White Paper
Crystal Solutions for Low Power
Applications
The Internet of Things [IoT] is the new wireless touchstone con-
necting live information, control mediums and hubs to wireless
devices such as phones, tablets and computers. These applica-
tions are widely used in Smart Homes, Smart Cities, Smart Facto-
ries, Smart Healthcare, Smart Agriculture and Smart Energy. Com-
munication protocols and transmission frequencies are guided by
standards such as IPv6, UDP, QUIC, Aeron and uIP. As a result, next Author:
generation MCUs, SoCs or FPGAs created to meet new communi- John Metzler
cation requirements have challenged chipset designers to devel-
Applications Engineer
op architectures that provide improved fast communication along
with low noise performance, but also at low power consumption. [Link]@[Link]
Utilizing low power elements helps continuous operation over T: 630-577-8816
long periods of time, but also increase challenges like reductions CTS Corporation
in oscillator gain margin and signal to noise ratios.
Currently there are billions of connected IoT devices. An expo-
nential increase of connected devices is expected over the next
decade, as 5G infrastructures will be readily available along with
more affordable consumer devices. The seemingly limitless con-
nections promised by 5G will continue to burden infrastructures
and push the boundaries of chipset performance, requiring the
timing block and associated frequency reference to provide very
reliable low power operation.
1
Low Power Requirements & Gain Margin GM
Advanced IoT chipsets utilizing oscillator de-
signs with lower gain margins [GM] require crys-
tals with low equivalent series resistance [ESR]
and low plating capacitance [C0], to ensure
quick start-up over wide temperature ranges
and low battery power levels.
The RF function, or timing block, of many
chipsets [MCUs, FPGAs, and SOCs] uses an on-
chip Pierce oscillator configuration to generate
the reference clock frequency. Typically this
block is an inverter amplifier that drives the res-
onant loop completed by the addition of an ex-
ternal crystal resonator [Y1] and two load capac-
itors [CL1, CL2], Figure 1. An additional feedback
resistor may be included to help stabilize the DC
operating point. Figure 1: Pierce Oscillator
Using the inverter amplifier’s transconductance
value, provided by the chipset manufacturer,
the gain margin GM of the reference clock com- GM = gm/gm[minimum]
pleted by the amplifier feedback loop and crys-
tal resonant loop can be calculated. See figure gm = inverter amplifier transconductance, in mA/V or
1 as reference. µA/V
gm[minimum] = limit of transconductance value that
To safeguard proper operation of the crystal
resonant circuit under all environmental con-
ensures proper oscillation, in mA/V or µA/V
ditions, the gain margin GM [or safety factor]
should be greater than 3.0 minimum with a tar-
get goal of greater than 5.0.
The equivalent circuit values of the crystal also
affect the gain margin GM and are accounted gm[minimum] = 4*R1*[2πf]2*[C0+CL]2
for with the following calculation. See Figure 2
as reference. R1 = motional series resistance of crystal [ESR]
C0 = shunt capacitance of crystal
Through this formula and assuming a fixed val-
ue for gm of the chipset’s inverter amplifier, it [electrode and package capacitance]
shows the only way to increase gain margin CL = plating load capacitance of crystal
GMis to decrease the value of gm[minimum].
The typical value for C0, of crystals developed
for low power operation, is less than 3.0pF,
making gm[minimum] dependent on the value of
R1 and the selected load capacitance CL. CTS
IoT Enhanced crystals [4xxW Series] are de-
signed and processed with the lowest series re-
sistance values, while coupled with small load
capacitance options, securing a safe gain mar-
gin GM that supports low power consumption
and reliable operation over all conditions of a
customer application. Figure 2: Crystal Equivalent Circuit
CTS | Connect
2
CTS IoT Frequency Reference Portfolio
MCUs, FPGAs or SOCs containing the RF function previously described are typically used to trans-
mit and receive a wide variety of information through wireless protocols. These chipsets require a
reference crystal in the MHz range to complete the oscillator circuit that provides the main system
data clock signal. In addition, the chipset may also contain a real time clock reference [kHz crystal]
for timekeeping functions. To support next generation chipsets for IoT, CTS has developed crystal
families that have required performance attributes previously outlined.
IoT Enhanced
Crystals
[4xxW Series]
New CTS models [412W, 416W,
402W, 425W, 403W] provide
enhanced design parameters
targeted for low power wire-
less protocols used in IoT en-
terprises for consumer and
industrial [IIoT]. These include Key 4xxW Crystal Parameters
operating temperature range •Low Plating Capacitance [C0], <3.0pF
•Low ESR Ranges [R1]
to -40°C to +125°C, tight tol-
•Small Load Capacitance Options [CL]
erance and stability options, •Temperature Range to -40°C to +125°C
low plating capacitance, small •Stability Options – ±10ppm to ±150ppm
load capacitance values and •Fundamental Crystal Designs
a variety of industry standard •Small Ceramic Surface Mount Package
package sizes. •Tape and Reel Packaging
Package ESR C0
Model/ Frequency Tolerance Temperature Temperature
Size Maximum Parameters
Data Sheet [MHz] @ +25°C Stability Range
[mm] [Ohm] [pF]
-40°C to +85°C
32 – 80 ±7ppm - ±10ppm - 1.0 Typ.
412W 1.2 x 1.0 -40°C to +105°C 100 – 60
Fundamental 30ppm 100ppm <3.0 Max.
-40°C to +125°C
-40°C to +85°C
24 – 52 ±10ppm - ±10ppm - 1.0 Typ.
416W 1.6 x 1.2 -40°C to +105°C 150 – 80
Fundamental 30ppm 100ppm <3.0 Max.
-40°C to +125°C
-40°C to +85°C
16 – 52 ±10ppm - ±10ppm - 1.0 Typ.
402W 2.0 x 1.6 -40°C to +105°C 150 – 50
Fundamental 30ppm 100ppm <3.0 Max.
-40°C to +125°C
-40°C to +85°C
16 – 52 ±10ppm - ±10ppm - 1.0 Typ.
425W 2.5 x 2.0 -40°C to +105°C 100 – 40
Fundamental 30ppm 100ppm <3.0 Max.
-40°C to +125°C
-40°C to +85°C
10 – 54 ±10ppm - ±10ppm 1.0 Typ.
403W 3.2 x 2.5 -40°C to +105°C 150 – 35
Fundamental 30ppm -100ppm <3.0 Max.
-40°C to +125°C
CTS | Connect | CTS Crystals
3
Low ESR Tuning Fork Crystals @ 32.768kHz
Many of today’s electronic devices require some form of
timekeeping that include current time, calendar events
or processing scheduled tasks. Keeping track of time and
organizing multiple tasks such as taking measurements,
monitoring communications and wake-up on de-
mand surveillance; real time clock references [RTC] at
32.768kHz provide a cost effective solution that support
such critical functions.
Portable or handheld electronics use low power FPGAs
and microcontrollers [MCUs] to preserve battery life for
long hours of operation. Operating at voltage levels be-
low +1.5V require crystals with low ESR to ensure crys- Key TFE Crystal Parameters
tal start-up and minimize current consumption during •Low Plating Capacitance [C0], 1.0pF Typical
wake-up on demand operations. CTS Low ESR Series •Low ESR Values [R1] <50k Ohms
Tuning Fork Crystals, offer resistances as low as 50k •Small Load Capacitance Options [CL]
ohms maximum, a classic parabolic temperature curve •Temperature Range to -40°C to +85°C
with -0.035ppm/°C2 temperature coefficient, +25°C •Small Ceramic Surface Mount Package
turnover point, standard load capacitance options and
•Tape and Reel Packaging
are available in three industry standard ceramic package
size options; 3.2mmx1.5mm [TFE32], 2.0mmx1.2mm
[TFE20] and 1.6mmx1.0mm [TFE16].
Package ESR C0
Model/ Frequency Tolerance Temperature Temperature
Size Maximum Parameters
Data Sheet [MHz] @ +25°C Stability Range
[mm] [Ohm] [pF]
32.768kHz -0.034ppm/°C²
TFE16 1.6 x 1.0 ±20ppm -40°C to +85°C 60k 1.5 Typ.
Tuning Fork Temp Coefficient
32.768kHz -0.034ppm/°C²
TFE20 2.0 x 1.2 ±20ppm -40°C to +85°C 50k 1.8 Typ.
Tuning Fork Temp Coefficient
32.768kHz -0.034ppm/°C²
TFE32 3.2 x 1.5 ±20ppm -40°C to +85°C 50k 1.0 Typ.
Tuning Fork Temp Coefficient
CTS | Connect | CTS Crystals
RTC TCXO @ 32.768kHz
For applications the need a more precise 32.768kHz
reference, common for GPS functions, the CTS RTC
solution is Model TT32 TCXO. TT32 operates with a
maximum current draw of 1.5µA @ +3.3V and delivers
a very tight frequency stability at ±5.0ppm over -40°C
to +85°C; for accurate time keeping over variations Key TT32 TCXO Parameters
in temperature; when compared to simple crystal •Low Current Consumption, <2µA
devices that utilize tuning fork resonators. TT32’s
•Tight Frequency Stability, ±5.0ppm
low power consumption is important for preserv-
ing battery life of portable or handheld electronics •Temperature Range to -40°C to +85°C
employing low power FPGAs and microcontrollers •Small Ceramic Surface Mount Package
[MCUs]. It will also help minimize current consump- •Tape and Reel Packaging
tion during wake-up on demand operations.
Package Input ESR Output
Model/ Frequency Temperature Temperature
Size Voltage Maximum Load
Data Sheet [MHz] Stability Range
[mm] [V] [µA] [PF]
32.768kHz
TT32 3.2 x 2.5 +1.8V - +3.3V ±5.0ppm -40°C to +85°C 2.0 15
HCMOS
CTS | Connect | CTS TCXO
4
Low Power Wireless Application Examples
Smart Home
Security System
Application: Video Surveillance
Device: TI CC3220 SimpleLink Wi-Fi. See Figure 3
Frequency Reference: Crystal 1 – CTS PART NUMBER TFE322P32K7680R
[32.768kHz, ±20ppm Tolerance, ±150ppm Stability, -40°C to +85°C, 50k Ohms Maximum ESR]
CTS Advantage: Small Size, Low ESR
Frequency Reference: Crystal 2 – CTS PART NUMBER 425WF40011IKR
[40MHz, ±10/10±ppm Tolerance/Stability, -40°C to +85°C, 8pF CL, 25 Ohms typical 40 Ohms maximum ESR]
CTS Advantage: Small Size, Low ESR, Low C0, Customization Available
Vcc
Wide Voltage
(2.1 to 3.6 V) / Vcc
Wide Voltage
(2.1 to 3.6 V) /
32.768-kHz
1 CTS Crystal
Vcc
32.768-kHz
CTS Crystal
Wide Voltage
(2.1 to 3.6 V) / Vcc
Wide Voltage40-MHz
(2.1 to 3.6 V)CTS
/ Crystal
2 40-MHz
CTS Crystal
32.768-kHz 32.768-kHz
CTS Crystal CTS Crystal CTS clock
40-MHz
CTS Crystal
40-MHz CTS Crystal
CTS Crystal
Figure 3: TI CC3220x Block Diagram CTS clock
See the CTS quick page
CTS Crystal
Smart Agriculture Figure 4: Semtech S1257 Block Diagram
See the CTS quick page
RFID Cow Ear Tag
Application: LoRa Gateway
[wireless wide area network, bi-directional communication between a device and a gateway]
Device: Semtech SX1257 RF Front-End Transceiver. See Figure 4
Frequency Reference: Crystal – CTS PART NUMBER 402WF3201XIAR
[32MHz, ±10/±15ppm Tolerance/Stability, -40°C to +85°C, 10pF CL, 30 Ohms typical 60 Ohms maximum ESR]
CTS Advantage: Small Size, Low ESR, Low C0, Customization Available
CTS | Connect
5
Common Wireless Frequencies
Frequency Wireless Protocol CTS Solutions
TFE16
32.768kHz Real Time Clock Reference [RTC] TFE20
TFE32
12.00MHz CAN Bus, USB
403W
13.56MHz RFID
16.00MHz Wi-Fi, ZigBee, Bluetooth, Bluetooth Low Energy 403W
19.20MHz DECT, GPS, Bluetooth Low Energy 425W
402W
20.00MHz Wi-Fi, Bluetooth, USB
24.00MHz Wi-Fi, Bluetooth, Bluetooth Low Energy
25.00MHz Industrial, Scientific, Medical Radio Band 403W
WLan, Wi-Fi, Bluetooth, Bluetooth Low Energy, GSM, 425W
26.00MHz
Near-Field Communication 402W
27.12MHz RFID 416W
30.00MHz Industrial, Scientific, Medical Radio Band
32.00MHz ZigBee, Bluetooth, Bluetooth Low Energy, 6LowPan, RF4CE, LoRa
37.40MHz Wi-Fi, Bluetooth 403W
425W
38.40MHz DECT, Wi-Fi, Bluetooth 402W
Wi-Fi, Bluetooth, Bluetooth Low Energy, 416W
40.00MHz
Near-field Communication, SimpleLink 412W
48.00MHz Wi-Fi, Bluetooth, USB
52.00MHz WLan, Wi-Fi, GSM
Conclusion
The Internet of Things is an infinite space that will continue to grow, connecting and communi-
cating a myriad of devices and is only limited by human imagination and innovation. As low pow-
er operational boundaries are pushed, design risks will more than ever need to be reviewed and
accounted for during development of the chipset RF function and associated frequency reference,
in order to provide robust user devices with long-lasting reliable operation.
More Information:
[Link]
[Link]
John Metzler Jacqueline Morris
[Link]@[Link] Marketing & Communications Manager
Applications Engineer [Link]@[Link]
CTS Corporation CTS Corporation
CTS | Connect