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Module V Assignment All76 PDF

The document outlines assignment questions for a module on interconnect, I/O pads, and layout in VLSI design, focusing on various topics including layouts of universal gates, interconnect parameters, parasitics, I/O pads, and ESD protection circuits. Each question requires students to perform design tasks, derive expressions, and analyze circuit behavior, with specific assignments listed for individual students. The assignments emphasize practical applications of CMOS technology and design rules, as well as theoretical concepts in electrical engineering.

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firstrahul39
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0% found this document useful (0 votes)
7 views3 pages

Module V Assignment All76 PDF

The document outlines assignment questions for a module on interconnect, I/O pads, and layout in VLSI design, focusing on various topics including layouts of universal gates, interconnect parameters, parasitics, I/O pads, and ESD protection circuits. Each question requires students to perform design tasks, derive expressions, and analyze circuit behavior, with specific assignments listed for individual students. The assignments emphasize practical applications of CMOS technology and design rules, as well as theoretical concepts in electrical engineering.

Uploaded by

firstrahul39
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

MODULE V – ASSIGNMENT QUESTIONS

Interconnect, I/O Pads, and Layout


VLSIDesign | DigitalIntegratedCircuits
Q. Question Assigned Students (Roll No. | Name)
No.

Topic 1: Layouts of Universal Gates and Design Rules

1. Draw the stick diagram and complete layout of a 2-input NAND gate using CMOS Assigned To:
technology. Label all layers (diffusion, polysilicon, metal) and verify compliance with lambda- BTECH/10152/24 ABHINAV
based design rules as per Mead-Conway guidelines. Also explain why design rules are BTECH/10164/24 NABANJAN DUTTA
stated in terms of lambda (λ) rather than absolute dimensions. BTECH/10253/24 AYUSH JAISWAL
BTECH/10317/24 RUDRAKSH

2. Design a minimum-area CMOS layout for the logic function F = (A + B)(C + D) using Euler Assigned To:
BTECH/10434/24 SIDHANT ANWESHI
path ordering. Draw the stick diagram, derive the optimal transistor ordering for pull-up and BTECH/10438/24 ANIMESH KUMAR
pull-down networks, and compare the area with a naïve layout implementation. BTECH/10454/24 PREKSHA BAID
BTECH/10501/24 PRINCE RAJ

Assigned To:
3. Implement the logic function F = (AB + CD + EF)' using diffusion sharing and transistor
BTECH/10625/24 PARI GAUTAM
reordering. Derive all possible Euler paths and determine which one minimizes diffusion
BTECH/10649/24 RAM GUPTA
breaks. Compare the layout with a standard AOI gate in terms of area efficiency and well BTECH/10668/24 GUNGUN KUMARI
contact placement. BTECH/10671/24 PRITIKA KUMARI

Assigned To:
4. For a 0.18 μm CMOS technology, design the layout of a 3-input NAND gate optimized for BTECH/10672/24 PRATIK TIRKEY
minimum delay instead of minimum area. Determine the optimal transistor widths using BTECH/10677/24 OM KUMAR SINGH
logical effort and estimate the layout area penalty. Explain how design rule violations (e.g., BTECH/10678/24 DIPANSHU AGRAWAL
minimum polysilicon spacing) are detected by DRC tools. BTECH/10679/24 RAHUL SAHU

Topic 2: Interconnect Parameters and Electrical Wire Models


5. A global interconnect of length 4 mm is implemented in a 90 nm CMOS process. Given: Assigned To:
Sheet resistance = 0.05 Ω/□, Wire capacitance = 0.18 fF/μm. Derive the distributed RC delay BTECH/10680/24 PRINCE JANARDAN
expression and compute the delay using the Elmore delay approximation. Show that BTECH/10682/24 HIMANSHU DUBEY
BTECH/10685/24 DEVENDRA HEMBRAM
propagation delay is proportional to L².
BTECH/10686/24 KSHITIZ SINHA
Assigned To:
6. A global clock wire of 5 mm length must meet a skew budget of 50 ps. Given R_sheet = 0.08 BTECH/10691/24 HITESH BAJAJ
Ω/□ and C = 0.2 fF/μm², determine the minimum required wire width and suggest an optimal BTECH/10698/24 SUMIT RATHORE
repeater buffering strategy to meet the constraint. Derive the optimal number and size of BTECH/10701/24 ARPAN MANEK
repeaters. BTECH/10708/24 HIMANSHU GUPTA

Assigned To:
7. A clock distribution network must drive 32 loads arranged in an H-tree structure. Derive the
Elmore delay expression for each branch and estimate the maximum clock skew. Compare BTECH/10712/24 ARYAN RAJ
lumped vs. distributed wire models and identify the frequency at which inductance effects BTECH/10715/24 MOHIT
BTECH/10716/24 MOHAMMAD SHARIB
must be included. SIDDIQUI
BTECH/10717/24 PRIYANSHU SRIVASTAVA
Assigned To:
8. Starting from Maxwell's equations, derive the distributed RLC transmission line model for on-
BTECH/10719/24 AMAN CHANDRA
chip wires. For a high-speed bus operating at 3 GHz, analyze the effects of skin effect, BTECH/10720/24 SADIQUE AHMAD KHAN
inductive ringing, and crosstalk-induced delay variations. BTECH/10721/24 NITIN SINGH
BTECH/10725/24 ADITYA RAJ

Topic 3: Capacitive, Resistive, and Inductive Parasitics

9. Derive a complete capacitance model for two parallel interconnect wires including: (a) Assigned To:
BTECH/10735/24 PAWAN KUMAR RANA
parallel plate capacitance, (b) fringing capacitance, and (c) coupling capacitance. Compare
BTECH/10745/24 AYUSH MARK HEMBROM
the values when using SiO₂ (k = 3.9) and low-k dielectric (k = 2.5) and discuss how low-k BTECH/10746/24 ARNAV SRIVASTAVA
materials reduce parasitic interconnect delay. BTECH/10756/24 SIDDHARTH KUMAR
NAYAK
Assigned To:
10. In a 65 nm process, two parallel wires run for 1 mm with a coupling capacitance of 0.15
BTECH/10767/24 SOURISH CHOUDHARY
fF/μm. A signal wire also runs parallel to an aggressor wire for 500 μm. Calculate the Miller BTECH/10774/24 AYUSH
coupling capacitance and analyze its effect on signal integrity (delay, noise) for both in-phase BTECH/10776/24 PRAKHAR TAMBI
and out-of-phase switching scenarios. BTECH/10794/24 AOZZ BRAHMSHIV JHA

Assigned To:
11. Derive the inductance per unit length of a microstrip wire over a ground plane. At what clock BTECH/10799/24 GARIMA AGARWAL
frequency does inductive impedance become comparable to resistive impedance for a 1 mm BTECH/10805/24 SAMEER KUMAR
Cu wire of 1 μm width? Compute the inductive reactance at 5 GHz using appropriate process BTECH/10814/24 SRIJAN SINHA
parameters. BTECH/10816/24 ARYAMAN PRASAD

Assigned To:
12. Perform parasitic extraction of a 2 mm clock wire using both π-model and T-model and BTECH/10826/24 SAHIL
compare accuracy with the distributed RC model. In a mixed-signal SoC, model the substrate BTECH/10831/24 SUMIT KUMAR DUTTA
as a distributed RC network and estimate the noise voltage reaching an analog block due to BTECH/10834/24 VIVEK KUMAR SAHU
BTECH/10847/24 SAGARNIL BARARI
digital switching. Explain how guard rings and deep n-well structures mitigate this coupling.

Topic 4: I/O Pads and ESD Protection Circuits


13. Design a CMOS output driver capable of driving a 50 Ω transmission line at 1 Gbps. Include Assigned To:
pre-driver stages and slew-rate control. Determine the required transistor sizing, estimate BTECH/10849/24 SMARAN YANAPU
power dissipation, and explain how controlled edge rates reduce EMI and ground bounce. BTECH/10850/24 ANKIT RAJ
BTECH/10859/24 ARYAN PATRO
BTECH/10863/24 AADARSH NINGWAL
Assigned To:
14. During a 2 kV Human Body Model (HBM) ESD event, derive the current waveform and BTECH/10871/24 ABDULLAH SAIF
calculate the peak current and energy dissipated in the protection device. Explain the
operation of a double-diode clamp structure and verify the device can handle the event BTECH/10879/24 SHARWANI MUNDA
without triggering latch-up. BTECH/10887/24 NAMAN GUPTA
BTECH/10888/24 STUTI GARG

15. Compare SCR-based ESD protection circuits with diode-based clamps in terms of: (a) trigger Assigned To:
voltage, (b) holding voltage, (c) area efficiency, and (d) leakage current. Analyze gate- BTECH/10891/24 ANISH KUMAR GUPTA
grounded NMOS (ggNMOS) vs. SCR I-V characteristics and their suitability for nanometer BTECH/10895/24 MICHRAI PURTY
BTECH/10897/24 BHAGYA RAJ
CMOS technologies. BTECH/10899/24 AKRITI AGARWAL

16. Assigned To:


A chip uses 1.2 V core logic and 3.3 V I/O logic. Design a level-shifting circuit that prevents
BTECH/10920/24 SUJEET TANA BHAGAT
oxide breakdown and ensures reliable operation. Explain how transistor stacking prevents BTECH/10938/24 MAYUR SETH
oxide overstress and ensures correct logic translation between voltage domains. BTECH/10939/24 PREETY MURMU
BTECH/10942/24 RAKSHIT POONIA

Topic 5: Bidirectional and Schmitt Trigger in the Input Pad

17. Analyze the latch-up condition in CMOS I/O pads using the parasitic npnp thyristor model. Assigned To:
Describe layout-level and circuit-level techniques — guard rings, well taps, and retrograde BTECH/10949/24 ADITI SHANKAR
wells — used to prevent latch-up triggering during ESD events. BTECH/10955/24 MANISH JALARAM BISNOI
BTECH/10956/24 PALAK CHANDAN
AGARWALA
BTECH/10961/24 ANMOL KACHHAP

Assigned To:
18. Design a bidirectional I/O pad that functions as both input and output depending on an enable
signal. Include bus-hold circuitry with weak feedback to prevent floating nodes. Draw the BTECH/10969/24 PREM RANJAN
BTECH/10977/24 SOURABH KUMAR
complete transistor-level schematic, explain tri-state output control, and discuss how bus
BTECH/10978/24 ADITYA MAHESH
contention is avoided.
BTECH/10982/24 DIVYANSHU KUMAR

Derive the switching thresholds (V_IL, V_IH) of a CMOS Schmitt trigger in terms of transistor Assigned To:
19. BTECH/10989/24 MALOTH SHASANK
sizing ratios. Design a Schmitt trigger for a 3.3 V supply with switching thresholds V_TH+ =
BTECH/10998/24 KHUSHI NARENDRA
2.1 V and V_TH− = 0.9 V. Calculate all transistor dimensions and verify the hysteresis SHUKLA
window using DC transfer curve analysis. BTECH/11001/24 DIVYESH MOHAN
BTECH/11009/24 LAXMI KUMARI

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