Microcontroller and Embedded System
Microcontroller and Embedded System
pm
USN
4
Microcontrollers and Embedded Systems
:2
Time: 3 hrs. Max. Marks: 100
6
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Note: 1. Answer any FIVE full questions, choosing ONE full question from each module.
2. M : Marks , L: Bloom’s level , C: Course outcomes.
01
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Module – 1 M L C
Q.1 a. Differentiate between: 10 L2 CO1
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i) RISC and CISC
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ii) Microprocessor and micro controller
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b. With a neat diagram, explain embedded system hardware. 10 L2 CO1
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12
OR
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Q.2 a. Explain in detail about Current Program Status Register (CPSR). 10 L2 CO1
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Module – 2
Q.3 a. Explain about load store instructions in ARM with an example. 10 L2 CO2
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Module – 3
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01
25
OR
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Q.6 a. Explain the purpose of embedded system used in various domains. 10 L2 CO3
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Module – 4
Q.7 a. Explain the characteristics of embedded system. 10 L2 CO4
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BCO601
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OR
Q.8 a. What are the operational and non operational quality attributes of an 10 L1 CO4
embedded system.
4
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b. With a neat diagram, explain how source file to object file translation takes 10 L2 CO4
place in high level language based firmware development.
6
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Module – 5
01
Q.9 a. With a neat diagram, explain operating system architecture. 10 L2 CO5
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b. Explain the steps involved in selecting RTOs. 10 L2 CO5
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02
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OR
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Q.10 a. Write a note on multiprocessing and multitasking. 10 L1 CO5
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b. Explain the following: 10 L2 CO5
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i) Simulator, Emulator
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ii) Boundary scan
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0p
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01
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BEC601/BTE601/BVL601
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USN
5
Embedded System Design
6 :2
Time: 3 hrs. Max. Marks: 100
:0
Note: 1. Answer any FIVE full questions, choosing ONE full question from each module.
2. M : Marks , L: Bloom’s level , C: Course outcomes.
01
L
-B
Module – 1 M L C
Q.1 a. Define Embedded System. Explain the six purpose of Embedded system 8 L2 CO3
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with an example for each.
02
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b. Bring out the differences between RISC and CISC. 4 L2 CO3
c.
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Mention all the cores around which an embedded system is built. Discuss 8 L2 CO3
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any two in detail.
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OR
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Q.2 a. What are the different types of memories need in Embedded System 8 L2 CO3
Design? Explain the role of each. L
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b. With a neat interfacing diagram, explain Inter Integrated Circuit (I2C) Bus. 6 L2 CO3
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Module – 2
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Q.3 -B
a. Explain the different characteristics of Embedded System in detail. 8 L2 CO4
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b. Explain the different types of serial interface bus used in Automotive 6 L2 CO4
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Communication.
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01
25
Q.4 a. Explain the different fundamental design approaches used in Hardware 8 L2 CO4
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Software Co-design.
20
b. With FSM model, explain the design and operation of Automatic 6 L2 CO4
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c. Explain with a neat diagram, the process of converting assembly language 6 L2 CO4
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to machine language.
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Module – 3
Q.5 a. With a neat diagram, explain the different functions of operating system. 8 L2 CO5
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b. Explain in detail the structure, memory organization and state transitions of 8 L2 CO5
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the process.
c. Differentiate between Hard Real Time System and Soft Real Time System 4 L4 CO5
with an example for each.
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BEC601/BTE601/BVL601
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OR
Q.6 a. Three process with process IDS P1, P2 and P3 are having estimated 7 L3 CO5
completion time of 10, 5, 7 milliseconds respectively. A new process
5
P4 with estimated completion time of 2 ms enter the READY queue after
:2
2 ms. Calculate the waiting time and turnaround time for each process and
6
the average waiting time and turnaround time (assuming no I/O waiting for
the processes) in SJF scheduling algorithm.
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01
b. Explain the concept of Dead lock with an example. Also explain the 5 L2 CO5
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methods of handling Dead lock.
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c. Discuss the different techniques for embedding the firmware into the target 8 L2 CO5
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processor.
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Q.7 a. With a neat diagram, explain the four main hardware components of ARM- 8 L2 CO1
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based embedded device.
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b. Discuss about RISC design philosophy. 6 L2 CO1
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c. Explain the factors that make the ARM instruction set suitable for
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embedded applications.
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Q.8 a. Explain ARM core data flow model with neat diagram. 8 L2 CO1
m
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b. Explain the different processor modes of ARM processor with the help of
1p
6 L2 CO1
ARM register set.
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With suitable diagrams, explain the following hardware extensions of ARM
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c. 6 L2 CO1
code.
42
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01
Module – 5
Q.9 a. Explain with diagram, barrel shifter operation in ARM processor. Give an 8 L2 CO2
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example.
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c. Develop an assembly language program to count the number of ones and 6 L3 CO2
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OR
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b. Explain both forward and backward branch instructions with an example. 6 L2 CO2
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USN BEC602
2
:2
VLSI Design and Testing
3
Time: 3 hrs. Max. Marks: 100
:2
Note: 1. Answer any FIVE full questions, choosing ONE full question from each module.
01
L
2. M : Marks , L: Bloom’s level , C: Course outcomes.
-B
Module – 1 M L C
5
Q.1 a. Implement CMOS logic for the following compound gates. 10 L3 CO1
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i) F = A (B C) DE
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ii) F = (A B C) D-2
b. Implement and explain 2 i/p multiplexes using TG and also mention 10 L3 CO2
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advantages of TG.
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a. Design flip-flop using multiplexes and inverter.
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Q.2 08 L3 CO2
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b. Illustrate structural representation for 2 i/p NAND gates by adding 04 L3 CO2
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performance parameter.
VT
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Module – 2
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Q.3 a. Explain the working principle of nMOS enhancement nmos transistor. 10 L2 CO1
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b. Define Body Effect. Illustrate how body effect alters the Vt and give 05 L3 CO1
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mathematical expressions.
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01
OR
Q.4 a. Draw schematic diagram of CMOS inverter and explain its D C Transfer 12 L3 CO1
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characteristics.
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Module – 3
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OR
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Module – 4
Q.7 a. What are the advantages of Dynamic CMOS logic and explain the working 08 L3 CO4
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b. Realize 2 inputs XOR / XNOR gate using cascode voltage switch logic. 04 L3 CO4
c. Implement 4 – way switch logic using Transmission gate and write layout 08 L3 CO4
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BEC602
OR
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Q.8 a. Draw star connection for CMOS inverter layout optimization and mention 06 L3 CO4
its advantages.
2
b. Find Euler’s path for the function Z (A B) CD and draw 06 L3 CO4
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corresponding layout.
c. Write short notes on : 08 L2 CO4
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i) ESD Protection
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ii) Tristate and Bidirectional Pads.
01
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Module – 5
Q.9 a. Implement AOI based clocked NOR SR Latch circuit with waveforms. 10 L3 CO5
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b. Illustrate typical design flow of a contemporary and an ideal approach for 10 L3 CO5
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designing system.
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Q.10 a. Illustrate J – K flip – flop with Nand gate JK latches with waveforms. 10 L3 CO5
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b. Write short notes on : 10 L2 CO1
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i) Adhoc Testing
ii) Self Test and Build in Test.
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5p
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BL
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USN BEC654C/BTE654C
1
:1
Electronic Communication System
0
Time: 3 hrs. Max. Marks: 100
:2
Note: 1. Answer any FIVE full questions, choosing ONE full question from each module.
01
L
2. M : Marks , L: Bloom’s level , C: Course outcomes.
-B
Module – 1 M L C
6
Q.1 a. Briefly, explain what are the different modes of communications. 6 L2 CO1
02
L
b. Explain with a neat block diagram the element of electronic and 10 L2 CO1
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communication system. -2
L
An RF amplifier has an input signal power of 1W and delivers the output 4
01
c. L3 CO1
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signal with 10W power. Determine its power gain in decibels (dB).
5-
OR
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a. With a neat block diagram, explain the element of digital communication
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Q.2 8 L2 CO1
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system.
U
m
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c. Determine the antenna gain of a reflector dish antenna having an effective 4 L3 CO1
1p
area of 0.56, operating at 12 GHZ.
L
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Module – 2
:1
-B
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Q.3 a. Define and explain amplitude modulation with necessary expression and 10 L2 CO2
34
waveforms.
L
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b. Derive the expression for the total power in a single tone AM signal. 10 L3 CO2
:
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01
OR
Q.4 a. Show how the modulation index can be computed by displaying the AM 10 L3 CO2
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26
envelope on an oscilloscope.
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20
Module – 3
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Q.5 a. Define Pulse Amplitude Modulation (PAM) with necessary diagrams. 10 L2 CO3
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(PPM)
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Q.6 a. State and prove sampling theorem. 10 L3 CO3
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BEC654C/BTE654C
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Module – 4
1
Q.7 a. Define and state and properties of entropy. 5 L2 CO4
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b. Describe the four basic types of redundancy checks. 12 L2 CO4
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c. A communication system consists of 6 messages with probabilities 1/8, 1/8, 3 L3 CO4
01
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1/8, 1/8, 1/4 and 1/4 respectively. Determine the entropy of the system.
-B
OR
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Q.8 a. With a neat block diagram, explain BPSK modulator and demodulator. 8 L2 CO4
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b. With necessary expressions and waveforms, explain Amplitude Shift
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Keying (ASK).
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c. Explain QPSK with necessary expression and the constellation diagram. 6 L2 CO4
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Module – 5
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m
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OR
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01
b. List and briefly explain the main areas of wireless applications. 10 L2 CO5
*****
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