International Journal of Heat and Mass Transfer 178 (2021) 121601

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International Journal of Heat and Mass Transfer

journal homepage: [Link]/locate/hmt

Review

A comprehensive review on micro/nanoscale surface modification

techniques for heat transfer enhancement in heat exchanger
Dong Ho Nguyen a,b, Ho Seon Ahn a,b,c,∗
a
Department of Mechanical Engineering, Incheon National University, Incheon, Republic of Korea
b
Nuclear Safety Research Institute, Incheon National University, Incheon, Republic of Korea
c
AHN Materials INC, Incheon, Republic of Korea

a r t i c l e i n f o a b s t r a c t

Article history: Improving heat exchanger thermal-hydraulic efficiency is of utmost importance for energy conversion and
Received 20 February 2021 can be carried out through various techniques which are divided into active and passive methods. Ad-
Revised 6 June 2021
vancing nanotechnology in surface modification produces fantastic advances and high potential for heat
Accepted 13 June 2021
transfer enhancement in heat exchangers. Research has shown that a micro/nano surface improves heat
Available online 28 June 2021
transfer by inducing turbulence and fluid mixing in single phase heat exchangers. Modified surface in
Keywords: a phase change heat exchanger promotes prompt vaporized bubble release and enhances communica-
Heat Exchanger tion between nucleation sites for easier liquid transport in boiling, while a condenser engineered surface
Heat transfer enhancement improves heat transfer by switching thin film to dropwise condensation (DWC) or jumping droplet con-
Nano technonlogy densation. This paper aims to provide a comprehensive view of the latest status of the application of
micro/nanoscale surface modification techniques in heat exchanger for heat transfer intensification. In
addition, the heat transfer enhancing mechanism and recommended future research directions are ad-
dressed for both single and phase change heat exchanger.
© 2021 Elsevier Ltd. All rights reserved.

1. Introduction faces or the introduction of elements into the flow. Increasing the
effective surface area and residence duration of the heat transfer
Due to the worsening energy and environmental issues, the fluids is one technique to improve heat transfer rate in convective
need for energy savings as well as the exploration of renewable en- heat transfer. It causes the swirl in the bulk of the fluids and dis-
ergy resources is prioritized. Heat exchangers are important com- turbs the boundary layers, leading to increasing effective surface
ponents involved in almost all types of energy conversion, includ- area, residence time as well as HTC. Inserts, expanded surfaces,
ing many small-scale applications, to large-scale power plants [1- surface modification, and the use of nanofluids are typical ways
5]. Therefore, it has become increasingly important to use high- that are frequently used [7]. Compound methods are combinations
efficiency heat exchangers and more compact designs have devel- of two or more passive and/or active strategies used together [8].
oped in response. Among passive methods, the use of nanofluid and surface modifi-
The primary methods used for heat transfer enhancement in- cation are frequently used and be extremely effective at improv-
clude active and passive methods. In the active method uses, exter- ing the thermal-hydraulic efficiency of heat exchangers. Nanofluid
nal power input is required to enhance the heat transfer rate. The is used in place of traditional working fluid (water) to increase
external power may be supplied either through a heated surface or the thermal conductivity of the fluid media, thus improving heat
via a flow of fluids to the system. Mechanical aids and the use of a transfer and the efficiency of the heat exchanger. Numerous studies
magnetic field to disrupt light seeded particles in a flowing stream have been reported on the application of various nanofluids in heat
are examples of active methods. Active approaches have received exchanger devices, with astounding results. For instance, recent
little financial support due to their high costs and the issues asso- studies have experimented with nitrogen-doped, graphene-based
ciated with vibration or acoustic disturbance [6]. Passive methods [9] with an enhancement of 15.8% the convective HTC in compar-
do not need any external power and typically use modified sur- ison with water, spherical carbon-acetone nanofluid [10] with 73%
improvement, GNP nano-suspension [11] with 21% higher in HTC,
MWCNT based nanofluid [12], etc. [13-15]. Surface modification in-
∗
Corresponding author at: Department of Mechanical Engineering, Incheon Na- cludes coating and roughing of the surface structure on a fine scale
tional University, Incheon, 22012, Republic of Korea.
from micro to nanoscale. Recent advances in the field of micro-
E-mail address: hsahn@[Link] (H.S. Ahn).

[Link]
0017-9310/© 2021 Elsevier Ltd. All rights reserved.
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

2. Micro/nanoscale surface modification techniques

Nomenclature
A majority number of techniques are available to generate the
CA Contact angle surfaces of interest for enhancing thermal performance of heat ex-
SAM Self-assembled monolayers changer. The single convective and phase change heat transfer is
CVD Chemical Vapor Deposition influenced by energy and topology of the surface which repre-
iCVD Initiated Chemical Vapor Deposition sent for chemical and geometric nature of the surface, respectively.
FECVD Plasma Enhanced Chemical Vapor Deposition There are a huge number of research articles on these techniques
FWC Filmwise condensation available in the literature, and it has been proved that the depen-
DWC Dropwise condensation dence of surface morphology on only a few controlling parame-
PMMA Methyl methacrylate ters has common trends. For many controlling parameters, the re-
BN Boron Nitride sult on surface structure shows differently in specific experimen-
CNT Carbon Nanotube tal cases [38-43]. Basically, surface modification in micro/nanoscale
MWCNT Multi-Walled Carbon Nanotubes can be generated by roughening and coating methods. Roughening
PVD Physical vapor deposition or subtractive method usually obtains a relatively simple structure,
HTC Heat transfer coefficient while the coating method can provide a more complex structure
CHTC Condensation heat transfer coefficient and variable in material selection. This section briefly presents sur-
OHTC Overall heat transfer coefficient face modification methods that have been utilized in heat transfer
PTFE Polytetrafluoroethylene intensification. In addition, the fundamental but essential informa-
tion of individual methods such as working principle/procedure,
process parameters as well as their general effects on surface
topology and pros and cons are summarized in Table 1.
nano production and surface functionalization have widened the
limits for heat transfer intensification by surface modification [16- 2.1. Roughening techniques
18]. The surface structure could be modified either by roughening
methods such as sand/abrasive blasting, shot peening, and etch- In single-phase heat exchanger, roughened surface improves
ing without the change of chemical composition of the surface or convective heat transfer by enhancing turbulence effect [44], while
nanocoating of various materials such as metals, polymers, ceram- in phase change it increases the heat transfer contact area and the
ics, and composites in complex structures such as porous, pyra- number of nucleation sites [45]. Roughening surface could be done
mid, bumps, and pillars in micro/nanoscales by nanocoating tech- by either mechanical methods such as sandblasting, abrasive blast-
nology namely Self-assembled monolayers (SAM), Chemical Vapor ing, and shot peening or chemical and electrochemical techniques
Deposition (CVD), ion implantation, electrodeposition, and electro- such as chemical and electrochemical etchings. Most mechanical
less plating, etc. [19-21]. roughening techniques result in simple surface structure mainly
Researchers published a variety of review papers on heat trans- consisting of randomly distributed peaks and valleys, in contrast,
fer improvement in heat exchanger. To the best of our knowl- chemical and electrochemical ones are able to provide complex
edge, a majority number of studies employing nanofluids as work- structure and controllable roughness parameters such as pitch and
ing fluid have been conducted and mentioned in recent review porosity via adjusting process parameters.
articles [22-26]. Some researchers have conducted surveys on en- Sand/abrasive blasting is a procedure of firing high-speed sand
hancing techniques in a specific kind of heat exchanger either sin- particles repeatedly on the sample surface, leading to the removal
gle or phase change. Liu and Sakr [27] conducted a comprehen- of surface oxide scale and local plastic deformation, which makes
sive review on passive heat transfer enhancements in pipe heat the surface smoother or even more texture. Poongavanam al et.
exchangers. Abed al et. [28] detailly reviewed enhancement tech- [46] used shot blasting to create V- corrugated on aluminum ab-
niques in shell and tube spray evaporator. Alam and Kim [29] did sorber plate for highly augmenting heat transfer coefficients. Shot
a review on single phase heat transfer enhancement techniques in peeing uses almost similar principles and equipment with sand
heat exchanger applications. Zhang al et. [30] published a survey blasting to create a rough surface. The main feature that helps
on heat transfer enhancement techniques in plate heat exchangers. to distinguish shot peening with sandblasting is that the surface
Passive method using inserting element and/or surface modifica- is only compressed by accelerated metal particles in shot peen-
tion in macroscale has been also paid much attention, and the re- ing process, however, the surface is both compressed and removed
view work in this subject is well updated [31-35]. However, very surface material in sandblasting. Jabardo al et. [47] shot peened
few literature reviews have been done on micro/nanoscale sur- copper, brass, and stainless steel resulting in surfaces having av-
face modification techniques in heat exchanger. Edalatpour et al. erage roughness between 0.03 mm and 10.5 mm. Etching is chem-
[36] overviewed techniques to modify surface wettability for ap- ical process in which substrate’s atoms are soluted, resulting in a
plications with condensation or evaporation. Saman Rashidi et al. desirable rough surface of the substrate. Generally, etching is cate-
[37] presented an overall application of porous material for en- gorized as wet and dry etching. Wet etching uses liquid chemicals
ergy management in heat exchanger. With an increasing number or etchants to take off the substrate material. During these proce-
of studies that has been published, as the current state, a thor- dures, the substrate is immersed in the solution, or the solution is
ough review of micro/nanoscale surface modification techniques spread on the substrate. Wet etching requires simple equipment,
has been pressing to be addressed. controllable etching rate, highly planar etching surface, and high
The aim of the paper is not only to explain the related studies selectivity. However, wet etching is usually isotropic, leading to the
on the application of micro/nanoscale surface modification tech- removal of substrate material under the masking material. In dry
niques in heat exchanger, but also to discuss insight into enhanc- etching, substrate is dissolved using reactive ions or vapor etchant.
ing heat transfer mechanisms. In addition, this work also addresses Generally, wet etching has material removal rate that is usually
important issues and the room for future research topics. Expect- faster than almost dry etching processes. In addition, wet etching
edly, it will offer readers an extensive outlook on the application can be easily controlled by varying temperature or the concentra-
of surface modification techniques in heat exchangers as well as tion of etching solution [48]. In the case of electrochemical etching,
providing a base reference for future research. it would be convenient to control the process by changing current

2
 Table 1

D.H. Nguyen and H.S. Ahn

Summary of coating methods for heat transfer intensification in heat exchange

Common trends of
Coating method Working principle Process parameters process parameters Advantages Disadvantages Ref.

Sand/abrasive • Particle size • Particle size • Easy process • Unstructured: [46,100-102]

blasting/ Shot • Blasting time • Less machinery
increases with Random
peening • Blasting average distributed
distance roughness. peaks and
• Roughness valleys
increases then • Sand/abrasive
decreases with blasting cause
blasting time. risk of human
• Roughness heath
decreases with (silicosis)
the increase of
distance.
The blasting system mainly contains an air compressor, sand container, spray gun,
and sample holder. The high pressure pulls abrasive into the blast gun, then travels
through a nozzle that directs the particles toward the sample. The method can be
conducted horizontally or vertically
Electrochemical • Etchant • Etching rate • Uniform porous • No control for [103-106]
etching
concentration decreases with structure with size precision
• Current time, increases in nanoscale etching
density with • Preserve nature of • Nonuniform on
• Etching time concentration, substrate material curved surface
• Stirring current density
and stirring
3

Electrochemical etching cell consists of etching tank to contain etching solution, a

power supply to provide Direct current connecting sample (positive pole) and
carbon electrode (negative pole), and a magnetic stirrer, specimen should be placed
parallel to a carbon plate

International Journal of Heat and Mass Transfer 178 (2021) 121601

CVD • Precursor Complex • Corrosion and • Ultra-high [107-109]
• Substrate wear resistance vacuum
material • Flexible in • Substrate need
• Pressure material selection heating
• Temperature with different • High cost
microstructures

a) Sequence of events during CVD: A coating process complicatedly involves flow of

gas into the reactor, reacting, and then exhaust of by-products out of the reactor.
Firstly, precursor gases are supplied into the chamber via pressurized gas lines, then
precursors are transported from the main flow to the boundary layer (a) and
adsorption of precursors is heated on the substrate so that the adsorption of
precursors starts to occur (b), which is followed by chemical reaction and atoms
diffuse over the surface to growth sites (c). As a result of chemical reaction in the
previous event, by-products are resulted and desorbed out of the interface through
boundary layer to the mainstream (d and e).; b) Schematic diagram of a chemical
vapor deposition (CVD) system which consists of a vapor pressure feed system, a
CVD reactor with heating zone and an effluent gas handling system
(continued on next page)
 Table 1 (continued)

D.H. Nguyen and H.S. Ahn

Coating method Working principle Process parameters Common trends of Advantages Disadvantages Ref.
process parameters

Ion implantation • Vapor source Complex • High performance • Performance [110-113]

• Plasma and at low subcooling decreases as
transport • Low-temperature increasing
• Particle impact process subcooling.
• Substrate • High cost
parameter

Ion implantation consists of discharging ions, which are introduced as a gas at one
end of the implantation system and directed by a series of magnets onto a target or
work piece.
SAM • Translation Complex • Very thin coating • Robustness [115-117]
stage velocity • Low thermal and durability
• Evaporation resistance.
rate • High thermal
• N2 flow rate performance
• Colloidal
concentration
4

Schematic diagram of an ideal, single-crystalline SAM of alkanethiolates supported

on a gold surface with a (111) texture. The anatomy and characteristics of the SAM
are highlighted [114]
Dip coating • Dipping time • Thickness • Simple technique • Thickness [120-123]

International Journal of Heat and Mass Transfer 178 (2021) 121601

• Withdrawal increases with • Cost-effective control
speed solution • May fail during
• Solution concentration heat treatment
concentration • Coating
• Viscosity thickness is
• Temperature reversibly
proportional to
dip-coating
rate

A schematic of the dip-coating method: The process includes dipping the substrate
with a prescribed speed of in the coating solution, maintaining the substrate in the
solution for a while, withdrawing the substrate from the coating solution and
evaporating the solvent [118,119]. Depending on the required thickness, dip coating
process can be repeated several times.
(continued on next page)
 D.H. Nguyen and H.S. Ahn
Table 1 (continued)

Coating method Working principle Process parameters Common trends of Advantages Disadvantages Ref.
process parameters

Spray coating • Surface • Thickness • Simple and cheap • Limited [124-126]

temperature increases with method operation
• Moving speed slow nozzle range not
• Concentration moving speed, useful
• Solvent high extremely
concentration. harsh
environments

A schematic of warm spray coating technique and its setup

Spin coating • Rotating speed • Coating • Uniform thin • Limit to size of [42,127-129]
5

• Viscosity thickness coating with a substrate

• Evaporation inversely low-cost • Lack of
proportional to production material
the square root • Coating thickness efficiency
of the speed can be changed (2–5%)
• High viscosity easily by changing
yields the spin speed or
uniformity and change the

International Journal of Heat and Mass Transfer 178 (2021) 121601

thicker film. viscosity of the
• Bad liquids
evaporation
leads the
increase in
Schematic of spin coating process: Initially, solution droplet is placed at the center viscosity and
of the substrate, then a spinning motor forces the substrate to rotate and form concentration
centrifugal force, so that the solution droplet is able to uniformly spread out over of solution
the substrate surface. The process is followed by keeping spinning speed constant,
resulting a uniform thin film. In order to obtain a required coating, solution solvent
is evaporated leaving a thin desirable coating layer on the substrate.
(continued on next page)
 Table 1 (continued)

D.H. Nguyen and H.S. Ahn

Coating method Working principle Process parameters Common trends of Advantages Disadvantages Ref.
process parameters

Electrodeposition • Electrolyte • Crystal size • Thin, smooth, and • Risk of [130-133]

concentration decreased with adherent coating hydrogen
• Current the increase of • Require low embrittlement
density current density operating • Non-uniform
• Deposition temperature coating on
time curved surface

Schematic representation of an electrochemical cell for metal electroplating: The

electrodeposition simply refers to the process in which metal ions travel in the
electrolyte and are reduced on the cathode surface under an applied electrical
potential condition. The conductive substrate to be coated serves as a working
electrode (cathode) and is immersed in an electrolyte containing metal ions to be
deposited. A conductive counter electrode (anode) is also mounted in the electrolyte.
Using an external power source, a potential is applied between the two electrodes
to force the occurrence of reactions on the electrodes. As a result, a reduction occurs
6

in the substrate, while an oxidation reaction occurs in the counter electrode

Electroless coating • Solution • Temperature • No need electricity • Limited in [134-136]
composition increase grain • Durability material
• pH value size • Uniform coating selection
• Plating • Deposition rate on curved surface
temperature decreases with • Low operating
• Deposition time temperature and

International Journal of Heat and Mass Transfer 178 (2021) 121601

time atmospheric
pressure

schematic of electroless coating apparatus: (a) the basic illustration of electroless

coating experiment apparatus. (b) summarized the procedure steps of electroless
deposition process including pretreatment, sensitization, activation, and electroless
deposition. After degreasing and etching, the substrate is sensitized and activated to
generate a built-in potential in ionic media. With the effect of this built-in potential,
metal deposition takes place irrespective of the substrate surface.
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

density [49]. Huynh al et. [50] successfully generated hydrophilic enhancement in thermal performance [83-87]. Electroless coating
glass-ceramic enamel surface by using halogenic acid etching for is referred to as an autocatalytic method in which the reduction
heat transfer applications. Deng al et. [51] employed electrochem- of aqueous metal ions occurs on a substrate surface. The film de-
ical etching to fabricate fluid channels on titanium plates for mi- position occurs without a need for electricity, instead, the internal
crochannel plate heat exchangers. Since the fabrication technique current is generated by reducing agent in the solution itself [88].
is quite simple and inexpensive, but very effective for heat transfer In contrast to electrodeposition, electroless coating does not need
augmentation, it is widely utilized in the saving-energy and com- electricity to operate and has gained a wide adaptation in many in-
pact design of heat transfer devices. dustries by virtue of their outstanding surface properties [89-92].
Many pure metals such as nickel, copper, gold, silver, palladium,
2.2. Nanocoating techniques and cobalt are commonly being deposited to fabricate numerous
nano/microstructures by employing this technique in various ap-
Micro/nano structure can be added to the heat exchanger sur- plications [93-95]. Some studies have pioneered to enhance ther-
face by coating. There is a vast majority of complex surface struc- mal performance of heat exchanger by this technique with a great
ture and material selection available in coating technology compar- success [65,96-99].
ing to roughening methods. The coating methods are also versatile
such as chemical vapor deposition, ion implantation, SAM, spray 3. Recent applications in heat exchanger
coating, dip coating, spin coating, electrodeposition, and electro-
less coating, etc. Coating techniques usually obtain a complex sur- 3.1. Single-phase heat transfer enhancement
face structure with complex and randomly distributed shape and
size. Depending on different types of coating techniques, the grain Although various research groups have investigated the use
size and the coating thickness may vary from a few nanometers to of passive enhancement techniques in heat exchanger, in single-
hundreds of micrometers. phase heat transfer, micro/nano surface modification techniques
Chemical vapor deposition (CVD) is a deposition process to have received moderate attention. Almost typical works on mi-
form a film on a heated surface by decomposing gas chemical cro/nanoscale surface modification techniques applied in single-
precursors. With the advance of this technology, nowadays, CVD phase heat exchanger are summarized in Table 2.
has been used to grow ultrathin and complex nanostructure coat-
ings with success in enhancing heat transfer augmentation [52,53]. 3.1.1. Roughening techniques
Preston et al. [54] coated single-layer thin graphene on cop- Roughening technique is referred to a process which employs
per substrate by using both low-pressure CVD and atmospheric- either physical or chemical means to generate artificial roughness
pressure CVD for enhancing condensation heat transfer. Paxson on a substrate. In most cases, chemical composition of the sub-
et al. [52] presented the use of Initiated Chemical Vapor Depo- strate after being treated by roughening methods is rarely changed,
sition (iCVD) copolymer thin films grafted to condensing surface, so that the nature of substrate material is preserved. One of the
having a robust hydrophobicity. Ion implantation is a process in most common and simple methods is abrasive blasting. Some stud-
which atoms are embedded on the substrate from a beam of ion- ies have proved the great potential of this technique for heat
ized particles, resulting in the change of physical, chemical, or elec- transfer enhancement in heat exchanger. Wajs and Mikielewicz
trical properties. The method is mainly used to create hydrophobic [137,138] employed abrasive blasting technique for increasing sur-
surface on heat transfer device to promote DWC with the enhance- face roughness with the use of glass microbeads. The average
ment in HTC more than 5 times [55-59]. Self-assembled monolay- roughness of modified surface Ra and Rz were 2.8 μm and 15.9
ers (SAM) consist of a single layer of organic molecules that are μm, respectively, which were six times and five times higher than
adsorbed to form a coating on a surface. The chemical and physical on a flat surface. As a consequence, for the highest value of hot wa-
properties of the resulting SAM can be predetermined by correctly ter mass flux, the OHTC of the smooth PHE was found to be higher
choosing the terminal group on these alkyl molecules. SAMs have than the modified one, on the other hand, the opposite trend was
negligible thermal resistance comparing with other hydrophobic found for the lowest mass flux. According to the study, between
coatings [60,61]. Many studies have applied SAMs on heat trans- the highest and lowest mass fluxes, there exist a transient range,
fer surface for intensification of thermal performance [62-67]. Dip where the OHTC of the commercial heat exchanger was higher
coating and spray coating are simple and inexpensive methods to than the modified one for some values of heat flux, and vice versa
obtain thin coatings on different substrates. The techniques do not for the other. In an extended study [139], the authors replaced
require sophisticated equipment, are inexpensive, however, com- ethanol as working fluid on one side of the plate heat exchanger
pared to other coating methods, they may obtain a poor quality in order to investigate the effect of metallic porous microlayer on
of coating [68]. For applications having low shear stress and non- thermal-hydraulic performance. The result was distinguished into
severe conditions, they seem to be the first thought to modify two parts which were low Reynolds number region (<300) and
heat exchanger surface. Numerous studies have been applied dip high Reynolds number region (>300). In the low one, the OHTC of
coating and spray coating [63,69-71] for heat transfer augmenta- modified-surface heat exchanger was higher than smooth-surface
tion. Similarly, spin coating technique is a process of fabricating one of around 2-10%. Nevertheless, the opposite trend occurred in
thin film on flat substrate with source material, however, wherein the high Reynolds number by 6-10%. Interestingly, in all experi-
the solution spreads out by centrifugal force. Since it requires at mental cases, HTC on the ethanol side was seen higher values for
high rotating speed, its application is limited to small size of sub- the modified-surface heat exchanger, while the opposite was ob-
strate. Researchers have showed the success of spin coating in heat served for the smooth one. The result also reported the overall
transfer intensification [72-76]. Most porous metal coating have pressure drop of modified-surface heat exchanger was larger than
been well fabricated by sintering technique. The application in heat the smooth one in low-flow-rate experimental cases but smaller in
transfer enhancement also showed promising result [77-81]. Elec- cases of high flow rate. In similar research, Nilpueng and Wong-
trodeposition is a simple process that requires only a power sup- wises [44] examined single-phase heat transfer and pressure drop
ply, electrode materials and electroplating baths. The process is with a rough surface. On the cold stream side, surface rough-
advantageous on large and complex shape and size of the sur- ness Ra of 1.189 μm up to 3.312 μm was fabricated by sand
face [82]. The application of noble metals and metal oxide coat- blasting machine with various sand diameters. The experimen-
ing by electrodeposition in heat transfer has shown a significant tal results show that the heat transfer coefficient of rough sur-

7
 D.H. Nguyen and H.S. Ahn
Table 2
Summary of studies on single-phase heat exchanger using micro/nano surface modification techniques.

Heat exchanger Roughening /Coating

material Coated material method Micrograph Heat transfer enhancement Ref.

316 stainless steel – Abrasive blasting – HTC enhanced by 35% Wajs and Mikielewicz
[138]
316 stainless steel – Abrasive blasting – HTC increased and Wajs and Mikielewicz
decreased depending on [137]
heat flux
316 stainless steel – Abrasive blasting – HTC enhanced by 2-10.3% Wajs and Mikielewicz
[139]
316 stainless steel – Sand blasting HTC enhanced by Nilpueng and Wongwises
3.9–19.2% [44]

Nichrome wire – Sand blasting HTC enhanced as Re< 105 Rangesh al et. [140]
8

and vice versa

316 stainless steel – Sand blasting Average heat transfer rate Attalla and Maghrabie
enhanced by 12-54% [141]

International Journal of Heat and Mass Transfer 178 (2021) 121601

Copper – Shot peening Nusselt number increased Ganesh and Velraj [142]
by 28.2%
Copper – Shot peening HTC increased up to 115% Ganesh al et. [143]
When using MWCNT
(continued on next page)
 D.H. Nguyen and H.S. Ahn
Table 2 (continued)

Heat exchanger Coated material Roughening /Coating Micrograph Heat transfer enhancement Ref.
material method

316 stainless steel – Electrochemical Etching HTC increased by Ahn al et. [145]
0.6-11.2%

304 stainless steel – Electrochemical Etching HTC increased by Nguyen al et. [146]
10.5–17.7%

316 stainless steel – Electrochemical Etching HTC increased by Nguyen al et. [99]
11.8–17.1%
9

Copper – Chemical etching HTC increased by 80% Kunugi al et. [144]

International Journal of Heat and Mass Transfer 178 (2021) 121601

Copper Composite SiO2, Resin-coating – Unquantified heat transfer Jing al et. [147]
BaSO4, TiO2, AlN, enhancement
BN
Stainless steel Copper Electroplating – HTC enhanced by 15% Kumar al et. [148]

Stainless steel PMMA Spray coating HTC enhanced by 0.6-11.2 Ahn al et. [145]
%

(continued on next page)

 D.H. Nguyen and H.S. Ahn
Table 2 (continued)

Heat exchanger Coated material Roughening /Coating Micrograph Heat transfer enhancement Ref.
material method

Copper MWCNT Spray coating Heat transfer rate Meikandan al et. [152]
enhanced by 24.2%

NA Al2 O3 Dip coating HTC enhanced roughly by Antonino al et. [149]

nanoparticles 50%

Copper Ag nanoparticles Chemical reduction HTC enhanced by 95% Armstrong al et. [150]
10

Stainless steel Titanium PVD HTC increased but not Oon al et. [151]
quantified

International Journal of Heat and Mass Transfer 178 (2021) 121601

Stainless steel Ni, Cu, Ag Electroless plating HTC enhanced by 8.8-22% Nguyen al et. [99]
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

face plates increased by 4.46–17.95% compared with smooth sur- Nguyen et al. [146] further investigated the influence of etchant
face, whereas pressure drop of flow inside the rough surface plate concentration, current density, and etching time on the surface of
increased 3.90–19.24%. Ultimately, they concluded that thermal- 304 stainless steel plate heat exchanger. The research found that
hydraulic performance was enhanced for roughed surface as being electrochemical etching process was able to generate hydropho-
evident by performance evaluation of criterion and exegetic effi- bic surface, even superhydrophobic structure at the optimal pro-
ciency. In aeroengine applications, Rangesh [140] utilized 20 μm cess parameters. As a further step, the thermal performance of the
and 100 μm particles as blasting media to rough pre-cooler sur- etched plate heat exchanger was experimentally evaluated. Con-
face. Their experimental result provided that when sprayed from a sequently, OHTC experienced a significant improvement by 10.5–
distance of 2 cm/s with the wire moving speed of 2 cm/s, 100 μm 17.7% compared with commercial device due to the enlargement
silicon carbide particles produced the most consistent and rough- of the surface area obtained by the etching process and the en-
est possible for wire surface. In the comparison between the ther- hancement of turbulence intensity inside the fluid channel. On the
mal performance of bare and sand-blasted wires, a lower Nusselt other hand, there was an increase in pressure drop indicated by
number was seen for sand-blasted wire. A comprehensive conclu- the rise of friction factor of 21.3–87.3% for the etched. To determine
sion was given as that surface treatment can possibly enhance the thermal-hydraulic performance, performance of evaluation cri-
heat transfer at low duct Reynolds numbers which involve lower terion was used and valued from 1.05 to 1.194 which concluded
vehicle speed, higher altitude flight, or smaller-scale vehicle size. better performance in heat transfer although higher pressure drop
Additionally, the effective heat transfer enhancement is projected occurred. In a similar study on 316 Stainless steel plate heat ex-
in cases where the boundary layer growth is relatively small on changer, electrochemical etching was applied on smooth surface
the pre-cooler duct walls when Re < 105 . Attalla and Maghrabie before an electroless plating process [99]. The quantified enhance-
[141] investigated the effect of relative roughness (2.6-9.8 × 10−4 ) ment in OHTC has re-confirmed the previous study.
generated by sand blasting machine on the performance of plate
heat exchanger. The analysis of thermal performance revealed that 3.1.2. Nanocoating techniques for heat transfer augmentation
the average heat transfer rate increased with increasing the rela- Various nanocoating coating methods have been applied in
tive roughness for all experimental cases. The heat transfer aug- single-phase heat exchanger for heat transfer augmentation. Jing
mentation resulted by rough surface was quantified from 12-54.2% al et. [147] coated composite layer comprised of SiO2 , BaSO4 , TiO2 ,
in a comparison with the smooth surface in the case of Re=500. AlN, and BN by resin coating method consist of silicon modified
However, at Re=50 0 0, the upgrade of thermal performance was polyester and amino resins on copper heat exchanger. The result
reported to be lower (from 6.2-13.8%). Accompanied with the im- showed that the total HTC increased with increasing thermal con-
provement of heat transfer, rough surface caused higher pressure ductivity of coating. Especially, the heat transfer performance was
drop, so did pumping power. At Re=50 0 0, the pumping power in highly affected as coating thermal conductivity ranged from 0 to
this study increased by 2.9-12.4% compared with smooth surface 1 W/m•K, and the effect gradually weakened when coating ther-
plate heat exchanger. Eventually, the rough surface plate heat ex- mal conductivity falls into 1-2 W/m•K. Kumar al et. [148] em-
changer was confirmed to be more beneficial than the smooth one ployed electrodeposition method to coat copper on stainless steel
via specific heat transfer rate which was improved by 5-39% for all plate heat exchanger. The study aimed to compare convective heat
testing cases. transfer coefficient between bare and copper coated inside heat
In the literature, there are very limited studies applying shot exchanger channel. As expected, the result showed a higher con-
peening in heat exchanger. Ganesh and Velraj [142,143] conducted vective heat transfer coefficient in case of copper-coated heat ex-
an experimental investigation on thermal-hydraulic characteristics changer than the bare one, up to 15%. Ahn al et. [145] used spray
of tubular heat exchanger having rough surface (5.44 μm) treated coating to fabricate polymethyl methacrylate (PMMA) and boron
by pressurized shot peening. The analysis of heat transfer pro- nitride (BN) coatings on stainless steel plate heat exchanger af-
vided evidence of thermal improvement yielded from the modi- ter etching process. They studied both thermal and hydraulic per-
fied surface. Heat transfer augmentation was present via the in- formance of the coated device in comparison with a commercial
crease in Nusselt number up to 28.2 %, which occurred at the one. The experimental results revealed that OHTC of modified plate
lowest Reynolds number. The increment trend was also reported heat exchanger increased by 11.2% in the case of PMMA coating,
to be decreased with increasing Reynolds number. On the other however, dramatically decreased when applying BN coating. An-
hand, pressure drop in shot peened heat exchanger was higher tonino al et. [149] employed dip-coating method to coat Al2 O3
than of smooth one, a maximum of about 55%. The figure of merit nanoparticles on heat exchanger with the purpose of improving
compares the heat transfer performance enhancement along with their overall efficiency. HTC of non-coated heat exchanger was ex-
the penalty in the pumping power, which was evaluated within a perimentally quantified to be 116.5 (W/m2 K). An enhancement
range from 1.047 to 0.937, meaning that the shot peening method of thermal performance was seen in coated heat exchanger, 176.5
is favorable only at low Reynolds. (W/m2 K), an increase of about 50%. Armstrong al et. [150] coated
Etching has been employed as a flexible and effective method in silver nanoparticles on heat exchanging surface using the displace-
heat exchanger. Kunugi al et. [144] fabricated nano-particle porous ment reaction method. As a result of coating process, flower-
surface on heat exchanger by etching with some acids or alka- shaped dendritic structure was formed over the copper pipe. An
lis made from copper oxide and aluminum oxide about 100 nm experiment was conducted to examine the thermal and hydraulic
in size. The heat transfer experiment was conducted under co- characteristics before and after coating the heat exchanger. Con-
current flow condition. As a consequence, the maximum increase sequently, an increase by 95% in HTC was observed after coat-
in HTC of the etched heat exchanger was around 180% higher than ing silver nano particles compared to bare copper pipe. Besides,
that of the bare one. Ahn al et. [145] used Aqua Regia solution Darcy friction factor was higher for coated heat exchanger due
as a chemical etchant in electrochemical process to generate hy- to additional viscous phenomenon generated by silver nanoparti-
drophobic surface on commercial chevron plate heat exchanger. cles over the pipe surface. Oon al et. [151] conducted investiga-
The study was extended to fouling study of etched and polymethyl tion on thermal performance of titanium coated by PVD process
methacrylate (PMMA) and boron nitride (BN) coated surfaces. The on stainless steel heat exchanger. The experimental result showed
experimental results revealed that OHTC of modified plate heat ex- that at a fixed Reynolds number, HTC of the coated heat exchanger
changer increased by 0.6%-11.2% compared with commercial device was higher than that of uncoated one. In addition, the maximum
due to the generated micro/nanoscale structures on the surface. heat transfer increment is experienced at Re=15,0 0 0. Nguyen al et.

11
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

[99] utilized electroless plating method to coat separately nickel, drophobic heat exchanger could significantly improve the defrost-
copper, and silver on plate heat exchanger to augment thermal- ing efficiency.
hydraulic performance. By conducting heat transfer experiments, Laser-assisted 3D-microstructuring was used in the study of
a remarkable improvement in device’s performance was observed. Sharma al et. [159] to create well defined truncated micro-conical
Specifically, OHTC of the coated heat exchanger experienced an in- structure on copper surface for enhancement in DWC. In conden-
crease of 8.8–12.7%, 15.1–19.1%, and 17.4–22.1% in cases of nickel, sation heat transfer test, hierarchical copper surface obtained an
copper, and silver coatings, respectively, compared with the com- increase of nearly 700% in HTC when comparing with unstruc-
mercial device. However, there was a remarkable increase in fric- tured surfaces. Longo al et. [160] conducted an investigation of
tion factor. From an evaluation of Performance of Evaluation Crite- roughness on two-phase heat transfer inside the plate heat ex-
rion quantifying from 1.11 to 1.30 for all experiment cases, which changer. The heat exchanger with cross-grooved surface achieved
was the evidence of the enhancement in thermal-hydraulic perfor- higher HTC by up to 40% in evaporation and 60% in condensa-
mance. tion than that of smooth surface. Therefore, it was concluded that
cross-grooved surface was desirable both in evaporation and con-
densation. Table 3 summarizes abovementioned studies of the ap-
3.2. Phase-change heat transfer enhancement
plication of roughening methods in phase-change heat exchanger.
In comparison with single-phase heat exchanger, the applica-
3.2.2. Nanocoating methods
tion of micro/nanoscale surface modification techniques in phase-
According to a literature survey, the application of nanocoating
change heat exchanger have been paid much more attention, espe-
in phase-change heat exchanger for heat transfer augmentation is
cially, in recent years. Various forms of roughening and micro/nano
possibly discussed in different categories such as dropwise conden-
coatings are applied to enhance heat transfer in evaporation and
sation (DWC), evaporation heat transfer, and heat exchanger work-
condensation in heat exchanger.
ing under frosting and wet conditions. A summary of related stud-
ies is illustrated in Table 4.
3.2.1. Roughening methods
Sandblasting is a simple but effective method to generate rough [Link]. Enhancing dropwise condensation heat transfer. Since FWC
surface. Soontarapiromsook al et. [153] studied the effect of sur- is prevalent in many industrial-scale operations having low ther-
face roughness on condensation heat transfer in plate heat ex- mal efficiency, many researchers are attempting to propose effec-
changer. The average roughness was easily modified from 0.594 tive enhancing techniques. FWC heat transfer could be enhanced
mm to 2.754 mm by adjusting sand sizes from 24 grit to 46 grit in by inserting surface elements such as fins to increase heat trans-
sandblasting process. Similarly, to single-phase study, the increase fer area [161], however, most recent studies have concentrated on
in surface roughness resulted in an increase in HTC and friction promoting DWC via surface modification due to its convenience
factor, but the enhanced magnitude in phase change condition was when spacing is limited in ready-designed heat exchanger, which
much higher. HTC of sandblasted surfaces observed an increase of significantly improved of over one order in HTC. DWC is pro-
up to 44.5% compared with a smooth one. On the other hand, fic- moted primarily by increasing intrinsic contact angle and decreas-
tional pressure gradient of sandblasted surface was higher than ing contact-angle hysteresis to stimulate the departure of droplets
smooth one by 29.5%. Thermal performance factor was evaluated [162]. A majority number of research studies on condensation heat
to be higher than unity so that the rough surface is a favorable al- transfer improvement using hydrophobic surface which is obtained
ternative to smooth surface. The author continued similar research from various coating techniques such as SAM, CVD, spin coating,
on vaporization heat transfer [154]. The experimental data revealed dip coating, spray coating, ion implantation, electrodeposition, and
a proportional trend of HTC and pressure drop with increasing electroless coating, etc. Das al et. [64] applied hydrophobic coat-
surface roughness. The HTC was 102% higher for sandblasted sur- ings created through SAMs on gold, copper, and copper-nickel alloy
face, while its pressure drop increased up to 45%. Alwazzan al et. surfaces. They investigated the performance of coated surface by
[155] promoted dropwise condensation (DWC) heat transfer by uti- conducting a steam condensation experiment. As a result of ther-
lizing hybrid-patterned surface consisting of hydrophilic and hy- mal analysis of heat transfer, the SAM coated surface obtained a
drophobic regions. The sandwiched pattern was created by sand- remarkable enhancement in condensation heat transfer coefficients
blasting and SAM coating techniques. The results reveal that the compared with FWC. Specifically, a factor of 14 for SAM-on-copper
condensation heat transfer coefficient (CHTC) of all patterned sur- tubes, nine for SAM-on-gold-coated-aluminum tubes, and SAM-
face is much higher than that of filmwise condensation (FWC). The on-copper-nickel tubes, respectively, were observed under atmo-
HTC of the optimum ratio (sandwiched gap) achieved 4.8 and 1.8 spheric condition. However, the enhancement was smaller under
times higher than that of FWC and DWC, respectively. vacuum condition, a factor of 5 for Cu and Cu-Ni and 3.8 for SAM-
Some studies utilized etching method to modify surface for heat on-gold-coated-aluminum. The key improvement from DWC is that
transfer augmentation in phase-change heat exchanger [156-158]. several tiny drops of water remain on the hydrophobic surfaces
An enhancement by 15% of condensing heat transfer in experiment that are not present during FWC. Active sweeping of larger drops
of counter flow plate heat exchanger was obtained on etched sur- from above is important to the nucleation of smaller droplets on
face. Additionally, the increasing rate and the etching time were the surface and helps DWC cycle repeats itself. In another study,
disproportional, the HTC decreased as the etching time increased long-term thermal performance of n-octadecyl mercaptan coating
above 60 seconds [156]. In another study of copper finned tube on copper surface was investigated. As a result, the coated sur-
evaporator, the copper surface was etched by sodium hydrox- face showed superhydrophobic behavior, and the condensation ex-
ide (NaOH) and potassium persulphate (K2 S2 O8 ). As a result, hy- periment observed an increase in HTC by 1.8- 3 times as high as
drophilic heat exchanger could reduce the pressure drop by 30%, FWC after 2600 hours [66]. Yang and Gu [65] employed SAMs of
while a small increment of total cooling capacity was achieved docosanoic acid on a vertical copper tube. They found an enor-
[158]. Wang al et. [157] modified fin-tube heat exchanger surface mous improvement in CHTC more than 10 times higher for SAM
by sodium hydroxide solution etching method to mitigate frosting surface in comparison to FWC on the bare surface. Chen al et.
phenomenon. The experimental data proved the effectiveness of [67] fabricated super hydrophobic coating (1530 ) on copper us-
etched surface which obtained 17.1% less frost thickness compared ing SAM of n-Octadecanethiol to promote DWC of steam. The re-
with the bare surface. Moreover, it was concluded that superhy- sult of condensation experiment revealed a noticeable HTC aug-

12
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

Table 3
Summary of studies using roughening method for heat transfer augmentation in heat exchanger.

Substrate Roughening Surface structure and Heat transfer

material method Micrograph Wettability Enhancement Ref.

Stainless steel Sandblasting – HTC enhanced by 44% Soontarapiromsook

al et. [153]

Stainless steel Sandblasting – HTC enhanced by 102% Soontarapiromsook

al et. [154]

Copper Sandblasting Hydrophobic surface 90 ± 20 HTC enhanced 4.8 Alwazzan al et.

Sandblasted surface 66 ± 40 times [155]

Stainless steel Etching 59.7±70 HTC enhanced by 15% Seok al et. [156]

Copper Etching untreated 900 /500 , treated Enhanced cooling Min al et.[158]
800 /00 capacity

Aluminum Etching – > 1500 HTC enhanced by 25% Wang al et.[157]

Copper laser-assisted Bare θ A = 10.4 ± 4.3 °, HTC enhanced by 700% Sharma al et. [159]
microcone-structured 161.6 ±
1.5 ° /160.4 ± 1.3°

Stainless steel – – HTC enhanced by 40% Longo al et. [160]

in evaporation and
60% in condensation

13
 D.H. Nguyen and H.S. Ahn
Table 4
Summary of studies of studies using nanocoating method for heat transfer augmentation in heat exchanger.

Heat transfer Substrate Coated Material/ Coating

mode material Surface structure method Micrograph Wettability Heat transfer Enhancement Ref.

Dropwise Gold, copper, Alkylthiols SAM – – HTC increased 9 times for Das al et. [64]
condensation copper-nickel gold-coated aluminum, 14
alloy times for copper and
copper-nickel tubes
Dropwise Copper Docosanoic acid and SAM – – HTC increased more than Yang and Gu [65]
condensation Ni-P-PTFE one order
Dropwise Copper n-octadecyl mercaptan SAM – Bare 33.30 , coated HTC increased 1.8-3 times Vemuri al et. [66]
condensation 1550
Dropwise Copper n-Octadecanethiol SAM Bare 850 , coated 1530 HTC increased 2.1 times Chen al et. [67]
condensation

Dropwise Copper Methyl-terminated CVD Bare 770 , coated 1680 Condensation rates Mondal al et. [163]
condensation increased 4 times
14

Dropwise Copper Graphene CVD Coated 93±50/56±50 HTC increased 4 times Preston al et. [54]
condensation

International Journal of Heat and Mass Transfer 178 (2021) 121601

Dropwise Aluminum Fluorine-doped PECVD Bare 660 , micro HTC increased 205% Ryu al et. [164]
condensation diamond-like carbon blasted 980 , F-DLC
1050 , micro blasted+
F-DLC 1420

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 D.H. Nguyen and H.S. Ahn
Table 4 (continued)

Heat transfer Substrate Coated Material/ Coating Micrograph Wettability Heat transfer Enhancement Ref.
mode material Surface structure method

Dropwise Silicon, Graft polymer iCVD – HTC increased 4-8 times Khalil al et. [165]
condensation Titanium

Dropwise Copper Fluorosilane polymer Spin coating Uncoated 1060 , Coated Unquantified enhancement Huang and Leu [74]
condensation 1530

Dropwise Aluminum Fluorosilane Spin coating Untreated 85 ± 40 , HTC increased 8 times Parin al et. [75]
condensation etched samples
151-158± 30
15

Dropwise Copper Graphene oxide Dip coating Bare 840 /100 , Coated HTC increased 8 times Colusso al et. [166]
condensation 890 /280

International Journal of Heat and Mass Transfer 178 (2021) 121601

Dropwise Copper Chlorotriethylsilane Dip coating Uncoated 101.60 , HTC increased 67.7% Panuthara al et. [167]
condensation Coated 123.50

Dropwise Copper CNT Dip coating – Uncoated 730 , Coated HTC increased 31% Kumar al et. [168]
condensation 1230
(continued on next page)
 D.H. Nguyen and H.S. Ahn
Table 4 (continued)

Heat transfer Substrate Coated Material/ Coating Micrograph Wettability Heat transfer Enhancement Ref.
mode material Surface structure method

Dropwise Stainless steel PTFE Dip coating Coated 1090 HTC increased 100% Park al et. [169]
condensation

Dropwise Stainless steel assembled CNT Dip coating Uncoated 850 , Coated HTC increased 16% Kim al et. [171]
condensation 1050

Dropwise Copper Ethyl nonafluorobutyl Spray coating Superhydrophilic 150 , HTC increased 6-16% Yang al et. [170]
condensation hydrophilic 730 ,
hydrophobic 1250
16

Dropwise Stainless steel PTFE +SiO2 Spray coating Hydrophilic 620 , HTC increased 2.7 times Ji al et. [71]
condensation hydrophobic 1320

International Journal of Heat and Mass Transfer 178 (2021) 121601

Dropwise Copper, Cerium-Oxide Electroless Coated 164.0 ± HTC increased 2-5 times Shim al et. [96]
condensation Aluminum, plating 0.50 /159.4 ± 0.80
Steel

Dropwise Naval brass Lead Ni–P–PTFE Electroless – – HTC increased 4 times Lara and Holtzapple
condensation plating [97,172]
(continued on next page)
 D.H. Nguyen and H.S. Ahn
Table 4 (continued)

Heat transfer Substrate Coated Material/ Coating Micrograph Wettability Heat transfer Enhancement Ref.
mode material Surface structure method

Dropwise Stainless steel Ni-P-PFA Electroless – – HTC increased 100% Berndt al et.
condensation coating
Dropwise Stainless steel Nitrogen ion Plasma-ion – – HTC increased 3.2 times Kananeh al et. [58]
condensation implantation
Dropwise Silicon Teflon Inductive Plain hydrophobic 102 HTC increased 155% Lu al et. [180]
condensation coupled ± 0.20 , plain
plasma hydrophilic 31 ± 0.20 ,
reactive ion nanowires 144.3 ±
etching 0.150

Dropwise Stainless steel PTFE Ion-beam – 96-1140 HTC increased 1.6–28.6 Ma al et. [173]
condensation mixed times
implantation
Dropwise Aluminum and PTFE Coated >1500 HTC increased 64% Tsuchiya al et. [174]
condensation Copper Electrospinning
17

Dropwise ZnO In Situ – HTC increased 140% Qu al et. [175]

condensation growth

International Journal of Heat and Mass Transfer 178 (2021) 121601

Jumping Copper Clustered In Situ – HTC increased 125% Zhu al et. [179]
droplet ribbed-nanoneedles growth
condensation

Jumping Copper Copper oxide Chemical 172.00 /1680 HTC increased 30% Miljkovic al et. [176]
droplet oxidation compared with DWC
condensation based CuO Sustain jumping droplet
nanostructur- up to subcooling of 5K
ing

(continued on next page)

 D.H. Nguyen and H.S. Ahn
Table 4 (continued)

Heat transfer Substrate Coated Material/ Coating Micrograph Wettability Heat transfer Enhancement Ref.
mode material Surface structure method

Jumping Copper Nickel Nanocone Coated 1610 HTC increased 89% Zhao al et. [178]
droplet Electrodeposition
condensation

Jumping Copper Straight copper Coated 139± 3.50 Heat flux increased 100% Wen al et. [87]
droplet nanowire arrays Electrodeposition compared with DWC
condensation Sustain jumping droplet
up to subcooling of 8K

Jumping Copper 3D copper nanowire – Heat flux increased 100% Wen al et. [177]
droplet network Electrodeposition compared with DWC
condensation Sustain jumping droplet
up to subcooling of 24K
18

Jumping Aluminum Biphilic Mask-free – HTC increased 184% Hou al et. [215]
droplet electrospray- compared with
condensation ing superhydrophobic surface

International Journal of Heat and Mass Transfer 178 (2021) 121601

Jumping Copper Biphilic Electrostatic Bare 810 , HTC increased 29% Zhu al et. [192]
droplet coating superhydrophobic compared with
condensation 1700 , biphilic 1690 superhydrophobic surface

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 D.H. Nguyen and H.S. Ahn
Table 4 (continued)

Heat transfer Substrate Coated Material/ Coating Micrograph Wettability Heat transfer Enhancement Ref.
mode material Surface structure method

Evaporation Stainless steel Copper – HTC increased 100% Furberg al et. [199]
Electrodeposition

Evaporation Stainless steel Copper Coated 720 HTC increased 107% Park al et. [169]
Electrodeposition

Evaporation Copper Copper Sintering – HTC increased 100% Batikan al et. [78]
19

Evaporation Copper Copper Sintering – Heat transfer rate Lee al et. [79]
increased two times

International Journal of Heat and Mass Transfer 178 (2021) 121601

Evaporation Copper Copper Sintering – Heat transfer rate Bogan and Park [80]
increased 20%

(continued on next page)

 D.H. Nguyen and H.S. Ahn
Table 4 (continued)

Heat transfer Substrate Coated Material/ Coating Micrograph Wettability Heat transfer Enhancement Ref.
mode material Surface structure method

Evaporation Copper Copper Sintering – HTC increased 3 times Xu al et. [81]

Evaporation Copper Cu-CNT-TiO2 Sintering – HTC increased 3.15 times Pialago al et. [194]
composite

Evaporation Copper CuO, Cu2 O Chemical – Unquantified enhancement Batikan al et. [201]
immersion
20

Evaporation Aluminum Aluminum thermal – HTC increased 75-150% Abraham and Mani [200]
spray

International Journal of Heat and Mass Transfer 178 (2021) 121601

Under wet Aluminum Silica Dip coating Bare 640 , coated 1540 Same heat transfer Muneeshwaran and Wang
condition Pressure drop reduced 2 [204]
times

Under wet Steel Organic resin Dip coating – 10-200 HTC increased and Ma al et. [202,203]
condition decreased base on
presence of condensate
water
Pressure drop reduced 44%
(continued on next page)
 D.H. Nguyen and H.S. Ahn
Table 4 (continued)

Heat transfer Substrate Coated Material/ Coating Micrograph Wettability Heat transfer Enhancement Ref.
mode material Surface structure method

Under wet Aluminum – Plasma – Bare 850 /420 , coated Almost the same heat Liu and Jacobi[206]
condition coating 1100 /00 transfer
Pressure drop significantly
reduced
Under wet Aluminum Hydrophilic functional Plasma Bare 900 , coated 220 Same HTC, Pressure drop Kim al et. [205]
condition groups coating reduced 25%

Under wet Copper 1-dodecanethiol SAM – Bare 91.70 /67.10 , HTC increased 5-34% Hu al et. [207]
condition coated 161.20 /138.60
Under wet Copper CNT Spray coating – Heat transfer rate Meikandan al et. [152]
condition increased 24.2%
21

Under wet – – – Hydrophilic 30 , Unquantified enhancement Kim and Lee [208]

condition hydrophobic 1300
Under wet Aluminum TiO2 Sol-gel – HTC enhanced by 2.9-7% Zhang al et. [209]
condition

International Journal of Heat and Mass Transfer 178 (2021) 121601

Under frosting Aluminum HTMS CVD Bare 106 ± 1.50 , Reduce the required Boyina al et. [211]
condition Coated 156 ± 10 defrosting time and energy
by 50%

Under frosting Aluminum Chrome-based + PTFE- – – Bare 720 , hydrophilic Heat transfer rate Jhee al et. [210]
condition based 120 , hydrophobic 1240 increased 2.7%
material
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

mentation of 1.7-2.1 times higher for SAM surface than that of mal conductivity of the CNT layers significantly decreased the con-
FWC. CVD method shows superior robustness in condensation heat striction resistance during dropwise condensation. Due to the fact
transfer applications. Graphene was coated on copper tube for en- that the previous dropwise condensation HTC model was unable
hanced condensation heat transfer via CVD [54]. The result of heat to incorporate the physics of the HTC enhancement, a new drop-
transfer experiment provided that DWC was occurred due to the wise condensation HTC model was created that included the con-
coating, and heat transfer performance increased up to 4 times striction resistance. Spin coating was employed to coat fluorosilane
for coated device compared with the bare one. In addition, de- polymer and on monolothic copper and aluminum in research of
spite being porous materials, graphene coatings often exhibit in- Huang and Leu [74] and Parin al et. [75], respectively. The wet-
ert chemical behavior and excellent mechanical strength which tability of coated surfaces was characterized by a similar degree
are expected to result in enhanced wear resistance and provide of super-hydrophobicity. While the former research only provided
a durable alternative to the current state-of-the-art functional- an unquantified HTC, enhancement obtained on coated surface, the
ization coatings. In similar research, Mondal al et. [163] created latter one emphasized an increase of eight times compared with
hybrid superhydrophobic−hydrophilic surface by CVD and impal- bare surface. Electrodeposition and electroless plating have many
ing a superhydrophobic film onto an array of steel needles. The opposite pros and cons, were used to fabricate various advanced
coated surface was placed in condensation heat transfer experi- nanostructures. Shim al et. [96] coated Cerium oxide separately on
ment functioning as a condenser to compare its thermal perfor- copper, aluminum, steel via electroless plating process. As a re-
mance with the bare surface. Consequently, condensation rate on sult, all surface showed superhydrophobic behavior, and the analy-
hybrid surface was 4 times higher than bare copper, while it was sis of condensation experimental data provided an intensification
doubled compared with a superhydrophobic surface or a silane- of 2 times and 5 times higher in HTC before and after a ther-
treated silicon surface. Recently, Ryu al et. [164] employed plasma mal stability test, respectively. The increase of heat transfer coeffi-
enhanced chemical vapor deposition (PECVD) with gaseous media cients on ceria surfaces was expected due to enhanced bubble mo-
to coat fluorine-doped diamond-like carbon (F-DLC) on Al6061 sur- bility leading decreased thermal conduction resistance across the
face with the aim of obtaining DWC and enhancing CHTC. As ex- droplet. Lara and Holtzapple conducted an investigation on DWC
pected, a hydrophobic surface promoted DWC, and the dropwise on Ni–P–PTFE coated brass surface by electroless plating. It was
condensates were rapidly removed from the condensing surface. observed that OHTC obtained on Ni–P–PTFE leaded surface was
Condensation experiment also showed a significant enhancement approximately four times as high as uncoated one [97,172]. Be-
in heat transfer performance by 205%. In the study of Khalil al et. sides, other methods were also employed to generate hydropho-
[165], graft polymer was coated on tubular surface using initiated bic surface in condensers. Plasma-ion implantation of nitrogen ion
chemical vapor deposition (iCVD), which provided an improvement was able to enhance HTC by a factor of 3.2 when comparing to
of from four to eight times in vapor-side HTC compared with in- values theoretically calculated by the corrected Nusselt film the-
dustrially relevant heat exchanger surface. Dip coating, spray coat- ory [58]. The usage of ion-beam mixed implantation technique to
ing, and spin coatings are a simple but effective method to fabri- coat PTFE on the external surfaces of brass tube resulted in the
cate hydrophobic surface for enhancing phase-change heat transfer. enhancement of 1.6-28.6 times in HTC compared to film conden-
Dip coating was utilized in studies of Colusso al et.[166], Panuthara sation [173]. PTFE-coated aluminum and copper tubes via electro-
al et. [167], Kumar al et. [168], and Park al et. [169] for promoting spinning achieved an enhanced HTC by 64% and 61% than those of
condensation heat transfer. All studies reported a remarkable aug- uncoated ones, respectively [174]. In another study, in situ growth
mentation in CHTC due to hydrophobic coating, however, the incre- of ZnO was applied on the flat copper surface, and resulted in a
ment was largely different from each other. In details, grooved cop- nearly 140% enhancement in CHTC [175].
per tube coated with chlorotriethylsilane obtained the maximum Recent research into superhydrophobic surfaces has been based
increase of 68% in HTC compared with uncoated copper tube [167], on their ability to enhance heat transfer, where low droplet ad-
which was attributed to that the droplet remaining on the coated hesion and small-size droplet departure provide high HTC. Specif-
surface sweeping off from the surface at a higher rate, opening ically, when two or more micro-sized droplets coalesce on a su-
the surface for further nucleation, resulting in higher condensation perhydrophobic surface, they leap away from the surface due to
heat transfer. While an enhancement of only 31% was observed on the release of excess surface energy, which can further augment
CNT coated surface [168], up to 8 times on graphene oxide coated condensation heat transfer compared with conventional DWC.
surface [166], and 100% on Teflon coated surface [169] in compar- Miljkovic al et. [176] showed that superhydrophobic silanized cop-
ison with the untreated one. Spray and spin coatings have been per oxide surfaces fabricated by chemical-oxidation-based CuO
used as the main method to obtain hydrophobic surface in several nanostructuring could achieve 25% higher overall heat flux and 30%
recent studies [71,74,75,170]. A hydrophobic surface (CA=1250 ) ob- higher CHTC compared to hydrophobic condensing surfaces at low
tained by spraying an organic solution of ethyl nonafluorobutyl on supersaturations (<1.12). Wen al et. [87,177] employed two-step
copper plate generated DWC in heat transfer experiment, and its porous anodic alumina (PAA) template-assisted electro-deposition
CHTC was recorded of 6-16% higher than hydrophilic surface [170]. to fabricate copper nanowire surface. The experimental result rep-
Similarly, an augmentation of 2.7 times in HCT was obtained on resented an enhancement of 100% in overall heat flux over sub-
hydrophobic coating made of polytetrafluoroethylene (PTFE) as the cooling range up to 24 K, due to the increase in effective heat
matrix resin and micro-nano silicon dioxide (SiO2 ) as the rough- transfer area of long nanowires and the jumping departure of
ness modifier [71]. Recently, Kim al et. [171] enhanced dropwise condensed droplets at extremely small sizes, which promotes the
CHTC by layer-by-layer assembled CNT coatings with an additional creation of suspended and partially wetting droplets on superhy-
hydrophobic coating on stainless steel substrate. In comparison drophobic nanowire networks. In other recent studies, although
to the bare surface, the HTC enhancement was approximately 16 some researchers did not compare condensation heat transfer
percent. Interestingly, the majority of prior research showed that performance between droplet-jumping-induced superhydrophobic
flooding droplet behavior had a detrimental effect on dropwise surface and dropwise-induced hydrophobic surface, they presented
condensation heat transfer. However, the experimental findings for significant enhancement in CHTC due to jumping droplets com-
the layer-by-layer assembled CNT coatings demonstrated that the pared with FWC. Ultrathin nickel nano-cone structure was formed
HTC enhancement occurred during dropwise condensation, indi- on copper surface via electrodeposition technique. The superhy-
cating that there is another physics underlying the HTC enhance- drophobic surface showed over 89% enhancement in CHTC com-
ment. Despite the additional conduction resistance, the high ther- pared with smooth sample [178]. Zhu al et. [179] reported CHTC of

22
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

ing of 8K was reported in the study of Wen al et. [87]. The vi-
sualization data showed that at the surface subcooling below 8
K, most droplets are in suspended states, therefore, they are re-
moved by coalescence-induced droplet jumping. After surface sub-
cooling reaching 8 K, droplets tend to form as pinning state rather
than moving state, and as a result, most coalesced droplets still re-
main on the surface, although coalescence-induced droplet jump-
ing still occurs in certain regions. With accelerated surface sub-
cooling, droplets become completely immobile and eliminated only
by gravity, as illustrated in Fig. 2 -(a-c). The droplet wetting trans-
formation may be clarified by nucleation theory [184,185], where
condensation starts with the formation of small clusters. When
increasing subcooling, the clusters begin to expand and coalesce
into the macroscopic liquid phase as long as their size surpasses a
critical size that is determined by interfacial and volumetric con-
tributions to the Gibbs free energy. Larger surface subcooling re-
sults in a lower energy barrier for droplet nucleation, although
less vapor molecules are required to meet the critical nucleation
size. Thus, vapor molecules in inner space between nanowires can-
not form the clusters larger than the critical size due to high en-
ergy barriers for nucleation at small subcooling, but it is contrary
on the top of nanowires, as a result, condensed droplets form in
Fig. 1. Droplet growth dynamics. Time-lapse images captured via environmental Cassie mode and leap after coalescing. However, for nucleation un-
scanning electron microscopy (ESEM) of steady-state water condensation on a 10 der very high subcooling, fewer vapor molecules are required to
min CuO surface. A large viewing area was used to avoid electron beam heating
effects. Condensing droplets underwent spontaneous droplet jumping and surface
form clusters having larger than the critical size, leading to the for-
renewal. Light blue dotted circles highlight areas of the surface with droplets just mation of droplet nucleation on both top and sides of nanowires.
prior to coalescence and subsequent jumping, while red dotted circles highlight ar- With the further growth of droplets, the water condensate will fill
eas of the surface right after droplet jumping [176] in the inner space, obtaining the pinned droplets (Wenzel mode),
as indicated in Fig.s 2-(d) and 3-(c). Zhang et al. [186] recently
performed a condensation experiment on a honeycomb-like mi-
copper surfaces dramatically improved by 125% for in situ growth croporous superhydrophobic surface and discovered a similar con-
of clustered ribbed-nanoneedle surface due to the effects of high- densation heat transfer mode. On the original hydrophilic surface,
density condensation nucleation and small-scale micro drop self- filmwise condensation was achieved with subcooling up to 34 K.
departure. Superhydrophobic Si nanowire surface was coated with Over the entire range of subcooling degrees, dropwise conden-
Teflon by inductive coupled plasma reactive ion etching (ICPRIE) sation occurred on the hydrophobic surface. Additionally, the su-
method. The surface obtained HTC higher than plain hydrophilic perhydrophobic surface clearly captured the coalescence-induced
surface by 155% in condensation experiment. The enhanced ther- spontaneous jumping of condensate droplets. However, it was dis-
mal performance was separately explained as due to the jumping covered that the superhydrophobic surface’s superior performance
of the liquid droplets on the surface at low subcooling, and en- degrades significantly at higher subcooling temperatures caused by
hancement of the droplet departure frequency because of a large flooding.
number of cavities of nanowire array on the surface, which inter- There have been some attempts to avoid or delay the forma-
fered with pinned Wenzel droplets and flooding happening [180]. tion of pinned droplets on superhydrophobic surface during con-
Unfortunately, most studies have failed to maintain jumping densation. The study of Wen al et. [87] on superhydrophobic sur-
droplet condensation under high subcooling condition. In this re- face for jumping droplet condensation states that the formation
gard, the droplet nucleation density (number of nucleation sites of pinned droplets is due to the formation of droplets in the in-
produced per unit area on the surface) is extremely high, suffi- ner space between nanorods structure (micro-defects). Therefore,
cient to cause flooding of the condenser surface, which may re- in their further research [177], they fabricated 3D interconnected
sult in a lower heat transfer coefficient on superhydrophobic sur- nanowire network by growing copper nanowires within an anodic
faces than on flat hydrophobic surfaces. [176,181,182]. The in- aluminum oxide (AAO) template. In comparison with the previ-
crease in subcooling leads to the increase in density of nucleat- ous research, the structure could eliminate the micro-defects, so
ing droplets, thus, the spacing between them approaches surface- that it expectedly could eliminate any room for vapor molecules
structure length scale, which facilitates flooding and droplet jump- invading into the spacing between nanowires and prevent early
ing cannot be sustained. Therefore, the heat transfer efficiency de- nucleation-density-mediated flooding, as shown in Fig. 3-(a) and
grades due to the additional thermal resistance by large pinned (b). Fig. 3-(c) demonstrates condensation mode changing from
droplets adhering to surface. Miljkovic al et. [176] reported flood- jumping to flooding on straight superhydrophobic nanowire ar-
ing happening when surface subcooling exceeds 5 K on knife-like rays. Fig. 3-(d) presents stable jumping droplet condensation on
CuO nanostructured surface, responding to heat transfer threshold 3D superhydrophobic nanowire networks under a wide range of
(80 kW/m2 ). It was blamed on the interplay between the nanos- subcooling. Due to the smaller inter-wire spacing by the intercon-
tructure length scale and nucleation density [183]. At low super- nections than the characteristic size of droplet nucleation, droplets
saturations, droplets formed with a broad distance from each other are not able to form between nanowires, instead, it is limited on
compared with nanostructure length scale, and the droplet could the top of 3D nanowire networks. Consequently, most condensed
develop in suspended states (Cassie mode), as shown in Fig. 1. At droplets can maintain suspended state at large surface subcooling.
higher supersaturations, due to the increase of droplet nucleation Aside from 3D nanowire networks, some researchers have devel-
density the distance between two evolved droplets gets smaller, oped biphilic surface inspired by the overwings of desert beetle to
so they merged and pinned to the surface (Wenzel mode) due to prevent flooding phenomenon on superhydrophobic surface [187].
contact line depinning at their base. A higher transition subcool- A biphilic surface consists of a globally superhydrophobic substrate

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D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

Fig. 2. (a) jumping condensation; (b) mixing condensation; (c) dropwise condensation. Red dotted circles highlight fresh surface areas right after droplet jumping, while deep
blue dotted circles highlight areas of the surface with droplet just after coalescence and stay on the surface; d) Droplet wetting transition controlled by initial nucleation.
The critical size for initial droplet nucleation decrease rapidly with the increase of surface subcooling [87].

face could increase the nucleation density by 65%, and the jump-
ing droplet volume by up to 450% under pure water vapor con-
dition. Hou and coworkers [190] optimized the biphilic surface by
confining hydrophilic sites. It is revealed that the hydrophilic sites
and the water vapor had significantly less interfacial energy bar-
rier than that of the superhydrophobic substrate, so that the va-
por nucleation was orderly formed and confined on the hydrophilic
sites instead of on superhydrophobic regions. Such that heteroge-
neous condensation led to 328% and 215% enhancement in nucle-
ation density and droplet departure volume, respectively. Later, the
surface was successfully fined tune to prevent flooding under high
supersaturation ( S=1.54) and high subcooling ( T> 15K) [191].
Recently, Zhu al et. [192] fabricated biphilic nano-morphological
coating on tube surface of heat exchanger prototype by electro-
static method (Fig. 4- (a)). The condensation experiment presented
an enhancement in HTC by 38% when comparing with plain super-
hydrophobic copper tubes. This is due to flooding that occurred
on superhydrophobic tube (Fig. 4- (b)) when nucleation density
is increased leading to the gap between condensed droplets ap-
proaching nanostructure length scale (Fig. 4- (c)), therefore, they
formed Wenzel state droplets pinned on the surface. On the other
hand, the droplet formation is confined on the hydrophilic sites on
the biphilic surface, which assures the formation of kinetic-favored
suspended droplets, so that they coalesce and induce jumping pro-
cess. Xie al. et al. [193] developed a model for condensation on
a biphilic surface, which included sub-models for dropwise con-
densation on a hydrophobic stripe, filmwise condensation on a hy-
drophilic stripe, and a droplet detachment radius criterion for heat-
mass transfer between the two wettability regions. This work es-
tablishes a general framework for designing biphilic surfaces that
increase efficiency by up to 67 percent as compared to purely hy-
Fig. 3. A comparison of straight nanowire arrays and 3-D nanowire networks [177].
drophobic surfaces.
The condensation heat transfer enhancement achieved by vari-
ous surface treatments relative to FWC on a flat surface by insert-
ing elements or fins, and DWC by fabricating hydrophobic surface.
and additional local hydrophilic sites having high surface energy
Promoting jumping droplet is considered as the new advanced
[188]. The bygone studies have proved the ability to delay flooding
approach for condensation heat transfer augmentation that can
and maintain jumping-droplet-enhanced behavior during conden-
achieve the optimum heat transfer enhancement but was restricted
sation of biphilic surfaces. Chen et al. [189] found that biphilic sur-

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D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

Fig. 4. (a) SEM image and Energy-dispersive spectroscopy (EDS) results of a biphilic tube and ;(b) Superhydrophobic tube with flooded condensation mode and biphilic tube
with droplet-jumping-enhanced condensation mode ;(c ) Droplet jumping mechanism on the surface with biphilic nanomorphology [192].

to low subcooling due to flooding on the surface. The solution to on the effect of the coating on heat transfer of a falling-film heat
this problem has been disclosed by advanced nano-morphological exchanger showed a two-fold enhancement in evaporation heat
structure i.e., 3D nanowire networks and biphilic structure. The transfer rate. An almost similar experiment presented a superior
current scheme of enhanced condensation heat transfer in heat ex- evaporation heat transfer augmentation which was approximately
changer is roughly shown in Fig. 5. twice as high as on the plain tubes at a low solution flow rate
[78]. Bogan and Park [80] exhibited that the enhancement would
[Link]. Enhancing evaporation heat transfer. Several coating meth- be pronounced at a low solution flow rate (evaporation-dominated
ods such as sintering, electrodeposition, thermal spray coating, and regime), however, negligible at high solution flow rates and low
chemical immersion have successfully been applied for enhancing superheat/high subcooling conditions (sensibly-dominant regimes).
vaporization heat transfer in heat exchanger devices. Sintering was Their experiment data quantified an improvement of 20% in total
used to coat a uniform porous layer of copper powder on plain heat transfer for porous tube at the highest superheat condition.
tubes in the study of Lee al et. [79]. An experimental investigation In another research conducted by Xu al et. [81], remarkably, HTC

25
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

the coalescence phenomenon and merging of nucleated bubbles.

Many of the bubbles coalesce into larger ones until they leave the
surface, which results in more heat being dissipated. On the other
hand, the bubbles have almost no interaction on the plain surface,
and they take longer time to departure compared with the one
on the sintered surface, as shown in Fig. 6. An almost similar en-
hancement of 3.15 times was observed in the study of Pialago al
et. [194] in which composite coating of Cu-CNT-TiO2 was sintered
on copper tubes of semi-flooded evaporator. The enhancement is
attributed to the discrete of extended meniscus which typically
has a contact line region that can be divided into three regions,
namely non-evaporating, evaporating, and the intrinsic meniscus
regions [195,196]. The heat transfer mainly takes place in evapo-
rating regions. While plain surface has a moderate number of large
Fig. 5. The current scheme of enhanced condensation heat transfer in heat ex- extended meniscus or non-evaporating regions, rough/coated hav-
changer ing many pores, peaks, and valleys which break non-evaporating
film into a huge amount of smaller evaporating ones [197], there-
fore, creating a much larger number of evaporating regions surface
increased up to 3 times higher for the copper sintered tube than [194,198], as indicated in Fig. 7. According to recent publications,
that with a plain surface. To analyze the heat transfer enhance- rather than sintering, nano and micro porous layer was able to coat
ment mechanism, visualization data of bubble formation on plain on heat exchanger surface by electrodeposition, thermal spray, and
and porous surface were obtained, which revealed the presence of chemical immersion. Furberg al et. [199] utilized electrodeposition
more nucleation sites on microporous coating surfaces leading to to generate porous layer of copper on plate heat exchanger sur-

Fig. 6. The course of bubble departure for microporous coated and plain copper surfaces. (a) Plain copper surface, (b) microporous coated surface [81]

26
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

izontal tubes for falling film evaporation in multi-effect desali-

nation system. The evaporation experiment showed 75-150% im-
provements in performance for spray-coated tube. The usage of
chemical immersion method in NaOH aqueous solutions was able
to create hydrophilic and hydrophobic surfaces consisting of nano-
whisker structures of CuO and nano/micro-crystal structures of
Cu2 O (oxidized), respectively [201]. Three different evaporators of
untreated, oxidized, and porous-layer coated tubes were tested in
a heat transfer experiment using a horizontal tube, falling-film
evaporator. Consequently, heat transfer rates of the oxidized tubes
were higher than that of the plain tubes, and even better than the
porous-layer coated tubes for higher solution flow rates.

[Link]. Enhancing performance of heat exchangers under frosting and

wet condition. With the aim of upgrading thermal performance,
a few researchers have applied nanocoating technology in heat
exchanger working under frosting and wet conditions. Ma al et.
[202,203] employed dip coating to created hydrophilic on sur-
face of fin-and-tube heat exchanger to enhance thermal-hydraulic
performance under dehumidifying condition. The study concluded
that the coated surface was able to enhance the heat transfer
performance only when condensate water on the plain fin could
not form much water flow, whereas the hydrophilic coating could
downgrade the heat transfer performance. In addition, the coated
surface resulted in a reduction of 44% in pressure drop on the air
side. Muneeshwaran and Wang [204] fabricated a superhydropho-
bic coating on air-cooling heat exchanger via dip coating. They
Fig. 7. Schematic of the thin-film regions on a (a) bare and (b) coated surface [194]
aimed to experimentally compare the thermal-hydraulic perfor-
mance of coated and bare heat exchangers under wet conditions.
The data revealed that the heat transfer rate between those heat
face. The analysis of evaporation heat transfer data exhibited en- exchangers was almost similar, however, a two-fold reduction in
hancement of over 100% in OHTC on the refrigerant side. It is ex- pressure drop was found on the airside for coated heat exchang-
plained by the porous surface which consists of high density of ers compared with untreated one, which led to 30-60% energy
channels that penetrate directed normally the surface, forming a could be saved for the heat transfer system. The air-side surface
dendritic structure, as depicted in Fig. 8. The combination of high was modified by plasma coating in studies of and Kim [205] and
density and channel form allows the generated vapor to be eas- Liu [206]. In the former study, hydrophilic surface was created on
ily released with low resistance from the dendritic structure. Aside fin stock for dehumidifying finned-tube heat exchangers. Although
from that, the highly interconnected network of the structure fa- coated surface did not enhance HTC on the air side, it reduced
cilities liquid transport between the channels and the interaction 25% air pressure drop when comparing with uncoated heat ex-
between the nucleating sites. Park al et. [169] electroplated copper changer under fully wet condition. In the later research, differ-
on stainless steel two-phase flow heat exchanger. In evaporation ently, wettability was controlled in a wide range of contact angles,
experiment, due to remarkably promoted heterogeneous bubble from hydrophilic to hydrophobic. The result of heat transfer ex-
nucleation, HTC saw an average enhancement of 107% compared periment showed the j factor was slightly sensitive with conden-
with the untreated heat exchanger. Abraham and Mani [200] em- sate retention, and the pressure drop on the air side significantly
ployed thermal spray method to coat molten aluminum on hor- reduced with increasing wettability. In a different research, Hu al

Fig. 8. (a) Heat exchanger plate with enhanced surface structure fabricated on the refrigerant side, (b) Close-up view of enhanced heat exchanger plate (c)and (e) SEM
picture of the enhancement structure (d) SEM side-view [199]

27
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

et. [207] generated hydrophobic coating on metal foam by SAM.

A thermal and frictional test under wet condition was conducted
and showed that the coating could achieved 5–34% higher in HTC
than that in uncoated metal foam, nevertheless, the pressure drop
increased by 1–95%. Kim and Lee [208] carried out a comparison
between the performance of hydrophilic and hydrophobic surfaces
of louvered-fin heat exchanger under wet condition. They reported
the highest average heat transfer rate was accounted for hydropho-
bic heat exchanger. The sol-gel process was used to fabricate tita-
nium dioxide (TiO2 ) film on aluminum heat exchanger in study of
Zhang al et. [209]. The heat transfer experiment was designed to
investigate the effect of coatings on thermal enhancement at five
different baking temperatures, from 150 to 600°C. The experimen-
tal result stated the maximum increase in HTC occurred at 250°C,
which was higher than that of non-coated heat exchanger by 7 %,
and the mean increment was 5.1%. In case of baking temperature
at 150°C, the maximum increment was evaluated by 4.2% and the
mean value was around 2.9%.
The application of nanocoating has also been successfully
proved in heat exchanger under frosting condition. Jhee al et.
[210] used hydrophilic and hydrophobic coatings consisting of
Fig. 9. Single-phase convective heat transfer enhancement mechanism
chrome-based + PTFE-based material on fin-tube heat exchanger.
Their study revealed that the hydrophobic surface insignificantly
influenced defrosting behavior, while the hydrophilic coating im-
pacted strongly on frosting. Both surfaces indicated a small en-
hancement in the thermal performance rather than the uncoated [221,222]. Aside from area effect, the main contribution to heat
surface. Recently, CVD and chemical etching have been utilized transfer intensification is allocated to the stimulation of turbulence
to coat HTMS on aluminum surface to study the effects of sur- flow and reduction of the thermal boundary layer near the heat
face wettability on frosting process [211]. While the etching pro- transfer surface due to modified surface structure [30]. Modified
cess resulted in a superhydrophobic surface, CVD provided a su- surface consists of many roughness elements in the forms of small
perhydrophobic one. The time-dependent heat transfer experiment ribs, grains, or nanofins which expedite the onset of local turbu-
showed the ability of superhydrophobic heat exchangers to keep lence [223,224], as depicted in Fig. 9. They interfere with fluid
heat transfer rates above 300 W three times longer than super flow by breaking laminar sub-layer near the surface and generating
hydrophilic and the unaltered one. Additionally, superhydrophobic local vortices, thus, stimulating small circulation flows and sepa-
surfaces were capable of easily removing water, leading to a re- rate boundary layers along the surface [29,225-227]. The intensi-
duction in frequency of required defrosting cycles by 3 times. A fication of local turbulence is characterized by flow reattachment
comprehensive literature survey could conclude that although hy- which is featured by topology of modified surface [228]. Coating
drophobic surface has an insignificant effect on enhancing heat layer can add additional thermal resistance which offsets the en-
transfer, it obtains much lower pressure drop than other surfaces hanced heat transfer gain by the integrated effect of the coating
under wet conditions. In addition, bygone studies also recommend layers on the thermal-hydraulic phenomena [229]. The magnitude
the use of hydrophilic surface in heat exchanger under frosting of the additional thermal resistance mainly depends on coating
condition. In defrosting condition, however, hydrophobic surface thickness and thermal conductivity of coating material [147,230].
with large contact angle has proved its outstanding performance, Thin and high thermal conductive coating is favorable for dimin-
which is followed by hydrophilic surface with small contact angle ishing the total thermal resistance across heat transfer wall. In ad-
[212-214]. dition, the thermal enhancement always accompanies the increase
in pressure drop in most single-phase studies. It is attributed to
4. Mechanism analysis roughness elements that interfere with the viscous sub-layer to
generate and stimulate local vortices and circulation flow, at the
4.1. Single-phase same time they cause disturbance to the flow near the heat trans-
fer wall, leading to the loss of energy to the flow, or pressure drop
The literature has generally reported that the prime improve- [44,228]. When the roughening approach is employed on a single-
ment mechanisms of passive surface techniques in single-phase phase heat exchanger, there is no additional conductive thermal
heat transfer are enlargement of surface area, boundary layer in- resistance added because the thickness of the heat exchanger wall
terruption, secondary flow, and fluid mixing, etc. [216-219]. Since remains nearly unchanged. Due to the effect of increasing local tur-
micro/nanoscale surface modification belongs in passive technique bulence, the roughened surface is able to reduce convective heat
group, it is not surprising that the heat transfer enhancement resistance. Nguyen al et. [231] elucidated the mechanism by which
mechanism is constituted by some of those mentioned above. heat transfer is enhanced in terms of thermal resistance. Applying
However, some differences transparently exist due to micro/nano a thin coating to the bare surface increases the surface’s overall
scale. Comparing with unmodified surface, in single-phase heat thickness, which results in an increase in total conductive thermal
transfer, modified surface possesses an enlarged surface area. The resistance, which is highly dependent on the coating thickness and
magnitude of area effect depends on particle size/or increasing thermal conductivity of the coating material [147,230]. While this
with decreasing in the size of particle. For example, pores created additional thermal resistance can impair heat transfer, it can be re-
by chemical etching have a much larger effective area for facilitat- duced by using a very thin and highly thermally conductive coat-
ing heat transfer when comparing with the plain surface [146,220]. ing. Nevertheless, the micro/nano structure created by coating en-
Vertically aligned CNT functions as nano fins which contribute hances the turbulence effect, resulting in a significant decrease in
to increasing the total surface area for convective heat transfer convective thermal resistance. Ultimately, total thermal resistance

28
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

is considerably lowered, resulting in improved heat transfer and nanostructures, as explained in section [Link] and summarized in
thermal-hydraulic efficiency. Fig. 10-(b)
The ideal evaporating heat transfer would include uniform dis-
tribution of the solution fluid cover the entire heat transfer surface.
4.2. Phase-change heat transfer Unfortunately, the dry-out or unwetted area (where the surface/a
region of the surface becomes fully or excessively dry due to boil-
It is well known that high interfacial surface energy between ing/evaporation, which evaporates liquid to vapor in the presence
substrate metal and water results in strong adhesion of conden- of insufficient liquid supply to that region) usually occurs on heat
sate droplets substrate [176,232], in a usual case that condensate exchanger surface due to surface properties, solution dispenser de-
drops’ formation is more than its removal, then these drops merge sign, tube spacing, and solution flow rate, etc. [247]. As a result,
and form a continuous liquid film covering over substrate surface the heat transfer area is decreased, leading to higher thermal re-
which interferes condensation heat transfer process [57,233,234]. sistance and low heat transfer performance. On the other hand,
The appearance of this liquid film makes the heat exchanger sur- modified surfaces are capable of preventing dry-out by continu-
face and steam flow separated or it blocks direct contact of vapor ously supplying liquid from the surrounding region; as a result, the
and heat transfer surface, therefore, it adds the additional thermal heat transfer area between the heat transfer wall and the liquid is
resistance to the heat exchange process [235]. Consequently, HTC maintained during evaporation, as is thermal resistance. The lit-
and overall heat transfer performances of heat exchanger are de- erature has proved that hydrophobic surfaces having low surface
graded. On the other hand, DWC is well known with rapid elim- energy can increase the number of vapor nucleation sites due to
ination of condensates. In DWC regime, as the vapor is cooled lower surface energy, leading to the enhance of HTC, while hy-
down by transferring heat from vapor stream to coolant flow via drophilic surfaces having high affinity can significantly improve the
heat exchanger wall, the droplets are formed on surface which has surface wettability and cause flooding at curtain nucleation sites
low surface energy, therefore, are easily dropped thanks to grav- as well as facilitating liquid supply towards the active nucleate
itational force [236,237], or spontaneous droplet jumping on spe- sites [248,249], therefore, delaying the forming of a vapor blanket
cial superhydrophobic surfaces [176]. After the droplet just drops and enhance the CHF (the thermal limit of a phase change phe-
or the condensate wipes off along the shedding paths in a discon- nomenon in which boiling occurs during heating and dramatically
tinuous fashion, the surface is renewed for forming new droplets reduces heat transfer efficiency) [250-252]. Some researchers have
[238], This renewing process is beneficial to enhance the heat made different but convincing explanations towards driven mecha-
transfer because of the minimization of thermally resistant con- nisms associated with the effects of nanostructure coating on boil-
densate [239,240]. Comparing with the additional thermal resis- ing heat transfer. Aside from wettability enhancement caused by
tance obtained in FWC, DWC only generates a much smaller con- hydrophilic surface, capillary wicking is an additional mechanism
tribution to the total thermal resistance in heat transfer process. that was suggested in the study of Kim et al. [253]. They suggested
Therefore, by promoting DWC on surfaces of the heat exchanger, that when the surface is strongly hydrophilic, liquid spreading
the HTC and heat transfer performance can be modified by several driven by the capillary wicking effect will occur in the micro and
times [241]. The condensation process of filmwise and dropwise nanoscale capillaries, with the result being a significant increase in
is indicated in Fig. 10-(a). Generally, to induce spontaneous drop liquid spreading on the dry surface to rewet the area under the
evacuation or DWC, hydrophobic and nanostructured surfaces are bubbles and improve the CHF. The capillary pumping effect was
commonly employed by using nanocoating technology. The appli- then adopted by Kim et al. [254] to better explain the rapid bubble
cation of nanostructure coating may create additional thermal re- generation on the SiNW-coated surfaces, as seen in Fig. 12. In their
sistance to the heat transfer problem, thus, offset the overall gain view, the capillary pumping effect promotes a lateral liquid flow
in heat transfer [229,242]. In the case of Cassie Baxter mode where through the porous structure, bringing in continuous liquid flow
vapor is trapped between droplets and the substrate, the heat for the phase change process, thereby increasing the bubble gener-
transfer problem encounters another additional thermal resistance ation. Similarly but extensively, the effect of hydrophilic nanowire
due to low thermal conductivity of vapor [243]. Therefore, there coating on boiling heat transfer process was reviewed in study of
is optimum configuration of wettability induced from the nanos- Kumar and coworkers [221], as illustrated in Fig. 11. It can be eas-
tructure coating for augmenting heat transfer [176,244]. Compar- ily seen that the pores formed by nanowires contribute much more
ing with the traditional DWC where removal of the droplets can nucleation sites when compared to mono-cavities [255,256]. As the
only happen until they grow to at least millimeter-sized, the re- roughness of the nanowire coating is sufficiently high for contin-
lease of excess surface energy upon coalescence of droplets is able uous rewetting of the surface during the boiling [257]. Besides,
to induce spontaneous removal of micro-sized droplets - jump- the cavities between the nanowires act as capillary pumps, and
ing droplet, therefore, significantly reducing the renew time of the continuously detach the bubble from the surface [258]. When the
condensing surface and accelerating the removal frequency of con- vapor bubble expanded creating a dry-out region below, the hy-
densate droplets, leading to much smaller thermal resistance and drophilic coating allowed the supply of water towards its bottom
further enhancement of condensation heat transfer [176]. Most of surface, slowing the dry out [249,259]. Some researchers [260,261]
the previous works achieved droplet jumping on condensation sur- experimentally proved that the mase flow rate driven by capillary
face by promoting Cassie-state droplets via either superhydropho- is relatively small and not enough to supply rapid bubble release
bic nanostructures having relatively low surface energy or prevent- due to large viscous resistance inside the small-size capillary. Li
ing vapor molecules penetrate into the nanostructures [87,245]. al et. [262] suggested that the favorable bubble dynamics phe-
The jumping droplet condensation could be maintained at low sub- nomena on porous surface is due the evaporation-induced neg-
cooling, however, as the subcooling increases, the initial size of ative pressure that is the mechanism whereby water flows from
the nucleating droplets decreases [246], which leads to flooding the roots to the leaves and flowers. As meniscus evaporating, a
on superhydrophobic surfaces as the distance between nucleating large negative pressure is created in the capillary behind it, and
droplets is decreased to meet the length scale of the nanostruc- then push a liquid flow towards the meniscus, as shown in Fig. 13.
tures. To address this challenge, some innovative nanostructures Aside from evaporation-induced negative pressure, the rapid bub-
were studied such as 3D nanowire network, biphilic and hierar- ble release is assisted by large specific surface area of the porous
chical porous superhydrophobic. The mechanism of maintaining nanostructure, the liquid will easily be heated to the saturation
jumping droplet is dependent on the unique characteristics of the temperature or pass its boiling point before reaching the menis-

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D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

Fig. 10. Enhancing condensation scheme

cus, resulting in an instantaneous phase change at the liquid/vapor common group of metrics and experimental conditions is nec-
interface. essary.
• Over time, fouling can negatively impact heat exchanger perfor-
mance. The microstructure of the material may behave differ-
5. Recommended future research direction
ently than what it would on the substrate. Therefore, the foul-
ing behavior on these surfaces needs to be studied and/or im-
The enhancement in heat transfer due to micro/nanoscale sur-
proved.
face modification techniques has shown a promising result in both
• Long-term tests need to be conducted to provide an equiva-
single and phase change heat exchanger. However, the majority of
lent measure of performance and lifetimes. Such experiments
efforts are still important to carve out the entire picture of the do-
can help identify the root causes of surface failures and how to
main.
implement techniques that would prevent or improve such fail-
• There are very few studies that have been done in a single ures in industrial settings. Coatings that are adopted should last
phase with the employment of several simple roughening and longer in harsh environmental conditions. Research should be
coating techniques. This implies an empty room for research- done to ascertain how long the structures last and if over time
ing other advanced surface modification techniques. In addition, they have retained their functionality. Other problems need
a variety of new modified surfaces were studied under differ- to be addressed including the wear, erosion, and adhesion of
ent experimental conditions for both single- and phase-change micro-nano surface coatings.
applications, which makes it difficult for comparing between • Many studies have been experimentally conducted with com-
these surfaces, thus taking into account the development of a plete heat transfer data. Correlation is a powerful and econom-

30
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

Fig. 11. Effect of hydrophilic nanofin coating on boiling heat transfer [221]

Fig. 12. capillary pumping effect on SiNW-coated surfaces [254]

6. Conclusion

Surface modification with rough and nanocoating techniques

provide numerous opportunities to modify the surface of heat ex-
changer, resulting in enhanced performance. In this paper, an up-
to-date review of the studies on the enhancement of heat transfer
using surface modification is presented for single-phase and phase
change conditions. The first section of the paper outlines various
methods used to rough and coat surfaces in heat exchangers with
the aim of improving heat transfer. The second part (Section 3)
reviews recent studies on heat transfer intensification in heat ex-
changers with the use of varying modified surfaces. In Section 4,
the enhancement mechanisms underneath different heat transfer
in both single and phase change processes are elucidated. Finally,
future research directions are addressed to fill the gaps in this re-
search area. Some of the main highlights are as follows:

Fig. 13. The evaporation-driven liquid flow towards evaporating meniscus [262] • The heat transfer enhancement in phase change is remarkably
intensified in phase change than in a single phase. The view
has shown that the maximum enhancement of 95% in single-
phase HTC, while enhancing more than 8 times and 3 times
ical tool including many essential parameters. In this context, a were reported in DWC and evaporation, respectively.
consolidated correlation is necessary to provide a better indica- • Spinning, dipping, and spraying are simple and inexpensive
tion of the results obtained so far, which is essential for future methods but their use in heat exchangers enhances perfor-
studies. mance over other coatings. Although adhesion is a concern at

31
D.H. Nguyen and H.S. Ahn International Journal of Heat and Mass Transfer 178 (2021) 121601

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