond triple pairing):
- Extracting SysCfg from a faulty NAND: using specialized software
(e.g., Medusa or PC-3000) to recover SysConfig calibration data from
an apparently dead NAND without opening it.
- Double pairing method (CPU + NAND): for some models (e.g.,
iPhone 8 and X) or specific conditions where moving the third IC
(EEPROM) is not needed – replacing CPU and NAND is sufficient.
Advantage: reduced risk and repair time.
- Data recovery from a board with corroded layers: direct wiring
technique to test points to read the NAND.

Additional Workshop • 1. Flex cable repair (not just replacement):

Skills
- Re-soldering a physical button onto the power/volume/silent flex
(when the button itself has detached from the flex board)
- Replacing internal pins of the Lightning port without replacing the
whole flex
- Opening, cleaning, or replacing the rubber home button (iPhone 6 to
Topic Title Full Details

8)
• 2. Ultrasonic board cleaning:
- Using an ultrasonic cleaner with a special solution (deionized water
+ isopropyl alcohol) for water-damaged or battery-acid-corroded
boards
- Drying method after washing (oven at 70°C or hot air station)
• 3. Speaker and receiver repair at the component level:
- Separating the speaker diaphragm from the body and cleaning the
voice coil of lint and rust
- Replacing the earpiece (top screen receiver) membrane without
replacing the whole speaker
• 4. Layer separation of sandwich boards without a machine (full manual
method):
- Using hot air station + thin blade + 3D-printed frame (when a board
separator is not available)
• 5. Digital protocol analysis with oscilloscope (Decoding I2C/SPI/UART):
- Practical measurement and data interpretation on the I2C bus (e.g.,
detecting data transmission from the proximity sensor or detecting a
broken data line)
- Special settings for automatic protocol decoding on the oscilloscope
• 6. Reballing without a stencil (free balling / manual balling):
- Placing individual solder balls with a needle under a microscope for
ICs that don't have a suitable stencil
- Using solder paste with a homemade stencil (laser-cut on plastic
film)
• 7. Wireless charging coil repair (re-winding):
- Rewinding lacquered copper wire to replace a burnt MagSafe ring
(without replacing the entire back cover)
- Determining the correct number of turns and wire diameter with a
multimeter and caliper
• 8. Advanced voltage injection for shorts (step-by-step with workshop
details):
- Gradually increasing voltage from 0V upward in 0.1V steps until the
short starts drawing current
- Simultaneously using alcohol (white vapor method) or a FLIR
Topic Title Full Details

thermal camera to find the hot component

- Difference in behavior between a soft short and a hard short in
response to current

• 9. Repairing a burnt battery connector (pin-level):

- Removing healthy pins from a donor connector and installing them
on the original board (when the board pads are intact but the connector
plastic has melted)
- Using two-part or UV glue to secure the pins
• 10. Hardware-level MDM unlock (for independent repairers):
- Changing the board serial number or WiFi/BT MAC address to
bypass corporate MDM
- Required tools: JCID P15, PurplePro, or Medusa
- Ethical note: only for devices you legally own
• 11. Replacing a crystal oscillator at board level:
- Diagnosing a faulty crystal with an oscilloscope (absence of a sine or
square wave at the specified frequency)
- Soldering small crystals (2-pin or 4-pin) with hot air at low
temperature (280°C) to avoid cracking the crystal
• 12. Soldering on the Face ID flex without using a tag-on flex:
- Replacing the dot projector driver IC on the original Face ID flex
- Using hot air + preheating from below + special flux for flex cables
(temperature 260-280°C, very low airflow)
- Protecting optical sensors with aluminum foil during soldering
• 13. Taptic Engine repair at the coil level:
- Opening the metal casing of the Taptic Engine (with high precision)
- Finding a broken wire in the voice coil and re-soldering with thin
magnet wire (0.05mm)
- Re-gluing the diaphragm with special glue (or silicone glue)
• 14. Bottom loudspeaker repair without replacing the component:
- Replacing torn foam or membrane of the original speaker (not just
the protective mesh)
- Using a speaker repair kit (includes new membrane, voice coil, and
glue)
- Adjusting the voice coil gap using a test signal and oscilloscope
Topic Title Full Details

• 15. Proximity sensor repair at flex level:

- Opening the top screen flex (which contains the proximity sensor,
microphone, and ambient light sensor)
- Replacing or re-soldering the proximity sensor (small black
component) with hot air at 250°C
- Calibration with iCopy (specific models)
• 16. Thread repair on the chassis (helicoil):
- Using a helicoil for stripped plastic or metal threads in the phone
chassis (e.g., screen or board screw posts)
- Repairing copper threads on an aluminum chassis (on older models)

• 1. Screen lamination (glass only repair):

- Replacing only the broken front glass (without replacing the whole
OLED/LCD panel)
- Requires a separator machine, laminator, OCA film, and de-bubbler
(autoclave)
- Steps: separate broken glass from display panel using tungsten wire
or separator – clean remaining OCA adhesive from the panel with
alcohol and plastic blade – attach new glass with OCA film – laminate
(heat and pressure) – remove bubbles in autoclave or de-bubbler
- Benefit: reduces repair cost for expensive OLED panels (iPhone X
and above) and preserves the original lamination
• 2. Touch ID repair – iPhone 5s to 8 (and SE 1st to 3rd generation):
- Moving the home button IC from a broken button to a new button (to
preserve pairing with the CPU) – this IC is usually on the home button
flex and is paired with the main board
- Repairing the home button flex (re-soldering torn pins or replacing
copper traces with magnet wire)
- Fixing "Touch ID failed" error after screen or battery replacement –
hardware methods including resetting the Secure Enclave with tools
like JCID or PurplePro (on specific models)
- Replacing the rubber home button (physical button part) without
damaging the flex or IC
• 3. Hardware iCloud unlock (iCloud bypass via serial change):
- Changing the serial number, BT MAC, and WiFi MAC using JCID
P15 / PurplePro / Medusa
- Steps: read original information from NAND – change serial to a
clean serial (from a donor board or authorized serials) – write new
Topic Title Full Details

information to NAND – restore the phone via iTunes/3uTools

- On some models, full NAND replacement or Syscfg editing is also
required
- Ethical note: only for devices where the legal owner has forgotten
their iCloud password or the device is iCloud-locked and the owner is
present (with proof) – doing this on stolen devices is unethical and
illegal
• 4. Gyroscope / accelerometer repair:
- These sensors are usually separate ICs on the board (e.g., LIS331,
BMI160, STM221); failure causes automatic screen rotation failure,
incorrect orientation detection, errors in games and map apps
- Diagnosis: test with sensor testing apps (e.g., Sensor Test) and
confirm with oscilloscope (check I2C lines and data output)
- Repair: replace or reball the gyroscope IC with hot air (300°C, low
airflow) – note that some models have a 6-axis IC (e.g., BMI160) that
includes both accelerometer and gyroscope in one package
- Calibration after replacement: on some models, calibration via
software tools (e.g., JCID or PurplePro) is required
• 5. NFC module repair (Apple Pay – Near Field Communication loop):
- NFC failure typically manifests as inability to recognize bank cards
or "Apple Pay not available" error
- Main components: NFC controller IC (e.g., PN548, SN100, PN80V)
and the NFC coil (loop on back cover or chassis)
- Repair: replace the NFC controller IC using BGA method (precision
in reballing and soldering) – on some models this IC is paired with the
CPU and requires serial rewriting (similar to Face ID) – repair or
replace the NFC coil (solder broken points or rewind with lacquered
wire)
- After replacing the IC, you must use tools like JCID or PurplePro to
synchronize the NFC serial with the main board (otherwise NFC will
not work).