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Lecture Notes Week 4

The document discusses the solidification processes of metals, focusing on the characteristics of solid-liquid (S/L) interfaces, including atomically rough and flat interfaces. It highlights the importance of diffusion in solidification rates, the role of undercooling, and the effects of cooling and stirring on liquid composition and solidification dynamics. Additionally, it describes the growth of nuclei and dendrites in pure metals during solidification.

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5 views28 pages

Lecture Notes Week 4

The document discusses the solidification processes of metals, focusing on the characteristics of solid-liquid (S/L) interfaces, including atomically rough and flat interfaces. It highlights the importance of diffusion in solidification rates, the role of undercooling, and the effects of cooling and stirring on liquid composition and solidification dynamics. Additionally, it describes the growth of nuclei and dendrites in pure metals during solidification.

Uploaded by

parani_41
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd

Two types of S/L interface But, theoretically is such high value that

Atomically rough or diffuse becomes a fraction


interface (metallic system) i.e., can be neglected
Atomically flat or sharp interface S/L interface is assumed to be at equilibrium
(non metals) (

Continuous growth: migration of a Solidification of metals is usually a diffuse-


diffuse S/L interface controlled process
For pure metal, growth occurs at a rate
= undercooling of the interface controlled by heat conduction (diffusion)
below the equilibrium melting temp Alloy solidification is controlled by solute
( ) diffusion
Rate of solidification:
Atomically rough interface
continuous growth

Lateral growth: materials


with high entropy of melting
prefer to from atomically
smooth or closed-packed
interface
Atomically smooth interface migrate by ledge
formation and lateral growth
Surface nucleation
Spiral growth
Growth from intersection
Pure metal: solidification by latent heat is
conducted away from the S/L interface
Conduction: either through solid or liquid
depending on the temperature gradient

Superheated liquid Protrusion

Undercooled liquid Equation is generated for planar interface


Fast cooling with efficient stirring in liquid
Uniform liquid composition at any time
Local equilibrium at the solid-liquid interface
Liquid composition follow liquidus line
Solid composition changes with position as a result of
solidification at decreasing temperature with no diffusion in
solid
Average solid composition lower (in solute concentration)
than solidus line
Always reaches eutectic point
Cooling is very rapid to allow diffusion in solid (no
diffusion in the solid phase)
Liquid composition kept homogeneous by external stirring
Assume unidirectional solidification.
Assumption: After initial stage, system can reach
steady state with stable solidification rate
Liquid composition decreases from liquidus line
to bulk concentration
Local equilibrium at the solid-liquid interface
System can reaches steady state: balance of
diffusion and cooling/solidification process
Always reaches eutectic point

No stirring or convection rejected solute will be


transported away by diffusion

Rapid build up of solute ahead of the solid


Rapid increase in the composition of the solid
formed
Initial state is transient
Growth of a Nuclei

Pure Ni nuclei is growing in the most


favorable direction (highest thermal
gradient) in the liquid melt upon
cooling.

Growth of primary dendrite

Development of secondary dendrite

Video courtesy-
Ferreira, A. F., Ferreira, L. D. O., & Assis, A. D. C. (2011). Numerical simulation of the
solidification of pure melt by a phase-field model using an adaptive computation
domain. Journal of the Brazilian Society of Mechanical Sciences and Engineering, 33, 125-130.
Thank you
for your kind attention

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