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Partstack Datasheet

The document provides detailed specifications for the SMT inductors, SIMID series B82432C, including dimensions, rated inductance, construction features, and applications. It highlights the inductors' temperature range, high Q factor, and compliance with AEC-Q200 and RoHS standards. Additionally, it includes technical data, measuring conditions, and cautions regarding handling and soldering of the components.

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Sairy Lokman
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0% found this document useful (0 votes)
6 views8 pages

Partstack Datasheet

The document provides detailed specifications for the SMT inductors, SIMID series B82432C, including dimensions, rated inductance, construction features, and applications. It highlights the inductors' temperature range, high Q factor, and compliance with AEC-Q200 and RoHS standards. Additionally, it includes technical data, measuring conditions, and cautions regarding handling and soldering of the components.

Uploaded by

Sairy Lokman
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

SMT inductors

SIMID series, SIMID 1812-C

Series/Type: B82432C
Date: October 2012

a~í~=pÜÉÉí

¤EPCOS AG 2012. Reproduction, publication and dissemination of this publication, enclosures


hereto and the information contained therein without EPCOS’ prior express consent is prohibited.

Downloaded from [Link]


SMT inductors, SIMID series B82432C
SIMID 1812-C

Size 1812 (EIA) or 4532 (IEC)


Rated inductance 1 ... 1000 μH
Rated current 55 ... 600 mA

Construction
■ Upright ferrite drum core
■ Laser-welded winding
■ Flame-retardant molding

Features
■ Temperature range up to +150 °C
■ High Q factor
■ Qualified to AEC-Q200
■ Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020D
■ RoHS-compatible

Applications
■ Filtering of supply voltages, coupling, decoupling
■ Antenna systems
■ Automotive electronics
■ Telecommunications
■ Industrial electronics

Terminals
■ Base material CuSn6
■ Layer composition Cu, Ag, Sn (lead-free)1)
■ Electro-plated

Marking
■ Marking on component:
Manufacturer and letter “C”,
L value (in nH), tolerance of L value (coded),
date of manufacture (YWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value, quantity, date of packing

Delivery mode and packing unit


■ 12-mm blister tape, wound on 330-mm ‡ reel
■ Packing unit: 2500 pcs./reel

1) Ni-barrier-plated terminals on request (B82432C*50).

Please read Cautions and warnings and


Important notes at the end of this document. 2 10/12
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SMT inductors, SIMID series B82432C
SIMID 1812-C

Dimensional drawing and layout recommendation

0.5±0.11)

A
2.6±0.11)

B C B
D
IND0053-6

4.5±0.2
0.6 min.1)
3.2±0.2

A B C D
3.6 1.3 3.2 5.8

0.15 max. 3.2±0.2

Marking

1) Soldering area IND0083-T-E Dimensions in mm

Taping and packing


Blister tape Reel

4±0.1 18.4 max. 13±0.2


1.75±0.1
5.5±0.1

Component 1.5+0.1 2±0.05


330 +0
_2
12±0.3
<_ 5.9

12.4 +1.5
_0 62±1.5
<_ 4.1 8±0.1 1.6±0.1 IND0350-S

Direction of unreeling
IND0561-L-E

Dimensions in mm

Please read Cautions and warnings and


Important notes at the end of this document. 3 10/12
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SMT inductors, SIMID series B82432C
SIMID 1812-C

Technical data and measuring conditions

Rated inductance LR Measured with impedance analyzer Agilent 4294A


at frequency fL, 0.1 V, +20 °C
Q factor Qmin Measured with impedance analyzer Agilent 4294A
at frequency fQ, +20 °C
Rated temperature TR +85 qC
Rated current IR Maximum permissible DC with inductance decrease
'L/L0 d 10% and temperature increase
of d 30 K at rated temperature
Self-resonance frequency fres,min Measured with impedance analyzer Agilent E4991A, +20 °C
DC resistance Rmax Measured at +20 qC
Solderability (lead-free) Sn95.5Ag3.8Cu0.7: +(245 r5) °C, (5 r0.3) s
Wetting of soldering area t 90%
(based on IEC 60068-2-58)
Resistance to soldering heat +260 qC, 40 s (as referenced in JEDEC J-STD 020D)
Climatic category 55/150/56 (to IEC 60068-1)
Storage conditions Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, d 75% RH
Weight Approx. 130 mg

Characteristics and ordering codes

LR Tolerance fL Qmin fQ IR Rmax fres,min Ordering code 1)


PH MHz MHz mA : MHz
1.0 r10% ^ K 1 40 7.96 600 0.28 200 B82432C1102K000
1.2 1 40 7.96 560 0.32 160 B82432C1122K000
1.5 1 40 7.96 535 0.35 120 B82432C1152K000
1.8 1 40 7.96 490 0.41 100 B82432C1182K000
2.2 1 40 7.96 480 0.43 90 B82432C1222K000
2.7 1 40 7.96 450 0.49 75 B82432C1272K000
3.3 1 40 7.96 425 0.55 60 B82432C1332K000
3.9 1 40 7.96 410 0.59 50 B82432C1392K000
4.7 1 40 7.96 390 0.65 40 B82432C1472K000
5.6 1 40 7.96 375 0.71 40 B82432C1562K000
6.8 1 40 7.96 360 0.78 35 B82432C1682K000
8.2 1 40 7.96 330 0.92 30 B82432C1822K000

1) For Ni-barrier-plated terminals replace the last two digits “00” by “50”.

Please read Cautions and warnings and


Important notes at the end of this document. 4 10/12
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SMT inductors, SIMID series B82432C
SIMID 1812-C

Characteristics and ordering codes

LR Tolerance fL Qmin fQ IR Rmax fres,min Ordering code 1)2)


PH MHz MHz mA : MHz
10 r10% ^ K 1 40 7.96 320 0.98 28 B82432C1103K000
12 0.1 30 2.52 300 1.10 24 B82432C1123K000
15 0.1 30 2.52 280 1.25 21 B82432C1153K000
18 0.1 30 2.52 270 1.35 18 B82432C1183K000
22 0.1 30 2.52 260 1.45 16 B82432C1223K000
27 0.1 30 2.52 245 1.65 13 B82432C1273K000
33 r5% ^ J 0.1 30 2.52 230 1.85 13 B82432C1333+000
39 r10% ^ K 0.1 30 2.52 220 2.05 12 B82432C1393+000
47 0.1 30 2.52 210 2.3 12 B82432C1473+000
56 0.1 30 2.52 200 2.5 11 B82432C1563+000
68 0.1 30 2.52 190 2.8 10 B82432C1683+000
82 0.1 30 2.52 175 3.2 9 B82432C1823+000
100 0.1 30 0.796 145 4.7 8 B82432C1104+000
120 0.1 30 0.796 140 5.2 8 B82432C1124+000
150 0.1 30 0.796 130 6.1 7 B82432C1154+000
180 0.1 30 0.796 120 6.9 6 B82432C1184+000
220 0.1 30 0.796 115 7.5 6 B82432C1224+000
270 0.1 30 0.796 90 12.5 5 B82432C1274+000
330 0.1 30 0.796 85 14.1 4.5 B82432C1334+000
390 0.1 30 0.796 80 15.3 4.2 B82432C1394+000
470 0.1 30 0.796 75 17.5 4.0 B82432C1474+000
560 0.1 30 0.796 70 23.0 3.5 B82432C1564+000
680 0.1 30 0.796 65 25.0 3.3 B82432C1684+000
820 0.1 30 0.796 60 28.0 3.0 B82432C1824+000
1000 0.1 30 0.796 55 32.0 2.8 B82432C1105+000

Closer tolerances on request.


Higher currents possible at temperatures <TR on request.

1) Replace the + by the code letter for the required inductance tolerance.
2) For Ni-barrier-plated terminals replace the last two digits “00” by “50”.

Please read Cautions and warnings and


Important notes at the end of this document. 5 10/12
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SMT inductors, SIMID series B82432C
SIMID 1812-C

Impedance |Z| versus frequency f Inductance L versus DC load current IDC


measured with impedance analyzer Agilent measured with LCR meter Agilent 4285A,
E4991A, typical values at +20 °C typical values at +20 °C
IND0033-6 IND0034-8
10 6 10 4
Ω B82432C μH B82432C
|Z | L 1000 μH
5
10 10 3

100 μH
10 4 10 2

10 μH
10 3 10 1

1000 μH 1 μH
10 2 10 0
100 μH
10 μH
1 μH
_1
10 1 6 7 8 9
10 _2 _1
10 10 10 Hz 10 10 10 10 0 A 10 1
f I DC

Q factor versus frequency f Current derating Iop/IR


measured with impedance analyzer Agilent versus ambient temperature TA
E4991A, typical values at +20 °C (rated temperature TR = +85 °C)
IND0035-W IND0036-9-E
80 1.2
B82432C Iop B82432C

Q IR
1.0
60
0.8
1 μH
10 μH
40 100 μH 0.6
1000 μH

0.4
20
0.2

0 4 0
10 10 5 10 6 10 7 Hz 10 8 0 20 40 60 80 100 120 C 160
f TA

6 10/12
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Cautions and warnings

■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.

Please read Cautions and warnings and


Important notes at the end of this document. 7 10/12
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Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or


failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of an electronic component could endanger human life or health (e.g.
in accident prevention or life-saving systems), it must therefore be ensured by means of suitable
design of the customer application or other action taken by the customer (e.g. installation of
protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our
Material Data Sheets on the Internet ([Link]/material). Should you have any more
detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products.


Consequently, we cannot guarantee that all products named in this publication will always be
available. The aforementioned does not apply in the case of individual agreements deviating
from the foregoing for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).

7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CeraLink, CSMP, CSSP, CTVS,
DeltaCap, DigiSiMic, DSSP, FilterCap, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL,
SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap
are trademarks registered or pending in Europe and in other countries. Further information will
be found on the Internet at [Link]/trademarks.

8 10/12
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