BL-M7920XU1
802.11ax 1200Mbps WLAN + BT v5.3
USB3.0 Module Specification
SHENZHEN BILIAN ELECTRONIC CO., LTD
Add: 10~11/F, Building 1A, Huaqiang idea park, Guangming district, Shenzhen. Guangdong, China
Web: [Link]
(Top View) (Bottom View)
Module Name: BL-M7920XU1
Module Type: 802.11a/b/g/n/ac/ax 1200Mbps WLAN + Bluetooth v5.3 Combo USB3.0 Module
Revision: V1.0
Customer Approval:
Company:
Title:
Signature: Date:
B-link Approval:
Title:
Signature: Date:
Revision History
Revision Summary Release Date Revised By
0.1 Initial release 2023-08-09 Fnz
1.0 Official release 2023-10-25 Fnz
1 [Link]
1. Introduction
BL-M7920XU1 is a highly integrated Dual-band WLAN + Bluetooth v5.3 Combo module. It
combines a 2T2R Dual-band WLAN subsystem and a Bluetooth v5.3 subsystem, This module
compatible IEEE 802.11 a/b/g/n/ac/ax standard and provides the maximum PHY rate up to
1200Mbps, it supports BT / BLE dual mode with BT v5.3/v4.2/v2.1 compliant, offering feature-rich
wireless connectivity at high standards, and delivering reliable, cost-effective throughput from an
extended distance.
1.1 Features
Operating Frequency: 2.4~2.4835GHz or 5.15~5.85GHz
IEEE Standards: IEEE 802.11a/b/g/n/ac/ax
Wireless PHY rate can reach up to 1200Mbps
Support BT Classic / BT Low Energy dual mode
DC 3.3V±0.2V main power supply
1.2 Block Diagram
2 [Link]
1.3 General Specifications
Module Name BL-M7920XU1
Chipset MT7920TUN
WLAN Standards IEEE 802.11 a/b/g/n/ac/ax
BT Specification Bluetooth Core Specification v5.3/4.2/2.1
Host Interface USB3.0/USB2.0 for WLAN & Bluetooth
Connect to the external antennas through IPEX connectors
Antenna
Half hole PADs for external BT antenna (Reserved IPEX connector for BT)
Dimension 27.0*17.8*2.4mm (L*W*H)
Power Supply DC 3.3V±0.2V @1200mA (Max)
Operation Temperature -20℃ to +70℃
Operation Humidity 10% to 95% RH (Non-Condensing)
2. Pin Assignments
(Top View)
2.1 Pin Definition
No. Pin Name Type Level Description
1 GND RF RF Ground for WLAN_ANT1
2 NC RF NC(Reserved 2.4G / 5G RF PAD for WLAN_ANT1)
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3 GND RF RF Ground for WLAN_ANT1
4 GND RF RF Ground for WLAN_ANT0
5 NC RF NC(Reserved 2.4G / 5G RF PAD for WLAN_ANT0)
6 GND RF RF Ground for WLAN_ANT0
7 GND P Ground connections
8 NC - NC
9 NC - NC
10 GND P Ground connections
Function1:GPIO15, output, shall not be used as input;
Function2:UART TXD_BT output;
GPIO_UART_TXD_BT Function3:BT Host Interface Select Boot strap:
11 I/O 3.3V
0:USB (internal pull low by 10K resistor)
1:UART
If not used,this Pin can be left floating.
1、GPIO14,I/O;
12 GPIO_UART_RXD_BT I/O 3.3V 2、UART RXD_BT input.
If not used,this Pin can be left floating.
13 GND P Ground connections
USB 3.0 Device SuperSpeed Interface TX differential pair,
14 USB3SSTX- AO DC blocked output(to connect USB 3.0 Host“SSRX-”)
If USB3.0 is not used,this Pin can be left floating.
USB 3.0 Device SuperSpeed Interface TX differential pair,
15 USB3SSTX+ AO DC blocked output(to connect USB 3.0 Host“SSRX+”)
If USB3.0 is not used,this Pin can be left floating.
USB 3.0 Device SuperSpeed Interface RX differential pair
USB3SSRX-
16 AI (to connect USB 3.0 Host“SSTX-”)
If USB3.0 is not used,this Pin can be left floating.
USB 3.0 Device SuperSpeed Interface RX differential pair
USB3SSRX+
17 AI (to connect USB 3.0 Host“SSTX+”)
If USB3.0 is not used,this Pin can be left floating.
18 GND P Ground connections
USB 2.0 Device HighSpeed Interface differential pair
19 HSD+ A I/O
(to connect USB 2.0/3.0 Host“HSD+”)
USB 2.0 Device HighSpeed Interface differential pair
20 HSD- A I/O
(to connect USB 2.0/3.0 Host“HSD-”)
21 VDD33 P DC 3.3V power supply
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Reset active low input,this Pin can externally shutdown/
reset the module, internal pull high by 10K resistor.
22 Reset I 3.3V The external Reset input signal should remain asserted for
1mS at least.
If not used,this Pin can be left floating.
1、GPIO7, output, shall not be used as input;
2、Normal/Test mode Select Boot strap:
GPIO
23 I/O 3.3V 0 : Normal mode (internal pull low by 10K resistor)
1 : Test mode
If not used,this Pin can be left floating.
1、GPIO11, output, shall not be used as input;
2、UART RTS_BT output;
GPIO_UART_RTS_BT
3、USB3.0 Frequency Select_Boot strap:
24 I/O 3.3V
0:USB 2.5GHz bit half super speed Mode
1:USB 5GHz Mode (internal pull high by 10K resistor)
If not used,this Pin can be left floating.
1、GPIO12,I/O;
2、UART RTS_BT input;
3、WLAN Wake up Host, Active high output (need a external
25 GPIO_UART_CTS_BT I/O 3.3V
10K pull low resistor );
4、802.11mc TSF timing synchronization input.
If not used,this Pin can be left floating.
26 NC - NC
1、GPIO5,I/O;
27 GPIO_WL_DIS I/O 3.3V 2、Reserved for WLAN Radio-off function.
If not used,this Pin can be left floating.
1、GPIO3, output, shall not be used as input;
2、BT_Stereo output.
GPIO_BT_Stereo 3、XTAL clock mode Select_Boot strap:
28 I/O 3.3V
0: 40MHz XTAL(internal weak pull low, do not pull high
during power up!)
If not used,this Pin can be left floating.
29 GND RF RF Ground for BT_ANT
30 BT_RF RF RF PAD for BT_ANT
31 GND RF RF Ground for BT_ANT
J0 WLAN_RF0 RF IPEX connector for 2.4G / 5G RF to WLAN_ANT0
J1 WLAN_RF1 RF IPEX connector for 2.4G / 5G RF to WLAN_ANT1
J2 NC NC NC(Reserved IPEX connector PAD for BT_ANT)
P: Power or Ground; I/O: In/Output; I: Input; O :Output; O/D:Open Drain Output; A I/O:
Analog In/Output; AI: Analog Input; AO: Analog Output; RF: Analog RF Port or RF Ground;
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3. Electrical and Thermal Specifications
3.1 Recommended Operating Conditions
Parameters Min Typ Max Units
Ambient Operating Temperature -20 25 70 ℃
External Antenna VSWR 1.7 2 /
Supply Voltage VDD33 3.1 3.3 3.5 V
3.2 Digital I/O DC Specifications
Symbol Parameter Min Typ Max Units
VIH Input High Voltage VDD33*0.625 -- VDD33+0.3 V
VIL Input Low Voltage -0.3 -- VDD33*0.25 V
VOH Output High Voltage VDD33*0.75 -- VDD33+0.3 V
VOL Output Low Voltage -0.3 -- VDD33*0.125 V
3.3 Current Consumption
Conditions : VDD33=3.3V ; Ta:25℃
VDD33 Current
Use Case
Typ(IRMS) Max(IPeak) Units
WLAN & BT Unassociated (Linux Driver) 137 145 mA
BT MP3 playback (Linux Driver, WLAN disable) 137 145 mA
2.4G WLAN TCP throughput TX 420Mbps (Linux Drive, BT disable) 461 760 mA
2.4G WLAN TCP throughput RX 400Mbps (Linux Drive, BT disable) 204 740 mA
5G WLAN TCP throughput TX 780Mbps (Linux Driver) 648 880 mA
5G WLAN TCP throughput RX 800Mbps (Linux Driver) 240 820 mA
2.4G 11b 1Mbps TX@20dBm (1TX RF test) 419 448 mA
2.4G 11b 11Mbps TX@20dBm (1TX RF test) 344 465 mA
2.4G 11b 1Mbps RX (1RX RF test) 95 100 mA
2.4G 11a 6Mbps TX @19dBm (1TX RF test) 348 432 mA
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2.4G HE_SU 20MHz MCS0 TX@18dBm (2TX RF test) 371 784 mA
2.4G HE_SU 20MHz MCS0 RX (2RX RF test) 109 120 mA
2.4G HE_SU 40MHz MCS11 TX@14dBm (2TX RF test) 225 584 mA
2.4G HE_SU 40MHz MCS11 RX (2RX RF test) 109 120 mA
5G 11a 6Mbps TX @19dBm (1TX RF test) 293 416 mA
5G 11a 6Mbps RX (1RX RF test) 119 131 mA
5G HE_SU 80MHz MCS0 TX@17dBm (2TX RF test) 422 912 mA
5G HE_SU 80MHz MCS11 TX@13dBm (2TX RF test) 271 720 mA
5G HE_SU 80MHz MCS11 RX (2RX RF test) 144 150 mA
BT BR_1M TX@8dBm (BT RF test, WLAN disable) 90 100 mA
BT BR_1M RX Active (BT RF test, WLAN disable) 41 50 mA
BT EDR_3M TX@5dBm (BT RF test, WLAN disable) 82 100 mA
BT LE_1M TX@5dBm (BT RF test, WLAN disable) 69 80 mA
BT LE_2M TX@5dBm (BT RF test, WLAN disable) 60 70 mA
BT LE_2M RX Active (BT RF test, WLAN disable) 48 60 mA
4. WLAN RF Specifications
4.1 2.4G WLAN RF Specification
Conditions: VDD33=3.3V; Ta:25℃
Features Description
WLAN Standard IEEE 802.11b/g/n/ax, CSMA/CA
Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band)
Channels Ch1~Ch13 (For 20MHz Channels)
802.11b (DSSS): CCK, DQPSK, DBPSK;
802.11g (OFDM): BPSK, QPSK, QAM16, QAM64;
Modulation 802.11n (OFDM): BPSK, QPSK, QAM16, QAM64;
802.11ax (OFDMA): BPSK, BPSK_DCM, QPSK, QPSK_DCM, QAM16,
QAM16_DCM, QAM64, QAM256, QAM1024;
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802.11b: 1, 2, 5.5, 11Mbps;
802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps;
802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps;
802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps;
802.11n (HT40): MCS0~MCS7(1T1R) 13.5~150Mbps;
802.11n (HT40): MCS8~MCS15(2T2R) 27~300Mbps;
Data Rate
802.11ax (HE_MU,26~242RU): MCS0~MCS11(1T1R) 0.4~143.4Mbps;
802.11ax (HE_MU,26~242RU): MCS0~MCS11(2T2R) 0.8~286.8Mbps;
802.11ax (HE_SU, non-OFDMA 20MHz): MCS0~MCS11(1T1R) 3.6~143.4Mbps;
802.11ax (HE_SU, non-OFDMA 20MHz): MCS0~MCS11(2T2R) 7.3~286.8Mbps;
802.11ax (HE_SU, non-OFDMA 40MHz): MCS0~MCS11(1T1R) 7.3~286.8Mbps;
802.11ax (HE_SU,non-OFDMA 40MHz): MCS0~MCS11(2T2R) 14.6~573.5Mbps;
Frequency Tolerance ≦ ±20ppm
2.4G Transmitter Specifications(WLAN_ANT0&WLAN_ANT1)
TX Rate TX Power TX Power Tolerance EVM
802.11b@1~11Mbps 20dBm ±2dBm ≦-10dB
802.11g@6Mbps 19dBm ±2dBm ≦-15dB
802.11g@54Mbps 17dBm ±2dBm ≦-25dB
802.11n@HT20_MCS0 18dBm ±2dBm ≦-10dB
802.11n@HT20_MCS7 16dBm ±2dBm ≦-28dB
802.11n@HT40_MCS0 18dBm ±2dBm ≦-10dB
802.11n@HT40_MCS7 16dBm ±2dBm ≦-28dB
802.11ax@HE_SU 20M_MCS0 18dBm ±2dBm ≦-10dB
802.11ax@HE_SU 20M_MCS11 14dBm ±2dBm ≦-35dB
802.11ax@HE_SU 40M_MCS0 18dBm ±2dBm ≦-10dB
802.11ax@HE_SU 40M_MCS11 14dBm ±2dBm ≦-35dB
2.4G Receiver Specifications(WLAN_ANT0&WLAN_ANT1)
RX Rate Min Input Level(Typ) Max Input Level(Typ) PER
802.11b@1Mbps -94dBm -10dBm < 8%
802.11b@11Mbps -88dBm -10dBm < 8%
802.11g@6Mbps -92dBm -10dBm < 10%
802.11g@54Mbps -73dBm -10dBm < 10%
802.11n@HT20_MCS0 -92dBm -10dBm < 10%
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802.11n@HT20_MCS7 -72dBm -10dBm < 10%
802.11n@HT40_MCS0 -89dBm -10dBm < 10%
802.11n@HT40_MCS7 -69dBm -10dBm < 10%
802.11ax@HE_SU 20M_MCS0 -91dBm -10dBm < 10%
802.11ax@HE_SU 20M_MCS11 -61dBm -10dBm < 10%
802.11ax@HE_SU 40M_MCS0 -88dBm -10dBm < 10%
802.11ax@HE_SU 40M_MCS11 -58dBm -10dBm < 10%
4.2 5G WLAN RF Specification
Conditions: VDD33=3.3V; Ta:25℃
Features Description
WLAN Standard IEEE 802.11a/n/ac/ax, CSMA/CA
5.15~5.25GHz; 5.25~5.35GHz; 5.47~5.73GHz;
Frequency Range
5.735~5.835GHz (5GHz ISM Band)
Ch36, Ch40, Ch44, Ch48; Ch52~Ch64;
Channels
Ch100~Ch140; Ch149~Ch165 (For 20MHz Channels)
802.11a (OFDM): BPSK, QPSK, QAM16, QAM64;
802.11n (OFDM): BPSK, QPSK, QAM16, QAM64;
Modulation 802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256;
802.11ax (OFDMA): BPSK, BPSK_DCM, QPSK, QPSK_DCM, QAM16,
QAM16_DCM, QAM64, QAM256, QAM1024;
802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps;
802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps;
802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps;
802.11n (HT40): MCS0~MCS7(1T1R) 13.5~150Mbps;
802.11n (HT40): MCS8~MCS15(2T2R) 27~300Mbps;
802.11ac (VHT20): MCS0~MCS8(1T1R) 6.5~86.7Mbps;
802.11ac (VHT20): MCS0~MCS8(2T2R) 13~173.3Mbps;
802.11ac (VHT40): MCS0~MCS9(1T1R)13.5~200Mbps;
Data Rate
802.11ac (VHT40): MCS0~MCS9(2T2R)27~400Mbps;
802.11ac (VHT80): MCS0~MCS9(1T1R)29.3~433.3Mbps;
802.11ac (VHT80): MCS0~MCS9(2T2R)58.5~866.7Mbps;
802.11ax (HE_MU,26~484RU): MCS0~MCS11(1T1R) 0.4~286.8Mbps;
802.11ax (HE_MU,26~484RU): MCS0~MCS11(2T2R) 0.8~573.5Mbps;
802.11ax (HE_SU, non-OFDMA 20MHz): MCS0~MCS11(1T1R) 3.6~143.4Mbps;
802.11ax (HE_SU, non-OFDMA 20MHz): MCS0~MCS11(2T2R) 7.3~286.8Mbps;
802.11ax (HE_SU, non-OFDMA 40MHz): MCS0~MCS11(1T1R) 7.3~286.8Mbps;
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802.11ax (HE_SU,non-OFDMA 40MHz): MCS0~MCS11(2T2R) 14.6~573.5Mbps;
802.11ax (HE_SU,non-OFDMA 80MHz): MCS0~MCS11(1T1R) 15.3~600.4Mbps;
802.11ax (HE_SU, non-OFDMA 80MHz): MCS0~MCS11(2T2R) 30.6~1201Mbps;
Frequency Tolerance ≦ ±20ppm
5G Transmitter Specifications(WLAN_ANT0&WLAN_ANT1)
TX Rate TX Power TX Power Tolerance EVM
802.11a@6Mbps 19dBm ±2dBm ≦-10dB
802.11a@54Mbps 17dBm ±2dBm ≦-25dB
802.11n@HT20_MCS0 18dBm ±2dBm ≦-10dB
802.11n@HT20_MCS7 16dBm ±2dBm ≦-28dB
802.11n@HT40_MCS0 18dBm ±2dBm ≦-10dB
802.11n@HT40_MCS7 16dBm ±2dBm ≦-28dB
802.11ac@VHT20_MCS0 18dBm ±2dBm ≦-10dB
802.11ac@VHT20_MCS8 15dBm ±2dBm ≦-30dB
802.11ac@VHT40_MCS0 18dBm ±2dBm ≦-10dB
802.11ac@VHT40_MCS9 15dBm ±2dBm ≦-32dB
802.11ac@VHT80_MCS0 18dBm ±2dBm ≦-10dB
802.11ac@VHT80_MCS9 14dBm ±2dBm ≦-32dB
802.11ax@HE_SU 20M_MCS0 18dBm ±2dBm ≦-10dB
802.11ax@HE_SU 20M_MCS11 14dBm ±2dBm ≦-35dB
802.11ax@HE_SU 80M_MCS0 17dBm ±2dBm ≦-10dB
802.11ax@HE_SU 80M_MCS11 13dBm ±2dBm ≦-35dB
5G Receiver Specifications(WLAN_ANT0&WLAN_ANT1)
RX Rate Min Input Level(Typ) Max Input Level(Typ) PER
802.11a@6Mbps -92dBm -10dBm < 10%
802.11a@54Mbps -73dBm -10dBm < 10%
802.11n@HT20_MCS0 -92dBm -10dBm < 10%
802.11n@HT20_MCS7 -72dBm -10dBm < 10%
802.11n@HT40_MCS0 -89dBm -10dBm < 10%
802.11n@HT40_MCS7 -69dBm -10dBm < 10%
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802.11ac@VHT80_MCS0 -86dBm -10dBm < 10%
802.11ac@VHT80_MCS9 -59dBm -10dBm < 10%
802.11ax@HE_SU 80M_MCS0 -86dBm -10dBm < 10%
802.11ax@HE_SU 80M_MCS11 -56dBm -10dBm < 10%
4.3 Bluetooth RF Specification
Conditions: VDD33=3.3V; Ta:25℃
Features Description
Bluetooth Specification Bluetooth Core Specification v5.3/4.2/2.1
Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band)
Bluetooth Classic: Ch0~Ch78 (For 1MHz Channels);
Channels
Bluetooth Low Energy: Ch0~Ch39 (For 2MHz Channels);
Bluetooth Classic BR/EDR: Class1;
Power Classes
Bluetooth Low Energy: Class1.5;
BR_1Mbps: GFSK;
EDR_2Mbps: π/4-DQPSK;
EDR_3Mbps: 8DPSK;
Data Rate & Modulation LE_125Kbps: GFSK (Coded_S=8);
LE_500Kbps: GFSK (Coded_S=2);
LE_1Mbps: GFSK (Uncoded);
LE_2Mbps: GFSK (Uncoded);
Bluetooth Transmitter Specifications (BT_ANT)
Items Min Typ Max
TX Power
BR_1M 5dBm 8dBm 11dBm
EDR_2/3M 2dBm 5dBm 8dBm
LE_125K/500K/1M/2M 2dBm 5dBm 8dBm
Items Min Typ Max
BR_1M (DH1) Modulation Characteristics
Δf1avg 140KHz 165.1kHz 175KHz
Δf2avg 115KHz 149.9kHz /
Δf2max 115KHz 155.2kHz /
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Δf2avg/Δf1avg 0.8 0.96 /
BR_1M (DH1) Initial Carrier Frequency Tolerance
Init Freq Error -75kHz -13.3kHz +75kHz
EDR_3M(3DH5) EDR Carrier Frequency Stability and Modulation Accuracy
ωi -75KHz -2.98KHz +75KHz
ωi+ωo -75KHz -3.2KHz +75KHz
ωo -10KHz -0.3KHz +10KHz
8DPSK RMS DEVM / 0.042 0.13
8DPSK Peak DEVM / 0.085 0.25
LE_1M Modulation Characteristics
Δf1avg 225KHz 252.24KHz 275KHz
Δf2avg 185KHz 226.9KHz /
Δf2max 185KHz 219.21KHz /
Δf2avg/Δf1avg 0.8 0.899 /
LE_2M Modulation Characteristics
Δf1avg 450KHz 499.72KHz 550KHz
Δf2avg 370KHz 494.59KHz /
Δf2max 370KHz 474.7KHz /
Δf2avg/Δf1avg 0.8 0.989 /
Bluetooth Receiver Specifications (BT_ANT)
Sensitivity Maximum Input Level
Items
Input Level(Typ) BER Input Level(Typ) BER
BR_1M(1DH1) -90dBm ≦0.1% -5dBm ≦0.1%
EDR_2M(2DH1) -80dBm ≦0.01% -5dBm ≦0.1%
EDR_3M(3DH5) -80dBm ≦0.01% -5dBm ≦0.1%
Input Level (Typ) PER Input Level (Typ) PER
LE_125K/500K -92dBm ≦5% -5dBm ≦5%
LE_1M -88dBm ≦5% -5dBm ≦5%
LE_2M -84dBm ≦5% -5dBm ≦5%
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5. Mechanical Specifications
5.1 Module Outline Drawing
(Top View) (Side View) (Bottom View)
Module dimension: 27.0mm*17.8mm*2.4mm (L*W*H; Tolerance: ±0.3mm_L/W, ±0.2mm_H)
IPEX / MHF-1 connector dimension: 3.0*2.6*1.2mm (L*W*H, Ø2.0mm)
Module Bow and Twist:≤0.1mm
13 [Link]
5.2 Mechanical Dimensions
(Top View) (Bottom View)
6. Application Information
6.1 Typical Application Circuit
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6.2 External Antenna Isolation
Isolation of BT_ANT and WLAN_ANT ≥30dB for better BT and WLAN T/RX Concurrent performance;
Isolation of WLAN_ANT0 and WLAN_ANT1 ≥17dB (2.4G band) & ≥20dB (5G band) for better MIMO
Application;
6.3 Reset input requirement
The module has built-in power on reset function, an external Reset signal can also be input from Pin22.
A、Power on reset: When VDD33 is powered on and reaches 2.85V, a stable waiting time >55.1mS is required for
the crystal oscillator. Then the external Reset signal continues to remain asserted (<0.9V) >1ms. When the
external Reset signal goes to high level (>1.2V), BL-M7920XU1 releases reset and enters the ready state.
B、Hot reset: When the module is ready, external Reset signal drops from high to low level (<0.9V) and remains at
least 1ms, then rises again to high level (>1.2V) , the module completes a hot reset and re-enter the ready state.
C、Cold reset: When the module is ready, VDD33 power down and remain at a low level (<0.4V) least 1ms, then
power on again and repeat the process of A above.
6.4 USB interface Design Guidelines
A 、BL-M7920XU1 supports a USB device port which is fully compliant with USB v3.0 specification.
The Module can provide a concurrent operation of WLAN and Bluetooth over USB interface, also features
the high speed UART interface (Set PIN11 to“1”during power up) to support Bluetooth over UART.
B、It can connect to a USB 3.0 host port (connect all of HSD+/-、SSTX+/-、SSRX+/- signals) of System
Controller, WLAN & BT data rate up to 800Mbps with USB 3.0 Super Speed mode.
It can connect to a USB 2.0 host port(connect HSD+/- signals, left SSTX+/- and SSRX+/- float) of System
Controller, WLAN & BT data rate up to 330Mbps with USB 2.0 High Speed mode.
D、The USB high speed differential pair should be maintain 90 ±5 differential impedance.
D、Use minimum of PCB layer change、PCB trace/cable corner、connector--cable interconnection、signal pairs
length mismatch, to reduces signal reflections and impedance changes.
E、USB signal pairs as short as possible, avoid interference from Power and other signals.
F 、AC coupling capacitors for SSTX+/-、Common Mode filters for SSTX+/-、SSRX+/- are integrated on module.
G、The equivalent capacitance of optional ESD protection component on HSD+/- should <3pF.
The equivalent capacitance of optional ESD protection component on SSTX+/-、SSRX+/- should be <0.3pF.
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6.5 Recommend PCB Layout Footprint
(Design Units:mm)
6.6 Reflow Soldering Standard Conditions
Please use the reflow within 2 times.
Set up the highest temperature within 250℃.
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7. Key Components Of Module
No. Parts Specification Manufacturer Note
1 Chipset MT7920TUN MediaTek Inc.
SHEN ZHEN QILI ELECTRON CO.,LTD
2 PCB BL-M7920XU1 ShenZhen Tie Fa Technology Limited
Huizhou Dayawan Kexiang Technology Circuit Board Co., Ltd
Chengde oscillator Electronic Technology CO.,LTD
3 Crystal 40MHz-2016 LUCKI CM ELECTRONICS CO.,LTD
JinHua East Crystal Electronic CO.,LTD
Walsin Technology Corporation
Diplexer DIP1608
4 Dongguan Hekang Electronics Co.,LTD
FTR Technology Corporation
8. Package and Storage Information
8.1 Package Dimensions
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Package specification:
1. 900 modules per roll and 3,600 modules per box.
2. Outer box size: 39.5*38*35cm.
3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a
width of 44mm carrying belt).
4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag.
5. Each carton is packed with 4 boxes.
9. Storage Conditons
Absolute Maximum Ratings:
Storage temperature: -40℃ to +85℃
Storage humidity: 10% to 95% RH(Non-Condensing)
Recommended Storage Conditions:
Storage temperature: 5℃ to +40℃
Storage humidity: 20% to 90% RH
Please use this Module within 12month after vacuum-packaged.
The Module shall be stored without opening the packing.
After the packing opened, the Module shall be used within 72hours.
When the color of the humidity indicator in the packing changed,
the Module shall be baked before soldering.
Baking condition : 60℃, 24hours, 1time.
ESD Sensitivity:
ESD Protection: 2KV(HBM, Maximum rating)
The Module is a static-sensitive electronic device.
Do not operate or store near strong electrostatic fields.
Take proper ESD precautions!
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