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The AM62x Sitara™ processors feature a quad-core Arm Cortex-A53 microprocessor subsystem, a single-core Cortex-M4F MCU, and extensive multimedia capabilities including dual display support and a 3D graphics processing unit. Designed for industrial and automotive applications, these processors support secure boot, power management, and a wide range of connectivity options such as Ethernet, USB, and CAN-FD. The family includes various models tailored for specific applications like human-machine interfaces, IoT, and automotive systems.

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AM625, AM625-Q1, AM623, AM620-Q1

SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

AM62x Sitara™ Processors

1 Features Memory Subsystem:
Processor Cores: • Up to 816KB of On-chip RAM
• Up to Quad 64-bit Arm® Cortex®-A53 – 64KB of On-chip RAM (OCSRAM) with
microprocessor subsystem at up to 1.4GHz SECDED ECC , Can be divided into smaller
banks in increments of 32KB for as many as 2
– Quad-core Cortex-A53 cluster with 512KB L2
separate memory banks
shared cache with SECDED ECC
– 256KB of On-chip RAM with SECDED ECC in
– Each A53 Core has 32KB L1 DCache with
SMS Subsystem
SECDED ECC and 32KB L1 ICache with Parity
– 176KB of On-chip RAM with SECDED ECC in
protection
SMS Subsystem for TI security firmware
• Single-core Arm® Cortex®-M4F MCU at up to
– 256KB of On-chip RAM with SECDED ECC in
400MHz
Cortex-M4F MCU subsystem
– 256KB SRAM with SECDED ECC
– 64KB of On-chip RAM with SECDED ECC in
• Dedicated Device/Power Manager
Device/Power Manager Subsystem
Multimedia: • DDR Subsystem (DDRSS)
– Supports LPDDR4, DDR4 memory types
• Display subsystem
– 16-Bit data bus with inline ECC
– Dual display support
– Supports speeds up to 1600MT/s
– 1920x1080 @ 60fps for each display
– Max addressable range
– 1x 2048x1080 + 1x 1280x720
• 8GBytes with DDR4
– Up to 165MHz pixel clock support with
• 4GBytes with LPDDR4
Independent PLL for each display
– OLDI (4 lanes LVDS - 2x) and DPI (24-bit RGB Functional Safety:
LVCMOS)
• Functional Safety-Compliant targeted [Automotive]
– Support safety feature such as freeze frame
detection and MISR data check – Developed for functional safety applications
• 3D Graphics Processing Unit – Documentation will be available to aid ISO
26262 functional safety system design
– 1 pixel per clock or higher
– Systematic capability up to ASIL D targeted
– Fillrate greater than 500Mpixels/sec
– Hardware integrity up to ASIL B targeted
– >500MTexels/s, >8GFLOPs
– Safety-related certification
– Supports at least 2 composition layers
– Supports up to 2048x1080 @60fps • ISO 26262 by TUV SUD planned
– Supports ARGB32, RGB565 and YUV formats • AEC - Q100 qualified
– 2D graphics capable
– OpenGL ES 3.1, Vulkan 1.2
• One Camera Serial interface (CSI-Rx) - 4 Lane
with DPHY
– MIPI® CSI-2 v1.3 Compliant + MIPI D-PHY 1.2
– Support for 1,2,3 or 4 data lane mode up to
1.5Gbps per lane
– ECC verification/correction with CRC check +
ECC on RAM
– Virtual Channel support (up to 16)
– Ability to write stream data directly to DDR via
DMA

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Security: High-Speed Interfaces:

• Secure boot supported • Integrated Ethernet switch supporting (total 2
– Hardware-enforced Root-of-Trust (RoT) external ports)
– Support to switch RoT via backup key – RMII(10/100) or RGMII (10/100/1000)
– Support for takeover protection, IP protection, – IEEE1588 (Annex D, Annex E, Annex F with
and anti-roll back protection 802.1AS PTP)
• Trusted Execution Environment (TEE) supported – Clause 45 MDIO PHY management
– Arm TrustZone® based TEE – Packet Classifier based on ALE engine with
– Extensive firewall support for isolation 512 classifiers
– Secure watchdog/timer/IPC – Priority based flow control
– Secure storage support – Time sensitive networking (TSN) support
– Replay Protected Memory Block (RPMB) – Four CPU H/W interrupt Pacing
support – IP/UDP/TCP checksum offload in hardware
• Dedicated Security Controller with user • Two USB2.0 Ports
programmable HSM core and dedicated security – Port configurable as USB host, USB peripheral,
DMA & IPC subsystem for isolated processing or USB Dual-Role Device (DRD mode)
• Cryptographic acceleration supported – Integrated USB VBUS detection
– Session-aware cryptographic engine with ability General Connectivity:
to auto-switch key-material based on incoming
data stream • 9x Universal Asynchronous Receiver-Transmitters
• Supports cryptographic cores (UART)
– AES – 128-/192-/256-Bit key sizes • 5x Serial Peripheral Interface (SPI) controllers
– SHA2 – 224-/256-/384-/512-Bit key sizes • 6x Inter-Integrated Circuit (I2C) ports
– DRBG with true random number generator • 3x Multichannel Audio Serial Ports (McASP)
– PKA (Public Key Accelerator) to Assist in – Transmit and Receive Clocks up to 50MHz
RSA/ECC processing for secure boot – Up to 4/6/16 Serial Data Pins across 3x McASP
• Debugging security with Independent TX and RX Clocks
– Secure software controlled debug access – Supports Time Division Multiplexing (TDM),
– Security aware debugging Inter-IC Sound (I2S), and Similar Formats
– Supports Digital Audio Interface Transmission
PRU Subsystem: (SPDIF, IEC60958-1, and AES-3 Formats)
• Dual-core Programmable Real-Time Unit – FIFO Buffers for Transmit and Receive (256
Subystem (PRUSS) running up to 333MHz Bytes)
• Intended for driving GPIO for cycle accurate – Support for audio reference output clock
protocols such as additional: • 3x enhanced PWM modules (ePWM)
– General Purpose Input/Output (GPIO) • 3x enhanced Quadrature Encoder Pulse modules
– UARTs (eQEP)
– I2C • 3x enhanced Capture modules (eCAP)
– External ADC • General-Purpose I/O (GPIO), All LVCMOS I/O can
• 16KByte program memory per PRU with SECDED be configured as GPIO
ECC • 3x Controller Area Network (CAN) modules with
• 8KB data memory per PRU with SECDED ECC CAN-FD support
• 32KB general purpose memory with SECDED – Conforms w/ CAN Protocol 2.0 A, B and ISO
ECC 11898-1
• CRC32/16 HW accelerator – Full CAN FD support (up to 64 data bytes)
• Scratch PAD memory with 3 banks of 30 x 32-bit – Parity/ECC check for Message RAM
registers – Speed up to 8Mbps
• 1 Industrial 64-bit timer with 9 capture and
16 compare events, along with slow and fast
compensation
• 1 interrupt controller (INTC), minimum of 64 input
events supported

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[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Media and Data Storage: Optimal Power Management Solution:

• 3x Multi-Media Card/Secure Digital® (MMC/SD®/ • Recommended TPS65219 Power Management
SDIO) interface ICs (PMIC)
– 1x 8-bit eMMC interface up to HS200 speed – Companion PMIC specially designed to meet
– 2x 4-bit SD/SDIO interface up to UHS-I device power supply requirements
– Compliant with eMMC 5.1, SD 3.0 and SDIO – Flexible mapping and factory programmed
Version 3.0 configurations to support different use cases
• 1× General-Purpose Memory Controller (GPMC)
Boot Options:
up to 133MHz
– Flexible 8- and 16-Bit Asynchronous Memory • UART
Interface With up to four Chip (22-bit address) • I2C EEPROM
Selects (NAND, NOR, Muxed-NOR, and • OSPI/QSPI Flash
SRAM) • GPMC NOR/NAND Flash
– Uses BCH Code to Support 4-, 8-, or 16-Bit • Serial NAND Flash
ECC • SD Card
– Uses Hamming Code to Support 1-Bit ECC • eMMC
– Error Locator Module (ELM) • USB (host) boot from Mass Storage device
• Used With the GPMC to Locate Addresses • USB (device) boot from external host (DFU mode)
of Data Errors From Syndrome Polynomials • Ethernet
Generated Using a BCH Algorithm Technology / Package:
• Supports 4-, 8-, and 16-Bit Per 512-Byte
Block Error Location Based on BCH • 16nm technology
Algorithms • 13mm x 13mm, 0.5mm pitch, 425-pin FCCSP BGA
• OSPI/QSPI with DDR / SDR support (ALW)
– Support for Serial NAND and Serial NOR flash • 17.2mm x 17.2mm, 0.8mm pitch, 441-pin FCBGA
devices (AMC)
– 4GBytes memory address support
– XIP mode with optional on-the-fly encryption
Power Management:
• Low power modes supported by Device/Power
Manager
– Partial IO support for CAN/GPIO/UART wakeup
– DeepSleep
– MCU Only
– Standby
– Dynamic frequency scaling for Cortex-A53

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2 Applications
• Human Machine Interfaces (HMI)
• Retail automation
• Driver Monitoring System (DMS/OMS) / In-Cabin Monitoring (ICM)
• Telematics Control Unit (TCU)
• 3D Point Cloud
• Vehicle to Infrastructure / Vehicle to Vehicle (V2X / V2V)
• 3D Re-configurable automotive instrument cluster
• Appliance user interface and connectivity
• Medical equipment

3 Description
The low-cost AM62x Sitara™ MPU family of application processors are built for Linux® application development.
With scalable Arm® Cortex®-A53 performance and embedded features, such as dual-display support and 3D
graphics acceleration, along with an extensive set of peripherals, making the AM62x device well-suited for a
broad range of industrial and automotive applications while offering intelligent features and optimized power
architecture.
Functional safety requirements can be addressed using the integrated Cortex-M4F cores and dedicated
peripherals, which can all be isolated from the rest of the AM62x processor.
The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking
(TSN) capable. An additional PRU module on the device enables real-time I/O capability for customer’s own use
cases. In addition, the extensive set of peripherals included in AM62x enable system-level connectivity, such
as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/
FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security Module
(HSM) and employs advanced power management support for portable and power-sensitive applications.
Products in the AM62x processor family:
• AM625 – Human-machine Interaction SoC with Arm® Cortex®-A53-based edge AI and full-HD dual-display
• AM625-Q1 – Automotive Display SoC with embedded safety for digital clusters
• AM623 – Internet of Things (IoT) and Gateway SoC with Arm® Cortex®-A53-based object and gesture
recognition
• AM620-Q1 – Automotive Compute SoC with embedded safety for driver monitoring, networking and V2X
systems
Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
AM625 ALW (FCCSP BGA, 425) 13mm × 13mm
ALW (FCCSP BGA, 425) 13mm × 13mm
AM625-Q1
AMC (FCBGA, 441) 17.2mm × 17.2mm
AM623 ALW (FCCSP BGA, 425) 13mm × 13mm
ALW (FCCSP BGA, 425) 13mm × 13mm
AM620-Q1
AMC (FCBGA, 441) 17.2mm x 17.2mm

(1) For more information, see Mechanical, Packaging, and Orderable Information.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

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3.1 Functional Block Diagram

Figure 3-1 shows the functional block diagram for the device.

Note
To understand what device features are currently supported by TI Software Development Kits
(SDKs), search for the AM62x Software Build Sheet located in the Downloads tab option provided
at Processor-SDK-AM62x.

AM62x
Application Cores MCUSS With FFI
® ® ® PRUSS
Arm®
2x Arm Arm Arm
® ®
Cortex
Cortex-A53
-A53
®
Cortex -A53 ®
Cortex -M4F

System Memory
Arm®
2x Arm
®
Arm
® 256KB TCM
® ®
Cortex
Cortex-A53
-A53
®
Cortex -A53 64KB OCRAM
with ECC GPMC

512KB L2 with ECC

DDR4/LPDDR4
General Connectivity (Main Domain) General Connectivity with inline ECC 3x MMCSD
(MCUSS) (16b)
2-port Gb Ethernet w/ 1588

GPIO
3x SPI GPIO
Multimedia
2x SPI
8x UART 3x ePWM 2x Display 3D Graphics
with DPI Processing Unit
UART and OLDI (LVDS)
CAN-FD 3x eCAP

5x I2C 3x eQEP 2x CAN-FD

3x McASP CSI2 w/ DPHY
OSPI 2x USB 2.0 I2C

Security Management Subsystem (SMS)

Secure Boot
SHA PKA DRBG

MD5 AES TRNG HSM

426KB SRAM

System Services
DMA Firewall DCC ECC
Device/Power System Secure
Manager Monitor Boot
Debug IPC ESM Timers

Figure 3-1. Functional Block Diagram

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Table of Contents
1 Features............................................................................1 6.12 Timing and Switching Characteristics................... 102
2 Applications..................................................................... 4 7 Detailed Description....................................................226
3 Description.......................................................................4 7.1 Overview................................................................. 226
3.1 Functional Block Diagram........................................... 5 7.2 Processor Subsystems........................................... 227
4 Device Comparison......................................................... 7 7.3 Accelerators and Coprocessors..............................228
4.1 Related Products........................................................ 8 7.4 Other Subsystems.................................................. 229
5 Terminal Configuration and Functions........................10 7.5 Peripherals..............................................................231
5.1 Pin Diagrams............................................................ 10 8 Applications, Implementation, and Layout............... 236
5.2 Pin Attributes.............................................................12 8.1 Device Connection and Layout Fundamentals....... 236
5.3 Signal Descriptions................................................... 54 8.2 Peripheral- and Interface-Specific Design
5.4 Pin Connectivity Requirements.................................84 Information................................................................ 237
6 Specifications................................................................ 88 8.3 Clock Routing Guidelines........................................244
6.1 Absolute Maximum Ratings...................................... 88 9 Device and Documentation Support..........................245
6.2 ESD Ratings for Devices which are not AEC - 9.1 Device Nomenclature..............................................245
Q100 Qualified............................................................ 90 9.2 Tools and Software................................................. 248
6.3 ESD Ratings for AEC - Q100 Qualified Devices.......90 9.3 Documentation Support.......................................... 248
6.4 Power-On Hours (POH)............................................ 90 9.4 Support Resources................................................. 248
6.5 Recommended Operating Conditions.......................91 9.5 Trademarks............................................................. 248
6.6 Operating Performance Points..................................93 9.6 Electrostatic Discharge Caution..............................249
6.7 Power Consumption Summary................................. 93 9.7 Glossary..................................................................249
6.8 Electrical Characteristics...........................................94 10 Revision History........................................................ 250
6.9 VPP Specifications for One-Time Programmable 11 Mechanical, Packaging, and Orderable
(OTP) eFuses..............................................................99 Information.................................................................. 255
6.10 Thermal Resistance Characteristics..................... 100 11.1 Packaging Information.......................................... 255
6.11 Temperature Sensor Characteristics.....................101

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4 Device Comparison
Table 4-1 shows a comparison between devices, highlighting the differences.

Note
Availability of features listed in this table are a function of shared IO pins, where IO signals associated
with many of the features are multiplexed to a limited number of pins. The SysConfig tool should
be used to assign signal functions to pins. This will provide a better understanding of limitations
associated with pin multiplexing.

Table 4-1. Device Comparison

REFERENCE AM625, AM625-Q1 AM623 AM620-Q1
FEATURES
NAME AM6254 AM6252 AM6251 AM6234 AM6232 AM6231 AM6204 AM6202 AM6201

WKUP_CTRL_MMR_CFG0_JTAG_USER_ID[31:13](1)
Register bit values by device "Features" code (See Device Naming Convention for more information on device features)
C: 0x1D123 0x1D0A3 – 0x1D103 0x1D083 – – – –
G: 0x1D127 0x1D0A7 0x1D067 0x1D107 0x1D087 0x1D047 0x1D307 0x1D287 0x1D247
PROCESSORS AND ACCELERATORS
Speed Grades (See Device Speed Grades) T, S, K, G
Arm Cortex-A53 Quad Dual Single Quad Dual Single Quad Dual Single
Arm A53
Microprocessor Subsystem Core Core Core Core Core Core Core Core Core
Arm Cortex-M4F Single Core
Arm M4F
in MCU domain Functional Safety Optional(5)
3D Graphics Engine 3D Graphics
Yes Yes Yes No No No No No No
(OpenGL ES 3.1, Vulkan 1.2) engine
Device Management
WKUP_R5F Single core
Subsystem
Crypto Accelerators Security Yes
PROGRAM AND DATA STORAGE
On-Chip Shared Memory
OCSRAM 64KB (with SECDED ECC)
(RAM) in MAIN Domain
On-Chip Shared Memory
MCU_MSRAM 256KB
(RAM) in M4F Domain
DDR4/LPDDR4 DDR
DDRSS 16-bit data with inline ECC; up to 8GB using DDR4 or 4GB using LPDDR4
Subsystem
General-Purpose Memory
GPMC Up to 128MB with ECC
Controller
PERIPHERALS
1x DPI No
Display Subsystem DSS
1x OLDI (LVDS) No
Modular Controller Area
Network Interface with Full MCAN 3
CAN-FD Support
General-Purpose I/O GPIO Up to 168
Inter-Integrated Circuit
I2C 6
Interface
Multichannel Audio Serial Port MCASP 3
Multichannel Serial Peripheral
MCSPI 5
Interface

Multi-Media Card/ Secure 1x eMMC (8-bits)

MM/CSD
Digital Interface 2x SD/SDIO (4-bits)

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Table 4-1. Device Comparison (continued)

REFERENCE AM625, AM625-Q1 AM623 AM620-Q1
FEATURES
NAME AM6254 AM6252 AM6251 AM6234 AM6232 AM6231 AM6204 AM6202 AM6201
Flash Subsystem (FSS)(2) OSPI0/QSPI0 Yes(2)
Programmable Real-Time Unit
PRUSS 2x PRU Cores (Optional)
Subsystem(3)
Industrial Communication
PRUSS No
Subsystem Support(4)
Gigabit Ethernet Interface CPSW3G Yes
General-Purpose Timers TIMER 12 (4 in MCU Channel)
Global Timer Counter GTC 1
Enhanced Pulse-Width
EPWM 3
Modulator Module
Enhanced Capture Module ECAP 3
Enhanced Quadrature Encoder
EQEP 3
Pulse Module
Universal Asynchronous
UART 9
Receiver and Transmitter
CSI2-RX Controller with DPHY CSI-RX 1
USB2.0 Controller with PHY USB 2.0 2

(1) For more details about the WKUP_MMR0_JTAG_USER_ID register and DEVICE_ID bit field, see the device TRM.
(2) One flash interface, configured as OSPI0 or QSPI0.
(3) PRU Subsystem (PRUSS) is available when selecting an orderable part number that includes a Features code of C. Refer to Device
Naming Convention for definition of feature codes.
(4) Industrial Communication Subsystem support is not available for this family of devices.
(5) Functional Safety is available when selecting an orderable part number that includes a Functional Safety code of F. Refer to Device
Naming Convention for definition of feature codes.

4.1 Related Products

Sitara™ processors Broad family of scalable processors based on Arm® Cortex®-A cores with flexible
accelerators, peripherals, connectivity and unified software support – perfect for sensors to servers. Sitara
processors have the reliability needed for use in industrial applications.
AM625 Sitara™ processors Human-machine-interaction SoC with Arm® Cortex®-A53-based edge AI and
full-HD dual display. The low-cost AM625x Sitara™ MPU family of application processors are built for Linux®
application development. With scalable Arm® Cortex®-A53 performance and embedded features, such as:
dual-display support and 3D graphics acceleration, along with an extensive set of peripherals that make the
AM62x device well-suited for a broad range of industrial and automotive applications while offering intelligent
features and optimized power architecture as well.
AM623 Sitara™ processors Internet of Things (IoT) and gateway SoC with Arm® Cortex®-A53-based object
and gesture recognition. The low-cost AM623x Sitara™ MPU family of application processors are built for
Linux® application development. With scalable Arm® Cortex®-A53 performance and embedded features, such
as: dual-display support, along with an extensive set of peripherals that make the AM62x device well-suited for
a broad range of industrial and automotive applications while offering intelligent features and optimized power
architecture as well.
Sitara™ AM62x Developer Portal TI provides a wide range of design resource to ease customers’ evaluation
and development on AM62x platform. You can find the most important design resource in this page, such
as evaluation boards/reference designs, demos, software development kit for Linux/Android/Realtime-Linux/
FreeRTOS, SDK developer guide, configuration tools, Linux academy.
Sitara™ AM62x processors - Design Galley TI provides many reference designs containing ‘building block’
solutions to enable customers to rapidly develop their own unique products and solutions. here are 10+
reference designs with demos for analytic, HMI, and connectivity.
Products to complete your design:

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• Ethernet PHYs
• Power management / PMICs
• Clocks and timing
• Power switches
• CAN transceivers
• ESD Protection
Please reference the AM62x EVM schematic for details of how these devices are implemented in a system
design, and bill of materials for specific part number recommendations.

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5 Terminal Configuration and Functions

5.1 Pin Diagrams
Note
The terms "ball", "pin", and "terminal" are used interchangeably throughout the document. An attempt
is made to use "ball" only when referring to the physical package.

Figure 5-1 shows the ball locations for the 425-ball flip chip ball grid array (FCCSP BGA) package, where
the HTML version provides additional information when hovering your cursor over a ball. This figure is used
in conjunction with Section 5.2.1 through Table 5-74 (Pin Attributes table and all Signal Descriptions tables,
including the Connectivity Requirements table).
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

MCU_OSC0 WKUP MCU_UART0 MCU_UART0 MCU_SPI0 MCU_I2C0 WKUP_I2C0 WKUP UART0 EXT MCASP0 MCASP0
A VSS RSVD1 _UART0 TCK TDI SPI0_CS0 SPI0_CLK I2C0_SDA I2C1_SDA MMC1_CMD MMC1_DAT0 MMC2_SDCD VSS VSS
_XO _RTSn _TXD _CTSn _CLK _SCL _SDA _CLKOUT0 _CTSn _REFCLK1 _AXR2 _ACLKR

MCU_OSC0 MCU_MCAN0 WKUP MCU_UART0 MCU_UART0 PMIC_LPM MCU_SPI0 WKUP_I2C0 MCU_RESETS UART0 MCASP0 MCASP0 MCASP0
B RSVD0 _UART0 TRSTn TMS SPI0_D0 SPI0_D1 I2C0_SCL I2C1_SCL MMC1_DAT1 MMC1_CLK MMC2_SDWP MMC2_DAT0 VSS
_XI _RX _RXD _RXD _RTSn _EN0 _CS1 _SCL TATz _RTSn _AXR1 _AXR3 _ACLKX

WKUP WKUP WKUP WKUP MCU_SPI0 USB0

C _LFOSC0 _LFOSC0 _UART0 _UART0 EMU1 SPI0_CS1 MCAN0_TX MMC1_SDWP MMC1_DAT2 MMC2_CMD MMC2_DAT1
_XO _XI _TXD _CTSn _D1 _DRVVBUS

MCU MCU_MCAN1 MCU_MCAN0 MCU_SPI0 MCU_I2C0 MCASP0

D MCU_PORz TDO UART0_RXD EXTINTn MMC1_SDCD MMC1_DAT3 MMC2_DAT3 MMC2_CLK
_ERRORn _RX _TX _D0 _SDA _AFSX

DDR0_DQS0 MCU_MCAN1 MCU_SPI0 MCU MCASP0 MCASP0 OSPI0

E DDR0_DQS0 DDR0_DQ4 RSVD8 EMU0 UART0_TXD MCAN0_RX PORz_OUT MMC2_DAT2 OSPI0_D0
_n _TX _CS0 _RESETz _AXR0 _AFSR _CSn3

VDD VDDSHV USB1 RESET RESETSTA OSPI0

F DDR0_DQ7 DDR0_DQ6 DDR0_DQ2 DDR0_DQ0 RSVD2 VSS VDDSHV0 OSPI0_D3 OSPI0_D2
_CANUART _MCU _DRVVBUS _REQz Tz _CSn0

DDR0 CAP_VDDS VMON_1P8 VDDSHV VDDA OSPI0 OSPI0

G DDR0_DQ5 DDR0_DQ1 VDDS_OSC0 VSS VDDSHV0 VDDSHV5 VSS OSPI0_D1
_RESET0_n _CANUART _SOC _MCU _TEMP1 _CSn1 _LBCLKO

VDDSHV CAP_VDDS OSPI0

H DDR0_ODT0 DDR0_CKE0 DDR0_DM0 DDR0_DQ3 VDD_CORE VMON_VSYS VSS CAP_VDDS0 VSS CAP_VDDS5 VSS VSS OSPI0_CLK OSPI0_D6
_CANUART _MCU _CSn2

J DDR0_A0 DDR0_A1 DDR0_ODT1 DDR0_CKE1 VSS VPP VDD_CORE VDDR_CORE VSS VDD_CORE VDDSHV6 CAP_VDDS6 OSPI0_D7 OSPI0_D4 OSPI0_DQS OSPI0_D5

DDR0_CS1 VMON_3P3 GPMC0 GPMC0

K DDR0_A5 DDR0_A2 DDR0_A4 VSS VDDS_DDR VSS VSS VDDR_CORE VDD_CORE CAP_VDDS1 VSS GPMC0_WPn
_n _SOC _CSn2 _CSn3

DDR0_CK0 DDR0_CS0 GPMC0 GPMC0 GPMC0_OEn

L DDR0_CK0 DDR0_A3 VDDS_DDR VDDA_MCU VDD_CORE VDDA_PLL2 VDD_CORE VDDSHV1 VSS GPMC0_WEn
_n _n _CSn1 _ADVn_ALE _REn

DDR0_CAS DDR0_RAS VDDS_DDR GPMC0 GPMC0

M DDR0_BA0 DDR0_CAL0 VSS VSS VSS VSS VSS VDD_CORE VSS VSS VDDSHV1 GPMC0_DIR GPMC0_AD0
_n _n _C _CSn0 _BE0n_CLE

DDR0_ACT GPMC0
N DDR0_BA1 DDR0_BG1 DDR0_WE_n VDD_CORE VDD_CORE VDDR_CORE VDD_CORE VDDR_CORE VSS VDDSHV3 GPMC0_AD1 GPMC0_AD2 GPMC0_AD3
_n _BE1n

P DDR0_A8 DDR0_A7 DDR0_A9 DDR0_A11 VSS VDDS_DDR VSS VSS VDDR_CORE VDD_CORE VDDSHV3 CAP_VDDS3 GPMC0_AD6 GPMC0_AD5 GPMC0_AD4 GPMC0_CLK

DDR0 GPMC0
R DDR0_A13 DDR0_A6 DDR0_A10 DDR0_A12 VDDS_DDR VDD_CORE VDDR_CORE VSS VDD_CORE VSS VSS VSS GPMC0_AD7 GPMC0_AD8 GPMC0_AD9
_ALERT_n _AD11

VDDA GPMC0 GPMC0 GPMC0

T DDR0_PAR RSVD4 DDR0_BG0 VDDSHV4 VSS VDDR_CORE VSS VSS VSS VSS VSS VDDSHV3
_TEMP0 _AD12 _AD13 _AD10

VOUT0 GPMC0 GPMC0 GPMC0

U DDR0_DQ8 DDR0_DQ10 DDR0_DQ9 RSVD5 CAP_VDDS4 VSS VDDA_PLL0 VDD_CORE VDDR_CORE VDDA_PLL1 VDDSHV3 VSS
_DATA0 _WAIT0 _AD15 _AD14

DDR0_DQS1 VOUT0 VOUT0 VOUT0 GPMC0

V DDR0_DQS1 DDR0_DQ11 DDR0_DQ13 VDD_CORE VSS VSS VSS VSS VDD_CORE VSS VDD_CORE VSS
_n _DATA10 _DATA8 _DATA1 _WAIT1

VDDA_1P8 VDDA_1P8 VDDA_CORE VDDA_CORE VDDA_1P8 VOUT0 VOUT0 VOUT0

W DDR0_DQ15 DDR0_DQ12 DDR0_DM1 VSS VDDSHV2 CAP_VDDS2 VDDSHV2
_OLDI0 _OLDI0 _USB _CSIRX0 _CSIRX0 _DATA9 _DATA3 _DATA2

VDDA_1P8 VDDA_3P3 RGMII2 VOUT0 VOUT0 VOUT0 VOUT0

Y DDR0_DQ14 VSS MMC0_CMD MMC0_DAT3 OLDI0_A0P OLDI0_A2N RSVD7 VOUT0_DE
_USB _USB _TD0 _DATA14 _DATA6 _DATA5 _DATA4

CSI0 RGMII1 RGMII2 RGMII2_TX VOUT0 VOUT0 VOUT0 VOUT0

AA MMC0_DAT1 MMC0_DAT0 MMC0_DAT2 OLDI0_A0N OLDI0_A3P OLDI0_A2P VSS RSVD6
_RXRCALIB _RD3 _TD1 _CTL _DATA15 _DATA11 _DATA13 _DATA7

RGMII1 RGMII1 RGMII2 MDIO0 VOUT0 VOUT0

AB MMC0_CLK MMC0_DAT4 OLDI0_A1P OLDI0_A3N VSS USB1_VBUS CSI0_RXN3 CSI0_RXN0
_RD2 _RD0 _RD1 _MDIO _HSYNC _DATA12

USB1 RGMII1 RGMII2 RGMII2 VOUT0 VOUT0

AC MMC0_DAT5 MMC0_DAT7 OLDI0_A4P OLDI0_A4N USB0_VBUS CSI0_RXP3 CSI0_RXP0
_RCALIB _RD1 _TD3 _RD2 _PCLK _VSYNC

OLDI0 OLDI0 CSI0 RGMII1 RGMII1 RGMII1_TX RGMII1 RGMII2 RGMII2_RX RGMII2
AD VSS MMC0_DAT6 OLDI0_A1N OLDI0_A5P OLDI0_A6P OLDI0_A7N VSS USB1_DM USB0_DP VSS CSI0_RXN2 CSI0_RXN1 VSS MDIO0_MDC VSS
_CLK0N _CLK1P _RXCLKN _RXC _TD3 _CTL _TD1 _TD2 _CTL _RXC

OLDI0 OLDI0 USB0 CSI0 RGMII1_RX RGMII1 RGMII1 RGMII1 RGMII2 RGMII2 RGMII2
AE VSS RSVD3 OLDI0_A5N OLDI0_A6N OLDI0_A7P VSS USB1_DP USB0_DM VSS CSI0_RXP2 CSI0_RXP1 VSS VSS VSS
_CLK0P _CLK1N _RCALIB _RXCLKP _CTL _TD2 _TXC _TD0 _TXC _RD3 _RD0

Not to scale

Figure 5-1. ALW FCCSP Pin Diagram (Top View)

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Figure 5-2 shows the ball locations for the 441-ball flip chip ball grid array (FCBGA BGA) package, where
the HTML version provides additional information when hovering your cursor over a ball. This figure is used
in conjunction with Section 5.2.1 through Table 5-74 (Pin Attributes table and all Signal Descriptions tables,
including the Connectivity Requirements table).

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

WKUP WKUP MCU_OSC0 MCU_OSC0 WKUP MCU_UART0 WKUP_I2C0 MCU_I2C0 MCU_RESETS MCASP0
A VSS _LFOSC0 _LFOSC0 VSS _UART0 TRSTn UART0_RXD SPI0_D1 MCAN0_RX I2C1_SDA I2C1_SCL MMC1_DAT0 MMC1_CLK VSS
_XI _XO _XI _XO _CTSn _RXD _SDA _SDA TATz _AXR1

MCU WKUP WKUP MCU_UART0 MCU_SPI0 MCU_UART0 MCU_I2C0 WKUP UART0 MCASP0 MCASP0
B MCU_PORz RSVD0 _UART0 _UART0 EMU1 TMS MCAN0_TX MMC1_SDWP EXTINTn MMC1_DAT1 MMC1_DAT2 MMC2_DAT0
_ERRORn _RTSn _RXD _TXD _CLK _CTSn _SCL _CLKOUT0 _CTSn _AXR2 _AXR3

MCU_MCAN0 MCU_MCAN0 WKUP PMIC_LPM MCU_SPI0 MCU UART0 EXT MCASP0 MCASP0
C VDDS_DDR DDR0_DQ0 RSVD1 _UART0 TCK SPI0_CS0 SPI0_D0 MMC1_SDCD MMC1_CMD MMC1_DAT3 MMC2_SDWP MMC2_CMD
_RX _TX _TXD _EN0 _CS1 _RESETz _RTSn _REFCLK1 _AFSX _ACLKX

MCU_MCAN1 MCU_MCAN1 MCU_UART0 MCU_SPI0 MCASP0 MCASP0 USB0 MCASP0

D DDR0_DQS0 DDR0_DQ4 DDR0_DQ2 VSS EMU0 TDI VSS SPI0_CLK SPI0_CS1 I2C0_SDA VSS MMC2_SDCD MMC2_DAT1
_TX _RX _RTSn _D1 _AFSR _ACLKR _DRVVBUS _AXR0

DDR0_DQS0 MCU_SPI0 MCU_SPI0 WKUP_I2C0 RESETSTA RESET USB1 OSPI0 OSPI0

E VSS DDR0_DM0 DDR0_DQ1 DDR0_DQ3 RSVD2 TDO UART0_TXD I2C0_SCL PORz_OUT MMC2_DAT2 MMC2_DAT3 MMC2_CLK
_n _CS0 _D0 _SCL Tz _REQz _DRVVBUS _CSn2 _CSn3

VDDSHV VDDA OSPI0 OSPI0

F DDR0_DQ6 DDR0_DQ7 DDR0_DQ5 VSS DDR0_A0 VMON_VSYS VPP RSVD3 VSS VSS VDDSHV0 VSS VDDSHV5 VSS OSPI0_D0 OSPI0_D3 OSPI0_D2
_MCU _TEMP1 _CSn1 _CSn0

DDR0_CS1 DDR0 VDDSHV CAP_VDDS VDDSHV CAP_VDDS OSPI0

G DDR0_CKE0 DDR0_A2 DDR0_A1 VSS VSS CAP_VDDS0 VDDSHV0 VDDSHV5 CAP_VDDS5 VSS OSPI0_D1 OSPI0_CLK OSPI0_D6 OSPI0_D4
_n _RESET0_n _CANUART _CANUART _MCU _MCU _LBCLKO

DDR0_CS0 VDDSHV VDD VMON_1P8 GPMC0 GPMC0 GPMC0

H VSS DDR0_CKE1 DDR0_A3 DDR0_A5 VSS VDDA_MCU VDDR_CORE VDD_CORE VSS VDD_CORE VDDSHV6 VDDSHV6 OSPI0_DQS OSPI0_D5
_n _CANUART _CANUART _SOC _CSn1 _CSn2 _CSn3

DDR0_CAS GPMC0
J DDR0_CK0 DDR0_WE_n DDR0_ODT0 DDR0_A4 VSS VDDS_OSC0 VDDS_DDR VDD_CORE VSS VDD_CORE VSS VDD_CORE VSS CAP_VDDS6 VSS GPMC0_WEn GPMC0_DIR GPMC0_WPn OSPI0_D7
_n _CSn0

DDR0_CK0 DDR0_RAS VMON_3P3 GPMC0 GPMC0 GPMC0 GPMC0_OEn

K DDR0_ODT1 VSS DDR0_CAL0 VSS VDDS_DDR VSS VDDS_DDR VDD_CORE VDDA_PLL2 VSS VDD_CORE VDDSHV1 VDDSHV1 GPMC0_AD0
_n _n _SOC _BE0n_CLE _BE1n _ADVn_ALE _REn

VDDS_DDR VDDA_DDR
L VSS DDR0_BG1 DDR0_BA1 DDR0_BG0 DDR0_BA0 VSS VDDS_DDR VSS VDD_CORE VSS VDD_CORE VSS CAP_VDDS1 VSS GPMC0_AD5 GPMC0_AD6 GPMC0_AD1 GPMC0_AD2 GPMC0_AD3
_C _PLL0

DDR0_ACT VDDA GPMC0

M DDR0_PAR DDR0_A11 RSVD7 RSVD8 VSS VDD_CORE VSS VDDR_CORE VSS VDD_CORE VDDR_CORE VDD_CORE CAP_VDDS3 VSS VSS GPMC0_CLK GPMC0_AD7 GPMC0_AD4
_n _TEMP0 _AD10

DDR0 GPMC0 GPMC0 GPMC0

N DDR0_A7 DDR0_A10 DDR0_A9 DDR0_A13 VSS VDDSHV4 CAP_VDDS4 VDD_CORE VDDA_PLL0 VDD_CORE VSS VDD_CORE VSS VDDSHV3 VDDSHV3 GPMC0_AD8 GPMC0_AD9
_ALERT_n _AD12 _AD11 _AD13

VDDA_1P8 VDDA_CORE VDDA_CORE GPMC0 VOUT0 GPMC0 GPMC0 GPMC0

P VSS DDR0_A8 VSS DDR0_A6 DDR0_A12 VSS VDDSHV4 VDD_CORE VSS VSS VDDA_PLL1 VSS VSS
_OLDI0 _USB _CSIRX0 _WAIT1 _DATA1 _AD14 _AD15 _WAIT0

DDR0_DQS1 VDDA_1P8 VDDA_3P3 VDDA_1P8 VDDA_1P8 VOUT0 VOUT0 VOUT0 VOUT0 VOUT0
R DDR0_DQ9 DDR0_DQ8 DDR0_DM1 VSS RSVD4 VSS VSS CAP_VDDS2 VDDSHV2 VDDSHV2 VSS
_n _OLDI0 _USB _USB _CSIRX0 _DATA9 _DATA2 _DATA3 _DATA4 _DATA0

USB0 CSI0 VOUT0 VOUT0 VOUT0 VOUT0 VOUT0

T DDR0_DQS1 DDR0_DQ10 VSS DDR0_DQ14 DDR0_DQ15 VSS VSS VSS VSS VSS RSVD5 RSVD6 VSS VOUT0_DE
_RCALIB _RXRCALIB _VSYNC _DATA10 _DATA7 _DATA5 _DATA6

RGMII1 RGMII2 MDIO0 VOUT0 VOUT0 VOUT0 VOUT0 VOUT0

U VDDS_DDR DDR0_DQ11 DDR0_DQ12 DDR0_DQ13 VSS OLDI0_A2P OLDI0_A2N VSS USB1_VBUS VSS CSI0_RXP2 CSI0_RXN2 VSS
_TD0 _TD1 _MDIO _PCLK _DATA14 _DATA12 _DATA11 _DATA8

OLDI0 OLDI0 USB1 RGMII1_TX RGMII2 RGMII2 VOUT0 VOUT0

V MMC0_DAT1 MMC0_DAT0 MMC0_CMD MMC0_DAT7 OLDI0_A1N OLDI0_A1P USB0_VBUS VSS CSI0_RXP1 CSI0_RXN1 VSS MDIO0_MDC VSS
_CLK0N _CLK0P _RCALIB _CTL _TD3 _RXC _DATA15 _DATA13

RGMII1_RX RGMII1 RGMII1 RGMII2 RGMII2 RGMII2_RX RGMII2 VOUT0

W MMC0_DAT3 MMC0_DAT2 MMC0_DAT5 MMC0_DAT6 OLDI0_A3P OLDI0_A3N VSS USB1_DM USB1_DP VSS CSI0_RXP3 CSI0_RXN3 VSS
_CTL _RD0 _TXC _TD2 _RD0 _CTL _RD3 _HSYNC

OLDI0 RGMII1 RGMII1 RGMII1 RGMII2 RGMII2 RGMII2 RGMII2_TX

Y MMC0_CLK MMC0_DAT4 VSS VSS OLDI0_A4P VSS OLDI0_A7P OLDI0_A6P USB0_DP VSS CSI0_RXP0 CSI0_RXN0 VSS
_CLK1N _RD3 _RD1 _TD2 _TXC _RD2 _RD1 _CTL

OLDI0 CSI0 CSI0 RGMII1 RGMII1 RGMII1 RGMII1 RGMII2

AA VSS OLDI0_A0N OLDI0_A0P OLDI0_A4N OLDI0_A5P OLDI0_A5N OLDI0_A7N VSS OLDI0_A6N USB0_DM VSS VSS VSS
_CLK1P _RXCLKP _RXCLKN _RXC _RD2 _TD3 _TD1 _TD0

Not to scale

Figure 5-2. AMC FCBGA Pin Diagram (Top View)

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5.2 Pin Attributes

The following list describes the contents of each column in Table 5-1, Pin Attributes (ALW, AMC Packages):
1. BALL NUMBER: Ball numbers assigned to each terminal of the Ball Grid Array package.

2. BALL NAME: Ball name assigned to each terminal of the Ball Grid Array package (this name is typically
taken from the primary MUXMODE 0 signal function).

3. SIGNAL NAME: Signal name(s) of all dedicated and pin multiplexed signal functions associated with a ball.

Note
Many device pins support multiple signal functions. Some signal functions are selected via a single
layer of multiplexers associated with pins. Other signal functions are selected via two or more layers
of multiplexers, where one layer is associated with the pins and other layers are associated with
peripheral logic functions.
Table 5-1, Pin Attributes (ALW, AMC Packages) only defines signal multiplexing at the pins. For more
information, related to signal multiplexing at the pins, see the Pad Configuration Registers section in
the Device Configuration chapter of the device TRM. For information associated with peripheral signal
multiplexing, see the respective peripheral chapter in the device TRM.

4. MUX MODE: The MUXMODE value associated with each pin multiplexed signal function:
a. MUXMODE 0 is the primary pin multiplexed signal function. However, the primary pin multiplexed signal
function is not necessarily the default pin multiplexed signal function.

Note
The value found in the MUX MODE AFTER RESET column defines the default pin multiplexed
signal function selected when MCU_PORz is deasserted.

b. MUXMODE values 1 through 15 are possible for pin multiplexed signal functions. However, not all
MUXMODE values have been implemented. The only valid MUXMODE values are those defined as pin
multiplexed signal functions within the Pin Attributes table. Only valid values of MUXMODE should be
used.
c. Bootstrap defines SOC configuration pins, where the logic state applied to each pin is latched on the
rising edge of PORz_OUT. These input signal functions are fixed to their respective pins and are not
programmable via MUXMODE.
d. An empty box means Not Applicable.

Note
The following configurations of MUXMODE must be avoided for proper device operation.
• Configuring multiple pins operating as inputs to the same pin multiplexed signal function is not
supported as it can yield unexpected results.
• Configuring a pin to an undefined pin multiplexing mode will cause the pin behavior to be
undefined.

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5. TYPE: Signal type and direction:

• I = Input
• O = Output
• OD = Output, with open-drain output function
• IO = Input, Output, or simultaneously Input and Output
• IOD = Input, Output, or simultaneously Input and Output, with open-drain output function
• IOZ = Input, Output, or simultaneously Input and Output, with three-state output function
• OZ = Output with three-state output function
• A = Analog
• PWR = Power
• GND = Ground
• CAP = LDO Capacitor.
6. DSIS: The deselected input state (DSIS) indicates the state driven to the subsystem input (logic "0", logic
"1", or "pad" level) when the pin multiplexed signal function is not selected by MUXMODE.
• 0: Logic 0 driven to the subsystem input.
• 1: Logic 1 driven to the subsystem input.
• pad: Logic state of the pad is driven to the subsystem input.
• An empty box means Not Applicable.
7. BALL STATE DURING RESET RX/TX/PULL: State of the terminal while MCU_PORz is asserted, where RX
defines the state of the input buffer, TX defines the state of the output buffer, and PULL defines the state of
internal pull resistors:
• RX (Input buffer)
– Off: The input buffer is disabled.
– On: The input buffer is enabled.
• TX (Output buffer)
– Off: The output buffer is disabled.
– Low: The output buffer is enabled and drives VOL.
• PULL (Internal pull resistors)
– Off: Internal pull resistors are turned off.
– Up: Internal pull-up resistor is turned on.
– Down: Internal pull-down resistor is turned on.
– NA: Not Applicable.
• An empty box means Not Applicable.
8. BALL STATE AFTER RESET RX/TX/PULL: State of the terminal after MCU_PORz is deasserted, where
RX defines the state of the input buffer, TX defines the state of the output buffer, and PULL defines the state
of internal pull resistors:
• RX (Input buffer)
– Off: The input buffer is disabled.
– On: The input buffer is enabled.
• TX (Output buffer)
– Off: The output buffer is disabled.
– SS: The subsystem selected with MUXMODE determines the output buffer state.
• PULL (Internal pull resistors)
– Off: Internal pull resistors are turned off.
– Up: Internal pull-up resistor is turned on.
– Down: Internal pull-down resistor is turned on.
– NA: Not Applicable.
• An empty box means Not Applicable.
9. MUX MODE AFTER RESET: The value found in this column defines the default pin multiplexed signal
function after MCU_PORz is deasserted.
An empty box means Not Applicable.

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10. I/O OPERATING VOLTAGE: This column describes I/O operating voltage options of the respective power
supply, when applicable.
An empty box means Not Applicable.
For more information, see valid operating voltage range(s) defined for each power supply in Section 6.5,
Recommended Operating Conditions.
11. POWER: The power supply of the associated I/O, when applicable.
An empty box means Not Applicable.
12. HYS: Indicates if the input buffer associated with this I/O has hysteresis:
• Yes: With hysteresis
• No: Without hysteresis
• An empty box means Not Applicable.
For more information, see the hysteresis values in Section 6.8, Electrical Characteristics.
13. BUFFER TYPE: This column defines the buffer type associated with a terminal. This information can be
used to determine which Electrical Characteristics table is applicable.
An empty box means Not Applicable.
For electrical characteristics, refer to the appropriate buffer type table in Section 6.8, Electrical
Characteristics.
14. PULL UP/DOWN TYPE: Indicates the presence of an internal pullup or pulldown resistor. Pullup and
pulldown resistors can be enabled or disabled via software.
• PU: Internal pull-up
• PD: Internal pull-down
• PU/PD: Internal pull-up and pull-down
• An empty box means No internal pull.
15. PADCONFIG Register:Name of the IO pad configuration register associated with Ball.

16. PADCONFIG Address:Physical address of the IO pad configuration register associated with Ball.

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Table 5-1. Pin Attributes (ALW, AMC Packages)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
H15 G12 CAP_VDDS0 CAP_VDDS0 CAP
K18 L15 CAP_VDDS1 CAP_VDDS1 CAP
W17 R13 CAP_VDDS2 CAP_VDDS2 CAP
P19 M15 CAP_VDDS3 CAP_VDDS3 CAP
U7 N8 CAP_VDDS4 CAP_VDDS4 CAP
H17 G15 CAP_VDDS5 CAP_VDDS5 CAP
J19 J15 CAP_VDDS6 CAP_VDDS6 CAP
G9 G8 CAP_VDDS_CANUART CAP_VDDS_CANUART CAP
H11 G11 CAP_VDDS_MCU CAP_VDDS_MCU CAP
AD15 AA14 CSI0_RXCLKN CSI0_RXCLKN I 1.8V VDDA_1P8_CSIRX D-PHY
AE15 AA13 CSI0_RXCLKP CSI0_RXCLKP I 1.8V VDDA_1P8_CSIRX D-PHY
AA14 T11 CSI0_RXRCALIB CSI0_RXRCALIB A 1.8V VDDA_1P8_CSIRX D-PHY
AB14 Y13 CSI0_RXN0 CSI0_RXN0 I 1.8V VDDA_1P8_CSIRX D-PHY
AD14 V13 CSI0_RXN1 CSI0_RXN1 I 1.8V VDDA_1P8_CSIRX D-PHY
AD13 U12 CSI0_RXN2 CSI0_RXN2 I 1.8V VDDA_1P8_CSIRX D-PHY
AB12 W12 CSI0_RXN3 CSI0_RXN3 I 1.8V VDDA_1P8_CSIRX D-PHY
AC15 Y12 CSI0_RXP0 CSI0_RXP0 I 1.8V VDDA_1P8_CSIRX D-PHY
AE14 V12 CSI0_RXP1 CSI0_RXP1 I 1.8V VDDA_1P8_CSIRX D-PHY
AE13 U11 CSI0_RXP2 CSI0_RXP2 I 1.8V VDDA_1P8_CSIRX D-PHY
AC13 W11 CSI0_RXP3 CSI0_RXP3 I 1.8V VDDA_1P8_CSIRX D-PHY
VDDS_DDR,
N6 M1 DDR0_ACT_n DDR0_ACT_n O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
R3 N1 DDR0_ALERT_n DDR0_ALERT_n IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
M4 J3 DDR0_CAS_n DDR0_CAS_n O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
T1 M2 DDR0_PAR DDR0_PAR O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
M5 K5 DDR0_RAS_n DDR0_RAS_n O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
N3 J2 DDR0_WE_n DDR0_WE_n O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
J1 F5 DDR0_A0 DDR0_A0 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
J2 G5 DDR0_A1 DDR0_A1 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
K3 G4 DDR0_A2 DDR0_A2 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
L5 H4 DDR0_A3 DDR0_A3 O 1.1V / 1.2V DDR
VDDS_DDR_C

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
VDDS_DDR,
K4 J5 DDR0_A4 DDR0_A4 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
K1 H5 DDR0_A5 DDR0_A5 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
R2 P4 DDR0_A6 DDR0_A6 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
P2 N2 DDR0_A7 DDR0_A7 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
P1 P2 DDR0_A8 DDR0_A8 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
P4 N4 DDR0_A9 DDR0_A9 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
R5 N3 DDR0_A10 DDR0_A10 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
P5 M3 DDR0_A11 DDR0_A11 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
R6 P5 DDR0_A12 DDR0_A12 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
R1 N5 DDR0_A13 DDR0_A13 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
M1 L5 DDR0_BA0 DDR0_BA0 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
N1 L3 DDR0_BA1 DDR0_BA1 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
T4 L4 DDR0_BG0 DDR0_BG0 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
N2 L2 DDR0_BG1 DDR0_BG1 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
M2 K4 DDR0_CAL0 DDR0_CAL0 A 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
L1 J1 DDR0_CK0 DDR0_CK0 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
L2 K1 DDR0_CK0_n DDR0_CK0_n O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
H2 G3 DDR0_CKE0 DDR0_CKE0 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
J4 H2 DDR0_CKE1 DDR0_CKE1 O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
L6 H3 DDR0_CS0_n DDR0_CS0_n O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
K2 G1 DDR0_CS1_n DDR0_CS1_n O 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
H5 E3 DDR0_DM0 DDR0_DM0 IO 1.1V / 1.2V DDR
VDDS_DDR_C

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[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
VDDS_DDR,
W5 R4 DDR0_DM1 DDR0_DM1 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
F4 C2 DDR0_DQ0 DDR0_DQ0 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
G5 E4 DDR0_DQ1 DDR0_DQ1 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
F3 D3 DDR0_DQ2 DDR0_DQ2 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
H6 E5 DDR0_DQ3 DDR0_DQ3 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
E3 D2 DDR0_DQ4 DDR0_DQ4 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
G2 F3 DDR0_DQ5 DDR0_DQ5 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
F2 F1 DDR0_DQ6 DDR0_DQ6 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
F1 F2 DDR0_DQ7 DDR0_DQ7 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
U1 R3 DDR0_DQ8 DDR0_DQ8 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
U3 R2 DDR0_DQ9 DDR0_DQ9 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
U2 T2 DDR0_DQ10 DDR0_DQ10 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
V5 U2 DDR0_DQ11 DDR0_DQ11 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
W2 U3 DDR0_DQ12 DDR0_DQ12 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
V6 U4 DDR0_DQ13 DDR0_DQ13 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
Y1 T4 DDR0_DQ14 DDR0_DQ14 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
W1 T5 DDR0_DQ15 DDR0_DQ15 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
E1 D1 DDR0_DQS0 DDR0_DQS0 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
E2 E1 DDR0_DQS0_n DDR0_DQS0_n IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
V1 T1 DDR0_DQS1 DDR0_DQS1 IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
V2 R1 DDR0_DQS1_n DDR0_DQS1_n IO 1.1V / 1.2V DDR
VDDS_DDR_C
VDDS_DDR,
H1 J4 DDR0_ODT0 DDR0_ODT0 O 1.1V / 1.2V DDR
VDDS_DDR_C

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

E12 D9 PADCONFIG: EMU0 0 IO 0 On / Off / Up On / Off / Up 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG30
0x04084078
EMU1

C11 B10 PADCONFIG: EMU1 0 IO 0 On / Off / Up On / Off / Up 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG31
0x0408407C
EXTINTn EXTINTn 0 I 1

D16 B16 PADCONFIG: Off / Off / NA Off / Off / NA 7 1.8V / 3.3V VDDSHV0 Yes I2C OD FS
PADCONFIG125 GPIO1_31 7 IOD pad
0x000F41F4
EXT_REFCLK1 0 I 0
SYNC1_OUT 1 O
SPI2_CS3 2 IO 1
EXT_REFCLK1 SYSCLKOUT0 3 O
A18 C14 PADCONFIG: TIMER_IO4 4 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG124
0x000F41F0 CLKOUT0 5 O
CP_GEMAC_CPTS0_RFT_CLK 6 I 0
GPIO1_30 7 IO pad
ECAP0_IN_APWM_OUT 8 IO 0
GPMC0_ADVn_ALE 0 O
MCASP1_AXR2 2 IO 0
GPMC0_ADVn_ALE
PR0_PRU0_GPO9 4 IO 0
L23 K20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG33 PR0_PRU0_GPI9 5 I 0
0x000F4084
TRC_DATA7 6 O
GPIO0_32 7 IO pad
GPMC0_CLK 0 O
MCASP1_AXR3 2 IO 0
GPMC0_CLK GPMC0_FCLK_MUX 3 O
P25 M19 PADCONFIG: PR0_PRU0_GPO8 4 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG31
0x000F407C PR0_PRU0_GPI8 5 I 0
TRC_DATA6 6 O
GPIO0_31 7 IO pad

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
GPMC0_DIR 0 O
PR0_ECAP0_IN_APWM_OUT 1 IO 0
MCASP2_AXR13 3 IO 0
GPMC0_DIR
PR0_PRU0_GPO16 4 IO 0
M22 J19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG41 PR0_PRU0_GPI16 5 I 0
0x000F40A4
TRC_DATA14 6 O
GPIO0_40 7 IO pad
EQEP2_S 8 IO 0
GPMC0_OEn_REn 0 O
MCASP1_AXR1 2 IO 0
GPMC0_OEn_REn
PR0_PRU0_GPO10 4 IO 0
L24 K21 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG34 PR0_PRU0_GPI10 5 I 0
0x000F4088
TRC_DATA8 6 O
GPIO0_33 7 IO pad
GPMC0_WEn 0 O
MCASP1_AXR0 2 IO 0
GPMC0_WEn
PR0_PRU0_GPO11 4 IO 0
L25 J17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG35 PR0_PRU0_GPI11 5 I 0
0x000F408C
TRC_DATA9 6 O
GPIO0_34 7 IO pad
GPMC0_WPn 0 O
AUDIO_EXT_REFCLK1 1 IO 0
GPMC0_A22 2 OZ
GPMC0_WPn
UART6_TXD 3 O
K25 J20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG40 PR0_PRU0_GPO15 4 IO 0
0x000F40A0
PR0_PRU0_GPI15 5 I 0
TRC_DATA13 6 O
GPIO0_39 7 IO pad

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SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
GPMC0_AD0 0 IO 0
PR0_PRU1_GPO8 1 O
PR0_PRU1_GPI8 2 I 0
GPMC0_AD0 MCASP2_AXR4 3 IO 0
M25 K19 PADCONFIG: PR0_PRU0_GPO0 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG15
0x000F403C PR0_PRU0_GPI0 5 I 0
TRC_CLK 6 O
GPIO0_15 7 IO pad
BOOTMODE00 Bootstrap I
GPMC0_AD1 0 IO 0
PR0_PRU1_GPO9 1 O
PR0_PRU1_GPI9 2 I 0
GPMC0_AD1 MCASP2_AXR5 3 IO 0
N23 L19 PADCONFIG: PR0_PRU0_GPO1 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG16
0x000F4040 PR0_PRU0_GPI1 5 I 0
TRC_CTL 6 O
GPIO0_16 7 IO pad
BOOTMODE01 Bootstrap I
GPMC0_AD2 0 IO 0
PR0_PRU1_GPO10 1 O
PR0_PRU1_GPI10 2 I 0
GPMC0_AD2 MCASP2_AXR6 3 IO 0
N24 L20 PADCONFIG: PR0_PRU0_GPO2 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG17
0x000F4044 PR0_PRU0_GPI2 5 I 0
TRC_DATA0 6 O
GPIO0_17 7 IO pad
BOOTMODE02 Bootstrap I
GPMC0_AD3 0 IO 0
PR0_PRU1_GPO11 1 O
PR0_PRU1_GPI11 2 I 0
GPMC0_AD3 MCASP2_AXR7 3 IO 0
N25 L21 PADCONFIG: PR0_PRU0_GPO3 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG18
0x000F4048 PR0_PRU0_GPI3 5 I 0
TRC_DATA1 6 O
GPIO0_18 7 IO pad
BOOTMODE03 Bootstrap I

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AM625, AM625-Q1, AM623, AM620-Q1
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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
GPMC0_AD4 0 IO 0
PR0_PRU1_GPO12 1 O
PR0_PRU1_GPI12 2 I 0
GPMC0_AD4 MCASP2_AXR8 3 IO 0
P24 M21 PADCONFIG: PR0_PRU0_GPO4 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG19
0x000F404C PR0_PRU0_GPI4 5 I 0
TRC_DATA2 6 O
GPIO0_19 7 IO pad
BOOTMODE04 Bootstrap I
GPMC0_AD5 0 IO 0
PR0_PRU1_GPO13 1 O
PR0_PRU1_GPI13 2 I 0
GPMC0_AD5 MCASP2_AXR9 3 IO 0
P22 L17 PADCONFIG: PR0_PRU0_GPO5 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG20
0x000F4050 PR0_PRU0_GPI5 5 I 0
TRC_DATA3 6 O
GPIO0_20 7 IO pad
BOOTMODE05 Bootstrap I
GPMC0_AD6 0 IO 0
PR0_PRU1_GPO14 1 O
PR0_PRU1_GPI14 2 I 0
GPMC0_AD6 MCASP2_AXR10 3 IO 0
P21 L18 PADCONFIG: PR0_PRU0_GPO6 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG21
0x000F4054 PR0_PRU0_GPI6 5 I 0
TRC_DATA4 6 O
GPIO0_21 7 IO pad
BOOTMODE06 Bootstrap I
GPMC0_AD7 0 IO 0
PR0_PRU1_GPO15 1 O
PR0_PRU1_GPI15 2 I 0
GPMC0_AD7 MCASP2_AXR11 3 IO 0
R23 M20 PADCONFIG: PR0_PRU0_GPO7 4 IO 0 On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG22
0x000F4058 PR0_PRU0_GPI7 5 I 0
TRC_DATA5 6 O
GPIO0_22 7 IO pad
BOOTMODE07 Bootstrap I

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
GPMC0_AD8 0 IO 0
VOUT0_DATA16 1 O
UART2_RXD 2 I 1
GPMC0_AD8
MCASP2_AXR0 3 IO 0
R24 N20 PADCONFIG: On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG23 PR0_PRU1_GPO0 4 O
0x000F405C
PR0_PRU1_GPI0 5 I 0
GPIO0_23 7 IO pad
BOOTMODE08 Bootstrap I
GPMC0_AD9 0 IO 0
VOUT0_DATA17 1 O
UART2_TXD 2 O
GPMC0_AD9
MCASP2_AXR1 3 IO 0
R25 N21 PADCONFIG: On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG24 PR0_PRU1_GPO1 4 O
0x000F4060
PR0_PRU1_GPI1 5 I 0
GPIO0_24 7 IO pad
BOOTMODE09 Bootstrap I
GPMC0_AD10 0 IO 0
VOUT0_DATA18 1 O
UART3_RXD 2 I 1
GPMC0_AD10 MCASP2_AXR2 3 IO 0
T25 M17 PADCONFIG: PR0_PRU1_GPO2 4 O On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG25
0x000F4064 PR0_PRU1_GPI2 5 I 0
GPIO0_25 7 IO pad
OBSCLK0 8 O
BOOTMODE10 Bootstrap I
GPMC0_AD11 0 IO 0
VOUT0_DATA19 1 O
UART3_TXD 2 O
GPMC0_AD11 MCASP2_AXR3 3 IO 0
R21 N18 PADCONFIG: PR0_PRU1_GPO3 4 O On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG26
0x000F4068 PR0_PRU1_GPI3 5 I 0
TRC_DATA23 6 O
GPIO0_26 7 IO pad
BOOTMODE11 Bootstrap I

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
GPMC0_AD15 0 IO 0
VOUT0_DATA23 1 O
UART5_TXD 2 O
MCASP2_ACLKR 3 IO 0
GPMC0_AD15
PR0_PRU0_GPO3 4 IO 0
U24 P20 PADCONFIG: On / Off / Off On / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG30 PR0_PRU0_GPI3 5 I 0
0x000F4078
TRC_DATA19 6 O
GPIO0_30 7 IO pad
UART2_RTSn 8 O
BOOTMODE15 Bootstrap I
GPMC0_BE0n_CLE 0 O
MCASP1_ACLKX 2 IO 0
GPMC0_BE0n_CLE
PR0_PRU0_GPO12 4 IO 0
M24 K17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG36 PR0_PRU0_GPI12 5 I 0
0x000F4090
TRC_DATA10 6 O
GPIO0_35 7 IO pad
GPMC0_BE1n 0 O
MCASP2_AXR12 3 IO 0
GPMC0_BE1n
PR0_PRU0_GPO13 4 IO 0
N20 K18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG37 PR0_PRU0_GPI13 5 I 0
0x000F4094
TRC_DATA11 6 O
GPIO0_36 7 IO pad
GPMC0_CSn0 0 O
MCASP2_AXR14 3 IO 0
GPMC0_CSn0
PR0_PRU0_GPO17 4 IO 0
M21 J18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG42 PR0_PRU0_GPI17 5 I 0
0x000F40A8
TRC_DATA15 6 O
GPIO0_41 7 IO pad
GPMC0_CSn1 0 O
PR0_PRU1_GPO16 1 O
PR0_PRU1_GPI16 2 I 0
GPMC0_CSn1
MCASP2_AXR15 3 IO 0
L21 H17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG43 PR0_PRU0_GPO18 4 IO 0
0x000F40AC
PR0_PRU0_GPI18 5 I 0
TRC_DATA16 6 O
GPIO0_42 7 IO pad

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

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SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
I2C0_SCL 0 IOD 1
PR0_IEP0_EDIO_DATA_IN_OUT30 1 IO 0
SYNC0_OUT 2 O
OBSCLK0 3 O
I2C0_SCL
UART1_DCDn 4 I 1
B16 E12 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG120 EQEP2_A 5 I 0
0x000F41E0
EHRPWM_SOCA 6 O
GPIO1_26 7 IO pad
ECAP1_IN_APWM_OUT 8 IO 0
SPI2_CS0 9 IO 1
I2C0_SDA 0 IOD 1
PR0_IEP0_EDIO_DATA_IN_OUT31 1 IO 0
SPI2_CS2 2 IO 1
I2C0_SDA TIMER_IO5 3 IO 0
A16 D14 PADCONFIG: UART1_DSRn 4 I 1 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG121
0x000F41E4 EQEP2_B 5 I 0
EHRPWM_SOCB 6 O
GPIO1_27 7 IO pad
ECAP2_IN_APWM_OUT 8 IO 0
I2C1_SCL 0 IOD 1
UART1_RXD 1 I 1
TIMER_IO0 2 IO 0
I2C1_SCL
SPI2_CS1 3 IO 1
B17 A17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG122 EHRPWM0_SYNCI 4 I 0
0x000F41E8
GPIO1_28 7 IO pad
EHRPWM2_A 8 IO 0
MMC2_SDCD 9 I 1
I2C1_SDA 0 IOD 1
UART1_TXD 1 O
TIMER_IO1 2 IO 0
I2C1_SDA
SPI2_CLK 3 IO 0
A17 A16 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG123 EHRPWM0_SYNCO 4 O
0x000F41EC
GPIO1_29 7 IO pad
EHRPWM2_B 8 IO 0
MMC2_SDWP 9 I 1

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[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
MCAN0_RX 0 I 1
UART5_TXD 1 O
TIMER_IO3 2 IO 0
SYNC3_OUT 3 O
MCAN0_RX
UART1_RIn 4 I 1
E15 A15 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG119 EQEP2_S 5 IO 0
0x000F41DC
PR0_UART0_TXD 6 O
GPIO1_25 7 IO pad
MCASP2_AXR1 8 IO 0
EHRPWM_TZn_IN4 9 I 0
MCAN0_TX 0 O
UART5_RXD 1 I 1
TIMER_IO2 2 IO 0
SYNC2_OUT 3 O
MCAN0_TX
UART1_DTRn 4 O
C15 B13 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG118 EQEP2_I 5 IO 0
0x000F41D8
PR0_UART0_RXD 6 I 1
GPIO1_24 7 IO pad
MCASP2_AXR0 8 IO 0
EHRPWM_TZn_IN3 9 I 0
MCASP0_ACLKR 0 IO 0
SPI2_CLK 1 IO 0
MCASP0_ACLKR
UART1_TXD 2 O
A20 D16 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG108 EHRPWM0_B 6 IO 0
0x000F41B0
GPIO1_14 7 IO pad
EQEP1_I 8 IO 0
MCASP0_ACLKX 0 IO 0
MCASP0_ACLKX SPI2_CS1 1 IO 1
B20 C17 PADCONFIG: ECAP2_IN_APWM_OUT 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG105
0x000F41A4 GPIO1_11 7 IO pad
EQEP1_A 8 I 0

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SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
MCASP0_AFSR 0 IO 0
SPI2_CS0 1 IO 1
MCASP0_AFSR
UART1_RXD 2 I 1
E19 D15 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG107 EHRPWM0_A 6 IO 0
0x000F41AC
GPIO1_13 7 IO pad
EQEP1_S 8 IO 0
MCASP0_AFSX 0 IO 0
MCASP0_AFSX SPI2_CS3 1 IO 1
D20 C16 PADCONFIG: AUDIO_EXT_REFCLK1 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG106
0x000F41A8 GPIO1_12 7 IO pad
EQEP1_B 8 I 0
MCASP0_AXR0 0 IO 0
PR0_ECAP0_IN_APWM_OUT 1 IO 0
MCASP0_AXR0 AUDIO_EXT_REFCLK0 2 IO 0
E18 D18 PADCONFIG: PR0_UART0_TXD 5 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG104
0x000F41A0 EHRPWM1_B 6 IO 0
GPIO1_10 7 IO pad
EQEP0_I 8 IO 0
MCASP0_AXR1 0 IO 0
SPI2_CS2 1 IO 1
MCASP0_AXR1 ECAP1_IN_APWM_OUT 2 IO 0
B18 A18 PADCONFIG: PR0_UART0_RXD 5 I 1 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG103
0x000F419C EHRPWM1_A 6 IO 0
GPIO1_9 7 IO pad
EQEP0_S 8 IO 0
MCASP0_AXR2 0 IO 0
SPI2_D1 1 IO 0
UART1_RTSn 2 O
MCASP0_AXR2 UART6_TXD 3 O
A19 B17 PADCONFIG: PR0_IEP0_EDIO_DATA_IN_OUT29 4 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG102
0x000F4198 ECAP2_IN_APWM_OUT 5 IO 0
PR0_UART0_TXD 6 O
GPIO1_8 7 IO pad
EQEP0_B 8 I 0

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[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

D1 B1 PADCONFIG: MCU_ERRORn 0 IO Off / Off / Down On / SS / Down 0 1.8V VDDS_OSC0 Yes LVCMOS PU/PD
MCU_PADCONFIG24
0x04084060
MCU_I2C0_SCL MCU_I2C0_SCL 0 IOD 1

A8 B9 PADCONFIG: Off / Off / NA On / SS / NA 7 1.8V / 3.3V VDDSHV_MCU Yes I2C OD FS

MCU_PADCONFIG17 MCU_GPIO0_17 7 IOD pad
0x04084044
MCU_I2C0_SDA MCU_I2C0_SDA 0 IOD 1

D10 A10 PADCONFIG: Off / Off / NA On / SS / NA 7 1.8V / 3.3V VDDSHV_MCU Yes I2C OD FS
MCU_PADCONFIG18 MCU_GPIO0_18 7 IOD pad
0x04084048
MCU_MCAN0_RX 0 I 1
MCU_MCAN0_RX
MCU_TIMER_IO0 1 IO 0
B3 C4 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG14 MCU_SPI1_CS3 2 IO 1
0x04084038
MCU_GPIO0_14 7 IO pad
MCU_MCAN0_TX 0 O
MCU_MCAN0_TX
WKUP_TIMER_IO0 1 IO 0
D6 C5 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG13 MCU_SPI0_CS3 2 IO 1
0x04084034
MCU_GPIO0_13 7 IO pad
MCU_MCAN1_RX 0 I 1
MCU_TIMER_IO3 1 IO 0
MCU_MCAN1_RX
MCU_SPI0_CS2 2 IO 1
D4 D6 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG16 MCU_SPI1_CS2 3 IO 1
0x04084040
MCU_SPI1_CLK 4 IO 0
MCU_GPIO0_16 7 IO pad

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SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

D2 B2 PADCONFIG: MCU_PORz 0 I 0 1.8V VDDS_OSC0 Yes FS RESET

MCU_PADCONFIG22
0x04084058
MCU_RESETSTATz MCU_RESETSTATz 0 O

B12 A12 PADCONFIG: Off / Low / Off Off / SS / Off 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG23 MCU_GPIO0_21 7 IO pad
0x0408405C
MCU_RESETz

E11 C9 PADCONFIG: MCU_RESETz 0 I On / Off / Up On / Off / Up 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG21
0x04084054
MCU_SPI0_CLK MCU_SPI0_CLK 0 IO 0

A7 B7 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG2 MCU_GPIO0_2 7 IO pad
0x04084008
MCU_SPI0_CS0 MCU_SPI0_CS0 0 IO 1

E8 E7 PADCONFIG: WKUP_TIMER_IO1 4 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG0
0x04084000 MCU_GPIO0_0 7 IO pad

MCU_SPI0_CS1 0 IO 1
MCU_OBSCLK0 1 O
MCU_SPI0_CS1
MCU_SYSCLKOUT0 2 O
B8 C8 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG1 MCU_EXT_REFCLK0 3 I 0
0x04084004
MCU_TIMER_IO1 4 IO 0
MCU_GPIO0_1 7 IO pad
MCU_SPI0_D0 MCU_SPI0_D0 0 IO 0

D9 E8 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG3 MCU_GPIO0_3 7 IO pad
0x0408400C
MCU_SPI0_D1 MCU_SPI0_D1 0 IO 0

C9 D8 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG4 MCU_GPIO0_4 7 IO pad
0x04084010

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

B5 A8 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG5 MCU_GPIO0_5 7 IO pad
0x04084014
MCU_UART0_TXD MCU_UART0_TXD 0 O

A5 B6 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG6 MCU_GPIO0_6 7 IO pad
0x04084018
MDIO0_MDC MDIO0_MDC 0 O

AD24 V17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG88 GPIO0_86 7 IO pad
0x000F4160
MDIO0_MDIO MDIO0_MDIO 0 IO 0

AB22 U16 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG87 GPIO0_85 7 IO pad
0x000F415C
MMC0_CLK 0 IO 0
I2C3_SCL 1 IOD 1
EHRPWM2_A 2 IO 0
MMC0_CLK
PR0_PRU1_GPO4 3 O
AB1 Y1 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV4 Yes SDIO PU/PD
PADCONFIG134 PR0_PRU1_GPI4 4 I 0
0x000F4218
SPI1_CS1 5 IO 1
TIMER_IO4 6 IO 0
GPIO1_40 7 IO pad

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SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
MMC0_CMD 0 IO 1
I2C3_SDA 1 IOD 1
EHRPWM2_B 2 IO 0
MMC0_CMD
PR0_PRU0_GPO4 3 IO 0
Y3 V3 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV4 Yes SDIO PU/PD
PADCONFIG136 PR0_PRU0_GPI4 4 I 0
0x000F4220
SPI1_CS2 5 IO 1
TIMER_IO5 6 IO 0
GPIO1_41 7 IO pad
MMC1_CLK 0 IO 0
MMC1_CLK
TIMER_IO4 2 IO 0
B22 A20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV5 Yes SDIO PU/PD
PADCONFIG141 UART3_RXD 3 I 1
0x000F4234
GPIO1_46 7 IO pad
MMC1_CMD 0 IO 1
MMC1_CMD
TIMER_IO5 2 IO 0
A21 C18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV5 Yes SDIO PU/PD
PADCONFIG143 UART3_TXD 3 O
0x000F423C
GPIO1_47 7 IO pad
MMC1_SDCD 0 I 1
MMC1_SDCD UART6_RXD 1 I 1
D17 C15 PADCONFIG: TIMER_IO6 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG144
0x000F4240 UART3_RTSn 3 O
GPIO1_48 7 IO pad
MMC1_SDWP 0 I 1
MMC1_SDWP UART6_TXD 1 O
C17 B15 PADCONFIG: TIMER_IO7 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG145
0x000F4244 UART3_CTSn 3 I 1
GPIO1_49 7 IO pad
MMC2_CLK 0 IO 0
MMC2_CLK MCASP1_ACLKR 1 IO 0
D25 E21 PADCONFIG: MCASP1_AXR5 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes SDIO PU/PD
PADCONFIG70
0x000F4118 UART6_RXD 3 I 1
GPIO0_69 7 IO pad
MMC2_CMD 0 IO 1
MMC2_CMD MCASP1_AFSR 1 IO 0
C24 C21 PADCONFIG: MCASP1_AXR4 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes SDIO PU/PD
PADCONFIG72
0x000F4120 UART6_TXD 3 O
GPIO0_70 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
MMC2_SDCD 0 I 1
MMC2_SDCD
MCASP1_ACLKX 1 IO 0
A23 D20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes LVCMOS PU/PD
PADCONFIG73 UART4_RXD 3 I 1
0x000F4124
GPIO0_71 7 IO pad
MMC2_SDWP 0 I 1
MMC2_SDWP
MCASP1_AFSX 1 IO 0
B23 C20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes LVCMOS PU/PD
PADCONFIG74 UART4_TXD 3 O
0x000F4128
GPIO0_72 7 IO pad
MMC0_DAT0 0 IO 1
UART3_CTSn 1 I 1
MMC0_DAT0 EHRPWM_TZn_IN1 2 I 0
AA2 V2 PADCONFIG: PR0_PRU0_GPO3 3 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV4 Yes SDIO PU/PD
PADCONFIG133
0x000F4214 PR0_PRU0_GPI3 4 I 0
SPI2_CLK 6 IO 0
GPIO1_39 7 IO pad
MMC0_DAT1 0 IO 1
UART3_RTSn 1 O
EHRPWM1_B 2 IO 0
MMC0_DAT1
PR0_PRU0_GPO2 3 IO 0
AA1 V1 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV4 Yes SDIO PU/PD
PADCONFIG132 PR0_PRU0_GPI2 4 I 0
0x000F4210
SPI1_CS3 5 IO 1
SPI2_CS0 6 IO 1
GPIO1_38 7 IO pad
MMC0_DAT2 0 IO 1
UART3_TXD 1 O
EHRPWM1_A 2 IO 0
MMC0_DAT2
PR0_PRU0_GPO1 3 IO 0
AA3 W2 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV4 Yes SDIO PU/PD
PADCONFIG131 PR0_PRU0_GPI1 4 I 0
0x000F420C
SPI1_CLK 5 IO 0
TIMER_IO0 6 IO 0
GPIO1_37 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
MMC0_DAT7 0 IO 1
UART2_RXD 1 I 1
EHRPWM0_SYNCI 2 I 0
MMC0_DAT7
PR0_PRU1_GPO0 3 O
AC2 V4 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV4 Yes SDIO PU/PD
PADCONFIG126 PR0_PRU1_GPI0 4 I 0
0x000F41F8
SPI1_D0 5 IO 0
SPI2_CS1 6 IO 1
GPIO1_32 7 IO pad
MMC1_DAT0 0 IO 1
CP_GEMAC_CPTS0_HW2TSPUSH 1 I 0
MMC1_DAT0
TIMER_IO3 2 IO 0
A22 A19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV5 Yes SDIO PU/PD
PADCONFIG140 UART2_CTSn 3 I 1
0x000F4230
ECAP2_IN_APWM_OUT 4 IO 0
GPIO1_45 7 IO pad
MMC1_DAT1 0 IO 1
CP_GEMAC_CPTS0_HW1TSPUSH 1 I 0
MMC1_DAT1
TIMER_IO2 2 IO 0
B21 B19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV5 Yes SDIO PU/PD
PADCONFIG139 UART2_RTSn 3 O
0x000F422C
ECAP1_IN_APWM_OUT 4 IO 0
GPIO1_44 7 IO pad
MMC1_DAT2 0 IO 1
MMC1_DAT2 CP_GEMAC_CPTS0_TS_SYNC 1 O
C21 B20 PADCONFIG: TIMER_IO1 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV5 Yes SDIO PU/PD
PADCONFIG138
0x000F4228 UART2_TXD 3 O
GPIO1_43 7 IO pad
MMC1_DAT3 0 IO 1
MMC1_DAT3 CP_GEMAC_CPTS0_TS_COMP 1 O
D22 C19 PADCONFIG: TIMER_IO0 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV5 Yes SDIO PU/PD
PADCONFIG137
0x000F4224 UART2_RXD 3 I 1
GPIO1_42 7 IO pad
MMC2_DAT0 MMC2_DAT0 0 IO 1

B24 B21 PADCONFIG: MCASP1_AXR0 1 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes SDIO PU/PD
PADCONFIG69
0x000F4114 GPIO0_68 7 IO pad

MMC2_DAT1 MMC2_DAT1 0 IO 1

C25 D21 PADCONFIG: MCASP1_AXR1 1 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes SDIO PU/PD
PADCONFIG68
0x000F4110 GPIO0_67 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
MMC2_DAT2 0 IO 1
MMC2_DAT2
MCASP1_AXR2 1 IO 0
E23 E19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes SDIO PU/PD
PADCONFIG67 UART5_TXD 3 O
0x000F410C
GPIO0_66 7 IO pad
MMC2_DAT3 0 IO 1
MMC2_DAT3
MCASP1_AXR3 1 IO 0
D24 E20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV6 Yes SDIO PU/PD
PADCONFIG66 UART5_RXD 3 I 1
0x000F4108
GPIO0_65 7 IO pad
AA5 AA2 OLDI0_A0N OLDI0_A0N IO 1.8V VDDA_1P8_OLDI OLDI
Y6 AA3 OLDI0_A0P OLDI0_A0P IO 1.8V VDDA_1P8_OLDI OLDI
AD3 V5 OLDI0_A1N OLDI0_A1N IO 1.8V VDDA_1P8_OLDI OLDI
AB4 V6 OLDI0_A1P OLDI0_A1P IO 1.8V VDDA_1P8_OLDI OLDI
Y8 U7 OLDI0_A2N OLDI0_A2N IO 1.8V VDDA_1P8_OLDI OLDI
AA8 U6 OLDI0_A2P OLDI0_A2P IO 1.8V VDDA_1P8_OLDI OLDI
AB6 W6 OLDI0_A3N OLDI0_A3N IO 1.8V VDDA_1P8_OLDI OLDI
AA7 W5 OLDI0_A3P OLDI0_A3P IO 1.8V VDDA_1P8_OLDI OLDI
AC6 AA4 OLDI0_A4N OLDI0_A4N IO 1.8V VDDA_1P8_OLDI OLDI
AC5 Y5 OLDI0_A4P OLDI0_A4P IO 1.8V VDDA_1P8_OLDI OLDI
AE5 AA6 OLDI0_A5N OLDI0_A5N IO 1.8V VDDA_1P8_OLDI OLDI
AD6 AA5 OLDI0_A5P OLDI0_A5P IO 1.8V VDDA_1P8_OLDI OLDI
AE6 AA10 OLDI0_A6N OLDI0_A6N IO 1.8V VDDA_1P8_OLDI OLDI
AD7 Y9 OLDI0_A6P OLDI0_A6P IO 1.8V VDDA_1P8_OLDI OLDI
AD8 AA8 OLDI0_A7N OLDI0_A7N IO 1.8V VDDA_1P8_OLDI OLDI
AE7 Y8 OLDI0_A7P OLDI0_A7P IO 1.8V VDDA_1P8_OLDI OLDI
AD4 V7 OLDI0_CLK0N OLDI0_CLK0N IO 1.8V VDDA_1P8_OLDI OLDI
AE3 V8 OLDI0_CLK0P OLDI0_CLK0P IO 1.8V VDDA_1P8_OLDI OLDI
AE4 Y7 OLDI0_CLK1N OLDI0_CLK1N IO 1.8V VDDA_1P8_OLDI OLDI
AD5 AA7 OLDI0_CLK1P OLDI0_CLK1P IO 1.8V VDDA_1P8_OLDI OLDI
OSPI0_CLK OSPI0_CLK 0 O

H24 G19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG0 GPIO0_0 7 IO pad
0x000F4000
OSPI0_DQS OSPI0_DQS 0 I 0

J24 H20 PADCONFIG: UART5_CTSn 5 I 1 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG2
0x000F4008 GPIO0_2 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

G25 G18 PADCONFIG: UART5_RTSn 5 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG1
0x000F4004 GPIO0_1 7 IO pad

OSPI0_CSn0 OSPI0_CSn0 0 O

F23 F19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG11 GPIO0_11 7 IO pad
0x000F402C
OSPI0_CSn1 OSPI0_CSn1 0 O

G21 F17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG12 GPIO0_12 7 IO pad
0x000F4030
OSPI0_CSn2 0 O
SPI1_CS1 1 IO 1
OSPI0_CSn2 OSPI0_RESET_OUT1 2 O
H21 E17 PADCONFIG: MCASP1_AFSR 3 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG13
0x000F4034 MCASP1_AXR2 4 IO 0
UART5_RXD 5 I 1
GPIO0_13 7 IO pad
OSPI0_CSn3 0 O
OSPI0_RESET_OUT0 1 O
OSPI0_CSn3 OSPI0_ECC_FAIL 2 I 1
E24 E18 PADCONFIG: MCASP1_ACLKR 3 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG14
0x000F4038 MCASP1_AXR3 4 IO 0
UART5_TXD 5 O
GPIO0_14 7 IO pad
OSPI0_D0 OSPI0_D0 0 IO 0

E25 F18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG3 GPIO0_3 7 IO pad
0x000F400C
OSPI0_D1 OSPI0_D1 0 IO 0

G24 G17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG4 GPIO0_4 7 IO pad
0x000F4010
OSPI0_D2 OSPI0_D2 0 IO 0

F25 F21 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG5 GPIO0_5 7 IO pad
0x000F4014
OSPI0_D3 OSPI0_D3 0 IO 0

F24 F20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV1 Yes LVCMOS PU/PD
PADCONFIG6 GPIO0_6 7 IO pad
0x000F4018

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

B7 C7 PADCONFIG: Off / Off / Off Off / SS / Off 0 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG32 MCU_GPIO0_22 7 IO pad
0x04084080
PORz_OUT

E21 E13 PADCONFIG: PORz_OUT 0 O Off / Low / Off Off / SS / Off 0 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG148
0x000F4250
RESETSTATz

F22 E14 PADCONFIG: RESETSTATz 0 O Off / Low / Off Off / SS / Off 0 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG147
0x000F424C
RESET_REQz

F20 E15 PADCONFIG: RESET_REQz 0 I On / Off / Up On / Off / Up 0 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG146
0x000F4248

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

AE17 W14 PADCONFIG: RMII1_RX_ER 1 I 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG81
0x000F4144 GPIO0_79 7 IO pad

RGMII1_TXC RGMII1_TXC 0 IO 0

AE19 W16 PADCONFIG: RMII1_CRS_DV 1 I 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG76
0x000F4130 GPIO0_74 7 IO pad

RGMII1_TX_CTL RGMII1_TX_CTL 0 O

AD19 V15 PADCONFIG: RMII1_TX_EN 1 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG75
0x000F412C GPIO0_73 7 IO pad

RGMII2_RXC 0 I 0
RMII2_REF_CLK 1 I 0
RGMII2_RXC MCASP2_AXR1 2 IO 0
AD23 V18 PADCONFIG: PR0_PRU0_GPO1 3 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG96
0x000F4180 PR0_PRU0_GPI1 4 I 0
PR0_ECAP0_SYNC_IN 5 I 0
GPIO1_2 7 IO pad
RGMII2_RX_CTL 0 I 0
RMII2_RX_ER 1 I 0
RGMII2_RX_CTL
MCASP2_AXR3 2 IO 0
AD22 W19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG95 PR0_PRU0_GPO0 3 IO 0
0x000F417C
PR0_PRU0_GPI0 4 I 0
GPIO1_1 7 IO pad
RGMII2_TXC 0 IO 0
RMII2_CRS_DV 1 I 0
RGMII2_TXC
MCASP2_AXR5 2 IO 0
AE21 Y18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG90 PR0_PRU1_GPO1 3 O
0x000F4168
PR0_PRU1_GPI1 4 I 0
GPIO0_88 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

AB17 W15 PADCONFIG: RMII1_RXD0 1 I 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG83
0x000F414C GPIO0_81 7 IO pad

RGMII1_RD1 RGMII1_RD1 0 I 0

AC17 Y16 PADCONFIG: RMII1_RXD1 1 I 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG84
0x000F4150 GPIO0_82 7 IO pad

RGMII1_RD2 RGMII1_RD2 0 I 0

AB16 AA17 PADCONFIG: PR0_UART0_RTSn 2 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG85
0x000F4154 GPIO0_83 7 IO pad

RGMII1_RD3 RGMII1_RD3 0 I 0

AA15 Y15 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG86 GPIO0_84 7 IO pad
0x000F4158
RGMII1_TD0 RGMII1_TD0 0 O

AE20 U14 PADCONFIG: RMII1_TXD0 1 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG77
0x000F4134 GPIO0_75 7 IO pad

RGMII1_TD1 RGMII1_TD1 0 O

AD20 AA19 PADCONFIG: RMII1_TXD1 1 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG78
0x000F4138 GPIO0_76 7 IO pad

RGMII1_TD2 RGMII1_TD2 0 O

AE18 Y17 PADCONFIG: PR0_UART0_RXD 2 I 1 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG79
0x000F413C GPIO0_77 7 IO pad

RGMII1_TD3 RGMII1_TD3 0 O

AD18 AA18 PADCONFIG: PR0_UART0_TXD 2 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG80
0x000F4140 GPIO0_78 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
RGMII2_RD0 0 I 0
RMII2_RXD0 1 I 0
RGMII2_RD0 MCASP2_AXR2 2 IO 0
AE23 W18 PADCONFIG: PR0_PRU0_GPO2 3 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG97
0x000F4184 PR0_PRU0_GPI2 4 I 0
PR0_UART0_RTSn 6 O
GPIO1_3 7 IO pad
RGMII2_RD1 0 I 0
RMII2_RXD1 1 I 0
RGMII2_RD1 MCASP2_AFSR 2 IO 0
AB20 Y20 PADCONFIG: PR0_PRU0_GPO3 3 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG98
0x000F4188 PR0_PRU0_GPI3 4 I 0
MCASP2_AXR7 5 IO 0
GPIO1_4 7 IO pad
RGMII2_RD2 0 I 0
MCASP2_AXR0 2 IO 0
RGMII2_RD2 PR0_PRU0_GPO4 3 IO 0
AC21 Y19 PADCONFIG: PR0_PRU0_GPI4 4 I 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG99
0x000F418C PR0_UART0_RXD 5 I 1
GPIO1_5 7 IO pad
EQEP2_A 8 I 0
RGMII2_RD3 0 I 0
AUDIO_EXT_REFCLK0 2 IO 0
RGMII2_RD3 PR0_PRU0_GPO16 3 IO 0
AE22 W20 PADCONFIG: PR0_PRU0_GPI16 4 I 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG100
0x000F4190 PR0_UART0_TXD 5 O
GPIO1_6 7 IO pad
EQEP2_B 8 I 0
RGMII2_TD0 0 O
RMII2_TXD0 1 O
RGMII2_TD0
MCASP2_AXR6 2 IO 0
Y18 AA20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG91 PR0_PRU1_GPO2 3 O
0x000F416C
PR0_PRU1_GPI2 4 I 0
GPIO0_89 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
RGMII2_TD1 0 O
RMII2_TXD1 1 O
RGMII2_TD1 MCASP2_ACLKR 2 IO 0
AA18 U15 PADCONFIG: PR0_PRU1_GPO3 3 O Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG92
0x000F4170 PR0_PRU1_GPI3 4 I 0
MCASP2_AXR8 5 IO 0
GPIO0_90 7 IO pad
RGMII2_TD2 0 O
MCASP2_AFSX 2 IO 0
RGMII2_TD2 PR0_PRU1_GPO4 3 O
AD21 W17 PADCONFIG: PR0_PRU1_GPI4 4 I 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG93
0x000F4174 PR0_ECAP0_IN_APWM_OUT 5 IO 0
GPIO0_91 7 IO pad
EQEP2_I 8 IO 0
RGMII2_TD3 0 O
MCASP2_ACLKX 2 IO 0
PR0_PRU1_GPO16 3 O
RGMII2_TD3
PR0_PRU1_GPI16 4 I 0
AC20 V16 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV2 Yes LVCMOS PU/PD
PADCONFIG94 PR0_ECAP0_SYNC_OUT 5 O
0x000F4178
PR0_UART0_CTSn 6 I 1
GPIO1_0 7 IO pad
EQEP2_S 8 IO 0
B1 B3 RSVD0 RSVD0 N/A
A2 C3 RSVD1 RSVD1 N/A
F6 E6 RSVD2 RSVD2 N/A
AE2 F8 RSVD3 RSVD3 N/A
T2 R6 RSVD4 RSVD4 N/A
U4 T13 RSVD5 RSVD5 N/A
AA12 T14 RSVD6 RSVD6 N/A
Y15 M4 RSVD7 RSVD7 N/A
E7 M5 RSVD8 RSVD8 N/A
SPI0_CLK 0 IO 0
SPI0_CLK
CP_GEMAC_CPTS0_TS_SYNC 1 O
A14 D12 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG111 EHRPWM1_A 2 IO 0
0x000F41BC
GPIO1_17 7 IO pad

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

A10 C10 PADCONFIG: TCK 0 I On / Off / Up On / Off / Up 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG25
0x04084064
TDI

A11 D10 PADCONFIG: TDI 0 I On / Off / Up On / Off / Up 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG27
0x0408406C
TDO

D12 E10 PADCONFIG: TDO 0 OZ Off / Off / Up Off / SS / Up 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG28
0x04084070
TMS

B11 B11 PADCONFIG: TMS 0 I On / Off / Up On / Off / Up 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG29
0x04084074
TRSTn

B10 A11 PADCONFIG: TRSTn 0 I On / Off / Down On / Off / Down 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG26
0x04084068

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
UART0_CTSn 0 I 1
SPI0_CS2 1 IO 1
I2C3_SCL 2 IOD 1
UART2_RXD 3 I 1
UART0_CTSn
TIMER_IO6 4 IO 0
A15 B14 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG116 AUDIO_EXT_REFCLK0 5 IO 0
0x000F41D0
PR0_ECAP0_SYNC_OUT 6 O
GPIO1_22 7 IO pad
MCASP2_AFSX 8 IO 0
MMC2_SDCD 9 I 1
UART0_RTSn 0 O
SPI0_CS3 1 IO 1
I2C3_SDA 2 IOD 1
UART2_TXD 3 O
UART0_RTSn
TIMER_IO7 4 IO 0
B15 C13 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG117 AUDIO_EXT_REFCLK1 5 IO 0
0x000F41D4
PR0_ECAP0_IN_APWM_OUT 6 IO 0
GPIO1_23 7 IO pad
MCASP2_ACLKX 8 IO 0
MMC2_SDWP 9 I 1
UART0_RXD 0 I 1
UART0_RXD ECAP1_IN_APWM_OUT 1 IO 0
D14 A13 PADCONFIG: SPI2_D0 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG114
0x000F41C8 EHRPWM2_A 3 IO 0
GPIO1_20 7 IO pad
UART0_TXD 0 O
UART0_TXD ECAP2_IN_APWM_OUT 1 IO 0
E14 E11 PADCONFIG: SPI2_D1 2 IO 0 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG115
0x000F41CC EHRPWM2_B 3 IO 0
GPIO1_21 7 IO pad
VDDA_1P8_USB,
AE11 AA11 USB0_DM USB0_DM IO 1.8V / 3.3V USB2PHY
VDDA_3P3_USB
VDDA_1P8_USB,
AD11 Y10 USB0_DP USB0_DP IO 1.8V / 3.3V USB2PHY
VDDA_3P3_USB
USB0_DRVVBUS USB0_DRVVBUS 0 O

C20 D17 PADCONFIG: Off / Off / Down Off / Off / Down 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG149 GPIO1_50 7 IO pad
0x000F4254

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

F18 E16 PADCONFIG: Off / Off / Down Off / Off / Down 7 1.8V / 3.3V VDDSHV0 Yes LVCMOS PU/PD
PADCONFIG150 GPIO1_51 7 IO pad
0x000F4258
VDDA_1P8_USB,
AC9 V9 USB1_RCALIB USB1_RCALIB A 1.8V / 3.3V USB2PHY
VDDA_3P3_USB
VDDA_1P8_USB,
AB10 U9 USB1_VBUS USB1_VBUS A 1.8V / 3.3V USB2PHY
VDDA_3P3_USB
Y11 R11 VDDA_1P8_USB VDDA_1P8_USB PWR
W14 R12 VDDA_1P8_CSIRX0 VDDA_1P8_CSIRX0 PWR
W10, W9 P9, R9 VDDA_1P8_OLDI0 VDDA_1P8_OLDI0 PWR
Y13 R10 VDDA_3P3_USB VDDA_3P3_USB PWR
W13 P12 VDDA_CORE_CSIRX0 VDDA_CORE_CSIRX0 PWR
W12 P11 VDDA_CORE_USB VDDA_CORE_USB PWR
L9 VDDA_DDR_PLL0 VDDA_DDR_PLL0 PWR
L11 H10 VDDA_MCU VDDA_MCU PWR
U11 N10 VDDA_PLL0 VDDA_PLL0 PWR
U15 P14 VDDA_PLL1 VDDA_PLL1 PWR
L14 K12 VDDA_PLL2 VDDA_PLL2 PWR
T9 M7 VDDA_TEMP0 VDDA_TEMP0 PWR
G16 F16 VDDA_TEMP1 VDDA_TEMP1 PWR
J12, K16,
N12, N14, H11, M10,
VDDR_CORE VDDR_CORE PWR
P16, R12, M13
T10, U14
F15, G14 F12, G13 VDDSHV0 VDDSHV0 PWR
L18, M19 K15, K16 VDDSHV1 VDDSHV1 PWR
W16, W19 R14, R15 VDDSHV2 VDDSHV2 PWR
N18, P18,
N15, N16 VDDSHV3 VDDSHV3 PWR
T19, U18
T7 N7, P7 VDDSHV4 VDDSHV4 PWR
G17 F14, G14 VDDSHV5 VDDSHV5 PWR
J18 H15, H16 VDDSHV6 VDDSHV6 PWR

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
H9 G7, H7 VDDSHV_CANUART VDDSHV_CANUART PWR
F11, G12 F10, G10 VDDSHV_MCU VDDSHV_MCU PWR
K9, L8, P9, C1, J8, K7,
VDDS_DDR VDDS_DDR PWR
R8 K9, L8, U1
M9 L7 VDDS_DDR_C VDDS_DDR_C PWR
G7 J7 VDDS_OSC0 VDDS_OSC0 PWR
F8 H8 VDD_CANUART VDD_CANUART PWR
H8, J11,
H12, H14,
J14, K17,
J11, J13,
L12, L15,
J9, K10,
M16, N11,
K14, L11,
N13, N8, VDD_CORE VDD_CORE PWR
L13, M12,
P17, R11,
M14, M8,
R14, U12,
N11, N13,
V15, V17,
N9, P8
V8
G10 H9 VMON_1P8_SOC VMON_1P8_SOC A
K10 K11 VMON_3P3_SOC VMON_3P3_SOC A
H10 F6 VMON_VSYS VMON_VSYS A
VOUT0_DE 0 O
GPMC0_A17 1 OZ
PR0_PRU1_GPO17 2 O
VOUT0_DE
PR0_PRU1_GPI17 3 I 0
Y20 T17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG63 UART3_CTSn 4 I 1
0x000F40FC
PR0_PRU0_GPO7 5 IO 0
PR0_PRU0_GPI7 6 I 0
GPIO0_62 7 IO pad
VOUT0_HSYNC 0 O
GPMC0_A16 1 OZ
PR0_PRU1_GPO15 2 O
VOUT0_HSYNC
PR0_PRU1_GPI15 3 I 0
AB24 W21 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG62 UART3_RTSn 4 O
0x000F40F8
PR0_PRU0_GPO6 5 IO 0
PR0_PRU0_GPI6 6 I 0
GPIO0_61 7 IO pad

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
VOUT0_PCLK 0 O
GPMC0_A19 1 OZ
PR0_PRU1_GPO19 2 O
VOUT0_PCLK PR0_PRU1_GPI19 3 I 0
AC24 U17 PADCONFIG: UART2_CTSn 4 I 1 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG65
0x000F4104 PR0_PRU0_GPO19 5 IO 0
PR0_PRU0_GPI19 6 I 0
GPIO0_64 7 IO pad
PR0_ECAP0_IN_APWM_OUT 8 IO 0
VOUT0_VSYNC 0 O
GPMC0_A18 1 OZ
PR0_PRU1_GPO18 2 O
VOUT0_VSYNC
PR0_PRU1_GPI18 3 I 0
AC25 T16 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG64 UART2_RTSn 4 O
0x000F4100
PR0_PRU0_GPO18 5 IO 0
PR0_PRU0_GPI18 6 I 0
GPIO0_63 7 IO pad
VOUT0_DATA0 0 O
GPMC0_A0 1 OZ
PR0_PRU1_GPO0 2 O
VOUT0_DATA0
PR0_PRU1_GPI0 3 I 0
U22 R21 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG46 UART2_RXD 4 I 1
0x000F40B8
PR0_PRU0_GPO8 5 IO 0
PR0_PRU0_GPI8 6 I 0
GPIO0_45 7 IO pad
VOUT0_DATA1 0 O
GPMC0_A1 1 OZ
PR0_PRU1_GPO1 2 O
VOUT0_DATA1
PR0_PRU1_GPI1 3 I 0
V24 P18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG47 UART2_TXD 4 O
0x000F40BC
PR0_PRU0_GPO9 5 IO 0
PR0_PRU0_GPI9 6 I 0
GPIO0_46 7 IO pad

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
VOUT0_DATA2 0 O
GPMC0_A2 1 OZ
PR0_PRU1_GPO2 2 O
VOUT0_DATA2
PR0_PRU1_GPI2 3 I 0
W25 R18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG48 UART3_RXD 4 I 1
0x000F40C0
PR0_PRU0_GPO10 5 IO 0
PR0_PRU0_GPI10 6 I 0
GPIO0_47 7 IO pad
VOUT0_DATA3 0 O
GPMC0_A3 1 OZ
PR0_PRU1_GPO3 2 O
VOUT0_DATA3
PR0_PRU1_GPI3 3 I 0
W24 R19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG49 UART3_TXD 4 O
0x000F40C4
PR0_PRU0_GPO11 5 IO 0
PR0_PRU0_GPI11 6 I 0
GPIO0_48 7 IO pad
VOUT0_DATA4 0 O
GPMC0_A4 1 OZ
PR0_PRU1_GPO4 2 O
VOUT0_DATA4
PR0_PRU1_GPI4 3 I 0
Y25 R20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG50 UART4_RXD 4 I 1
0x000F40C8
PR0_PRU0_GPO12 5 IO 0
PR0_PRU0_GPI12 6 I 0
GPIO0_49 7 IO pad
VOUT0_DATA5 0 O
GPMC0_A5 1 OZ
PR0_PRU1_GPO5 2 O
VOUT0_DATA5
PR0_PRU1_GPI5 3 I 0
Y24 T20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG51 UART4_TXD 4 O
0x000F40CC
PR0_PRU0_GPO13 5 IO 0
PR0_PRU0_GPI13 6 I 0
GPIO0_50 7 IO pad

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
VOUT0_DATA6 0 O
GPMC0_A6 1 OZ
PR0_PRU1_GPO6 2 O
VOUT0_DATA6
PR0_PRU1_GPI6 3 I 0
Y23 T21 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG52 UART5_RXD 4 I 1
0x000F40D0
PR0_PRU0_GPO14 5 IO 0
PR0_PRU0_GPI14 6 I 0
GPIO0_51 7 IO pad
VOUT0_DATA7 0 O
GPMC0_A7 1 OZ
PR0_PRU1_GPO7 2 O
VOUT0_DATA7
PR0_PRU1_GPI7 3 I 0
AA25 T19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG53 UART5_TXD 4 O
0x000F40D4
PR0_PRU0_GPO15 5 IO 0
PR0_PRU0_GPI15 6 I 0
GPIO0_52 7 IO pad
VOUT0_DATA8 0 O
GPMC0_A8 1 OZ
PR0_PRU1_GPO16 2 O
VOUT0_DATA8
PR0_PRU1_GPI16 3 I 0
V21 U21 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG54 UART6_RXD 4 I 1
0x000F40D8
PR0_PRU0_GPO17 5 IO 0
PR0_PRU0_GPI17 6 I 0
GPIO0_53 7 IO pad
VOUT0_DATA9 0 O
GPMC0_A9 1 OZ
PR0_PRU1_GPO8 2 O
VOUT0_DATA9
PR0_PRU1_GPI8 3 I 0
W21 R17 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG55 UART6_TXD 4 O
0x000F40DC
PR0_PRU0_GPO16 5 IO 0
PR0_PRU0_GPI16 6 I 0
GPIO0_54 7 IO pad

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

BALL BALL
MUX
ALW AMC STATE STATE
BALL NAME [2] MODE I/O PULL
BALL BALL MUX TYPE DSIS DURING AFTER HYS BUFFER
PADCONFIG Register [15] SIGNAL NAME [3] AFTER OPERATING POWER [11] UP/DOWN
NUMBER NUMBER MODE [4] [5] [6] RESET RESET [12] TYPE [13]
PADCONFIG Address [16] RESET VOLTAGE [10] TYPE [14]
[1] [1] (RX/TX/PULL) (RX/TX/PULL)
[9]
[7] [8]
VOUT0_DATA10 0 O
GPMC0_A10 1 OZ
PR0_PRU1_GPO9 2 O
VOUT0_DATA10
PR0_PRU1_GPI9 3 I 0
V20 T18 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG56 UART6_RTSn 4 O
0x000F40E0
PR0_PRU0_GPO0 5 IO 0
PR0_PRU0_GPI0 6 I 0
GPIO0_55 7 IO pad
VOUT0_DATA11 0 O
GPMC0_A11 1 OZ
PR0_PRU1_GPO10 2 O
VOUT0_DATA11
PR0_PRU1_GPI10 3 I 0
AA23 U20 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG57 UART6_CTSn 4 I 1
0x000F40E4
PR0_PRU0_GPO1 5 IO 0
PR0_PRU0_GPI1 6 I 0
GPIO0_56 7 IO pad
VOUT0_DATA12 0 O
GPMC0_A12 1 OZ
PR0_PRU1_GPO11 2 O
VOUT0_DATA12
PR0_PRU1_GPI11 3 I 0
AB25 U19 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG58 UART5_RTSn 4 O
0x000F40E8
PR0_PRU0_GPO2 5 IO 0
PR0_PRU0_GPI2 6 I 0
GPIO0_57 7 IO pad
VOUT0_DATA13 0 O
GPMC0_A13 1 OZ
PR0_PRU1_GPO12 2 O
VOUT0_DATA13
PR0_PRU1_GPI12 3 I 0
AA24 V21 PADCONFIG: Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV3 Yes LVCMOS PU/PD
PADCONFIG59 UART5_CTSn 4 I 1
0x000F40EC
PR0_PRU0_GPO3 5 IO 0
PR0_PRU0_GPI3 6 I 0
GPIO0_58 7 IO pad

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

A12 B12 PADCONFIG: Off / Off / Off Off / SS / Off 0 1.8V / 3.3V VDDSHV_MCU Yes LVCMOS PU/PD
MCU_PADCONFIG33 MCU_GPIO0_23 7 IO pad
0x04084084
WKUP_I2C0_SCL WKUP_I2C0_SCL 0 IOD 1

B9 E9 PADCONFIG: Off / Off / NA On / SS / NA 7 1.8V / 3.3V VDDSHV_MCU Yes I2C OD FS

MCU_PADCONFIG19 MCU_GPIO0_19 7 IOD pad
0x0408404C
WKUP_I2C0_SDA WKUP_I2C0_SDA 0 IOD 1

A9 A9 PADCONFIG: Off / Off / NA On / SS / NA 7 1.8V / 3.3V VDDSHV_MCU Yes I2C OD FS

MCU_PADCONFIG20 MCU_GPIO0_20 7 IOD pad
0x04084050
C2 A2 WKUP_LFOSC0_XI WKUP_LFOSC0_XI I 1.8V VDDS_OSC0 LFXOSC
C1 A3 WKUP_LFOSC0_XO WKUP_LFOSC0_XO O 1.8V VDDS_OSC0 LFXOSC

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Table 5-1. Pin Attributes (ALW, AMC Packages) (continued)

B4 B5 PADCONFIG: MCU_SPI0_CS2 2 IO 1 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG9
0x04084024 MCU_GPIO0_9 7 IO pad

WKUP_UART0_TXD WKUP_UART0_TXD 0 O

C5 C6 PADCONFIG: MCU_SPI1_CS2 2 IO 1 Off / Off / Off Off / Off / Off 7 1.8V / 3.3V VDDSHV_CANUART Yes LVCMOS PU/PD
MCU_PADCONFIG10
0x04084028 MCU_GPIO0_10 7 IO pad

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5.3 Signal Descriptions

Many signals are available on multiple pins, according to the software configuration of the pin multiplexing
options.
The following list describes the column headers:
1. SIGNAL NAME: The name of the signal passing through the pin.

Note
Signal names and descriptions provided in each Signal Descriptions table, represent the pin
multiplexed signal function which is implemented at the pin and selected via PADCONFIG registers.
Device subsystems may provide secondary multiplexing of signal functions, which are not described
in these tables. For more information on secondary multiplexed signal functions, see the respective
peripheral chapter of the device TRM.

2. PIN TYPE: Signal direction and type:

4. BALL: Ball number(s) associated with signal

For more information on the IO cell configurations, see the Pad Configuration Registers section in Device
Configuration chapter of the device TRM.
5.3.1 CPSW3G
[Link] MAIN Domain
Table 5-2. CPSW3G0 RGMII1 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
RGMII1_RXC I RGMII Receive Clock AD17 AA16
RGMII1_RX_CTL I RGMII Receive Control AE17 W14
RGMII1_TXC IO RGMII Transmit Clock AE19 W16
RGMII1_TX_CTL O RGMII Transmit Control AD19 V15
RGMII1_RD0 I RGMII Receive Data 0 AB17 W15
RGMII1_RD1 I RGMII Receive Data 1 AC17 Y16
RGMII1_RD2 I RGMII Receive Data 2 AB16 AA17
RGMII1_RD3 I RGMII Receive Data 3 AA15 Y15
RGMII1_TD0 O RGMII Transmit Data 0 AE20 U14
RGMII1_TD1 O RGMII Transmit Data 1 AD20 AA19
RGMII1_TD2 O RGMII Transmit Data 2 AE18 Y17
RGMII1_TD3 O RGMII Transmit Data 3 AD18 AA18

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Table 5-3. CPSW3G0 RGMII2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
RGMII2_RXC I RGMII Receive Clock AD23 V18
RGMII2_RX_CTL I RGMII Receive Control AD22 W19
RGMII2_TXC IO RGMII Transmit Clock AE21 Y18
RGMII2_TX_CTL O RGMII Transmit Control AA19 Y21
RGMII2_RD0 I RGMII Receive Data 0 AE23 W18
RGMII2_RD1 I RGMII Receive Data 1 AB20 Y20
RGMII2_RD2 I RGMII Receive Data 2 AC21 Y19
RGMII2_RD3 I RGMII Receive Data 3 AE22 W20
RGMII2_TD0 O RGMII Transmit Data 0 Y18 AA20
RGMII2_TD1 O RGMII Transmit Data 1 AA18 U15
RGMII2_TD2 O RGMII Transmit Data 2 AD21 W17
RGMII2_TD3 O RGMII Transmit Data 3 AC20 V16

Table 5-4. CPSW3G0 RMII1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
RMII1_CRS_DV I RMII Carrier Sense / Data Valid AE19 W16
RMII1_REF_CLK I RMII Reference Clock AD17 AA16
RMII1_RX_ER I RMII Receive Data Error AE17 W14
RMII1_TX_EN O RMII Transmit Enable AD19 V15
RMII1_RXD0 I RMII Receive Data 0 AB17 W15
RMII1_RXD1 I RMII Receive Data 1 AC17 Y16
RMII1_TXD0 O RMII Transmit Data 0 AE20 U14
RMII1_TXD1 O RMII Transmit Data 1 AD20 AA19

Table 5-5. CPSW3G0 RMII2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
RMII2_CRS_DV I RMII Carrier Sense / Data Valid AE21 Y18
RMII2_REF_CLK I RMII Reference Clock AD23 V18
RMII2_RX_ER I RMII Receive Data Error AD22 W19
RMII2_TX_EN O RMII Transmit Enable AA19 Y21
RMII2_RXD0 I RMII Receive Data 0 AE23 W18
RMII2_RXD1 I RMII Receive Data 1 AB20 Y20
RMII2_TXD0 O RMII Transmit Data 0 Y18 AA20
RMII2_TXD1 O RMII Transmit Data 1 AA18 U15

5.3.2 CPTS

Note
Some CPTS signals are connected directly to CPTS modules within the device. Other CPTS signals
are connected to the Time Sync Router and fanned out to peripherals linked to the router. Input
signals are sent to the peripherals while output signals are sourced from the peripherals. For more
information, see the Time Sync and Compare Events section in the Time Sync chapter in the device
TRM.

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[Link] MAIN Domain

Table 5-6. CPTS Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
CP_GEMAC_CPTS0_RFT_CLK I CPTS Reference Clock Input A18 C14
CPTS Time Stamp Counter Compare Output
CP_GEMAC_CPTS0_TS_COMP O C13, D22 C19, D13
from CPSW3G0 CPTS
CPTS Time Stamp Counter Bit Output from
CP_GEMAC_CPTS0_TS_SYNC O A14, C21 B20, D12
CPSW3G0 CPTS
CPTS Hardware Time Stamp Push Input to
CP_GEMAC_CPTS0_HW1TSPUSH I B13, B21 B19, C12
Time Sync Router
CPTS Hardware Time Stamp Push Input to
CP_GEMAC_CPTS0_HW2TSPUSH I A22, B14 A14, A19
Time Sync Router
CPTS Time Stamp Generator Bit 0 Output from
SYNC0_OUT O B16 E12
Time Sync Router
CPTS Time Stamp Generator Bit 1 Output from
SYNC1_OUT O A18 C14
Time Sync Router
CPTS Time Stamp Generator Bit 2 Output from
SYNC2_OUT O C15 B13
Time Sync Router
CPTS Time Stamp Generator Bit 3 Output from
SYNC3_OUT O E15 A15
Time Sync Router

5.3.3 CSI-2
[Link] MAIN Domain
Table 5-7. CSIRX0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
CSI-2 Differential Receive Clock Input
CSI0_RXCLKN I AD15 AA14
(negative)
CSI0_RXCLKP I CSI-2 Differential Receive Clock Input (positive) AE15 AA13
CSI-2 D-PHY connection to external calibration
CSI0_RXRCALIB (1) A AA14 T11
resistor
CSI0_RXN0 I CSI-2 Differential Receive Input (negative) AB14 Y13
CSI0_RXN1 I CSI-2 Differential Receive Input (negative) AD14 V13
CSI0_RXN2 I CSI-2 Differential Receive Input (negative) AD13 U12
CSI0_RXN3 I CSI-2 Differential Receive Input (negative) AB12 W12
CSI0_RXP0 I CSI-2 Differential Receive Input (positive) AC15 Y12
CSI0_RXP1 I CSI-2 Differential Receive Input (positive) AE14 V12
CSI0_RXP2 I CSI-2 Differential Receive Input (positive) AE13 U11
CSI0_RXP3 I CSI-2 Differential Receive Input (positive) AC13 W11

(1) An external 499 Ω ±1% resistor must be connected between this pin and VSS and the maximum power dissipation for the resistor is
7.2mW. No external voltage should be applied to this pin.

5.3.4 DDRSS
[Link] MAIN Domain
Table 5-8. DDRSS0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
DDR0_ACT_n O DDRSS Activation Command N6 M1
DDR0_ALERT_n IO DDRSS Alert R3 N1
DDR0_CAS_n O DDRSS Column Address Strobe M4 J3
DDR0_PAR O DDRSS Command and Address Parity T1 M2
DDR0_RAS_n O DDRSS Row Address Strobe M5 K5

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Table 5-8. DDRSS0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
DDR0_WE_n O DDRSS Write Enable N3 J2
DDR0_A0 O DDRSS Address Bus J1 F5
DDR0_A1 O DDRSS Address Bus J2 G5
DDR0_A2 O DDRSS Address Bus K3 G4
DDR0_A3 O DDRSS Address Bus L5 H4
DDR0_A4 O DDRSS Address Bus K4 J5
DDR0_A5 O DDRSS Address Bus K1 H5
DDR0_A6 O DDRSS Address Bus R2 P4
DDR0_A7 O DDRSS Address Bus P2 N2
DDR0_A8 O DDRSS Address Bus P1 P2
DDR0_A9 O DDRSS Address Bus P4 N4
DDR0_A10 O DDRSS Address Bus R5 N3
DDR0_A11 O DDRSS Address Bus P5 M3
DDR0_A12 O DDRSS Address Bus R6 P5
DDR0_A13 O DDRSS Address Bus R1 N5
DDR0_BA0 O DDRSS Bank Address M1 L5
DDR0_BA1 O DDRSS Bank Address N1 L3
DDR0_BG0 O DDRSS Bank Group T4 L4
DDR0_BG1 O DDRSS Bank Group N2 L2
DDR0_CAL0 (1) A IO Pad Calibration Resistor M2 K4
DDR0_CK0 O DDRSS Clock L1 J1
DDR0_CK0_n O DDRSS Negative Clock L2 K1
DDR0_CKE0 O DDRSS Clock Enable H2 G3
DDR0_CKE1 O DDRSS Clock Enable J4 H2
DDR0_CS0_n O DDRSS Chip Select L6 H3
DDR0_CS1_n O DDRSS Chip Select K2 G1
DDR0_DM0 IO DDRSS Data Mask H5 E3
DDR0_DM1 IO DDRSS Data Mask W5 R4
DDR0_DQ0 IO DDRSS Data F4 C2
DDR0_DQ1 IO DDRSS Data G5 E4
DDR0_DQ2 IO DDRSS Data F3 D3
DDR0_DQ3 IO DDRSS Data H6 E5
DDR0_DQ4 IO DDRSS Data E3 D2
DDR0_DQ5 IO DDRSS Data G2 F3
DDR0_DQ6 IO DDRSS Data F2 F1
DDR0_DQ7 IO DDRSS Data F1 F2
DDR0_DQ8 IO DDRSS Data U1 R3
DDR0_DQ9 IO DDRSS Data U3 R2
DDR0_DQ10 IO DDRSS Data U2 T2
DDR0_DQ11 IO DDRSS Data V5 U2
DDR0_DQ12 IO DDRSS Data W2 U3
DDR0_DQ13 IO DDRSS Data V6 U4
DDR0_DQ14 IO DDRSS Data Y1 T4
DDR0_DQ15 IO DDRSS Data W1 T5
DDR0_DQS0 IO DDRSS Data Strobe E1 D1

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Table 5-8. DDRSS0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
DDR0_DQS0_n IO DDRSS Complimentary Data Strobe E2 E1
DDR0_DQS1 IO DDRSS Data Strobe V1 T1
DDR0_DQS1_n IO DDRSS Complimentary Data Strobe V2 R1
DDR0_ODT0 O DDRSS On-Die Termination for Chip Select 0 H1 J4
DDR0_ODT1 O DDRSS On-Die Termination for Chip Select 1 J3 K2
DDR0_RESET0_n O DDRSS Reset G1 G2

(1) An external 240 Ω ±1% resistor must be connected between this pin and VSS. The maximum power dissipation for the resistor is
5.2mW. No external voltage should be applied to this pin.

5.3.5 DSS
[Link] MAIN Domain
Table 5-9. DSS0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
VOUT0_DE O Video Output Data Enable Y20 T17
VOUT0_EXTPCLKIN I Video Output External Pixel Clock Input V25 P17
VOUT0_HSYNC O Video Output Horizontal Sync AB24 W21
VOUT0_PCLK O Video Output Pixel Clock Output AC24 U17
VOUT0_VSYNC O Video Output Vertical Sync AC25 T16
VOUT0_DATA0 O Video Output Data 0 U22 R21
VOUT0_DATA1 O Video Output Data 1 V24 P18
VOUT0_DATA2 O Video Output Data 2 W25 R18
VOUT0_DATA3 O Video Output Data 3 W24 R19
VOUT0_DATA4 O Video Output Data 4 Y25 R20
VOUT0_DATA5 O Video Output Data 5 Y24 T20
VOUT0_DATA6 O Video Output Data 6 Y23 T21
VOUT0_DATA7 O Video Output Data 7 AA25 T19
VOUT0_DATA8 O Video Output Data 8 V21 U21
VOUT0_DATA9 O Video Output Data 9 W21 R17
VOUT0_DATA10 O Video Output Data 10 V20 T18
VOUT0_DATA11 O Video Output Data 11 AA23 U20
VOUT0_DATA12 O Video Output Data 12 AB25 U19
VOUT0_DATA13 O Video Output Data 13 AA24 V21
VOUT0_DATA14 O Video Output Data 14 Y22 U18
VOUT0_DATA15 O Video Output Data 15 AA21 V20
VOUT0_DATA16 O Video Output Data 16 R24 N20
VOUT0_DATA17 O Video Output Data 17 R25 N21
VOUT0_DATA18 O Video Output Data 18 T25 M17
VOUT0_DATA19 O Video Output Data 19 R21 N18
VOUT0_DATA20 O Video Output Data 20 T22 N17
VOUT0_DATA21 O Video Output Data 21 T24 N19
VOUT0_DATA22 O Video Output Data 22 U25 P19
VOUT0_DATA23 O Video Output Data 23 U24 P20

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5.3.6 ECAP
[Link] MAIN Domain
Table 5-10. ECAP0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Enhanced Capture (ECAP) Input or Auxiliary
ECAP0_IN_APWM_OUT IO A18, C13 C14, D13
PWM (APWM) Output

Table 5-11. ECAP1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Enhanced Capture (ECAP) Input or Auxiliary B16, B18, B19, A13, A18, B18,
ECAP1_IN_APWM_OUT IO
PWM (APWM) Output B21, D14 B19, E12

Table 5-12. ECAP2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Enhanced Capture (ECAP) Input or Auxiliary A16, A19, A22, A19, B17, C17,
ECAP2_IN_APWM_OUT IO
PWM (APWM) Output B20, E14 D14, E11

5.3.7 Emulation and Debug

[Link] MAIN Domain
Table 5-13. Trace Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
TRC_CLK O Trace Clock M25 K19
TRC_CTL O Trace Control N23 L19
TRC_DATA0 O Trace Data 0 N24 L20
TRC_DATA1 O Trace Data 1 N25 L21
TRC_DATA2 O Trace Data 2 P24 M21
TRC_DATA3 O Trace Data 3 P22 L17
TRC_DATA4 O Trace Data 4 P21 L18
TRC_DATA5 O Trace Data 5 R23 M20
TRC_DATA6 O Trace Data 6 P25 M19
TRC_DATA7 O Trace Data 7 L23 K20
TRC_DATA8 O Trace Data 8 L24 K21
TRC_DATA9 O Trace Data 9 L25 J17
TRC_DATA10 O Trace Data 10 M24 K17
TRC_DATA11 O Trace Data 11 N20 K18
TRC_DATA12 O Trace Data 12 U23 P21
TRC_DATA13 O Trace Data 13 K25 J20
TRC_DATA14 O Trace Data 14 M22 J19
TRC_DATA15 O Trace Data 15 M21 J18
TRC_DATA16 O Trace Data 16 L21 H17
TRC_DATA17 O Trace Data 17 K22 H18
TRC_DATA18 O Trace Data 18 K24 H19
TRC_DATA19 O Trace Data 19 U24 P20
TRC_DATA20 O Trace Data 20 U25 P19
TRC_DATA21 O Trace Data 21 T24 N19
TRC_DATA22 O Trace Data 22 T22 N17
TRC_DATA23 O Trace Data 23 R21 N18

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Table 5-14. JTAG Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EMU0 IO Emulation Control 0 E12 D9
EMU1 IO Emulation Control 1 C11 B10
TCK I JTAG Test Clock Input A10 C10
TDI I JTAG Test Data Input A11 D10
TDO OZ JTAG Test Data Output D12 E10
TMS I JTAG Test Mode Select Input B11 B11
TRSTn I JTAG Reset B10 A11

5.3.8 EPWM
[Link] MAIN Domain
Table 5-15. EPWM Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EHRPWM_SOCA O EHRPWM Start of Conversion A B16 E12
EHRPWM_SOCB O EHRPWM Start of Conversion B A16 D14
EHRPWM_TZn_IN0 I EHRPWM Trip Zone Input 0 (active low) B14 A14
EHRPWM_TZn_IN1 I EHRPWM Trip Zone Input 1 (active low) AA2 V2
EHRPWM_TZn_IN2 I EHRPWM Trip Zone Input 2 (active low) AC1 W3
EHRPWM_TZn_IN3 I EHRPWM Trip Zone Input 3 (active low) C15 B13
EHRPWM_TZn_IN4 I EHRPWM Trip Zone Input 4 (active low) E15 A15
EHRPWM_TZn_IN5 I EHRPWM Trip Zone Input 5 (active low) C13 D13

Table 5-16. EPWM0 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EHRPWM0_A IO EHRPWM Output A A13, AB2, E19 C11, D15, Y2
EHRPWM0_B IO EHRPWM Output B A20, C13, Y4 D13, D16, W1
Sync Input to EHRPWM module from an
EHRPWM0_SYNCI I AC2, B17 A17, V4
external pin
Sync Output from EHRPWM module to an
EHRPWM0_SYNCO O A17, AD2 A16, W4
external pin

Table 5-17. EPWM1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EHRPWM1_A IO EHRPWM Output A A14, AA3, B18 A18, D12, W2
EHRPWM1_B IO EHRPWM Output B AA1, B13, E18 C12, D18, V1

Table 5-18. EPWM2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EHRPWM2_A IO EHRPWM Output A AB1, B17, D14 A13, A17, Y1
EHRPWM2_B IO EHRPWM Output B A17, E14, Y3 A16, E11, V3

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5.3.9 EQEP
[Link] MAIN Domain
Table 5-19. EQEP0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EQEP0_A (1) I EQEP Quadrature Input A B19 B18
EQEP0_B (1) I EQEP Quadrature Input B A19 B17
EQEP0_I (1) IO EQEP Index E18 D18
EQEP0_S (1) IO EQEP Strobe B18 A18

(1) This EQEP input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.

Table 5-20. EQEP1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EQEP1_A (1) I EQEP Quadrature Input A B20 C17
EQEP1_B (1) I EQEP Quadrature Input B D20 C16
EQEP1_I (1) IO EQEP Index A20 D16
EQEP1_S (1) IO EQEP Strobe E19 D15

(1) This EQEP input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.

Table 5-21. EQEP2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
EQEP2_A (1) I EQEP Quadrature Input A AC21, B16 E12, Y19
EQEP2_B (1) I EQEP Quadrature Input B A16, AE22 D14, W20
AD21, C15,
EQEP2_I (1) IO EQEP Index B13, P17, W17
V25
AC20, E15,
EQEP2_S (1) IO EQEP Strobe A15, J19, V16
M22

(1) This EQEP input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.

5.3.10 GPIO
[Link] MAIN Domain
Table 5-22. GPIO0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPIO0_0 IO General Purpose Input/Output H24 G19
GPIO0_1 IO General Purpose Input/Output G25 G18
GPIO0_2 IO General Purpose Input/Output J24 H20
GPIO0_3 IO General Purpose Input/Output E25 F18
GPIO0_4 IO General Purpose Input/Output G24 G17
GPIO0_5 IO General Purpose Input/Output F25 F21
GPIO0_6 IO General Purpose Input/Output F24 F20
GPIO0_7 IO General Purpose Input/Output J23 G21
GPIO0_8 IO General Purpose Input/Output J25 H21
GPIO0_9 IO General Purpose Input/Output H25 G20
GPIO0_10 IO General Purpose Input/Output J22 J21
GPIO0_11 IO General Purpose Input/Output F23 F19
GPIO0_12 IO General Purpose Input/Output G21 F17

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Table 5-22. GPIO0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPIO0_13 (1) IO General Purpose Input/Output H21 E17
GPIO0_14 (1) IO General Purpose Input/Output E24 E18
GPIO0_15 IO General Purpose Input/Output M25 K19
GPIO0_16 IO General Purpose Input/Output N23 L19
GPIO0_17 IO General Purpose Input/Output N24 L20
GPIO0_18 IO General Purpose Input/Output N25 L21
GPIO0_19 IO General Purpose Input/Output P24 M21
GPIO0_20 IO General Purpose Input/Output P22 L17
GPIO0_21 IO General Purpose Input/Output P21 L18
GPIO0_22 IO General Purpose Input/Output R23 M20
GPIO0_23 IO General Purpose Input/Output R24 N20
GPIO0_24 IO General Purpose Input/Output R25 N21
GPIO0_25 IO General Purpose Input/Output T25 M17
GPIO0_26 IO General Purpose Input/Output R21 N18
GPIO0_27 IO General Purpose Input/Output T22 N17
GPIO0_28 IO General Purpose Input/Output T24 N19
GPIO0_29 IO General Purpose Input/Output U25 P19
GPIO0_30 IO General Purpose Input/Output U24 P20
GPIO0_31 IO General Purpose Input/Output P25 M19
GPIO0_32 IO General Purpose Input/Output L23 K20
GPIO0_33 IO General Purpose Input/Output L24 K21
GPIO0_34 IO General Purpose Input/Output L25 J17
GPIO0_35 IO General Purpose Input/Output M24 K17
GPIO0_36 IO General Purpose Input/Output N20 K18
GPIO0_37 IO General Purpose Input/Output U23 P21
GPIO0_38 IO General Purpose Input/Output V25 P17
GPIO0_39 IO General Purpose Input/Output K25 J20
GPIO0_40 IO General Purpose Input/Output M22 J19
GPIO0_41 IO General Purpose Input/Output M21 J18
GPIO0_42 IO General Purpose Input/Output L21 H17
GPIO0_43 (1) IO General Purpose Input/Output K22 H18
GPIO0_44 (1) IO General Purpose Input/Output K24 H19
GPIO0_45 IO General Purpose Input/Output U22 R21
GPIO0_46 IO General Purpose Input/Output V24 P18
GPIO0_47 IO General Purpose Input/Output W25 R18
GPIO0_48 IO General Purpose Input/Output W24 R19
GPIO0_49 IO General Purpose Input/Output Y25 R20
GPIO0_50 IO General Purpose Input/Output Y24 T20
GPIO0_51 IO General Purpose Input/Output Y23 T21
GPIO0_52 IO General Purpose Input/Output AA25 T19
GPIO0_53 IO General Purpose Input/Output V21 U21
GPIO0_54 IO General Purpose Input/Output W21 R17
GPIO0_55 IO General Purpose Input/Output V20 T18
GPIO0_56 IO General Purpose Input/Output AA23 U20
GPIO0_57 IO General Purpose Input/Output AB25 U19

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Table 5-22. GPIO0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPIO0_58 IO General Purpose Input/Output AA24 V21
GPIO0_59 IO General Purpose Input/Output Y22 U18
GPIO0_60 IO General Purpose Input/Output AA21 V20
GPIO0_61 IO General Purpose Input/Output AB24 W21
GPIO0_62 IO General Purpose Input/Output Y20 T17
GPIO0_63 IO General Purpose Input/Output AC25 T16
GPIO0_64 IO General Purpose Input/Output AC24 U17
GPIO0_65 (1) IO General Purpose Input/Output D24 E20
GPIO0_66 (1) IO General Purpose Input/Output E23 E19
GPIO0_67 (1) IO General Purpose Input/Output C25 D21
GPIO0_68 (1) IO General Purpose Input/Output B24 B21
GPIO0_69 (1) IO General Purpose Input/Output D25 E21
GPIO0_70 (1) IO General Purpose Input/Output C24 C21
GPIO0_71 (1) IO General Purpose Input/Output A23 D20
GPIO0_72 (1) IO General Purpose Input/Output B23 C20
GPIO0_73 IO General Purpose Input/Output AD19 V15
GPIO0_74 IO General Purpose Input/Output AE19 W16
GPIO0_75 IO General Purpose Input/Output AE20 U14
GPIO0_76 IO General Purpose Input/Output AD20 AA19
GPIO0_77 IO General Purpose Input/Output AE18 Y17
GPIO0_78 IO General Purpose Input/Output AD18 AA18
GPIO0_79 IO General Purpose Input/Output AE17 W14
GPIO0_80 IO General Purpose Input/Output AD17 AA16
GPIO0_81 IO General Purpose Input/Output AB17 W15
GPIO0_82 IO General Purpose Input/Output AC17 Y16
GPIO0_83 IO General Purpose Input/Output AB16 AA17
GPIO0_84 IO General Purpose Input/Output AA15 Y15
GPIO0_85 IO General Purpose Input/Output AB22 U16
GPIO0_86 IO General Purpose Input/Output AD24 V17
GPIO0_87 IO General Purpose Input/Output AA19 Y21
GPIO0_88 IO General Purpose Input/Output AE21 Y18
GPIO0_89 IO General Purpose Input/Output Y18 AA20
GPIO0_90 IO General Purpose Input/Output AA18 U15
GPIO0_91 IO General Purpose Input/Output AD21 W17

(1) This GPIO input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.

Table 5-23. GPIO1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPIO1_0 IO General Purpose Input/Output AC20 V16
GPIO1_1 IO General Purpose Input/Output AD22 W19
GPIO1_2 IO General Purpose Input/Output AD23 V18
GPIO1_3 IO General Purpose Input/Output AE23 W18
GPIO1_4 IO General Purpose Input/Output AB20 Y20
GPIO1_5 IO General Purpose Input/Output AC21 Y19
GPIO1_6 IO General Purpose Input/Output AE22 W20

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Table 5-23. GPIO1 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPIO1_7 IO General Purpose Input/Output B19 B18
GPIO1_8 IO General Purpose Input/Output A19 B17
GPIO1_9 IO General Purpose Input/Output B18 A18
GPIO1_10 IO General Purpose Input/Output E18 D18
GPIO1_11 IO General Purpose Input/Output B20 C17
GPIO1_12 IO General Purpose Input/Output D20 C16
GPIO1_13 IO General Purpose Input/Output E19 D15
GPIO1_14 IO General Purpose Input/Output A20 D16
GPIO1_15 IO General Purpose Input/Output A13 C11
GPIO1_16 (1) IO General Purpose Input/Output C13 D13
GPIO1_17 IO General Purpose Input/Output A14 D12
GPIO1_18 IO General Purpose Input/Output B13 C12
GPIO1_19 IO General Purpose Input/Output B14 A14
GPIO1_20 IO General Purpose Input/Output D14 A13
GPIO1_21 IO General Purpose Input/Output E14 E11
GPIO1_22 IO General Purpose Input/Output A15 B14
GPIO1_23 IO General Purpose Input/Output B15 C13
GPIO1_24 IO General Purpose Input/Output C15 B13
GPIO1_25 IO General Purpose Input/Output E15 A15
GPIO1_26 IO General Purpose Input/Output B16 E12
GPIO1_27 IO General Purpose Input/Output A16 D14
GPIO1_28 IO General Purpose Input/Output B17 A17
GPIO1_29 IO General Purpose Input/Output A17 A16
GPIO1_30 IO General Purpose Input/Output A18 C14
GPIO1_31 (1) IOD General Purpose Input/Output D16 B16
GPIO1_32 (1) IO General Purpose Input/Output AC2 V4
GPIO1_33 (1) IO General Purpose Input/Output AD2 W4
GPIO1_34 (1) IO General Purpose Input/Output AC1 W3
GPIO1_35 (1) IO General Purpose Input/Output AB2 Y2
GPIO1_36 (1) IO General Purpose Input/Output Y4 W1
GPIO1_37 (1) IO General Purpose Input/Output AA3 W2
GPIO1_38 (1) IO General Purpose Input/Output AA1 V1
GPIO1_39 (1) IO General Purpose Input/Output AA2 V2
GPIO1_40 (1) IO General Purpose Input/Output AB1 Y1
GPIO1_41 (1) IO General Purpose Input/Output Y3 V3
GPIO1_42 (1) IO General Purpose Input/Output D22 C19
GPIO1_43 (1) IO General Purpose Input/Output C21 B20
GPIO1_44 (1) IO General Purpose Input/Output B21 B19
GPIO1_45 (1) IO General Purpose Input/Output A22 A19
GPIO1_46 (1) IO General Purpose Input/Output B22 A20
GPIO1_47 (1) IO General Purpose Input/Output A21 C18
GPIO1_48 (1) IO General Purpose Input/Output D17 C15
GPIO1_49 (2) IO General Purpose Input/Output C17 B15
GPIO1_50 IO General Purpose Input/Output C20 D17

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Table 5-23. GPIO1 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPIO1_51 IO General Purpose Input/Output F18 E16

(1) This GPIO input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.
(2) This EQEP input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.

[Link] MCU Domain

Table 5-24. MCU_GPIO0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_GPIO0_0 (1) IO General Purpose Input/Output E8 E7
MCU_GPIO0_1 (1) IO General Purpose Input/Output B8 C8
MCU_GPIO0_2 IO General Purpose Input/Output A7 B7
MCU_GPIO0_3 IO General Purpose Input/Output D9 E8
MCU_GPIO0_4 IO General Purpose Input/Output C9 D8
MCU_GPIO0_5 IO General Purpose Input/Output B5 A8
MCU_GPIO0_6 IO General Purpose Input/Output A5 B6
MCU_GPIO0_7 (1) IO General Purpose Input/Output A6 B8
MCU_GPIO0_8 (1) IO General Purpose Input/Output B6 D7
MCU_GPIO0_9 IO General Purpose Input/Output B4 B5
MCU_GPIO0_10 IO General Purpose Input/Output C5 C6
MCU_GPIO0_11 (1) IO General Purpose Input/Output C6 A7
MCU_GPIO0_12 (1) IO General Purpose Input/Output A4 B4
MCU_GPIO0_13 IO General Purpose Input/Output D6 C5
MCU_GPIO0_14 IO General Purpose Input/Output B3 C4
MCU_GPIO0_15 (1) IO General Purpose Input/Output E5 D5
MCU_GPIO0_16 (1) IO General Purpose Input/Output D4 D6
MCU_GPIO0_17 IOD General Purpose Input/Output A8 B9
MCU_GPIO0_18 IOD General Purpose Input/Output D10 A10
MCU_GPIO0_19 IOD General Purpose Input/Output B9 E9
MCU_GPIO0_20 IOD General Purpose Input/Output A9 A9
MCU_GPIO0_21 IO General Purpose Input/Output B12 A12
MCU_GPIO0_22 IO General Purpose Input/Output B7 C7
MCU_GPIO0_23 IO General Purpose Input/Output A12 B12

(1) This GPIO input signal has a debounce function. For more information on I/O Debounce configuration, see the TRM Device
Configuration chapter.

5.3.11 GPMC
[Link] MAIN Domain
Table 5-25. GPMC0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPMC Address Valid (active low) or Address
GPMC0_ADVn_ALE O L23 K20
Latch Enable
GPMC0_CLK O GPMC clock P25 M19
GPMC0_DIR O GPMC Data Bus Signal Direction Control M22 J19
GPMC0_FCLK_MUX O GPMC functional clock output P25 M19
GPMC Output Enable (active low) or Read
GPMC0_OEn_REn O L24 K21
Enable (active low)

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Table 5-25. GPMC0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPMC0_WEn O GPMC Write Enable (active low) L25 J17
GPMC0_WPn O GPMC Flash Write Protect (active low) K25 J20
GPMC Address 0 Output. Only used to
GPMC0_A0 OZ effectively address 8-bit data non-multiplexed U22 R21
memories
GPMC address 1 Output in A/D non-multiplexed
GPMC0_A1 OZ V24 P18
mode and Address 17 in A/D multiplexed mode
GPMC address 2 Output in A/D non-multiplexed
GPMC0_A2 OZ W25 R18
mode and Address 18 in A/D multiplexed mode
GPMC address 3 Output in A/D non-multiplexed
GPMC0_A3 OZ W24 R19
mode and Address 19 in A/D multiplexed mode
GPMC address 4 Output in A/D non-multiplexed
GPMC0_A4 OZ Y25 R20
mode and Address 20 in A/D multiplexed mode
GPMC address 5 Output in A/D non-multiplexed
GPMC0_A5 OZ Y24 T20
mode and Address 21 in A/D multiplexed mode
GPMC address 6 Output in A/D non-multiplexed
GPMC0_A6 OZ Y23 T21
mode and Address 22 in A/D multiplexed mode
GPMC address 7 Output in A/D non-multiplexed
GPMC0_A7 OZ AA25 T19
mode and Address 23 in A/D multiplexed mode
GPMC address 8 Output in A/D non-multiplexed
GPMC0_A8 OZ V21 U21
mode and Address 24 in A/D multiplexed mode
GPMC address 9 Output in A/D non-multiplexed
GPMC0_A9 OZ W21 R17
mode and Address 25 in A/D multiplexed mode
GPMC address 10 Output in A/D non-
GPMC0_A10 OZ multiplexed mode and Address 26 in A/D V20 T18
multiplexed mode
GPMC address 11 Output in A/D non-
GPMC0_A11 OZ multiplexed mode and unused in A/D AA23 U20
multiplexed mode
GPMC address 12 Output in A/D non-
GPMC0_A12 OZ multiplexed mode and unused in A/D AB25 U19
multiplexed mode
GPMC address 13 Output in A/D non-
GPMC0_A13 OZ multiplexed mode and unused in A/D AA24 V21
multiplexed mode
GPMC address 14 Output in A/D non-
GPMC0_A14 OZ multiplexed mode and unused in A/D Y22 U18
multiplexed mode
GPMC address 15 Output in A/D non-
GPMC0_A15 OZ multiplexed mode and unused in A/D AA21 V20
multiplexed mode
GPMC address 16 Output in A/D non-
GPMC0_A16 OZ multiplexed mode and unused in A/D AB24 W21
multiplexed mode
GPMC address 17 Output in A/D non-
GPMC0_A17 OZ multiplexed mode and unused in A/D Y20 T17
multiplexed mode
GPMC address 18 Output in A/D non-
GPMC0_A18 OZ multiplexed mode and unused in A/D AC25 T16
multiplexed mode
GPMC address 19 Output in A/D non-
GPMC0_A19 OZ multiplexed mode and unused in A/D AC24 U17
multiplexed mode

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Table 5-25. GPMC0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPMC address 20 Output in A/D non-
GPMC0_A20 OZ multiplexed mode and unused in A/D K24 H19
multiplexed mode
GPMC address 21 Output in A/D non-
GPMC0_A21 OZ multiplexed mode and unused in A/D V25 P17
multiplexed mode
GPMC address 22 Output in A/D non-
GPMC0_A22 OZ multiplexed mode and unused in A/D K25 J20
multiplexed mode
GPMC Data 0 Input/Output in A/D non-
GPMC0_AD0 IO multiplexed mode and additionally Address 1 M25 K19
Output in A/D multiplexed mode
GPMC Data 1 Input/Output in A/D non-
GPMC0_AD1 IO multiplexed mode and additionally Address 2 N23 L19
Output in A/D multiplexed mode
GPMC Data 2 Input/Output in A/D non-
GPMC0_AD2 IO multiplexed mode and additionally Address 3 N24 L20
Output in A/D multiplexed mode
GPMC Data 3 Input/Output in A/D non-
GPMC0_AD3 IO multiplexed mode and additionally Address 3 N25 L21
Output in A/D multiplexed mode
GPMC Data 4 Input/Output in A/D non-
GPMC0_AD4 IO multiplexed mode and additionally Address 3 P24 M21
Output in A/D multiplexed mode
GPMC Data 5 Input/Output in A/D non-
GPMC0_AD5 IO multiplexed mode and additionally Address 3 P22 L17
Output in A/D multiplexed mode
GPMC Data 6 Input/Output in A/D non-
GPMC0_AD6 IO multiplexed mode and additionally Address 3 P21 L18
Output in A/D multiplexed mode
GPMC Data 7 Input/Output in A/D non-
GPMC0_AD7 IO multiplexed mode and additionally Address 3 R23 M20
Output in A/D multiplexed mode
GPMC Data 8 Input/Output in A/D non-
GPMC0_AD8 IO multiplexed mode and additionally Address 3 R24 N20
Output in A/D multiplexed mode
GPMC Data 9 Input/Output in A/D non-
GPMC0_AD9 IO multiplexed mode and additionally Address 3 R25 N21
Output in A/D multiplexed mode
GPMC Data 10 Input/Output in A/D non-
GPMC0_AD10 IO multiplexed mode and additionally Address 11 T25 M17
Output in A/D multiplexed mode
GPMC Data 11 Input/Output in A/D non-
GPMC0_AD11 IO multiplexed mode and additionally Address 12 R21 N18
Output in A/D multiplexed mode
GPMC Data 12 Input/Output in A/D non-
GPMC0_AD12 IO multiplexed mode and additionally Address 13 T22 N17
Output in A/D multiplexed mode
GPMC Data 13 Input/Output in A/D non-
GPMC0_AD13 IO multiplexed mode and additionally Address 14 T24 N19
Output in A/D multiplexed mode
GPMC Data 14 Input/Output in A/D non-
GPMC0_AD14 IO multiplexed mode and additionally Address 15 U25 P19
Output in A/D multiplexed mode
GPMC Data 15 Input/Output in A/D non-
GPMC0_AD15 IO multiplexed mode and additionally Address 16 U24 P20
Output in A/D multiplexed mode

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Table 5-25. GPMC0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
GPMC Lower-Byte Enable (active low) or
GPMC0_BE0n_CLE O M24 K17
Command Latch Enable
GPMC0_BE1n O GPMC Upper-Byte Enable (active low) N20 K18
GPMC0_CSn0 O GPMC Chip Select 0 (active low) M21 J18
GPMC0_CSn1 O GPMC Chip Select 1 (active low) L21 H17
GPMC0_CSn2 O GPMC Chip Select 2 (active low) K22 H18
GPMC0_CSn3 O GPMC Chip Select 3 (active low) K24 H19
GPMC0_WAIT0 I GPMC External Indication of Wait U23 P21
GPMC0_WAIT1 I GPMC External Indication of Wait V25 P17

5.3.12 I2C
[Link] MAIN Domain
Table 5-26. I2C0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
I2C0_SCL IOD I2C Clock B16 E12
I2C0_SDA IOD I2C Data A16 D14

Table 5-27. I2C1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
I2C1_SCL IOD I2C Clock B17 A17
I2C1_SDA IOD I2C Data A17 A16

Table 5-28. I2C2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
I2C2_SCL IOD I2C Clock K22 H18
I2C2_SDA IOD I2C Data K24 H19

Table 5-29. I2C3 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
I2C3_SCL IOD I2C Clock A15, AB1 B14, Y1
I2C3_SDA IOD I2C Data B15, Y3 C13, V3

[Link] MCU Domain

Table 5-30. MCU_I2C0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_I2C0_SCL IOD I2C Clock A8 B9
MCU_I2C0_SDA IOD I2C Data D10 A10

[Link] WKUP Domain

Table 5-31. WKUP_I2C0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
WKUP_I2C0_SCL IOD I2C Clock B9 E9
WKUP_I2C0_SDA IOD I2C Data A9 A9

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5.3.13 MCAN
[Link] MAIN Domain
Table 5-32. MCAN0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCAN0_RX I MCAN Receive Data E15 A15
MCAN0_TX O MCAN Transmit Data C15 B13

[Link] MCU Domain

Table 5-33. MCU_MCAN0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_MCAN0_RX I MCAN Receive Data B3 C4
MCU_MCAN0_TX O MCAN Transmit Data D6 C5

Table 5-34. MCU_MCAN1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_MCAN1_RX I MCAN Receive Data D4 D6
MCU_MCAN1_TX O MCAN Transmit Data E5 D5

5.3.14 MCASP
[Link] MAIN Domain
Table 5-35. MCASP0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCASP0_ACLKR IO MCASP Receive Bit Clock A20 D16
MCASP0_ACLKX IO MCASP Transmit Bit Clock B20 C17
MCASP0_AFSR IO MCASP Receive Frame Sync E19 D15
MCASP0_AFSX IO MCASP Transmit Frame Sync D20 C16
MCASP0_AXR0 IO MCASP Serial Data (Input/Output) E18 D18
MCASP0_AXR1 IO MCASP Serial Data (Input/Output) B18 A18
MCASP0_AXR2 IO MCASP Serial Data (Input/Output) A19 B17
MCASP0_AXR3 IO MCASP Serial Data (Input/Output) B19 B18

Table 5-36. MCASP1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCASP1_ACLKR IO MCASP Receive Bit Clock D25, E24, K24 E18, E21, H19
MCASP1_ACLKX IO MCASP Transmit Bit Clock A23, H25, M24 D20, G20, K17
MCASP1_AFSR IO MCASP Receive Frame Sync C24, H21, K22 C21, E17, H18
MCASP1_AFSX IO MCASP Transmit Frame Sync B23, J22, U23 C20, J21, P21
MCASP1_AXR0 IO MCASP Serial Data (Input/Output) B24, J25, L25 B21, H21, J17
MCASP1_AXR1 IO MCASP Serial Data (Input/Output) C25, J23, L24 D21, G21, K21
MCASP1_AXR2 IO MCASP Serial Data (Input/Output) E23, H21, L23 E17, E19, K20
MCASP1_AXR3 IO MCASP Serial Data (Input/Output) D24, E24, P25 E18, E20, M19
MCASP1_AXR4 IO MCASP Serial Data (Input/Output) C24, K22 C21, H18
MCASP1_AXR5 IO MCASP Serial Data (Input/Output) D25, K24 E21, H19

Table 5-37. MCASP2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCASP2_ACLKR IO MCASP Receive Bit Clock AA18, U24 P20, U15

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Table 5-37. MCASP2 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
AC20, B15,
MCASP2_ACLKX IO MCASP Transmit Bit Clock C13, N19, V16
T24
MCASP2_AFSR IO MCASP Receive Frame Sync AB20, U25 P19, Y20
A15, AD21,
MCASP2_AFSX IO MCASP Transmit Frame Sync B14, N17, W17
T22
AC21, C15,
MCASP2_AXR0 IO MCASP Serial Data (Input/Output) B13, N20, Y19
R24
AD23, E15,
MCASP2_AXR1 IO MCASP Serial Data (Input/Output) A15, N21, V18
R25
MCASP2_AXR2 IO MCASP Serial Data (Input/Output) AE23, T25 M17, W18
MCASP2_AXR3 IO MCASP Serial Data (Input/Output) AD22, R21 N18, W19
MCASP2_AXR4 IO MCASP Serial Data (Input/Output) AA19, M25 K19, Y21
MCASP2_AXR5 IO MCASP Serial Data (Input/Output) AE21, N23 L19, Y18
MCASP2_AXR6 IO MCASP Serial Data (Input/Output) N24, Y18 AA20, L20
MCASP2_AXR7 IO MCASP Serial Data (Input/Output) AB20, N25 L21, Y20
MCASP2_AXR8 IO MCASP Serial Data (Input/Output) AA18, P24 M21, U15
MCASP2_AXR9 IO MCASP Serial Data (Input/Output) P22 L17
MCASP2_AXR10 IO MCASP Serial Data (Input/Output) P21 L18
MCASP2_AXR11 IO MCASP Serial Data (Input/Output) R23 M20
MCASP2_AXR12 IO MCASP Serial Data (Input/Output) N20 K18
MCASP2_AXR13 IO MCASP Serial Data (Input/Output) M22 J19
MCASP2_AXR14 IO MCASP Serial Data (Input/Output) M21 J18
MCASP2_AXR15 IO MCASP Serial Data (Input/Output) L21 H17

5.3.15 MCSPI
[Link] MAIN Domain
Table 5-38. MCSPI0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
SPI0_CLK IO SPI Clock A14 D12
SPI0_CS0 IO SPI Chip Select 0 A13 C11
SPI0_CS1 IO SPI Chip Select 1 C13 D13
SPI0_CS2 IO SPI Chip Select 2 A15 B14
SPI0_CS3 IO SPI Chip Select 3 B15 C13
SPI0_D0 IO SPI Data 0 B13 C12
SPI0_D1 IO SPI Data 1 B14 A14

Table 5-39. MCSPI1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
SPI1_CLK IO SPI Clock AA3, J25 H21, W2
SPI1_CS0 IO SPI Chip Select 0 J23, Y4 G21, W1
SPI1_CS1 IO SPI Chip Select 1 AB1, H21 E17, Y1
SPI1_CS2 IO SPI Chip Select 2 Y3 V3
SPI1_CS3 IO SPI Chip Select 3 AA1 V1
SPI1_D0 IO SPI Data 0 AC2, H25 G20, V4
SPI1_D1 IO SPI Data 1 AD2, J22 J21, W4

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Table 5-40. MCSPI2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
SPI2_CLK IO SPI Clock A17, A20, AA2 A16, D16, V2
SPI2_CS0 IO SPI Chip Select 0 AA1, B16, E19 D15, E12, V1
SPI2_CS1 IO SPI Chip Select 1 AC2, B17, B20 A17, C17, V4
SPI2_CS2 IO SPI Chip Select 2 A16, B18, Y4 A18, D14, W1
SPI2_CS3 IO SPI Chip Select 3 A18, AD2, D20 C14, C16, W4
SPI2_D0 IO SPI Data 0 AC1, B19, D14 A13, B18, W3
SPI2_D1 IO SPI Data 1 A19, AB2, E14 B17, E11, Y2

[Link] MCU Domain

Table 5-41. MCU_MCSPI0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_SPI0_CLK IO SPI Clock A7 B7
MCU_SPI0_CS0 IO SPI Chip Select 0 E8 E7
MCU_SPI0_CS1 IO SPI Chip Select 1 B8 C8
MCU_SPI0_CS2 IO SPI Chip Select 2 B4, D4 B5, D6
MCU_SPI0_CS3 IO SPI Chip Select 3 D6 C5
MCU_SPI0_D0 IO SPI Data 0 D9 E8
MCU_SPI0_D1 IO SPI Data 1 C9 D8

Table 5-42. MCU_MCSPI1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_SPI1_CLK IO SPI Clock A4, D4 B4, D6
MCU_SPI1_CS0 IO SPI Chip Select 0 C6 A7
MCU_SPI1_CS1 IO SPI Chip Select 2 E5 D5
MCU_SPI1_CS2 IO SPI Chip Select 2 C5, D4 C6, D6
MCU_SPI1_CS3 IO SPI Chip Select 3 B3 C4
MCU_SPI1_D0 IO SPI Data 0 A6 B8
MCU_SPI1_D1 IO SPI Data 1 B6 D7

5.3.16 MDIO
[Link] MAIN Domain
Table 5-43. MDIO0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MDIO0_MDC O MDIO Clock AD24 V17
MDIO0_MDIO IO MDIO Data AB22 U16

5.3.17 MMC
[Link] MAIN Domain
Table 5-44. MMC0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MMC0_CLK IO MMC/SD/SDIO Clock AB1 Y1
MMC0_CMD IO MMC/SD/SDIO Command Y3 V3
MMC0_DAT0 IO MMC/SD/SDIO Data AA2 V2
MMC0_DAT1 IO MMC/SD/SDIO Data AA1 V1
MMC0_DAT2 IO MMC/SD/SDIO Data AA3 W2

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Table 5-44. MMC0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MMC0_DAT3 IO MMC/SD/SDIO Data Y4 W1
MMC0_DAT4 IO MMC/SD/SDIO Data AB2 Y2
MMC0_DAT5 IO MMC/SD/SDIO Data AC1 W3
MMC0_DAT6 IO MMC/SD/SDIO Data AD2 W4
MMC0_DAT7 IO MMC/SD/SDIO Data AC2 V4

Table 5-45. MMC1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MMC1_CLK IO MMC/SD/SDIO Clock B22 A20
MMC1_CMD IO MMC/SD/SDIO Command A21 C18
MMC1_SDCD I SD Card Detect D17 C15
MMC1_SDWP I SD Write Protect C17 B15
MMC1_DAT0 IO MMC/SD/SDIO Data A22 A19
MMC1_DAT1 IO MMC/SD/SDIO Data B21 B19
MMC1_DAT2 IO MMC/SD/SDIO Data C21 B20
MMC1_DAT3 IO MMC/SD/SDIO Data D22 C19

Table 5-46. MMC2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MMC2_CLK (1) IO MMC/SD/SDIO Clock D25 E21
MMC2_CMD IO MMC/SD/SDIO Command C24 C21
MMC2_SDCD (2) I SD Card Detect A15, A23, B17 A17, B14, D20
MMC2_SDWP (2) I SD Write Protect A17, B15, B23 A16, C13, C20
MMC2_DAT0 IO MMC/SD/SDIO Data B24 B21
MMC2_DAT1 IO MMC/SD/SDIO Data C25 D21
MMC2_DAT2 IO MMC/SD/SDIO Data E23 E19
MMC2_DAT3 IO MMC/SD/SDIO Data D24 E20

(1) For MMC2 to work properly, the CTRLMMR_PADCONFIG71 register must be configured to set (1) the RXACTIVE bit and reset (0) the
TX_DIS bit.
(2) These MMCSD2 host controller input signals must be multiplexed to pins which are powered by the VDDSHV0 IO power rail rather
than the VDDSHV6 IO power rail when the MMC2 port is connected to a UHS-I SD Card that requires the VDDSHV6 IO power rail to
change its operating voltage from 3.3V to 1.8V when transitioning to one of the UHS-I data transfer modes.

5.3.18 OLDI
[Link] MAIN Domain
Table 5-47. OLDI0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
OLDI0_A0N IO OLDI Differential Data (negative) AA5 AA2
OLDI0_A0P IO OLDI Differential Data (positive) Y6 AA3
OLDI0_A1N IO OLDI Differential Data (negative) AD3 V5
OLDI0_A1P IO OLDI Differential Data (positive) AB4 V6
OLDI0_A2N IO OLDI Differential Data (negative) Y8 U7
OLDI0_A2P IO OLDI Differential Data (positive) AA8 U6
OLDI0_A3N IO OLDI Differential Data (negative) AB6 W6
OLDI0_A3P IO OLDI Differential Data (positive) AA7 W5
OLDI0_A4N IO OLDI Differential Data (negative) AC6 AA4

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Table 5-47. OLDI0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
OLDI0_A4P IO OLDI Differential Data (positive) AC5 Y5
OLDI0_A5N IO OLDI Differential Data (negative) AE5 AA6
OLDI0_A5P IO OLDI Differential Data (positive) AD6 AA5
OLDI0_A6N IO OLDI Differential Data (negative) AE6 AA10
OLDI0_A6P IO OLDI Differential Data (positive) AD7 Y9
OLDI0_A7N IO OLDI Differential Data (negative) AD8 AA8
OLDI0_A7P IO OLDI Differential Data (positive) AE7 Y8
OLDI0_CLK0N IO OLDI Differential Clock (negative) AD4 V7
OLDI0_CLK0P IO OLDI Differential Clock (positive) AE3 V8
OLDI0_CLK1N IO OLDI Differential Clock (negative) AE4 Y7
OLDI0_CLK1P IO OLDI Differential Clock (positive) AD5 AA7

5.3.19 OSPI
[Link] MAIN Domain
Table 5-48. OSPI0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
OSPI0_CLK O OSPI Clock H24 G19
OSPI Data Strobe (DQS) or Loopback Clock
OSPI0_DQS I J24 H20
Input
OSPI0_ECC_FAIL I OSPI ECC Status E24 E18
OSPI0_LBCLKO IO OSPI Loopback Clock Output G25 G18
OSPI0_CSn0 O OSPI Chip Select 0 (active low) F23 F19
OSPI0_CSn1 O OSPI Chip Select 1 (active low) G21 F17
OSPI0_CSn2 O OSPI Chip Select 2 (active low) H21 E17
OSPI0_CSn3 O OSPI Chip Select 3 (active low) E24 E18
OSPI0_D0 IO OSPI Data 0 E25 F18
OSPI0_D1 IO OSPI Data 1 G24 G17
OSPI0_D2 IO OSPI Data 2 F25 F21
OSPI0_D3 IO OSPI Data 3 F24 F20
OSPI0_D4 IO OSPI Data 4 J23 G21
OSPI0_D5 IO OSPI Data 5 J25 H21
OSPI0_D6 IO OSPI Data 6 H25 G20
OSPI0_D7 IO OSPI Data 7 J22 J21
OSPI0_RESET_OUT0 O OSPI Reset E24 E18
OSPI0_RESET_OUT1 O OSPI Reset H21 E17

5.3.20 Power Supply

Table 5-49. Power Supply Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
CAP_VDDS0 (1) CAP External capacitor connection for IO group 0 H15 G12
CAP_VDDS1 (1) CAP External capacitor connection for IO group 1 K18 L15
CAP_VDDS2 (1) CAP External capacitor connection for IO group 2 W17 R13
CAP_VDDS3 (1) CAP External capacitor connection for IO group 3 P19 M15
CAP_VDDS4 (1) CAP External capacitor connection for IO group 4 U7 N8
CAP_VDDS5 (1) CAP External capacitor connection for IO group 5 H17 G15

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Table 5-49. Power Supply Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
CAP_VDDS6 (1) CAP External capacitor connection for IO group 6 J19 J15
CAP_VDDS_CANUART (1) CAP External capacitor connection for IO CANUART G9 G8
CAP_VDDS_MCU (1) CAP External capacitor connection for IO MCU H11 G11
VDDA_1P8_USB PWR USB0 and USB1 1.8V analog supply Y11 R11
VDDA_1P8_CSIRX0 PWR CSIRX0 1.8V analog supply W14 R12
VDDA_1P8_OLDI0 PWR OLDI0 1.8V analog supply W10, W9 P9, R9
VDDA_3P3_USB PWR USB0 and USB1 3.3V analog supply Y13 R10
VDDA_CORE_CSIRX0 PWR CSIRX0 Core supply W13 P12
VDDA_CORE_USB PWR USB0 and USB1 core supply W12 P11
VDDA_DDR_PLL0 PWR DDR Deskew PLL analog supply L9
RCOSC, POR, POK, and MCU_ PLL0 analog
VDDA_MCU PWR L11 H10
supply
MAIN_PLL0, MAIN_PLL12, MAIN_PLL16, and
VDDA_PLL0 PWR U11 N10
MAIN_PLL17 analog supply
VDDA_PLL1 PWR MAIN_PLL1 and MAIN_PLL2 analog supply U15 P14
VDDA_PLL2 PWR MAIN_PLL8 and MAIN_PLL15 analog supply L14 K12
VDDA_TEMP0 PWR TEMP0 analog supply T9 M7
VDDA_TEMP1 PWR TEMP1 analog supply G16 F16
J12, K16, N12,
VDDR_CORE PWR RAM supply N14, P16, H11, M10, M13
R12, T10, U14
VDDSHV0 PWR IO supply for IO group 0 F15, G14 F12, G13
VDDSHV1 PWR IO supply for IO group 1 L18, M19 K15, K16
VDDSHV2 PWR IO supply for IO group 2 W16, W19 R14, R15
N18, P18, T19,
VDDSHV3 PWR IO supply for IO group 3 N15, N16
U18
VDDSHV4 PWR IO supply for IO group 4 T7 N7, P7
VDDSHV5 PWR IO supply for IO group 5 G17 F14, G14
VDDSHV6 PWR IO supply for IO group 6 J18 H15, H16
VDDSHV_CANUART PWR IO supply for IO CANUART H9 G7, H7
VDDSHV_MCU PWR IO supply for IO MCU F11, G12 F10, G10
C1, J8, K7, K9,
VDDS_DDR PWR DDR PHY IO supply K9, L8, P9, R8
L8, U1
VDDS_DDR_C PWR DDR clock IO supply M9 L7
VDDS_OSC0 PWR MCU_OSC0 supply G7 J7
VDD_CANUART PWR CANUART Core Supply F8 H8
H8, J11, J14,
H12, H14, J11,
K17, L12, L15,
J13, J9, K10,
M16, N11,
K14, L11, L13,
VDD_CORE PWR Core supply N13, N8, P17,
M12, M14, M8,
R11, R14,
N11, N13, N9,
U12, V15, V17,
P8
V8
VPP PWR eFuse ROM programming supply J8 F7

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Table 5-49. Power Supply Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
A1, A21, A4,
AA1, AA12,
A1, A24, A25, AA15, AA21,
AA11, AB9, AA9, D11,
AD1, AD12, D19, D4, E2,
AD16, AD25, F11, F13, F15,
AD9, AE1, F4, F9, G16,
AE12, AE16, G6, G9, H1,
AE24, AE25, H13, H6, J10,
AE8, B25, F13, J12, J14, J16,
G13, G19, J6, K13, K3,
H13, H16, K6, K8, L1,
H18, H20, J13, L10, L12, L14,
J7, K13, K15, L16, L6, M11,
VSS PWR Ground
K19, K7, L20, M16, M18, M6,
M10, M12, M9, N12, N14,
M13, M17, N6, P1, P10,
M18, M7, M8, P13, P15, P16,
N15, P10, P13, P3, P6, R16,
P7, R13, R15, R5, R7, R8,
R18, R20, T13, T10, T12, T15,
T14, T16, T17, T3, T6, T7, T9,
T18, T8, U19, U10, U13, U5,
U8, V10, V11, U8, V11, V14,
V13, V16, V18, V19, W10,
V9, W7, Y2 W13, W7, Y11,
Y14, Y3, Y4,
Y6

(1) This pin must always be connected via a 6.3V or greater, 0.8uF to 1.5μF capacitor to VSS if the respective VDDSHVx pin is ever
operated at 3.3V. The capacitor selected must provide a capacitance within the defined range after it has been derated for DC-bias,
operating temperature, and aging effects. There are three connection options if the respective VDDSHVx pin is only operated at 1.8V.
The pin can be connected to the same decoupling capacitor that is required for 3.3V operation, it can be left unconnected, or it can be
connected to the same 1.8V power source as the respective VDDSHVx pin.

5.3.21 PRUSS

Note
The PRUSS contains a second layer of peripheral signal multiplexing to enable additional functionality
on the PRU GPO and GPI signals. This internal wrapper multiplexing is described in the PRUSS
chapter in the device TRM

[Link] MAIN Domain

Table 5-50. PRUSS0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
PRUSS Enhanced Capture (ECAP) Input or AC24, AD21, C13, D18, J19,
PR0_ECAP0_IN_APWM_OUT IO
Auxiliary PWM (APWM) Output B15, E18, M22 U17, W17
PR0_ECAP0_SYNC_IN I PRUSS ECAP Sync Input A13, AD23 C11, V18
PR0_ECAP0_SYNC_OUT O PRUSS ECAP Sync Output A15, AC20 B14, V16
PRUSS Industrial Ethernet Digital I/O Data
PR0_IEP0_EDIO_DATA_IN_OUT28 IO B19 B18
Input/Output
PRUSS Industrial Ethernet Digital I/O Data
PR0_IEP0_EDIO_DATA_IN_OUT29 IO A19 B17
Input/Output
PRUSS Industrial Ethernet Digital I/O Data
PR0_IEP0_EDIO_DATA_IN_OUT30 IO B16 E12
Input/Output
PRUSS Industrial Ethernet Digital I/O Data
PR0_IEP0_EDIO_DATA_IN_OUT31 IO A16 D14
Input/Output

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Table 5-50. PRUSS0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
AD22, M25, K19, N17, T18,
PR0_PRU0_GPI0 I PRUSS PRU Data Input
T22, V20, Y4 W1, W19
AA23, AA3,
L19, N19, U20,
PR0_PRU0_GPI1 I PRUSS PRU Data Input AD23, N23,
V18, W2
T24
AA1, AB25,
L20, P19, U19,
PR0_PRU0_GPI2 I PRUSS PRU Data Input AE23, N24,
V1, W18
U25
AA2, AA24,
L21, P20, V2,
PR0_PRU0_GPI3 I PRUSS PRU Data Input AB20, N25,
V21, Y20
U24
AC21, P24, M21, U18, V3,
PR0_PRU0_GPI4 I PRUSS PRU Data Input
Y22, Y3 Y19
PR0_PRU0_GPI5 I PRUSS PRU Data Input AA21, P22 L17, V20
PR0_PRU0_GPI6 I PRUSS PRU Data Input AB24, P21 L18, W21
PR0_PRU0_GPI7 I PRUSS PRU Data Input R23, Y20 M20, T17
PR0_PRU0_GPI8 I PRUSS PRU Data Input P25, U22 M19, R21
PR0_PRU0_GPI9 I PRUSS PRU Data Input L23, V24 K20, P18
PR0_PRU0_GPI10 I PRUSS PRU Data Input L24, W25 K21, R18
PR0_PRU0_GPI11 I PRUSS PRU Data Input L25, W24 J17, R19
PR0_PRU0_GPI12 I PRUSS PRU Data Input M24, Y25 K17, R20
PR0_PRU0_GPI13 I PRUSS PRU Data Input N20, Y24 K18, T20
PR0_PRU0_GPI14 I PRUSS PRU Data Input U23, Y23 P21, T21
PR0_PRU0_GPI15 I PRUSS PRU Data Input AA25, K25 J20, T19
AE22, M22,
PR0_PRU0_GPI16 I PRUSS PRU Data Input J19, R17, W20
W21
PR0_PRU0_GPI17 I PRUSS PRU Data Input M21, V21 J18, U21
PR0_PRU0_GPI18 I PRUSS PRU Data Input AC25, L21 H17, T16
PR0_PRU0_GPI19 I PRUSS PRU Data Input AC24, K22 H18, U17
AD22, M25, K19, N17, T18,
PR0_PRU0_GPO0 IO PRUSS PRU Data Output
T22, V20, Y4 W1, W19
AA23, AA3,
L19, N19, U20,
PR0_PRU0_GPO1 IO PRUSS PRU Data Output AD23, N23,
V18, W2
T24
AA1, AB25,
L20, P19, U19,
PR0_PRU0_GPO2 IO PRUSS PRU Data Output AE23, N24,
V1, W18
U25
AA2, AA24,
L21, P20, V2,
PR0_PRU0_GPO3 IO PRUSS PRU Data Output AB20, N25,
V21, Y20
U24
AC21, P24, M21, U18, V3,
PR0_PRU0_GPO4 IO PRUSS PRU Data Output
Y22, Y3 Y19
PR0_PRU0_GPO5 IO PRUSS PRU Data Output AA21, P22 L17, V20
PR0_PRU0_GPO6 IO PRUSS PRU Data Output AB24, P21 L18, W21
PR0_PRU0_GPO7 IO PRUSS PRU Data Output R23, Y20 M20, T17
PR0_PRU0_GPO8 IO PRUSS PRU Data Output P25, U22 M19, R21
PR0_PRU0_GPO9 IO PRUSS PRU Data Output L23, V24 K20, P18
PR0_PRU0_GPO10 IO PRUSS PRU Data Output L24, W25 K21, R18
PR0_PRU0_GPO11 IO PRUSS PRU Data Output L25, W24 J17, R19
PR0_PRU0_GPO12 IO PRUSS PRU Data Output M24, Y25 K17, R20

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Table 5-50. PRUSS0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
PR0_PRU0_GPO13 IO PRUSS PRU Data Output N20, Y24 K18, T20
PR0_PRU0_GPO14 IO PRUSS PRU Data Output U23, Y23 P21, T21
PR0_PRU0_GPO15 IO PRUSS PRU Data Output AA25, K25 J20, T19
AE22, M22,
PR0_PRU0_GPO16 IO PRUSS PRU Data Output J19, R17, W20
W21
PR0_PRU0_GPO17 IO PRUSS PRU Data Output M21, V21 J18, U21
PR0_PRU0_GPO18 IO PRUSS PRU Data Output AC25, L21 H17, T16
PR0_PRU0_GPO19 IO PRUSS PRU Data Output AC24, K22 H18, U17
PR0_UART0_CTSn I PRUSS UART Clear to Send (active low) AC20, AD17 AA16, V16
PR0_UART0_RTSn O PRUSS UART Request to Send (active low) AB16, AE23 AA17, W18
AC21, AE18, A18, B13, B18,
PR0_UART0_RXD I PRUSS UART Receive Data
B18, B19, C15 Y17, Y19
A19, AD18,
A15, AA18,
PR0_UART0_TXD O PRUSS UART Transmit Data AE22, E15,
B17, D18, W20
E18

Table 5-51. PRUSS1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
AA19, AC2, N20, R21, V4,
PR0_PRU1_GPI0 I PRUSS PRU Data Input
R24, U22 Y21
AD2, AE21, N21, P18, W4,
PR0_PRU1_GPI1 I PRUSS PRU Data Input
R25, V24 Y18
AC1, T25, AA20, M17,
PR0_PRU1_GPI2 I PRUSS PRU Data Input
W25, Y18 R18, W3
AA18, AB2, N18, R19,
PR0_PRU1_GPI3 I PRUSS PRU Data Input
R21, W24 U15, Y2
AB1, AD21,
PR0_PRU1_GPI4 I PRUSS PRU Data Input R20, W17, Y1
Y25
PR0_PRU1_GPI5 I PRUSS PRU Data Input Y24 T20
PR0_PRU1_GPI6 I PRUSS PRU Data Input Y23 T21
PR0_PRU1_GPI7 I PRUSS PRU Data Input AA25 T19
PR0_PRU1_GPI8 I PRUSS PRU Data Input M25, W21 K19, R17
PR0_PRU1_GPI9 I PRUSS PRU Data Input N23, V20 L19, T18
PR0_PRU1_GPI10 I PRUSS PRU Data Input AA23, N24 L20, U20
PR0_PRU1_GPI11 I PRUSS PRU Data Input AB25, N25 L21, U19
PR0_PRU1_GPI12 I PRUSS PRU Data Input AA24, P24 M21, V21
PR0_PRU1_GPI13 I PRUSS PRU Data Input P22, Y22 L17, U18
PR0_PRU1_GPI14 I PRUSS PRU Data Input AA21, P21 L18, V20
PR0_PRU1_GPI15 I PRUSS PRU Data Input AB24, R23 M20, W21
AC20, L21,
PR0_PRU1_GPI16 I PRUSS PRU Data Input H17, U21, V16
V21
PR0_PRU1_GPI17 I PRUSS PRU Data Input Y20 T17
PR0_PRU1_GPI18 I PRUSS PRU Data Input AC25 T16
PR0_PRU1_GPI19 I PRUSS PRU Data Input AC24 U17
AA19, AC2, N20, R21, V4,
PR0_PRU1_GPO0 O PRUSS PRU Data Output
R24, U22 Y21
AD2, AE21, N21, P18, W4,
PR0_PRU1_GPO1 O PRUSS PRU Data Output
R25, V24 Y18

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Table 5-51. PRUSS1 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
AC1, T25, AA20, M17,
PR0_PRU1_GPO2 O PRUSS PRU Data Output
W25, Y18 R18, W3
AA18, AB2, N18, R19,
PR0_PRU1_GPO3 O PRUSS PRU Data Output
R21, W24 U15, Y2
AB1, AD21,
PR0_PRU1_GPO4 O PRUSS PRU Data Output R20, W17, Y1
Y25
PR0_PRU1_GPO5 O PRUSS PRU Data Output Y24 T20
PR0_PRU1_GPO6 O PRUSS PRU Data Output Y23 T21
PR0_PRU1_GPO7 O PRUSS PRU Data Output AA25 T19
PR0_PRU1_GPO8 O PRUSS PRU Data Output M25, W21 K19, R17
PR0_PRU1_GPO9 O PRUSS PRU Data Output N23, V20 L19, T18
PR0_PRU1_GPO10 O PRUSS PRU Data Output AA23, N24 L20, U20
PR0_PRU1_GPO11 O PRUSS PRU Data Output AB25, N25 L21, U19
PR0_PRU1_GPO12 O PRUSS PRU Data Output AA24, P24 M21, V21
PR0_PRU1_GPO13 O PRUSS PRU Data Output P22, Y22 L17, U18
PR0_PRU1_GPO14 O PRUSS PRU Data Output AA21, P21 L18, V20
PR0_PRU1_GPO15 O PRUSS PRU Data Output AB24, R23 M20, W21
AC20, L21,
PR0_PRU1_GPO16 O PRUSS PRU Data Output H17, U21, V16
V21
PR0_PRU1_GPO17 O PRUSS PRU Data Output Y20 T17
PR0_PRU1_GPO18 O PRUSS PRU Data Output AC25 T16
PR0_PRU1_GPO19 O PRUSS PRU Data Output AC24 U17

5.3.22 Reserved
Table 5-52. Reserved Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
RSVD0 N/A Reserved, must be left unconnected B1 B3
RSVD1 N/A Reserved, must be left unconnected A2 C3
RSVD2 N/A Reserved, must be left unconnected F6 E6
RSVD3 N/A Reserved, must be left unconnected AE2 F8
RSVD4 N/A Reserved, must be left unconnected T2 R6
RSVD5 N/A Reserved, must be left unconnected U4 T13
RSVD6 N/A Reserved, must be left unconnected AA12 T14
RSVD7 N/A Reserved, must be left unconnected Y15 M4
RSVD8 N/A Reserved, must be left unconnected E7 M5

5.3.23 System and Miscellaneous

[Link] Boot Mode Configuration
[Link].1 MAIN Domain
Table 5-53. Sysboot Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
BOOTMODE00 I Bootmode pin 0 M25 K19
BOOTMODE01 I Bootmode pin 1 N23 L19
BOOTMODE02 I Bootmode pin 2 N24 L20
BOOTMODE03 I Bootmode pin 3 N25 L21
BOOTMODE04 I Bootmode pin 4 P24 M21

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Table 5-53. Sysboot Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
BOOTMODE05 I Bootmode pin 5 P22 L17
BOOTMODE06 I Bootmode pin 6 P21 L18
BOOTMODE07 I Bootmode pin 7 R23 M20
BOOTMODE08 I Bootmode pin 8 R24 N20
BOOTMODE09 I Bootmode pin 9 R25 N21
BOOTMODE10 I Bootmode pin 10 T25 M17
BOOTMODE11 I Bootmode pin 11 R21 N18
BOOTMODE12 I Bootmode pin 12 T22 N17
BOOTMODE13 I Bootmode pin 13 T24 N19
BOOTMODE14 I Bootmode pin 14 U25 P19
BOOTMODE15 I Bootmode pin 15 U24 P20

[Link] Clock
[Link].1 MCU Domain
Table 5-54. MCU Clock Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_OSC0_XI I High frequency oscillator input B2 A5
MCU_OSC0_XO O High frequency oscillator output A3 A6

[Link].2 WKUP Domain

Table 5-55. WKUP Clock Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
WKUP_LFOSC0_XI I Low frequency (32.768KHz) oscillator input C2 A2
WKUP_LFOSC0_XO O Low frequency (32.768KHz) oscillator output C1 A3

[Link] System
[Link].1 MAIN Domain
Table 5-56. System Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
External clock input to McASP or output from A15, AE22,
AUDIO_EXT_REFCLK0 IO B14, D18, W20
McASP E18
External clock input to McASP or output from
AUDIO_EXT_REFCLK1 IO B15, D20, K25 C13, C16, J20
McASP
RMII Clock Output (50MHz). This pin is
used for clock source to the external RMII
CLKOUT0 O PHY and must also be routed back to the A18 C14
respective RMII[x]_REF_CLK pin for proper
device operation.
EXTINTn I External Interrupt D16 B16
EXT_REFCLK1 I External clock input to Main Domain A18 C14
Main Domain Observation clock output for test
OBSCLK0 O B16, T25 E12, M17
and debug purposes only
PORz_OUT O Main Domain POR status output E21 E13
RESETSTATz O Main Domain warm reset status output F22 E14
RESET_REQz I Main Domain external warm reset request input F20 E15
Main Domain system clock output (divided by 4)
SYSCLKOUT0 O A18 C14
for test and debug purposes only

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[Link].2 MCU Domain

Table 5-57. MCU System Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_ERRORn IO Error signal output from MCU Domain ESM D1 B1
MCU_EXT_REFCLK0 I External input to MCU Domain B8, E5 C8, D5
MCU Domain Observation clock output for test
MCU_OBSCLK0 O B8 C8
and debug purposes only
MCU_PORz I MCU and Main Domain cold reset D2 B2
MCU_RESETSTATz O MCU Domain warm reset status output B12 A12
MCU_RESETz I MCU Domain warm reset E11 C9
MCU Domain system clock output (divided by 4)
MCU_SYSCLKOUT0 O B8 C8
for test and debug purposes only

[Link].3 WKUP Domain

Table 5-58. WKUP System Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Dual-function PMIC control output, Low Power
PMIC_LPM_EN0 O B7 C7
Mode (active low) or PMIC Enable (active high)
WKUP_CLKOUT0 O WKUP Domain CLKOUT0 output A12 B12

[Link] VMON
Table 5-59. VMON Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Voltage monitor input for 1.8V SoC power
VMON_1P8_SOC A G10 H9
supply
Voltage monitor input for 3.3V SoC power
VMON_3P3_SOC A K10 K11
supply
Voltage monitor input, fixed 0.45V (+/-3%)
threshold. Use with external precisionVoltage
VMON_VSYS A H10 F6
divider to monitor a higherVoltage rail such as
the PMIC input supply.

5.3.24 TIMER
[Link] MAIN Domain
Table 5-60. TIMER Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Timer Inputs and Outputs (not tied to single
TIMER_IO0 IO AA3, B17, D22 A17, C19, W2
timer instance)
Timer Inputs and Outputs (not tied to single
TIMER_IO1 IO A17, C21 A16, B20
timer instance)
Timer Inputs and Outputs (not tied to single
TIMER_IO2 IO B21, C15 B13, B19
timer instance)
Timer Inputs and Outputs (not tied to single
TIMER_IO3 IO A22, E15 A15, A19
timer instance)
Timer Inputs and Outputs (not tied to single
TIMER_IO4 IO A18, AB1, B22 A20, C14, Y1
timer instance)
Timer Inputs and Outputs (not tied to single
TIMER_IO5 IO A16, A21, Y3 C18, D14, V3
timer instance)
Timer Inputs and Outputs (not tied to single
TIMER_IO6 IO A15, D17 B14, C15
timer instance)

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Table 5-60. TIMER Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Timer Inputs and Outputs (not tied to single
TIMER_IO7 IO B15, C17 B15, C13
timer instance)

[Link] MCU Domain

Table 5-61. MCU_TIMER Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Timer Inputs and Outputs (not tied to single
MCU_TIMER_IO0 IO A6, B3 B8, C4
timer instance)
Timer Inputs and Outputs (not tied to single
MCU_TIMER_IO1 IO B6, B8 C8, D7
timer instance)
Timer Inputs and Outputs (not tied to single
MCU_TIMER_IO2 IO E5 D5
timer instance)
Timer Inputs and Outputs (not tied to single
MCU_TIMER_IO3 IO D4 D6
timer instance)

[Link] WKUP Domain

Table 5-62. WKUP_TIMER Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
Timer Inputs and Outputs (not tied to single
WKUP_TIMER_IO0 IO C6, D6 A7, C5
timer instance)
Timer Inputs and Outputs (not tied to single
WKUP_TIMER_IO1 IO A4, E8 B4, E7
timer instance)

5.3.25 UART
[Link] MAIN Domain
Table 5-63. UART0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
UART0_CTSn I UART Clear to Send (active low) A15 B14
UART0_RTSn O UART Request to Send (active low) B15 C13
UART0_RXD I UART Receive Data D14 A13
UART0_TXD O UART Transmit Data E14 E11

Table 5-64. UART1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
UART1_CTSn I UART Clear to Send (active low) B19 B18
UART1_DCDn I UART Data Carrier Detect (active low) B16 E12
UART1_DSRn I UART Data Set Ready (active low) A16 D14
UART1_DTRn O UART Data Terminal Ready (active low) C15 B13
UART1_RIn I UART Ring Indicator E15 A15
UART1_RTSn O UART Request to Send (active low) A19 B17
UART1_RXD I UART Receive Data B17, E19 A17, D15
UART1_TXD O UART Transmit Data A17, A20 A16, D16

Table 5-65. UART2 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
A22, AB2, A19, P19, U17,
UART2_CTSn I UART Clear to Send (active low)
AC24, U25 Y2

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Table 5-65. UART2 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
AC1, AC25, B19, P20, T16,
UART2_RTSn O UART Request to Send (active low)
B21, U24 W3
A15, AC2, B14, C19,
UART2_RXD I UART Receive Data
D22, R24, U22 N20, R21, V4
AD2, B15, B20, C13,
UART2_TXD O UART Transmit Data
C21, R25, V24 N21, P18, W4

Table 5-66. UART3 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
UART3_CTSn I UART Clear to Send (active low) AA2, C17, Y20 B15, T17, V2
AA1, AB24,
UART3_RTSn O UART Request to Send (active low) C15, V1, W21
D17
B22, T25, A20, M17,
UART3_RXD I UART Receive Data
W25, Y4 R18, W1
A21, AA3, C18, N18,
UART3_TXD O UART Transmit Data
R21, W24 R19, W2

Table 5-67. UART4 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
UART4_CTSn I UART Clear to Send (active low) AA21 V20
UART4_RTSn O UART Request to Send (active low) Y22 U18
A23, K22, T22, D20, H18,
UART4_RXD I UART Receive Data
Y25 N17, R20
B23, K24, T24, C20, H19,
UART4_TXD O UART Transmit Data
Y24 N19, T20

Table 5-68. UART5 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
UART5_CTSn I UART Clear to Send (active low) AA24, J24 H20, V21
UART5_RTSn O UART Request to Send (active low) AB25, G25 G18, U19
C15, D24, B13, E17, E20,
UART5_RXD I UART Receive Data
H21, U25, Y23 P19, T21
AA25, E15, A15, E18, E19,
UART5_TXD O UART Transmit Data
E23, E24, U24 P20, T19

Table 5-69. UART6 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
UART6_CTSn I UART Clear to Send (active low) AA23, J22 J21, U20
UART6_RTSn O UART Request to Send (active low) H25, V20 G20, T18
B19, D17,
B18, C15, E21,
UART6_RXD I UART Receive Data D25, J23, V21,
G21, P17, U21
V25
A19, C17,
B15, B17, C21,
UART6_TXD O UART Transmit Data C24, J25, K25,
H21, J20, R17
W21

[Link] MCU Domain

Table 5-70. MCU_UART0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_UART0_CTSn I UART Clear to Send (active low) A6 B8

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Table 5-70. MCU_UART0 Signal Descriptions (continued)

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
MCU_UART0_RTSn O UART Request to Send (active low) B6 D7
MCU_UART0_RXD I UART Receive Data B5 A8
MCU_UART0_TXD O UART Transmit Data A5 B6

[Link] WKUP Domain

Table 5-71. WKUP_UART0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
WKUP_UART0_CTSn I UART Clear to Send (active low) C6 A7
WKUP_UART0_RTSn O UART Request to Send (active low) A4 B4
WKUP_UART0_RXD I UART Receive Data B4 B5
WKUP_UART0_TXD O UART Transmit Data C5 C6

5.3.26 USB
[Link] MAIN Domain
Table 5-72. USB0 Signal Descriptions
SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
USB0_DM IO USB 2.0 Differential Data (negative) AE11 AA11
USB0_DP IO USB 2.0 Differential Data (positive) AD11 Y10
USB0_DRVVBUS O USB VBUS control output (active high) C20 D17
USB0_RCALIB (1) A Pin to connect to calibration resistor AE10 T8
USB0_VBUS (2) A USB Level-shifted VBUS Input AC11 V10

(1) An external 499 Ω ±1% resistor must be connected between this pin and VSS and the maximum power dissipation for the resistor is
7.2mW. No external voltage should be applied to this pin.
(2) An external resistor divider is required to limit the voltage applied to the device pin. For more information, see Section 8.2.3, USB
VBUS Design Guidelines.

Table 5-73. USB1 Signal Descriptions

SIGNAL NAME [1] PIN TYPE [2] DESCRIPTION [3] ALW PIN [4] AMC PIN [4]
USB1_DM IO USB 2.0 Differential Data (negative) AD10 W8
USB1_DP IO USB 2.0 Differential Data (positive) AE9 W9
USB1_DRVVBUS O USB VBUS control output (active high) F18 E16
USB1_RCALIB (1) A Pin to connect to calibration resistor AC9 V9
USB1_VBUS (2) A USB Level-shifted VBUS Input AB10 U9

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5.4 Pin Connectivity Requirements

This section describes connectivity requirements for package balls that have specific connectivity requirements
and unused package balls.

Note
All power balls must be supplied with the voltages specified in Section 6.5, Recommended Operating
Conditions, unless otherwise specified .

Note
For additional clarification, "leave unconnected" or "no connect" (NC) means no signal traces can be
connected to these device ball numbers.

Table 5-74. Connectivity Requirements

ALW AMC
BALL BALL BALL NAME CONNECTION REQUIREMENTS
NUMBER NUMBER
Each of these balls must be connected to VSS through separate
external pull resistors to ensure the inputs associated with these
D1 B1 MCU_ERRORn balls are held to a valid logic low level if a PCB signal trace
B10 A11 TRSTn is connected and not actively driven by an attached device. The
internal pull-down can be used to hold a valid logic low level if no
PCB signal trace is connected to the ball.
E12 D9 EMU0
Each of these balls must be connected to the corresponding power
C11 B10 EMU1
supply(1) through separate external pull resistors to ensure the inputs
E11 C9 MCU_RESETz
associated with these balls are held to a valid logic high level if a
F20 E15 RESET_REQz
PCB signal trace is connected and not actively driven by an attached
A10 C10 TCK
device. The internal pull-up can be used to hold a valid logic high
A11 D10 TDI
level if no PCB signal trace is connected to the ball.
B11 B11 TMS
A8 B9 MCU_I2C0_SCL Each of these balls must be connected to the corresponding power
D10 A10 MCU_I2C0_SDA supply(1) or VSS through separate external pull resistors to ensure
B9 E9 WKUP_I2C0_SCL the inputs associated with these balls are held to a valid logic high or
A9 A9 WKUP_I2C0_SDA low level as appropriate for the selected signal function.
M25 K19 GPMC0_AD0
N23 L19 GPMC0_AD1
N24 L20 GPMC0_AD2
N25 L21 GPMC0_AD3
P24 M21 GPMC0_AD4
P22 L17 GPMC0_AD5
P21 L18 GPMC0_AD6 Each of these balls must be connected to the corresponding power
R23 M20 GPMC0_AD7 supply(1) or VSS through separate external pull resistors to ensure
R24 N20 GPMC0_AD8 the inputs associated with these balls are held to a valid logic high or
R25 N21 GPMC0_AD9 low level as appropriate to select the desired device boot mode.
T25 M17 GPMC0_AD10
R21 N18 GPMC0_AD11
T22 N17 GPMC0_AD12
T24 N19 GPMC0_AD13
U25 P19 GPMC0_AD14
U24 P20 GPMC0_AD15
K9 K9 VDDS_DDR
L8 L8 VDDS_DDR
P9 J8 VDDS_DDR
If DDRSS is not used, each of these balls must be connected directly
R8 K7 VDDS_DDR
to VSS.
- C1 VDDS_DDR
- U1 VDDS_DDR
M9 L7 VDDS_DDR_C

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Table 5-74. Connectivity Requirements (continued)

ALW AMC
BALL BALL BALL NAME CONNECTION REQUIREMENTS
NUMBER NUMBER
N6 M1 DDR0_ACT_n
R3 N1 DDR0_ALERT_n
M4 J3 DDR0_CAS_n
T1 M2 DDR0_PAR
M5 K5 DDR0_RAS_n
N3 J2 DDR0_WE_n
J1 F5 DDR0_A0
J2 G5 DDR0_A1
K3 G4 DDR0_A2
L5 H4 DDR0_A3
K4 J5 DDR0_A4
K1 H5 DDR0_A5
R2 P4 DDR0_A6
P2 N2 DDR0_A7
P1 P2 DDR0_A8
P4 N4 DDR0_A9
R5 N3 DDR0_A10
P5 M3 DDR0_A11
R6 P5 DDR0_A12
R1 N5 DDR0_A13
M1 L5 DDR0_BA0
N1 L3 DDR0_BA1
T4 L4 DDR0_BG0
N2 L2 DDR0_BG1
M2 K4 DDR0_CAL0
L1 J1 DDR0_CK0 If DDRSS is not used, leave unconnected.
L2 K1 DDR0_CK0_n Note: The DDR0 pins in this list can only be left unconnected
H2 G3 DDR0_CKE0 when VDDS_DDR and VDDS_DDR_C are connected to VSS. The
J4 H2 DDR0_CKE1 DDR0 pins must be connected as defined in the DDR Board Design
L6 H3 DDR0_CS0_n and Layout Guidelines, when VDDS_DDR and VDDS_DDR_C are
K2 G1 DDR0_CS1_n connected to a power source.
H5 E3 DDR0_DM0
W5 R4 DDR0_DM1
F4 C2 DDR0_DQ0
G5 E4 DDR0_DQ1
F3 D3 DDR0_DQ2
H6 E5 DDR0_DQ3
E3 D2 DDR0_DQ4
G2 F3 DDR0_DQ5
F2 F1 DDR0_DQ6
F1 F2 DDR0_DQ7
U1 R3 DDR0_DQ8
U3 R2 DDR0_DQ9
U2 T2 DDR0_DQ10
V5 U2 DDR0_DQ11
W2 U3 DDR0_DQ12
V6 U4 DDR0_DQ13
Y1 T4 DDR0_DQ14
W1 T5 DDR0_DQ15
E1 D1 DDR0_DQS0
E2 E1 DDR0_DQS0_n
V1 T1 DDR0_DQS1
V2 R1 DDR0_DQS1_n
H1 J4 DDR0_ODT0
J3 K2 DDR0_ODT1
G1 G2 DDR0_RESET0_n
USB0 and USB1 share these power rails, so each of these balls
W12 P11 VDDA_CORE_USB must be connected to valid power sources when either USB0 or
Y11 R11 VDDA_1P8_USB USB1 is used.
Y13 R10 VDDA_3P3_USB If USB0 and USB1 are not used, each of these balls must be
connected directly to VSS.

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Table 5-74. Connectivity Requirements (continued)

ALW AMC
BALL BALL BALL NAME CONNECTION REQUIREMENTS
NUMBER NUMBER
If USB0 or USB1 is not used, leave the respective DM, DP, and
AE11 AA11 USB0_DM VBUS balls unconnected.
AD11 Y10 USB0_DP
AE10 T8 USB0_RCALIB Note: The USB0_RCALIB and USB1_RCALIB pins can only
AC11 V10 USB0_VBUS be left unconnected when VDDA_CORE_USB, VDDA_1P8_USB,
AD10 W8 USB1_DM and VDDA_3P3_USB are connected to VSS. The USB0_RCALIB
AE9 W9 USB1_DP and USB1_RCALIB pins must be connected to VSS through
AC9 V9 USB1_RCALIB separate appropriate external resistors when VDDA_CORE_USB,
AB10 U9 USB1_VBUS VDDA_1P8_USB, and VDDA_3P3_USB are connected to power
sources.
If CSIRX0 is not used and the device boundary scan function is
required, each of these balls must be connected to valid power
W13 P12 VDDA_CORE_CSIRX0 sources.
W14 R12 VDDA_1P8_CSIRX0 If CSIRX0 is not used and the device boundary scan function is not
required, each of these balls can alternatively be connected directly
to VSS.
AD15 AA14 CSI0_RXCLKN
AE15 AA13 CSI0_RXCLKP
AB14 Y13 CSI0_RXN0 If CSIRX0 is not used, leave unconnected.
AC15 Y12 CSI0_RXP0
AA14 T11 CSI0_RXRCALIB
AD14 V13 CSI0_RXN1 If CSIRX0 is not used or only operated in 1-lane mode, leave
AE14 V12 CSI0_RXP1 unconnected.
AD13 U12 CSI0_RXN2 If CSIRX0 is not used or only operated in 1-lane or 2-lane mode,
AE13 U11 CSI0_RXP2 leave unconnected.
AB12 W12 CSI0_RXN3 If CSIRX0 is not used or only operated in 1-lane, 2-lane, or 3-lane
AC13 W11 CSI0_RXP3 mode, leave unconnected.
AA5 AA2 OLDI0_A0N
Y6 AA3 OLDI0_A0P
AD3 V5 OLDI0_A1N
AB4 V6 OLDI0_A1P
Y8 U7 OLDI0_A2N
AA8 U6 OLDI0_A2P
AB6 W6 OLDI0_A3N
AA7 W5 OLDI0_A3P
AC6 AA4 OLDI0_A4N
AC5 Y5 OLDI0_A4P
If OLDI0 is not used, leave unconnected.
AE5 AA6 OLDI0_A5N
AD6 AA5 OLDI0_A5P
AE6 AA10 OLDI0_A6N
AD7 Y9 OLDI0_A6P
AD8 AA8 OLDI0_A7N
AE7 Y8 OLDI0_A7P
AD4 V7 OLDI0_CLK0N
AE3 V8 OLDI0_CLK0P
AE4 Y7 OLDI0_CLK1N
AD5 AA7 OLDI0_CLK1P
If VMON_VSYS is not used, this ball must be connected directly to
H10 F6 VMON_VSYS
VSS.
If VMON_1P8_SOC is not used to monitor the SOC power rail, this
G10 H9 VMON_1P8_SOC
ball must remain connected to a 1.8V power rail.
If VMON_3P3_SOC is not used to monitor the SOC power rail,
K10 K11 VMON_3P3_SOC this ball must remain connected to a 3.3V power rail or connected
directly to VSS.

(1) To determine which power supply is associated with any IO, see POWER column of the Pin Attributes table.

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Note
Internal pull resistors are weak and may not source enough current to maintain a valid logic level
for some operating conditions. This can be the case when connected to components with leakage
to the opposite logic level, or when external noise sources couple to signal traces attached to balls
which are only pulled to a valid logic level by the internal resistor. Therefore, external pull resistors are
recommended to hold a valid logic level on balls with external connections.
Many of the device IOs are turned off by default and external pull resistors may be required to hold
inputs of any attached device in a valid logic state until software initializes the respective IOs. The
state of configurable device IOs are defined in the BALL STATE DURING RESET RX/TX/PULL and
BALL STATE AFTER RESET RX/TX/PULL columns of the Pin Attributes table. Any IO with its input
buffer (RX) turned off is allowed to float without damaging the device. However, any IO with its input
buffer (RX) turned on shall never be allowed to float to any potential between VILSS and VIHSS. The
input buffer can enter a high-current state which could damage the IO cell if allowed to float between
these levels.

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6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)(1) (2)
PARAMETER MIN MAX UNIT
VDD_CORE Core supply -0.3 1.05 V
VDDR_CORE RAM supply -0.3 1.05 V
VDD_CANUART CANUART core supply -0.3 1.05 V
VDDA_CORE_CSIRX0 CSIRX0 core supply -0.3 1.05 V
VDDA_CORE_USB USB0 and USB1 core supply -0.3 1.05 V
VDDA_DDR_PLL0(3) DDR Deskew PLL supply -0.3 1.05 V
VDDS_DDR DDR PHY IO supply -0.3 1.57 V
VDDS_DDR_C DDR clock IO supply -0.3 1.57 V
VDDS_OSC0 MCU_OSC0 supply -0.3 1.98 V
VDDA_MCU RCOSC, POR, POK, and MCU_ PLL0 analog supply -0.3 1.98 V
MAIN_PLL0, MAIN_PLL12, MAIN_PLL16, and MAIN_PLL17
VDDA_PLL0 -0.3 1.98 V
analog supply
VDDA_PLL1 MAIN_PLL1 and MAIN_PLL2 analog supply -0.3 1.98 V
VDDA_PLL2 MAIN_PLL8 and MAIN_PLL15 analog supply -0.3 1.98 V
VDDA_1P8_CSIRX0 CSIRX0 1.8V analog supply -0.3 1.98 V
VDDA_1P8_OLDI0 OLDI0 1.8V analog supply -0.3 1.98 V
VDDA_1P8_USB USB0 and USB1 1.8V analog supply -0.3 1.98 V
VDDA_TEMP0 TEMP0 analog supply -0.3 1.98 V
VDDA_TEMP1 TEMP1 analog supply -0.3 1.98 V
VPP eFuse ROM programming supply -0.3 1.98 V
VDDSHV_MCU IO supply for IO MCU -0.3 3.63 V
VDDSHV_CANUART IO supply for IO CANUART -0.3 3.63 V
VDDSHV0 IO supply for IO group 0 -0.3 3.63 V
VDDSHV1 IO supply for IO group 1 -0.3 3.63 V
VDDSHV2 IO supply for IO group 2 -0.3 3.63 V
VDDSHV3 IO supply for IO group 3 -0.3 3.63 V
VDDSHV4 IO supply for IO group 4 -0.3 3.63 V
VDDSHV5 IO supply for IO group 5 -0.3 3.63 V
VDDSHV6 IO supply for IO group 6 -0.3 3.63 V
VDDA_3P3_USB USB0 and USB1 3.3V analog supply -0.3 3.63 V
MCU_PORz -0.3 3.63 V
MCU_I2C0_SCL, MCU_I2C0_SDA,
WKUP_I2C0_SCL, WKUP_I2C0_SDA,
-0.3 1.98(4) V
and EXTINTn
When operating at 1.8V
MCU_I2C0_SCL, MCU_I2C0_SDA,
Steady-state max voltage at all fail-safe IO pins WKUP_I2C0_SCL, WKUP_I2C0_SDA,
-0.3 3.63(4)
and EXTINTn
When operating at 3.3V
VMON_1P8_SOC -0.3 1.98 V
VMON_3P3_SOC -0.3 3.63 V
VMON_VSYS(5) -0.3 1.98 V

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over operating junction temperature range (unless otherwise noted)(1) (2)

PARAMETER MIN MAX UNIT
USB0_VBUS, USB1_VBUS(7) -0.3 3.6 V
Steady-state max voltage at all other IO pins(6) IO supply
All other IO pins -0.3 V
voltage + 0.3
20% of IO supply voltage for up to 20%
Transient overshoot and undershoot at IO pin of the signal period (see Figure 6-1, IO 0.2 × VDD(8) V
Transient Voltage Ranges)
I-Test -100 100 mA
Latch-up performance(9)
Over-Voltage (OV) Test 1.5 x VDD(8) V
TSTG Storage temperature -55 +150 °C

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Section 6.5, Recommended Operating
Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be
fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) The VDDA_DDR_PLL0 power rail is only available on the AMC package. This power rail is internally connected to VDD_CORE in the
ALW package.
(4) The absolute maximum ratings for these fail-safe pins depends on their IO supply operating voltage. Therefore, this value is also
defined by the maximum VIH value found in the I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics section, where
the electrical characteristics table has separate parameter values for 1.8V mode and 3.3V mode.
(5) The VMON_VSYS pin provides a way to monitor the system power supply. For more information, see Section 8.2.4, System Power
Supply Monitor Design Guidelines.
(6) This parameter applies to all IO pins which are not fail-safe and the requirement applies to all values of IO supply voltage. For
example, if the voltage applied to a specific IO supply is 0 volts the valid input voltage range for any IO powered by that supply will be
–0.3 to +0.3 volts. Special attention should be applied anytime peripheral devices are not powered from the same power sources used
to power the respective IO supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range,
including power supply ramp-up and ramp-down sequences.
(7) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see Section 8.2.3, USB
Design Guidelines.
(8) VDD is the voltage on the corresponding power-supply pin(s) for the IO.
(9) For current pulse injection (I-Test):
• Pins stressed per JEDEC JESD78 (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times
maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage.

For over-voltage performance (Over-Voltage (OV) Test):

• Supplies stressed per JEDEC JESD78 (Class II) and passed specified voltage injection.

Fail-safe IO terminals are designed such they do not have dependencies on the respective IO power supply
voltage. This allows external voltage sources to be connected to these IO terminals when the respective IO
power supplies are turned off. The MCU_I2C0_SCL, MCU_I2C0_SDA, WKUP_I2C0_SCL, WKUP_I2C0_SDA,
EXTINTn, VMON_1P8_SOC, VMON_3P3_SOC, VMON_VSYS, and MCU_PORz are the only fail-safe IO
terminals. All other IO terminals are not fail-safe and the voltage applied to them should be limited to the value
defined by the "Steady-state max voltage at all other IO pins" parameter in Section 6.1.

Overshoot = 20% of nominal

IO supply voltage
Tovershoot

Tperiod

Tundershoot

Undershoot = 20% of nominal

IO supply voltage

A. Tovershoot + Tundershoot < 20% of Tperiod

Figure 6-1. IO Transient Voltage Ranges

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6.2 ESD Ratings for Devices which are not AEC - Q100 Qualified
VALUE UNIT

Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000

V(ESD) V
(ESD) Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) ±250

(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings for AEC - Q100 Qualified Devices

VALUE UNIT
Human-body model (HBM), per AEC - Q100-002(1) ±1000
Corner pins ALW
package
(A1, A25, AE1, and
V(ESD) Electrostatic discharge AE25) ±750 V
Charged-device model (CDM), per AEC - Q100-011
Corner pins AMC
package
(A1, A21, AA1, and
AA21)
All other pins ±250

(1) AEC - Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Power-On Hours (POH)

POWER ON HOURS (POH)(1) (2) (3)
JUNCTION TEMPERATURE RANGE (TJ) LIFETIME (POH)
Commercial 0°C to 95°C 100000
Extended Industrial –40°C to 105°C 100000
Automotive –40°C to 125°C 20000(4)

(1) This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard
terms and conditions for TI semiconductor products.
(2) Unless specified in the table above, all voltage domains and operating conditions are supported in the device at the noted
temperatures.
(3) POH is a function of voltage, temperature and time. Usage at higher voltages and temperatures will result in a reduction in POH.
(4) Automotive profile is defined as 20000 power on hours with a junction temperature as follows: 5%@-40°C, 65%@70°C, 20%@110°C,
and 10%@125°C.

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6.5 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
SUPPLY NAME DESCRIPTION MIN(1) NOM MAX(1) UNIT
VDD_CORE(2) Core supply 0.75V operation 0.715 0.75 0.79 V
VDDA_CORE_CSIRX0(2) CSIRX0 core supply
VDDA_CORE_USB(2) USB0 and USB1 core supply 0.85V operation 0.81 0.85 0.895 V
VDDA_DDR_PLL0(2) (3) DDR Deskew PLL supply
0.75V operation 0.715 0.75 0.79 V
VDD_CANUART(4) CANUART core supply
0.85V operation 0.81 0.85 0.895 V
VDDR_CORE RAM supply 0.81 0.85 0.895 V

VDDS_DDR(5) DDR PHY IO supply 1.1V operation 1.06 1.1 1.17 V

VDDS_DDR_C(5) DDR clock IO supply 1.2V operation 1.14 1.2 1.26 V
VDDS_OSC0 MCU_OSC0 supply 1.71 1.8 1.89 V
VDDA_MCU RCOSC, POR, POK, and MCU_ PLL0 analog supply 1.71 1.8 1.89 V
MAIN_PLL0, MAIN_PLL12, MAIN_PLL16, and MAIN_PLL17 analog
VDDA_PLL0 1.71 1.8 1.89 V
supply
VDDA_PLL1 MAIN_PLL1 and MAIN_PLL2 analog supply 1.71 1.8 1.89 V
VDDA_PLL2 MAIN_PLL8 and MAIN_PLL15 analog supply 1.71 1.8 1.89 V
VDDA_1P8_CSIRX0 CSIRX0 1.8V analog supply 1.71 1.8 1.89 V
VDDA_1P8_OLDI0 OLDI0 1.8V analog supply 1.71 1.8 1.89 V
VDDA_1P8_USB USB0 and USB1 1.8V analog supply 1.71 1.8 1.89 V
VDDA_TEMP0 TEMP0 analog supply 1.71 1.8 1.89 V
VDDA_TEMP1 TEMP1 analog supply 1.71 1.8 1.89 V
VPP eFuse ROM programming supply see(6) see(6) see(6) V
VMON_1P8_SOC Voltage monitor for 1.8V SoC power supply 1.71 1.8 1.89 V
VDDA_3P3_USB USB0 and USB1 3.3V analog supply 3.135 3.3 3.465 V
VMON_3P3_SOC Voltage monitor for 3.3V SoC power supply 3.135 3.3 3.465 V
VMON_VSYS Voltage monitor pin 0 see(7) 1 V
USB0_VBUS USB0 Level-shifted VBUS Input 0 see(8) 3.465 V
USB1_VBUS USB1 Level-shifted VBUS Input 0 see(8) 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV_CANUART(9) Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV_MCU Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV0 Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV1 Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV2 Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV3 Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV4 Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV5 Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V
1.8V operation 1.71 1.8 1.89 V
VDDSHV6 Dual-voltage IO supply
3.3V operation 3.135 3.3 3.465 V

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over operating junction temperature range (unless otherwise noted)

SUPPLY NAME DESCRIPTION MIN(1) NOM MAX(1) UNIT
Automotive -40 125 °C
Extended
TJ Operating junction temperature range -40 105 °C
Industrial
Commercial 0 95 °C

(1) The voltage at the device ball must never drop below the MIN voltage or rise above the MAX voltage for any amount of time during
normal device operation.
(2) VDD_CORE, VDDA_CORE_CSIRX0, VDDA_CORE_USB, and VDDA_DDR_PLL0 shall be sourced from the same power source.
Care should be taken to ensure that voltage differential between VDD_CORE and VDDA_CORE_USB is within +/- 1%.
(3) The VDDA_DDR_PLL0 power rail is only available on the AMC package. This power rail is internally connected to VDD_CORE in the
ALW package.
(4) VDD_CANUART shall be connected to an always on power source when using Partial IO low power mode. VDD_CANUART shall be
connected to the same power source as VDD_CORE, VDDA_CORE_CSI_DSI, VDDA_CORE_USB, and VDDA_DDR_PLL0 when not
using Partial IO low power mode.
(5) VDDS_DDR and VDDS_DDR_C shall be sourced from the same power source.
(6) Refer to the Recommended Operating Conditions for OTP eFuse Programming table for VPP supply voltages based on eFuse usage.
(7) The VMON_VSYS pin provides a way to monitor the system power supply. For more information, see Section 8.2.4, System Power
Supply Monitor Design Guidelines.
(8) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see Section 8.2.3, USB
Design Guidelines.
(9) VDDSHV_CANUART shall be connected to an always on power source when using Partial IO low power mode. VDDSHV_CANUART
shall be connected to any valid IO power source when not using Partial IO low power mode.

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6.6 Operating Performance Points

This section describes maximum operating conditions of the device in Table 6-1 and describes each Operating
Performance Point (OPP) for processor clocks and device core clocks in Table 6-2.
Table 6-1. Device Speed Grades
MAXIMUM
MAXIMUM OPERATING FREQUENCY (MHz) TRANSITION
RATE (MT/s)(2)
Speed VDD_CORE Device/ SMS
Grade (V)(1) A53SS Main MCUSS Power Subsystem
(Cortex- GPU PRU Infra (Cortex- Manager (Dual OCSRAM DDR4 LPDDR4
A53x) (CBA) M4F) (Cortex- Cortex-
R5F) M4F)
G 0.75/0.85 300 500 250 250 400 400 400 400 1600 1600
K 0.75/0.85 800 500 250 250 400 400 400 400 1600 1600
S 0.75/0.85 1000 500 333 250 400 400 400 400 1600 1600
0.75/0.85 1250
T 500 333 250 400 400 400 400 1600 1600
0.85 1400

(1) Nominal operating voltage, see Recommended Operating Conditions.

(2) Maximum DDR Frequency will be limited based on the specific memory type (vendor) used in a system and by PCB implementation.
Refer to DDR Board Design and Layout Guidelines for the proper PCB implementation to achieve maximum DDR frequency.

Table 6-2. Device Operating Performance Points

FIXED OPERATING FREQUENCY OPTIONS (MHz)(2) MT/s(3)

OPP A53SS(1) DEVICE/

MAIN SMS /
GPU PRU MCUSS POWER OCSRAM DDR4 LPDDR4
INFRA (CBA) SMS CBA
MANAGER

From 1600
High ARM0 500 250 400 400 400 (Max) From
PLL 333, DDR
400
Bypass 250, PLL
or
to or 250 Bypass(4)
200
Speed 200 (DRAM DLL to
Low Grade N/A 125 133 133 133 Bypass) 1600
Maximum

(1) Default operating frequency, set by software at boot. Supports Dynamic Frequency Scaling after boot.
(2) Fixed operating frequency, set by software at boot.
(3) Maximum DDR Frequency will be limited based on the specific memory type (vendor) used in a system and by PCB implementation.
Refer to DDR Board Design and Layout Guidelines for the proper PCB implementation to achieve maximum DDR frequency.
(4) The DDR PLL output, which sources DDR0_CK0 and DDR0_CK0_n, is typically defined in units of frequency. So the "DDR PLL
Bypass" transaction rate is equal to 2x the DDR PLL output frequency when operating in bypass mode.

6.7 Power Consumption Summary

For information on the device power consumption, see the AM62x Power Estimation Tool application note.

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6.8 Electrical Characteristics

Note
The interfaces or signals described in Section 6.8 correspond to the interfaces or signals available in
multiplexing mode 0 (Primary Signal Function).
All interfaces or signals multiplexed on the balls described in these tables have the same DC electrical
characteristics, unless multiplexing involves a PHY and GPIO combination, in which case different DC
electrical characteristics are specified for the different multiplexing modes (Functions).

6.8.1 I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
1.8V MODE
(1)
VIL Input Low Voltage 0.3 × VDD V
(1)
VILSS Input Low Voltage Steady State 0.3 × VDD V
(1)
VIH Input High Voltage 0.7 × VDD 1.98(2) V
(1)
VIHSS Input High Voltage Steady State 0.7 × VDD V
(1)
VHYS Input Hysteresis Voltage 0.1 × VDD mV
VI = 1.8V 10 µA
IIN (3) Input Leakage Current.
VI = 0V -10 µA
(1)
VOL Output Low Voltage 0.2 × VDD V
IOL (4) Low Level Output Current VOL(MAX) 10 mA
18f(5)
SRI (6) Input Slew Rate or V/s
1.8E+6
(7)
3.3V MODE
(1)
VIL Input Low Voltage 0.3 × VDD V
(1)
VILSS Input Low Voltage Steady State 0.25 × VDD V
(1)
VIH Input High Voltage 0.7 × VDD 3.63(2) V
(1)
VIHSS Input High Voltage Steady State 0.7 × VDD V
(1)
VHYS Input Hysteresis Voltage 0.05 × VDD mV
VI = 3.3V 10 µA
IIN (3) Input Leakage Current.
VI = 0V -10 µA
VOL Output Low Voltage 0.4 V
IOL (4) Low Level Output Current VOL(MAX) 10 mA
33f(5)
SRI (6) Input Slew Rate or 8E+7 V/s
3.3E+6

(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.
(2) This value also defines the Absolute Maximum Ratings value the IO.
(3) This parameter defines leakage current when the terminal is operating as an input, undriven output, or both input and undriven output.
(4) The IOL parameter defines the minimum Low Level Output Current for which the device is able to maintain the specified VOL value.
The value defined by this parameter should be considered the maximum current available to a system implementation which needs to
maintain the specified VOL value for attached components.
(5) f = toggle frequency of the input signal in Hz.
(6) This MIN parameter only applies to input signal functions which are not defined in their respective Timing and Switching
Characteristics sections. Select the MIN parameter which results in the largest value.
(7) I2C Hs-mode is not supported when operating the IO in 3.3V mode.

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6.8.2 Fail-Safe Reset (FS RESET) Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
0.3 ×
VIL Input Low Voltage V
VDDS_OSC0
0.3 ×
VILSS Input Low Voltage Steady State V
VDDS_OSC0
0.7 ×
VIH Input High Voltage V
VDDS_OSC0
0.7 ×
VIHSS Input High Voltage Steady State V
VDDS_OSC0
VHYS Input Hysteresis Voltage 200 mV
VI = 1.8V 10 µA
IIN (1) Input Leakage Current.
VI = 0V -10 µA
18f(2)
SRI (3) Input Slew Rate or V/s
1.8E+6

(1) This parameter defines leakage current when the terminal is operating as an input.
(2) f = toggle frequency of the input signal in Hz.
(3) This MIN parameter only applies to input signal functions which are not defined in their respective Timing and Switching
Characteristics sections. Select the MIN parameter which results in the largest value.

6.8.3 High-Frequency Oscillator (HFOSC) Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
0.35 ×
VIL Input Low Voltage V
VDDS_OSC0
0.65 ×
VIH Input High Voltage V
VDDS_OSC0
VHYS Input Hysteresis Voltage 49 mV
VI = 1.8V 10 µA
IIN (1) Input Leakage Current.
VI = 0V -10 µA

(1) This parameter defines leakage current when the terminal is operating as an input.

6.8.4 Low-Frequency Oscillator (LFXOSC) Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
0.30 ×
VIL Input Low Voltage V
VDDS_OSC0
0.70 ×
VIH Input High Voltage V
VDDS_OSC0
Active Mode 85 mV
VHYS Input Hysteresis Voltage
Bypass Mode 324 mV
VI = 1.8V 10 µA
IIN (1) Input Leakage Current.
VI = 0V -10 µA

(1) This parameter defines leakage current when the terminal is operating as an input.

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6.8.5 SDIO Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
1.8V MODE
VIL Input Low Voltage 0.58 V
VILSS Input Low Voltage Steady State 0.58 V
VIH Input High Voltage 1.27 V
VIHSS Input High Voltage Steady State 1.7 V
VHYS Input Hysteresis Voltage 150 mV
VI = 1.8V 10 µA
IIN (1) Input Leakage Current.
VI = 0V -10 µA
RPU Pull-up Resistor 40 50 60 kΩ
RPD Pull-down Resistor 40 50 60 kΩ
VOL Output Low Voltage 0.45 V
VOH Output High Voltage VDD(2) - 0.45 V
IOL (3) Low Level Output Current VOL(MAX) 4 mA
IOH (3) High Level Output Current VOH(MIN) 4 mA
18f(4)
SRI (5) Input Slew Rate or V/s
1.8E+6
3.3V MODE
VIL Input Low Voltage 0.25 × VDD(2) V
VILSS Input Low Voltage Steady State 0.15 × VDD(2) V
0.625 ×
VIH Input High Voltage V
VDD(2)
0.625 ×
VIHSS Input High Voltage Steady State V
VDD(2)
VHYS Input Hysteresis Voltage 150 mV
VI = 3.3V 10 µA
IIN (1) Input Leakage Current.
VI = 0V -10 µA
RPU Pull-up Resistor 40 50 60 kΩ
RPD Pull-down Resistor 40 50 60 kΩ
0.125 ×
VOL Output Low Voltage V
VDD(2)
VOH Output High Voltage 0.75 × VDD(2) V
IOL (3) Low Level Output Current VOL(MAX) 6 mA
IOH (3) High Level Output Current VOH(MIN) 10 mA
33f(4)
SRI (5) Input Slew Rate or V/s
3.3E+6

(1) This parameter defines leakage current when the terminal is operating as an input, undriven output, or both input and undriven output,
without internal pulls enabled.
(2) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.
(3) The IOL and IOH parameters define the minimum Low Level Output Current and High Level Output Current for which the device is
able to maintain the specified VOL and VOH values. Values defined by these parameters should be considered the maximum current
available to a system implementation which needs to maintain the specified VOL and VOH values for attached components.
(4) f = toggle frequency of the input signal in Hz.
(5) This MIN parameter only applies to input signal functions which are not defined in their respective Timing and Switching
Characteristics sections. Select the MIN parameter which results in the largest value.

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6.8.6 LVCMOS Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
1.8V MODE
VIL Input Low Voltage 0.35 × VDD(1) V
VILSS Input Low Voltage Steady State 0.3 × VDD(1) V
VIH Input High Voltage 0.65 × VDD(1) V
VIHSS Input High Voltage Steady State 0.85 × VDD(1) V
VHYS Input Hysteresis Voltage 150 mV
VI = 1.8V 10 µA
IIN (2) Input Leakage Current.
VI = 0V -10 µA
RPU Pull-up Resistor 15 22 30 kΩ
RPD Pull-down Resistor 15 22 30 kΩ
VOL Output Low Voltage 0.45 V
VOH Output High Voltage VDD(1) - 0.45 V
IOL (3) Low Level Output Current VOL(MAX) 3 mA
IOH (3) High Level Output Current VOH(MIN) 3 mA
18f(4)
SRI (5) Input Slew Rate or V/s
1.8E+6
3.3V MODE
VIL Input Low Voltage 0.8 V
VILSS Input Low Voltage Steady State 0.6 V
VIH Input High Voltage 2.0 V
VIHSS Input High Voltage Steady State 2.0 V
VHYS Input Hysteresis Voltage 150 mV
VI = 3.3V 10 µA
IIN (2) Input Leakage Current.
VI = 0V -10 µA
RPU Pull-up Resistor 15 22 30 kΩ
RPD Pull-down Resistor 15 22 30 kΩ
VOL Output Low Voltage 0.4 V
VOH Output High Voltage 2.4 V
IOL (3) Low Level Output Current VOL(MAX) 5 mA
IOH (3) High Level Output Current VOH(MIN) 9 mA
33f(4)
SRI (5) Input Slew Rate or V/s
3.3E+6

(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.
(2) This parameter defines leakage current when the terminal is operating as an input, undriven output, or both input and undriven output,
without internal pulls enabled.
(3) The IOL and IOH parameters define the minimum Low Level Output Current and High Level Output Current for which the device is
able to maintain the specified VOL and VOH values. Values defined by these parameters should be considered the maximum current
available to a system implementation which needs to maintain the specified VOL and VOH values for attached components.
(4) f = toggle frequency of the input signal in Hz.
(5) This MIN parameter only applies to input signal functions which are not defined in their respective Timing and Switching
Characteristics sections. Select the MIN parameter which results in the largest value.

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6.8.7 OLDI LVDS (OLDI) Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH Voltage, Output High 1.5 V
VOL Voltage, Output Low 0.925 V
VOCM Voltage, Output Common Mode 1.125 1.375 V
Delta Voltage, Output Common Mode Differential Load = 100Ω 30 mV
ΔVOCM
(Difference between high and low steady-states)
VOD Voltage, Output Differential 250 400 mV
Delta Voltage, Output Differential 50 mV
ΔVOD
(Difference between high and low steady-states)
V = VSS -5 mA
IOS Current, Output Short-Circuit
Differential Load = 100Ω
V = VDD(1) -10 4 40 µA
IOZ Current, Output High-Z or
V = VSS

(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.

6.8.8 CSI-2 (D-PHY) Electrical Characteristics

Note
CSIRX0 is compliant with MIPI DPHY v1.2 dated August 1, 2014, including ECNs and Errata as
applicable.

6.8.9 USB2PHY Electrical Characteristics

Note
The USB0 and USB1 interfaces are compliant with Universal Serial Bus Revision 2.0 Specification
dated April 27, 2000 including ECNs and Errata as applicable.

6.8.10 DDR Electrical Characteristics

Note
The DDR interface is compatible with DDR4 devices that are JESD79-4B standard-compliant, and
LPDDR4 devices that are JESD209-4B standard-compliant

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6.9 VPP Specifications for One-Time Programmable (OTP) eFuses

This section specifies the operating conditions required for programming the OTP eFuses.
6.9.1 Recommended Operating Conditions for OTP eFuse Programming
over operating junction temperature range (unless otherwise noted)
PARAMETER DESCRIPTION MIN NOM MAX UNIT
VDD_CORE Supply voltage range for the core domain during OTP See Section 6.5 V
operation
VPP Supply voltage range for the eFuse ROM domain during NC(1) V
normal operation without hardware support to program
eFuse ROM
Supply voltage range for the eFuse ROM domain during 0 V
normal operation with hardware support to program eFuse
ROM
Supply voltage range for the eFuse ROM domain during 1.71 1.8 1.89 V
OTP programming(2)
I(VPP) VPP current 400 mA
SR(VPP) VPP Power-up Slew Rate 6E + 4 V/s
Tj Operating junction temperature range while programming 0 25 85 °C
eFuse ROM.

(1) NC indicates No Connect.

(2) Supply voltage range includes DC errors and peak-to-peak noise.

6.9.2 Hardware Requirements

The following hardware requirements must be met when programming keys in the OTP eFuses:
• The VPP power supply must be disabled when not programming OTP registers.
• The VPP power supply must be ramped up after the proper device power-up sequence (for more details, see
Section [Link], Power Supply Sequencing).
6.9.3 Programming Sequence
Programming sequence for OTP eFuses:
• Power on the board per the power-up sequencing. No voltage should be applied on the VPP terminal during
power up and normal operation.
• Load the OTP write software required to program the eFuse (contact your local TI representative for the OTP
software package).
• Apply the voltage on the VPP terminal according to the specification in Section 6.9.1.
• Run the software that programs the OTP registers.
• After validating the content of the OTP registers, remove the voltage from the VPP terminal.
6.9.4 Impact to Your Hardware Warranty
You accept that eFusing the TI Devices with security keys permanently alters them. You acknowledge that the
eFuse can fail, for example, due to incorrect or aborted program sequence or if you omit a sequence step.
Further the TI device may fail to secure boot if the error code correction check fails for the Production Keys
or if the image is not signed and optionally encrypted with the current active Production Keys. These types of
situations will render the TI device inoperable and TI will be unable to confirm whether the TI devices conformed
to their specifications prior to the attempted eFuse. Consequently, TI will have no liability (warranty or otherwise)
for any TI devices that have been incorrectly eFused by customers.

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6.10 Thermal Resistance Characteristics

This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below
the TJ value identified in Section 6.5, Recommended Operating Conditions.

Note
The thermal parameters are generated following JEDEC standard JESD51x and are not intended
for design parameters. If you need a more accurate thermal representation, download the processor
thermal model and import your PCB design into a thermal simulation environment. For details on
thermal implementation guidelines, see the Thermal Solution Guidance section.

6.10.1 Thermal Resistance Characteristics for ALW and AMC Packages

It is recommended to perform thermal simulations at the system level with the worst case device power consumption.
ALW AMC
ALW AEC - Q100 AEC - Q100 AIR
NO. PARAMETER DESCRIPTION PACKAGE QUALIFIED QUALIFIED FLOW
°C/W(1) (2) PACKAGE PACKAGE (m/s)(3)
°C/W(1) (2) °C/W(1) (2)
T1 RΘJC Junction-to-case 4.3 3.2 1.2 N/A
T2 RΘJB Junction-to-board 7.1 6.0 3.9 N/A
T3 Junction-to-free air 19.3 18.3 13.3 0
T4 14.5 13.4 9.7 1
RΘJA
T5 Junction-to-moving air 13.4 12.3 8.7 2
T6 12.8 11.7 8.1 3
T7 0.11 0.07 0.73 0
T8 0.21 0.14 0.75 1
ΨJT Junction-to-package top
T9 0.26 0.18 0.76 2
T10 0.31 0.22 0.77 3
T11 7.0 5.9 3.7 0
T12 6.6 5.5 3.4 1
ΨJB Junction-to-board
T13 6.5 5.4 3.3 2
T14 6.5 5.4 3.3 3

(1) °C/W = degrees Celsius per watt.

(2) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Packages
(3) m/s = meters per second.

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6.11 Temperature Sensor Characteristics

This section summarizes the Voltage and Temperature Module (VTM) on die temperature sensor characteristics.
For operation and reliability concerns, the maximum junction temperature of the device must be equal to or less
than the TJ value identified in Recommended Operating Conditions.
Table 6-3. VTM Die Temperature Sensor Characteristics
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
Tacc VTM temperature sensor accuracy –40℃ to 125℃ –5 5 ℃

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6.12 Timing and Switching Characteristics

Note
The Timing Requirements and Switching Characteristics values may change following the silicon
characterization result.

Note
The default SLEWRATE settings in each pad configuration register must be used to ensure timings,
unless specific instructions are given otherwise.

6.12.1 Timing Parameters and Information

The timing parameter symbols used in Section 6.12, Timing and Switching Characteristics are created in
accordance with JEDEC Standard 100. To shorten the symbols, some pin names and other related terminologies
have been abbreviated in Table 6-4:
Table 6-4. Timing Parameters Subscripts
SYMBOL PARAMETER
c Cycle time (period)
d Delay time
dis Disable time
en Enable time
h Hold time
su Setup time
START Start bit
t Transition time
v Valid time
w Pulse duration (width)
X Unknown, changing, or don't care level
F Fall time
H High
L Low
R Rise time
V Valid
IV Invalid
AE Active Edge
FE First Edge
LE Last Edge
Z High impedance

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6.12.2 Power Supply Requirements

This section describes the power supply requirements to ensure proper device operation.

Note
All power balls must be supplied with the voltages specified in the Recommended Operating
Conditions section, unless otherwise specified in Signal Descriptions and Pin Connectivity
Requirements.

[Link] Power Supply Slew Rate Requirement

To maintain the safe operating range of the internal ESD protection devices, TI recommends limiting the
maximum slew rate of supplies to be less than 18mV/µs. For instance, as shown in Figure 6-2, TI recommends
having the supply ramp slew for a 1.8V supply of more than 100µs.
Figure 6-2 describes the Power Supply Slew Rate Requirement in the device.

Supply value

t
slew rate < 18 mV/μs
slew > (supply value) / (18 mV/μs)
or
supply value × 55.6 μs/V

SPRT740_ELCH_06

Figure 6-2. Power Supply Slew and Slew Rate

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[Link] Power Supply Sequencing

This section describes power sequence requirements using power sequence diagrams and associated notes.
Each power sequence diagram demonstrates the sequential order expected for each device power rail. This
is done by assigning each device power rail to one or more waveform. A dual-voltage power rail may be
associated with more than one waveform and the associated note will describe which waveform is applicable.
Each waveform defines a transition region for the associated power rails and shows its sequential relationship
to the transition regions of other power rails. The notes associated with the power sequence diagram provides
further detail of these requirements. See the Power-up Sequence section for details on power-up requirements,
and the Power-down Sequence section for details on power-down requirements.
Two types of power supply transition regions are used to simplify the power supply sequencing diagrams. The
legends shown in Figure 6-3 and Figure 6-4 along with their descriptions are provided to clarify what each
transition regions represents.
Figure 6-3 defines a transition region with multiple power rails which may be sourced from multiple power
supplies or a single power supply. Transitions shown within the transition region represent a use case where
multiple power supplies are used to source power rails associated with this waveform, and these power
supplies are allowed to ramp at different times within the region since they do not have any specific sequence
requirement relative to each other.

Figure 6-3. Multiple Power Supply Transition Legend

Figure 6-4 defines a transition region with one or more power rails which must be sourced from a single common
power supply. No transitions are shown within the region to represent a single ramp within the transition region.

Figure 6-4. Single Common Power Supply Transition Legend

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[Link].1 Power-Up Sequencing

Table 6-5 and Figure 6-5 describes the device power-up sequencing.

Note
The power supply sequencing requirements defined in this section does not include entry or exit
from low power modes. See Section [Link].3, Partial IO Power Sequencing for more information on
power supply sequence requirements when entering or exiting low power modes.

Note
All power rails must be turned off and decay below 300mV before initiating a new power-up
sequence anytime a power rail drops below the minimum value defined in Recommended
Operating Conditions. The only exception is when entering/exiting Partial IO low power mode with
VDDSHV_CANUART and VDD_CANUART sourced from an always on power source. For this use
case the VDDSHV_CANUART and VDD_CANUART power rails are allowed to remain on.

Table 6-5. Power-Up Sequencing – Supply / Signal Assignments

See: Figure 6-5
WAVEFORM SUPPLY / SIGNAL NAME
A VSYS(1), VMON_VSYS(2)
VDDSHV_CANUART(3), VDDSHV_MCU(3), VDDSHV0(3), VDDSHV1(3), VDDSHV2(3), VDDSHV3(3), VDDA_3P3_USB,
B
VMON_3P3_SOC(4)
VDDSHV_CANUART(5), VDDSHV_MCU(5), VDDSHV0(5), VDDSHV1(5), VDDSHV2(5), VDDSHV3(5), VDDA_MCU,
C VDDS_OSC0, VDDA_PLL0, VDDA_PLL1, VDDA_PLL2, VDDA_1P8_CSIRX0, VDDA_1P8_OLDI0, VDDA_1P8_USB,
VDDA_TEMP0, VDDA_TEMP1, VMON_1P8_SOC(6)
D VDDSHV4(7), VDDSHV5(7), VDDSHV6(7)
E VDDS_DDR(8), VDDS_DDR_C(8)
F VDD_CANUART(9)
G VDD_CANUART(10), VDD_CORE(10) (12), VDDA_CORE_CSIRX0(10), VDDA_CORE_USB0(10), VDDA_DDR_PLL0(10)
VDD_CANUART(11), VDD_CORE(11) (12), VDDA_CORE_CSIRX0(11), VDDA_CORE_USB0(11), VDDA_DDR_PLL0(11),
H
VDDR_CORE(12)
I VPP(13)
J MCU_PORz
K MCU_OSC0_XI, MCU_OSC0_XO

(1) VSYS represents the name of a supply which sources power to the entire system. This supply is expected to be a pre-regulated supply
that sources power management devices which source all other supplies.
(2) VMON_VSYS input is used to monitor VSYS via an external resistor divider circuit. For more information, see the System Power
Supply Monitor Design Guidelines.
(3) VDDSHV_CANUART, VDDSHV_MCU, and VDDSHVx [x=0-3] are dual voltage IO supplies which can be operated at 1.8V or 3.3V
depending on the application requirements.
VDDSHV_CANUART shall be connected to an always-on power source when using Partial IO low power mode, or connected to any
valid IO power source when not using Partial IO low power mode. When VDDSHV_CANUART is not connected to an always-on power
source and is operating at 3.3V, it shall be ramped up with other 3.3V supplies during the 3.3V ramp period defined by this waveform.
When any of the VDDSHV_MCU and VDDSHVx [x=0-3] IO supplies are operating at 3.3V, they shall be ramped up with other 3.3V
supplies during the 3.3V ramp period defined by this waveform.
(4) The VMON_3P3_SOC input is used to monitor supply voltage and shall be connected to the respective 3.3V supply source.
(5) VDDSHV_CANUART, VDDSHV_MCU, and VDDSHVx [x=0-3] are dual voltage IO supplies which can be operated at 1.8V or 3.3V
depending on the application requirements.
VDDSHV_CANUART shall be connected to an always-on power source when using Partial IO low power mode, or connected to any
valid IO power source when not using Partial IO low power mode. When VDDSHV_CANUART is not connected to an always-on power
source and is operating at 1.8V, it shall be ramped up with other 1.8V supplies during the 1.8V ramp period defined by this waveform.
When any of the VDDSHV_MCU and VDDSHVx [x=0-3] IO supplies are operating at 1.8V, they shall be ramped up with other 1.8V
supplies during the 1.8V ramp period defined by this waveform.
(6) The VMON_1P8_SOC input is used to monitor supply voltage and shall be connected to the respective 1.8V supply source.

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(7) VDDSHV4, VDDSHV5, and VDDSHV6 were designed to support power-up, power-down, or dynamic voltage change without any
dependency on other power rails. This capability is required to support UHS-I SD Cards.
(8) VDDS_DDR and VDDS_DDR_C are expected to be powered by the same source such that they ramp together.
(9) VDD_CANUART shall be connected to an always-on power source when using Partial IO low power mode.
When VDD_CANUART is connected to an always-on power source, the potential applied to VDD_CORE must never be greater than
the potential applied to VDD_CANUART + 0.18V during power-up or power-down. This requires VDD_CANUART to ramp up before
and ramp down after VDD_CORE. VDD_CANUART does not have any ramp requirements beyond the one defined for VDD_CORE.
(10) VDD_CANUART shall be connected to the same power source as VDD_CORE, VDDA_CORE_CSIRX0, VDDA_CORE_USB, and
VDDA_DDR_PLL0 when not using Partial IO low power mode.
VDD_CANUART, VDD_CORE, VDDA_CORE_CSIRX0, VDDA_CORE_USB, and VDDA_DDR_PLL0 can be operated at 0.75V or
0.85V. When these supplies are operating at 0.75V, they shall be ramped up prior to VDDR_CORE as defined by this waveform.
(11) VDD_CANUART shall be connected to the same power source as VDD_CORE, VDD_CORE, VDDA_CORE_CSIRX0,
VDDA_CORE_USB, and VDDA_DDR_PLL0 when not using Partial IO low power mode.
VDD_CANUART, VDD_CORE, VDDA_CORE_CSIRX0, VDDA_CORE_USB, and VDDA_DDR_PLL0 can be operated at 0.75V or
0.85V. When these supplies are operating at 0.85V, they shall be powered from the same source as VDDR_CORE and ramped during
the 0.85V ramp period defined by this waveform.
(12) The potential applied to VDDR_CORE must never be greater than the potential applied to VDD_CORE + 0.18V during power-up or
power-down. This requires VDD_CORE to ramp up before and ramp down after VDDR_CORE when VDD_CORE is operating at
0.75V. VDD_CORE does not have any ramp requirements beyond the one defined for VDDR_CORE.
VDD_CORE and VDDR_CORE are expected to be powered by the same source so they ramp together when VDD_CORE is
operating at 0.85V.
(13) VPP is the 1.8V eFuse programming supply, which shall be left floating (HiZ) or grounded during power-up/down sequences and
during normal device operation. This supply shall only be sourced while programming eFuse.

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VSYS
Waveform A VMON_VSYS

Waveform B

Waveform C

Waveform D

Waveform E

Waveform F

Waveform G

Waveform H

Waveform I Hi-Z

Waveform J

Waveform K

AM62Ax_ELCH_01

Figure 6-5. Power-Up Sequencing

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[Link].2 Power-Down Sequencing

Table 6-6 and Figure 6-6 describes the device power-down sequencing.

Table 6-6. Power-Down Sequencing – Supply / Signal Assignments

See: Figure 6-6
WAVEFORM SUPPLY / SIGNAL NAME
A VSYS, VMON_VSYS
VDDSHV_CANUART(1), VDDSHV_MCU(1), VDDSHV0(1), VDDSHV1(1), VDDSHV2(1), VDDSHV3(1), VDDA_3P3_USB,
B
VMON_3P3_SOC
VDDSHV_CANUART(2), VDDSHV_MCU(2), VDDSHV0(2), VDDSHV1(2), VDDSHV2(2), VDDSHV3(2), VDDA_MCU,
C VDDS_OSC0, VDDA_PLL0, VDDA_PLL1, VDDA_PLL2, VDDA_1P8_CSIRX0, VDDA_1P8_OLDI0, VDDA_1P8_USB,
VDDA_TEMP0, VDDA_TEMP1, VMON_1P8_SOC
D VDDSHV4(3), VDDSHV5(3), VDDSHV6(3)
E VDDS_DDR, VDDS_DDR_C
F VDD_CANUART(4)
G VDD_CANUART(5), VDD_CORE(5), VDDA_CORE_CSIRX0(5), VDDA_CORE_USB0(5), VDDA_DDR_PLL0(5)
VDD_CANUART(6), VDD_CORE(6), VDDA_CORE_CSIRX0(6), VDDA_CORE_USB0(6), VDDA_DDR_PLL0(6),
H
VDDR_CORE
I VPP
J MCU_PORz
K MCU_OSC0_XI, MCU_OSC0_XO

(1) VDDSHV_CANUART, VDDSHV_MCU, and VDDSHVx [x=0-3] when operating at 3.3V.

(2) VDDSHV_CANUART, VDDSHV_MCU, and VDDSHVx [x=0-3] when operating at 1.8V.
(3) VDDSHV4, VDDSHV5, and VDDSHV6 were designed to support power-up, power-down, or dynamic voltage change without any
dependency on other power rails. This capability is required to support UHS-I SD Cards.
(4) VDD_CANUART when connected to an always-on power source for Partial IO low power mode.
(5) VDD_CANUART, VDD_CORE, VDDA_CORE_CSIRX0, VDDA_CORE_USB0, and VDDA_DDR_PLL0 when operating at 0.75V
(6) VDD_CANUART, VDD_CORE, VDDA_CORE_CSIRX0, VDDA_CORE_USB0, and VDDA_DDR_PLL0 when operating at 0.85V

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VSYS
Horizontal dashed lines represent a use case where the system power remains turned “on”
Waveform A VMON_VSYS while the device power management solution is turned “off”.

Waveform B

Waveform C

Waveform D

Waveform E

Waveform F

Waveform G

Waveform H

Waveform I Hi-Z

Waveform J

Waveform K

AM62Ax_ELCH_02

Figure 6-6. Power-Down Sequencing

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[Link].3 Partial IO Power Sequencing

This section describes power supply sequence requirements when entering or exiting low power modes.
For more information on low power modes supported by this device and the names assigned to each low power
mode, see the Power Modes section in the Device Configuration chapter of the Technical Reference Manual.
Partial IO is the only low power mode that requires power supply changes to the device power rails. All power
supply rails except VDD_CANUART and VDDSHV_CANUART are turned off when operating in Partial IO mode.
The power sequence required to enter Partial IO is the same sequence defined in Section [Link].2, Power-
Down Sequencing with the exception of VDD_CANUART and VDDSHV_CANUART, which remain powered.
The power sequence required to exit Partial IO is the same sequence defined in Section [Link].1, Power-Up
Sequencing with the exception of VDD_CANUART and VDDSHV_CANUART, which are already powered.

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6.12.3 System Timing

For more details about features and additional description information on the subsystem multiplexing signals,
see the corresponding subsections within Signal Descriptions and Detailed Description sections.
[Link] Reset Timing
Tables and figures provided in this section define timing conditions, timing requirements, and switching
characteristics for reset related signals.
Table 6-7. Reset Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
VDD(1) = 1.8V 0.0018 V/ns
SRI Input slew rate
VDD(1) = 3.3V 0.0033 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 30 pF

(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.

Table 6-8. MCU_PORz Timing Requirements

see Figure 6-7
NO. PARAMETER MIN MAX UNIT
Hold time, MCU_PORz active (low) at Power-up
RST1 9500000 ns
after supplies valid (using external crystal circuit)
th(SUPPLIES_VALID - MCU_PORz) Hold time, MCU_PORz active (low) at Power-up
RST2 after supplies valid and external clock stable (using 1200 ns
external LVCMOS clock source)
Pulse Width, MCU_PORz low after Power-up
RST3 tw(MCU_PORzL) (without removal of Power or system reference 1200 ns
clock MCU_OSC0_XI/XO)

Figure 6-7. MCU_PORz Timing Requirements

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Table 6-9. MCU_RESETSTATz, and RESETSTATz Switching Characteristics

see Figure 6-8
NO. PARAMETER MIN MAX UNIT
Delay time, MCU_PORz active (low) to
RST4 td(MCU_PORzL-MCU_RESETSTATzL) 0 ns
MCU_RESETSTATz active (low)
Delay time, MCU_PORz inactive (high) to
RST5 td(MCU_PORzH-MCU_RESETSTATzH) 6120*S(1) ns
MCU_RESETSTATz inactive (high)
Delay time, MCU_PORz active (low) to
RST6 td(MCU_PORzL-RESETSTATzL) 0 ns
RESETSTATz active (low)
Delay time, MCU_PORz inactive (high) to
RST7 td(MCU_PORzH-RESETSTATzH) 9195*S(1) ns
RESETSTATz inactive (high)
Pulse Width, MCU_RESETSTATz low
RST8 tw(MCU_RESETSTATzL) 966*S(1) ns
(SW_MCU_WARMRST)
Pulse Width, RESETSTATz low
RST9 tw(RESETSTATzL) (SW_MCU_WARMRST, SW_MAIN_PORz, or 4040*S ns
SW_MAIN_WARMRST)

(1) S = MCU_OSC0_XI/XO clock period in ns.

Figure 6-8. MCU_RESETSTATz, and RESETSTATz Switching Characteristics

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Table 6-10. MCU_RESETz Timing Requirements

see Figure 6-9
NO. PARAMETER MIN MAX UNIT
RST10 tw(MCU_RESETzL) (1) Pulse Width, MCU_RESETz active (low) 1200 ns

(1) This timing parameter is valid only after all supplies are valid and MCU_PORz has been asserted for the specified time.

Table 6-11. MCU_RESETSTATz, and RESETSTATz Switching Characteristics

see Figure 6-9
NO. PARAMETER MIN MAX UNIT
Delay time, MCU_RESETz active (low) to
RST11 td(MCU_RESETzL-MCU_RESETSTATzL) 0 ns
MCU_RESETSTATz active (low)
Delay time, MCU_RESETz inactive (high) to
RST12 td(MCU_RESETzH-MCU_RESETSTATzH) 966*S(1) ns
MCU_RESETSTATz inactive (high)
RST13 td(MCU_RESETzL-RESETSTATzL) Delay time, MCU_RESETz active (low) to
960 ns
RESETSTATz active (low)
RST14 td(MCU_RESETzH-RESETSTATzH) Delay time, MCU_RESETz inactive (high) to
4040*S(1) ns
RESETSTATz inactive (high)

(1) S = MCU_OSC0_XI/XO clock period in ns.

Figure 6-9. MCU_RESETz, MCU_RESETSTATz, and RESETSTATz Timing Requirements and Switching
Characteristics

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Table 6-12. RESET_REQz Timing Requirements

see Figure 6-10
NO. PARAMETER MIN MAX UNIT
RST15 tw(RESET_REQzL) (1) Pulse Width, RESET_REQz active (low) 1200 ns

(1) This timing parameter is valid only after all supplies are valid and MCU_PORz has been asserted for the specified time.

Table 6-13. RESETSTATz Switching Characteristics

see Figure 6-10
NO. PARAMETER MIN MAX UNIT
Delay time, RESET_REQz active (low) to
RST16 td(RESET_REQzL-RESETSTATzL) 900*T(1) ns
RESETSTATz active (low)
Delay time, RESET_REQz inactive (high) to
RST17 td(RESET_REQzH-RESETSTATzH) 4040*S(2) ns
RESETSTATz inactive (high)

(1) T = Reset Isolation Time (Software Dependent)

(2) S = MCU_OSC0_XI/XO clock period in ns.

Figure 6-10. RESET_REQz and RESETSTATz Timing Requirements and Switching Characteristics

Table 6-14. EMUx Timing Requirements

see Figure 6-11
NO. PARAMETER MIN MAX UNIT
Setup time, EMU[1:0] before MCU_PORz inactive
RST18 tsu(EMUx-MCU_PORz) 3*S(1) ns
(high)
Hold time, EMU[1:0] after MCU_PORz inactive
RST19 th(MCU_PORz - EMUx) 10 ns
(high)

(1) S = MCU_OSC0_XI/XO clock period in ns.

Figure 6-11. EMUx Timing Requirements

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Table 6-15. BOOTMODE Timing Requirements

see Figure 6-12
NO. PARAMETER MIN MAX UNIT
Setup time, BOOTMODE[15:00] valid before
RST23 tsu(BOOTMODE-PORz_OUT) PORz_OUT high (External MCU PORz event or 3*S(1) ns
Software SW_MAIN_PORz)
Hold time, BOOTMODE[15:00] valid after
RST24 th(PORz_OUT - BOOTMODE) PORz_OUT high (External MCU PORz event, or 0 ns
Software SW_MAIN_PORz)

(1) S = MCU_OSC0_XI/XO clock period in ns.

Table 6-16. PORz_OUT Switching Characteristics

see Figure 6-12
NO. PARAMETER MIN MAX UNIT
Delay time, MCU_PORz active (low) to
RST25 td(MCU_PORzL-PORz_OUT) 0 ns
PORz_OUT active (low)
Delay time, MCU_PORz inactive (high) to
RST26 td(MCU_PORzH-PORz_OUT) 1840 ns
PORz_OUT inactive (high)
Pulse Width, PORz_OUT low (MCU_PORz or
RST27 tw(PORz_OUTL) 1200 ns
SW_MAIN_PORz)

Figure 6-12. BOOTMODE Timing Requirements and PORz_OUT Switching Characteristics

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[Link] Error Signal Timing

Tables and figures provided in this section define timing conditions and switching characteristics for
MCU_ERRORn.
Table 6-17. Error Signal Timing Conditions
PARAMETER MIN MAX UNIT
OUTPUT CONDITIONS
CL Output load capacitance 30 pF

Table 6-18. MCU_ERRORn Switching Characteristics

see Figure 6-13
NO. PARAMETER MIN MAX UNIT
Cycle time minimum, MCU_ERRORn (PWM
ERR1 tc(MCU_ERRORn) (P*H)+(P*L)(1) (3) (4) ns
mode enabled)
Pulse width minimum, MCU_ERRORn active
ERR2 tw(MCU_ERRORn) P*R(1) (2) ns
(PWM mode disabled)(5)
td (ERROR_CONDITION- Delay time, ERROR CONDITION to
ERR3 50*P(1) ns
MCU_ERRORnL) MCU_ERRORn active(5)

(1) P = ESM functional clock period in ns.

(2) R = Error Pin Counter Pre-Load Register count value.
(3) H = Error Pin PWM High Pre-Load Register count value.
(4) L = Error Pin PWM Low Pre-Load Register count value.
(5) When PWM mode is enabled, MCU_ERRORn stops toggling after ERR3 and will maintain its value (either high or low) until the error is
cleared. When PWM mode is disabled, MCU_ERRORn is active low.

Internal Error Condition

(Active High)

ERR1

MCU_ERRORn
(PWM Mode Enabled)

ERR2
ERR3
MCU_ERRORn
(PWM Mode Disabled)

Figure 6-13. MCU_ERRORn Timing Requirements and Switching Characteristics

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Table 6-20. Clock Timing Requirements

see Figure 6-14
NO. MIN MAX UNIT
CLK1 tc(EXT_REFCLK1) Cycle time minimum, EXT_REFCLK1 10 ns
CLK2 tw(EXT_REFCLK1H) Pulse Duration, EXT_REFCLK1 high E*0.45(1) E*0.55(1) ns
CLK3 tw(EXT_REFCLK1L) Pulse Duration, EXT_REFCLK1 low E*0.45(1) E*0.55(1) ns
CLK1 tc(MCU_EXT_REFCLK0) Cycle time minimum, MCU_EXT_REFCLK0 10 ns
CLK2 tw(MCU_EXT_REFCLK0H) Pulse Duration, MCU_EXT_REFCLK0 high F*0.45(2) F*0.55(2) ns
CLK3 tw(MCU_EXT_REFCLK0L) Pulse Duration, MCU_EXT_REFCLK0 low F*0.45(2) F*0.55(2) ns
CLK1 tc(AUDIO_EXT_REFCLK0) Cycle time minimum, AUDIO_EXT_REFCLK0 20 ns
CLK2 tw(AUDIO_EXT_REFCLK0H) Pulse Duration, AUDIO_EXT_REFCLK0 high G*0.45(3) G*0.55(3) ns
CLK3 tw(AUDIO_EXT_REFCLK0L) Pulse Duration, AUDIO_EXT_REFCLK0 low G*0.45(3) G*0.55(3) ns
CLK1 tc(AUDIO_EXT_REFCLK1) Cycle time minimum, AUDIO_EXT_REFCLK1 20 ns
CLK2 tw(AUDIO_EXT_REFCLK1H) Pulse Duration, AUDIO_EXT_REFCLK1 high H*0.45(4) H*0.55(4) ns
CLK3 tw(AUDIO_EXT_REFCLK1L) Pulse Duration, AUDIO_EXT_REFCLK1 low H*0.45(4) H*0.55(4) ns

(1) E = EXT_REFCLK1 cycle time in ns.

(2) F = MCU_EXT_REFCLK0 cycle time in ns.
(3) G = AUDIO_EXT_REFCLK0 cycle time in ns.
(4) H = AUDIO_EXT_REFCLK1 cycle time in ns.

CLK1
CLK2 CLK3

Input Clock

Figure 6-14. Clock Timing Requirements

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Table 6-21. Clock Switching Characteristics

see Figure 6-15
NO. PARAMETER MIN MAX UNIT
CLK4 tc(SYSCLKOUT0) Cycle time minimum,SYSCLKOUT0 8 ns
CLK5 tw(SYSCLKOUT0H) Pulse Duration, SYSCLKOUT0 high A*0.4(1) A*0.6(1) ns
CLK6 tw(SYSCLKOUT0L) Pulse Duration, SYSCLKOUT0 low A*0.4(1) A*0.6(1) ns
CLK4 tc(OBSCLK0) Cycle time minimum, OBSCLK0 5 ns
CLK5 tw(OBSCLK0H) Pulse Duration, OBSCLK0 high B*0.45(2) B*0.55(2) ns
CLK6 tw(OBSCLK0L) Pulse Duration, OBSCLK0 low B*0.45(2) B*0.55(2) ns
CLK4 tc(CLKOUT0) Cycle time minimum, CLKOUT0 20 ns
CLK5 tw(CLKOUT0H) Pulse Duration, CLKOUT0 high C*0.4(3) C*0.6(3) ns
CLK6 tw(CLKOUT0L) Pulse Duration, CLKOUT0 low C*0.4(3) C*0.6(3) ns
CLK4 tc(MCU_SYSCLKOUT0) Cycle time minimum, MCU_SYSCLKOUT0 10 ns
CLK5 tw(MCU_SYSCLKOUT0H) Pulse Duration, MCU_SYSCLKOUT0 high E*0.4(4) E*0.6(4) ns
CLK6 tw(MCU_SYSCLKOUT0L) Pulse Duration, MCU_SYSCLKOUT0 low E*0.4(4) E*0.6(4) ns
CLK4 tc(MCU_OBSCLK0) Cycle time minimum, MCU_OBSCLK0 5 ns
CLK5 tw(MCU_OBSCLK0H) Pulse Duration, MCU_OBSCLK0 high D*0.45(5) D*0.55(5) ns
CLK6 tw(MCU_OBSCLK0L) Pulse Duration, MCU_OBSCLK0 low D*0.45(5) D*0.55(5) ns
CLK4 tc(WKUP_CLKOUT0) Cycle time minimum, WKUP_CLKOUT0 5 ns
CLK5 tw(WKUP_CLKOUT0H) Pulse Duration, WKUP_CLKOUT0 high W*0.4(6) W*0.6(6) ns
CLK6 tw(WKUP_CLKOUT0L) Pulse Duration, WKUP_CLKOUT0 low W*0.4(6) W*0.6(6) ns
Cycle time minimum, AUDIO_EXT_REFCLK0
20 ns
(McASP Clock Source)
CLK4 tc(AUDIO_EXT_REFCLK0 )
Cycle time minimum, AUDIO_EXT_REFCLK0
10 ns
(PLL Clock Source)
CLK5 tw(AUDIO_EXT_REFCLK0 H) Pulse Duration, AUDIO_EXT_REFCLK0 high G*0.4(7) G*0.6(7) ns
CLK6 tw(AUDIO_EXT_REFCLK0 L) Pulse Duration, AUDIO_EXT_REFCLK0 low G*0.4(7) G*0.6(7) ns
Cycle time minimum, AUDIO_EXT_REFCLK1
20 ns
(McASP Clock Source)
CLK4 tc(AUDIO_EXT_REFCLK1 )
Cycle time minimum, AUDIO_EXT_REFCLK1
10 ns
(PLL Clock Source)
CLK5 tw(AUDIO_EXT_REFCLK1 H) Pulse Duration, AUDIO_EXT_REFCLK1 high J*0.4(8) J*0.6(8) ns
CLK6 tw(AUDIO_EXT_REFCLK1 L) Pulse Duration, AUDIO_EXT_REFCLK1 low J*0.4(8) J*0.6(8) ns

(1) A = SYSCLKOUT0 cycle time in ns.

(2) B = OBSCLK0 cycle time in ns.
(3) C = CLKOUT0 cycle time in ns.
(4) E = MCU_SYSCLKOUT0 cycle time in ns.
(5) D = MCU_OBSCLK0 cycle time in ns.
(6) W = WKUP_CLKOUT0 cycle time in ns.
(7) G = AUDIO_EXT_REFCLK0 cycle time in ns.
(8) J = AUDIO_EXT_REFCLK1 cycle time in ns.

CLK4
CLK5 CLK6

Output Clock

Figure 6-15. Clock Switching Characteristics

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6.12.4 Clock Specifications

[Link] Input Clocks / Oscillators
Various external clock inputs/outputs are needed to drive the device. Summary of these input clock signals is as
follows:
• MCU_OSC0_XO/MCU_OSC0_XI — external main crystal interface pins connected to the internal high-
frequency oscillator (MCU_HFOSC0), which is the default clock source for internal reference clock
HFOSC0_CLKOUT.
• WKUP_LFOSC0_XO/WKUP_LFOSC0_XI — external crystal interface pins connected to internal low-
frequency oscillator (WKUP_LFOSC0), which sources optional 32768Hz reference clock.
• General purpose clock inputs
– MCU_EXT_REFCLK0 — optional external system clock.
– EXT_REFCLK1 — optional external system clock.
• External video pixel clock input
– VOUT0_EXTPCLKIN — optional for the DPI0 port of DSS.
• External CPTS reference clock input
– CP_GEMAC_CPTS0_RFT_CLK — optional reference clock input for CPTS_RFT_CLK.
• External audio reference clock inputs/outputs
– AUDIO_EXT_REFCLK[1:0] — optional McASP high-frequency input clocks when configured to operate as
an input.
For more information about Input clock interfaces, see Clocking section in Device Configuration chapter in the
device TRM.

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[Link].1 MCU_OSC0 Internal Oscillator Clock Source

Figure 6-16 shows the recommended crystal circuit. All discrete components used to implement the oscillator
circuit must be placed as close as possible to the MCU_OSC0_XI and MCU_OSC0_XO pins.

Device

MCU_OSC0_XI MCU_OSC0_XO

Crystal

CL1 CL2

PCB Ground
AM65x_MCU_OSC_INT_01

Figure 6-16. MCU_OSC0 Crystal Implementation

The crystal must be in the fundamental mode of operation and parallel resonant. Table 6-22 summarizes the
required electrical constraints.
Table 6-22. MCU_OSC0 Crystal Circuit Requirements
PARAMETER MIN TYP MAX UNIT
Fxtal Crystal Parallel Resonance Frequency 25 MHz
Fxtal Crystal Frequency Stability and Tolerance Ethernet RGMII and RMII ±100 ppm
not used
Ethernet RGMII and RMII ±50
using derived clock
CL1+PCBXI Capacitance of CL1 + CPCBXI 12 24 pF
CL2+PCBXO Capacitance of CL2 + CPCBXO 12 24 pF
CL Crystal Load Capacitance 6 12 pF
Cshunt Crystal Circuit Shunt Capacitance ESRxtal = 30Ω 25MHz 7 pF
ESRxtal = 40Ω 25MHz 5 pF
ESRxtal = 50Ω 25MHz 5 pF
ESRxtal Crystal Effective Series Resistance (1) Ω

(1) The maximum ESR of the crystal is a function of the crystal frequency and shunt capacitance. See the Cshunt parameter.

When selecting a crystal, the system design must consider temperature and aging characteristics of the crystal
based on worst case environment and expected life expectancy of the system.
Table 6-23 details the switching characteristics of the oscillator.
Table 6-23. MCU_OSC0 Switching Characteristics - Crystal Mode
PARAMETER PACKAGE MIN TYP MAX UNIT
CXI XI Capacitance ALW 0.812 pF
AMC 1.635 pF
CXO XO Capacitance ALW 0.83 pF
AMC 1.72 pF

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Table 6-23. MCU_OSC0 Switching Characteristics - Crystal Mode (continued)

PARAMETER PACKAGE MIN TYP MAX UNIT
CXIXO XI to XO Mutual Capacitance ALW 0.0114 pF
AMC 0.267 pF
ts Start-up Time 4 ms

VDD_CORE (min.)
VDD_CORE
VSS
Voltage

VDDS_OSC0 (min.) VDDS_OSC0

VSS MCU_OSC0_XO

tsX

Time

AM65x_MCU_OSC_STARTUP_02

Figure 6-17. MCU_OSC0 Start-up Time

[Link].1.1 Load Capacitance

The crystal circuit must be designed such that it applies the appropriate capacitive load to the crystal, as defined
by the crystal manufacturer. The capacitive load, CL, of this circuit is a combination of discrete capacitors
CL1, CL2, and several parasitic contributions. PCB signal traces which connect crystal circuit components to
MCU_OSC0_XI and MCU_OSC0_XO have parasitic capacitance to ground, CPCBXI and CPCBXO, where the
PCB designer should be able to extract parasitic capacitance for each signal trace. The MCU_OSC0 circuits
and device package have combined parasitic capacitance to ground, CPCBXI and CPCBXO, where these parasitic
capacitance values are defined in Table 6-23.

Device
Crystal Circuit PCB
Components Signal Traces
MCU_OSC0_XI

CL1 CPCBXI CXI

CL2 CPCBXO CXO

MCU_OSC0_XO

AM65x_MCU_OSC_CC_05

Figure 6-18. Load Capacitance

Load capacitors, CL1 and CL2 in Figure 6-16, should be chosen such that the below equation is satisfied. CL in
the equation is the load specified by the crystal manufacturer.
CL = [(CL1 + CPCBXI + CXI) × (CL2 + CPCBXO + CXO)] / [(CL1 + CPCBXI + CXI) + (CL2 + CPCBXO + CXO)]

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To determine the value of CL1 and CL2, multiply the capacitive load value CL by 2. Using this result, subtract
the combined values of CPCBXI + CXI to determine the value of CL1 and the combined values of CPCBXO + CXO
to determine the value of CL2. For example, if CL = 10pF, CPCBXI = 2.9pF, CXI = 0.5pF, CPCBXO = 3.7pF, CXO =
0.5pF, the value of CL1 = [(2CL) - (CPCBXI + CXI)] = [(2 × 10pF) - 2.9pF - 0.5pF)] = 16.6pF and CL2 = [(2CL) -
(CPCBXO + CXO)] = [(2 × 10pF) - 3.7pF - 0.5pF)] = 15.8pF
[Link].1.2 Shunt Capacitance
The crystal circuit must also be designed such that it does not exceed the maximum shunt capacitance for
MCU_OSC0 operating conditions defined in Table 6-22. Shunt capacitance, Cshunt, of the crystal circuit is a
combination of crystal shunt capacitance and parasitic contributions. PCB signal traces which connect crystal
circuit components to MCU_OSC0 have mutual parasitic capacitance to each other, CPCBXIXO, where the PCB
designer should be able to extract mutual parasitic capacitance between these signal traces. The device
package also has mutual parasitic capacitance, CXIXO, where this mutual parasitic capacitance value is defined
in Table 6-23.
PCB routing should be designed to minimize mutual capacitance between XI and XO signal traces. This is
typically done by keeping signal traces short and not routing them in close proximity. Mutual capacitance can
also be minimized by placing a ground trace between these signals when the layout requires them to be routed
in close proximity. It is important to minimize the mutual capacitance on the PCB to provide as much margin as
possible when selecting a crystal.

Device
Crystal Circuit PCB
Components Signal Traces
MCU_OSC0_XI

CPCBXIXO CXIXO
CO

MCU_OSC0_XO

AM65x_MCU_OSC_SC_06

Figure 6-19. Shunt Capacitance

A crystal should be chosen such that the below equation is satisfied. CO in the equation is the maximum shunt
capacitance specified by the crystal manufacturer.
Cshunt ≥ CO + CPCBXIXO + CXIXO
For example, the equation would be satisfied when the crystal being used is 25MHz with an ESR = 30Ω,
CPCBXIXO = 0.04pF, CXIXO = 0.01pF, and shunt capacitance of the crystal is less than or equal to 6.95pF.

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[Link].2 MCU_OSC0 LVCMOS Digital Clock Source

Figure 6-20 shows the recommended oscillator connections when MCU_OSC0_XI is connected to a 1.8V
LVCMOS square-wave digital clock source.

Note
1. A DC steady-state condition is not allowed on MCU_OSC0_XI when the oscillator is powered up.
This is not allowed because MCU_OSC0_XI is internally AC coupled to a comparator that can
enter an unknown state when DC is applied to the input. Therefore, application software must
power down MCU_OSC0 any time MCU_OSC0_XI is not toggling between logic states.

2. The LVCMOS clock signal sourcing the MCU_OSC0_XI input must have monotonic transitions.
The clock source should be connected to MCU_OSC0_XI with a point-to-point connection,
via a series termination resistor placed near the clock source. The series termination resistor
value should match the clock source output impedance to the transmission line impedance. For
example, the series termination resistor value needs to be 20 ohms if the clock source has an
output impedance of 30 ohms and the PCB signal trace has a characteristic impedance of 50
ohms. This allows the reflection that returns from the far end of the un-terminated transmission
line to be completely absorbed such that is does not introduce any non-monotonic events on the
signal.

3. The PCB trace length connecting the LVCMOS clock source to MCU_OSC0_XI should be
minimized. This reduces capacitive loading and decreases probability of external noise sources
coupling into the clock signal. Reduced capacitive loading improves rise/fall times of the clock
signal which reduces the probability of jitter being introduced in the system.

Device

MCU_OSC0_XI MCU_OSC0_XO

PCB Ground

AM65x_MCU_OSC_EXT_CLK_03

Figure 6-20. 1.8V LVCMOS-Compatible Clock Input

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Table 6-24. MCU_OSC0 LVCMOS Digital Clock Source Requirements

PARAMETER MIN TYP MAX UNIT
Frequency 25 MHz
Ethernet RGMII and RMII
±100
Fxtal not used
Frequency Stability and Tolerance ppm
Ethernet RGMII and RMII
±50
using derived clock
DC Duty Cycle 45 55 %
tR/F Rise/Fall Time (10%-90% rise, 90%-10% fall) 4(1) ns
JPeriod(RMS) Period Jitter, RMS (100k samples) 20 ps
JPeriod(PK-PK) Period Jitter, Peak to Peak (100k samples) 300 ps
JPhase(RMS) Phase Jitter, RMS (BW 100Hz to 1MHz) 10(2) ps

(1) Most LVCMOS oscillator datasheets define their maximum Output Rise/Fall times with a capacitive load much larger than the actual
load that will be applied by the combined PCB trace capacitance and MCU_OSC0_XI input capacitance. It should not be difficult to
find a LVCMOS oscillator that meets this requirement. However, the system designer must confirm the LVCMOS oscillator selected will
provide the appropriate rise/fall time to MCU_OSC0_XI input.
(2) Most LVCMOS oscillator datasheets define their max RMS Phase Jitter using a larger bandwidth integration range than required by
this device. To get a more appropriate value, it may be necessary to contact the LVCMOS oscillator manufacture and ask them to
provide a maximum RMS Phase Jitter using the same bandwidth integration range that has been defined for this parameter.

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[Link].3 WKUP_LFOSC0 Internal Oscillator Clock Source

Figure 6-21 shows the recommended crystal circuit. It is recommended that preproduction printed-circuit board
(PCB) designs include the two optional resistors Rbias and Rd in case they are required for proper oscillator
operation when combined with production crystal circuit components. In most cases, Rbias is not required and
Rd is a 0-Ω resistor. These resistors may be removed from production PCB designs after evaluating oscillator
performance with production crystal circuit components installed on preproduction PCBs.

Device

WKUP_LFOSC0_XI WKUP_LFOSC0_XO

Rd
Crystal (Optional)

(Optional) Rbias

Cf1 Cf2

PCB Ground

J7ES_LF_OSC_INT_12

Figure 6-21. WKUP_LFOSC0 Crystal Implementation

Table 6-25 presents LFXOSC modes of operation.

Table 6-25. LFXOSC Modes of Operation
MODE BP_C PD_C XI XO CLK_OUT DESCRIPTION
ACTIVE 0 0 XTAL XTAL CLK_OUT Active oscillator mode providing 32kHz
PWRDN 0 1 X PD LOW Output will be pulled down to LOW. PAD to be tri-stated. Active mode
disabled
BYPASS 1 0 CLK PD CLK XI is driven by external clock source. XO is pulled down to LOW. Due to ESD
diode to supply, XI should not be driven unless oscillator supply is present.

Note
User should set CTRLMMR_WKUP_LFXOSC_TRIM[18:16] i_mult = 3b’001 for CL in the range 6pf to
9.5pf. CTRLMMR_WKUP_LFXOSC_TRIM [18:16] i_mult = 3b’010 for CL in the range 8.5pf to 12pf.
Default setting is 3b’010.

Note
The load capacitors, Cf1 and Cf2 in Figure 6-22, should be chosen such that the below equation is
satisfied. CL in the equation is the load specified by the crystal manufacturer. All discrete components
used to implement the oscillator circuit should be placed as close as possible to the associated
oscillator WKUP_LFOSC0_XI, WKUP_LFOSC0_XO, and VSS pins.

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Cf1Cf2
CL=
(Cf1+Cf2)
J7ES_CL_MATH_03

Figure 6-22. Load Capacitance Equation

The crystal must be in the fundamental mode of operation and parallel resonant. Table 6-26 summarizes the
required electrical constraints.
Table 6-26. WKUP_LFOSC0 Crystal Electrical Characteristics
NAME DESCRIPTION MIN TYP MAX UNIT
Parallel resonance crystal frequency 32768 Hz
fp
Crystal Frequency Stability and Tolerance ±100 PPM
Cf1 Cf1 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
Cf2 Cf2 load capacitance for crystal parallel resonance with Cf1 = Cf2 12 24 pF
ESRxtal – 40 kΩ 4 pF
ESRxtal – 60 kΩ 3 pF
Cshunt Shunt capacitance
ESRxtal – 80 kΩ 2 pF
ESRxtal – 100 kΩ 1 pF
ESR Crystal effective series resistance (1) Ω

(1) The maximum ESR of the crystal is a function of the crystal frequency and shunt capacitance. See the Cshunt parameter.

When selecting a crystal, the system design must consider the temperature and aging characteristics of a based
on the worst case environment and expected life expectancy of the system.
Table 6-27 details the switching characteristics of the oscillator and the requirements of the input clock.
Table 6-27. WKUP_LFOSC0 Switching Characteristics – Crystal Mode
NAME DESCRIPTION MIN TYP MAX UNIT
fxtal Oscillation frequency 32768 Hz
tsX Start-up time 96.5 ms

VDD_CORE (min.)
VDD_CORE
VSS
Voltage

VDDS_OSC0 (min.) VDDS_OSC0

WKUP_LFOSC0_XO
VSS
tsX

Time
LFXOSC_STARTUP_02

Figure 6-23. WKUP_LFOSC0 Start-up Time

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[Link].4 WKUP_LFOSC0 LVCMOS Digital Clock Source

Figure 6-24 shows the recommended oscillator connections when WKUP_LFOSC0_XI is connected to a 1.8V
LVCMOS square-wave digital clock source.

Device

WKUP_LFOSC0_XI WKUP_LFOSC0_XO

PCB Ground

AM62x_MCU_OSC_EXT_CLK_03

Figure 6-24. 1.8V LVCMOS-Compatible Clock Input

[Link].5 WKUP_LFOSC0 Not Used

Figure 6-25 shows the recommended oscillator connections when WKUP_LFOSC0 is not used.

Device

WKUP_LFOSC0_XI WKUP_LFOSC0_XO

NC
PCB Ground

Figure 6-25. WKUP_LFOSC0 Not Used

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[Link] Output Clocks

The device provides several system clock outputs. Summary of these output clocks are as follows:
• MCU_SYSCLKOUT0
– MCU_PLL0_HSDIV0_CLKOUT (MCU_SYSCLKOUT0) divided by 4 and sent out of the device as
MCU_SYSCLKOUT0. This clock output is provided for test and debug purposes only.
• MCU_OBSCLK0
– Observation clock output for test and debug purposes only.
• WKUP_CLKOUT0
– WKUP domain CLKOUT0 output.
• SYSCLKOUT0
– MAIN_PLL0_HSDIV0_CLKOUT (SYSCLKOUT0) divided by 4 and then sent out of the device as
SYSCLKOUT0. This clock output is provided for test and debug purposes only.
• CLKOUT0
– CLKOUT0 is the Ethernet subsystem clock (MAIN_PLL2_HSDIV1_CLKOUT) divided-by-5 or divided-
by-10. This clock output was provided as an optional source to the external PHY. When configured
to operate as the RMII Clock source (50MHz) the signal must also be routed back to the respective
RMII[x]_REF_CLK pin for proper device operation.
• OBSCLK0
– Observation clock output for test and debug purposes only.
• AUDIO_EXT_REFCLK[1:0]
– Option of sourcing one of six McASP high-frequency audio reference clocks,
MAIN_PLL1_HSDIV6_CLKOUT, or MAIN_PLL2_HSDIV8_CLKOUT when configured to operate as an
output.
[Link] PLLs
Power is supplied to the Phase-Locked Loop circuits (PLLs) by internal regulators that derive their power from
off-chip power-sources.
There is one PLL in the MCU domain:
• MCU_PLL0 (MCU PLL)
There are eight PLLs in the MAIN domain:
• MAIN_PLL0 (MAIN PLL)
• MAIN_PLL1 (PER0 PLL)
• MAIN_PLL2 (PER1 PLL)
• MAIN_PLL8 (ARM0 PLL)
• MAIN_PLL12 (DDR PLL)
• MAIN_PLL15 (SMS_PLL)
• MAIN_PLL16 (DSS0 PLL)
• MAIN_PLL17 (DSS1 PLL)
The system designer should consider the reference clock source start-up time and the PLL lock requirements
before configuring and using any of the PLL outputs as clock sources. The device reference clock input
requirements are defined in Section [Link], Input Clocks / Oscillators. PLL configuration details are described
in the device TRM.
For more information on PLLs, see the PLL subsection in the Clocking subsection of the Device Configuration
section in the device TRM.

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[Link] Recommended System Precautions for Clock and Control Signal Transitions
All clock and strobe signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
Monotonic transitions are more likely to occur with fast signal transitions. It is easy for noise to create non-
monotonic events on a signal with slow transitions. Therefore, avoid slow signal transitions on all clock and
control signals since they are more likely to generate glitches inside the device.

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6.12.5 Peripherals
[Link] CPSW3G
For more details about features and additional description information on the device Gigabit Ethernet MAC, see
the corresponding subsections within Signal Descriptions and Detailed Description sections.
[Link].1 CPSW3G MDIO Timing
Table 6-28, Table 6-29, Table 6-30, and Figure 6-26 present timing conditions, timing requirements, and
switching characteristics for CPSW3G MDIO.
Table 6-28. CPSW3G MDIO Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.9 3.6 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 10 470 pF
PCB CONNECTIVITY REQUIREMENTS
td(Trace Delay) Propagation delay of each trace 0 5 ns
td(Trace Mismatch Delay) Propagation delay mismatch across all traces 1 ns

Table 6-29. CPSW3G MDIO Timing Requirements

see Figure 6-26
NO. PARAMETER MIN MAX UNIT
MDIO1 tsu(MDIO_MDC) Setup time, MDIO[x]_MDIO valid before MDIO[x]_MDC high 45 ns
MDIO2 th(MDC_MDIO) Hold time, MDIO[x]_MDIO valid after MDIO[x]_MDC high 0 ns

Table 6-30. CPSW3G MDIO Switching Characteristics

see Figure 6-26
NO. PARAMETER MIN MAX UNIT
MDIO3 tc(MDC) Cycle time, MDIO[x]_MDC 400 ns
MDIO4 tw(MDCH) Pulse Duration, MDIO[x]_MDC high 160 ns
MDIO5 tw(MDCL) Pulse Duration, MDIO[x]_MDC low 160 ns
MDIO7 td(MDC_MDIO) Delay time, MDIO[x]_MDC low to MDIO[x]_MDIO valid -10 10 ns

MDIO3
MDIO4
MDIO5
MDIO[x]_MDC

MDIO1

MDIO2

MDIO[x]_MDIO
(input)

MDIO7

MDIO[x]_MDIO
(output)
CPSW2G_MDIO_TIMING_01

Figure 6-26. CPSW3G MDIO Timing Requirements and Switching Characteristics

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[Link].2 CPSW3G RMII Timing

Table 6-31, Table 6-32, Figure 6-27, Table 6-33, Figure 6-28, Table 6-34, and Figure 6-29 present timing
conditions, timing requirements, and switching characteristics for CPSW3G RMII.
Table 6-31. CPSW3G RMII Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
VDD(1) = 1.8V 0.18 5
SRI Input slew rate V/ns
VDD(1) = 3.3V 0.4 5
OUTPUT CONDITIONS
CL Output load capacitance 3 25 pF

(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.

Table 6-32. RMII[x]_REF_CLK Timing Requirements – RMII Mode

see Figure 6-27
NO. PARAMETER DESCRIPTION MIN MAX UNIT
RMII1 tc(REF_CLK) Cycle time, RMII[x]_REF_CLK 19.999 20.001 ns
RMII2 tw(REF_CLKH) Pulse Duration, RMII[x]_REF_CLK High 7 13 ns
RMII3 tw(REF_CLKL) Pulse Duration, RMII[x]_REF_CLK Low 7 13 ns

RMII1

RMII2

RMII[x]_REF_CLK

RMII3

Figure 6-27. CPSW3G RMII[x]_REF_CLK Timing Requirements – RMII Mode

Table 6-33. RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
see Figure 6-28
NO. PARAMETER DESCRIPTION MIN MAX UNIT
RMII4 tsu(RXD-REF_CLK) Setup time, RMII[x]_RXD[1:0] valid before RMII[x]_REF_CLK 4 ns
tsu(CRS_DV-REF_CLK) Setup time, RMII[x]_CRS_DV valid before RMII[x]_REF_CLK 4 ns
tsu(RX_ER-REF_CLK) Setup time, RMII[x]_RX_ER valid before RMII[x]_REF_CLK 4 ns
RMII5 th(REF_CLK-RXD) Hold time RMII[x]_RXD[1:0] valid after RMII[x]_REF_CLK 2 ns
th(REF_CLK-CRS_DV) Hold time, RMII[x]_CRS_DV valid after RMII[x]_REF_CLK 2 ns
th(REF_CLK-RX_ER) Hold time, RMII[x]_RX_ER valid after RMII[x]_REF_CLK 2 ns

RMII4

RMII5

RMII[x]_REF_CLK

RMII[x]_RXD[1:0], RMII[x]_CRS_DV,
RMII[x]_RX_ER

Figure 6-28. CPSW3G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, RMII[x]_RX_ER Timing Requirements – RMII

Mode

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Table 6-34. RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode

see Figure 6-29
NO. PARAMETER DESCRIPTION MIN MAX UNIT
RMII6 td(REF_CLK-TXD) Delay time, RMII[x]_REF_CLK High to RMII[x]_ 2 10 ns
TXD[1:0] valid
td(REF_CLK-TX_EN) Delay time, RMII[x]_REF_CLK to RMII[x]_TX_EN 2 10 ns
valid

RMII6

RMII[x]_REF_CLK

RMII[x]_TXD[1:0], RMII[x]_TX_EN

Figure 6-29. RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode

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[Link].3 CPSW3G RGMII Timing

Table 6-35, Table 6-36, Table 6-37, Figure 6-30, Table 6-38, Table 6-39, and Figure 6-31 present timing
conditions, timing requirements, and switching characteristics for CPSW3G RGMII.
Table 6-35. CPSW3G RGMII Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
VDD(1) = 1.8V 1.44 5
SRI Input slew rate V/ns
VDD(1) = 3.3V 2.64 5
OUTPUT CONDITIONS
CL Output load capacitance 2 20 pF
PCB CONNECTIVITY REQUIREMENTS
RGMII[x]_RXC,
RGMII[x]_RD[3:0], 50 ps
td(Trace Mismatch RGMII[x]_RX_CTL
Propagation delay mismatch across all traces
Delay) RGMII[x]_TXC,
RGMII[x]_TD[3:0], 50 ps
RGMII[x]_TX_CTL

(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.

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Table 6-36. RGMII[x]_RXC Timing Requirements – RGMII Mode

see Figure 6-30
NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
RGMII1 tc(RXC) Cycle time, RGMII[x]_RXC 10Mbps 360 440 ns
100Mbps 36 44 ns
1000Mbps 7.2 8.8 ns
RGMII2 tw(RXCH) Pulse duration, RGMII[x]_RXC high 10Mbps 160 240 ns
100Mbps 16 24 ns
1000Mbps 3.6 4.4 ns
RGMII3 tw(RXCL) Pulse duration, RGMII[x]_RXC low 10Mbps 160 240 ns
100Mbps 16 24 ns
1000Mbps 3.6 4.4 ns

Table 6-37. RGMII[x]_RD[3:0], and RGMII[x]_RX_CTL Timing Requirements – RGMII Mode

see Figure 6-30
NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
RGMII4 tsu(RD-RXC) Setup time, RGMII[x]_RD[3:0] valid before RGMII[x]_RXC 10Mbps 1 ns
high/low
100Mbps 1 ns
1000Mbps 1 ns
tsu(RX_CTL-RXC) Setup time, RGMII[x]_RX_CTL valid before RGMII[x]_RXC 10Mbps 1 ns
high/low
100Mbps 1 ns
1000Mbps 1 ns
RGMII5 th(RXC-RD) Hold time, RGMII[x]_RD[3:0] valid after RGMII[x]_RXC 10Mbps 1 ns
high/low
100Mbps 1 ns
1000Mbps 1 ns
th(RXC-RX_CTL) Hold time, RGMII[x]_RX_CTL valid after RGMII[x]_RXC 10Mbps 1 ns
high/low
100Mbps 1 ns
1000Mbps 1 ns

RGMII1

RGMII2
RGMII3
(A)
RGMII[x]_RXC

RGMII4

RGMII5
(B)
RGMII[x]_RD[3:0] 1st Half-byte 2nd Half-byte

(B)
RGMII[x]_RX_CTL RXDV RXERR

A. RGMII[x]_RXC must be externally delayed relative to the data and control pins.
B. Data and control information is received using both edges of the clocks. RGMII[x]_RD[3:0] carries data bits 3-0 on the rising edge of
RGMII[x]_RXC and data bits 7-4 on the falling edge of RGMII[x]_RXC. Similarly, RGMII[x]_RX_CTL carries RXDV on rising edge of
RGMII[x]_RXC and RXERR on falling edge of RGMII[x]_RXC.

Figure 6-30. CPSW3G RGMII[x]_RXC, RGMII[x]_RD[3:0], RGMII[x]_RX_CTL Timing Requirements - RGMII

Mode

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Table 6-38. RGMII[x]_TXC Switching Characteristics – RGMII Mode

see Figure 6-31
NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
RGMII6 tc(TXC) Cycle time, RGMII[x]_TXC 10Mbps 360 440 ns
100Mbps 36 44 ns
1000Mbps 7.2 8.8 ns
RGMII7 tw(TXCH) Pulse duration, RGMII[x]_TXC high 10Mbps 160 240 ns
100Mbps 16 24 ns
1000Mbps 3.6 4.4 ns
RGMII8 tw(TXCL) Pulse duration, RGMII[x]_TXC low 10Mbps 160 240 ns
100Mbps 16 24 ns
1000Mbps 3.6 4.4 ns

Table 6-39. RGMII[x]_TD[3:0] and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode

see Figure 6-31
NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
RGMII9 tosu(TD-TXC) Output setup time(1), RGMII[x]_TD[3:0] valid to 10Mbps 1.2 ns
RGMII[x]_TXC high/low
100Mbps 1.2 ns
1000Mbps 1.2 ns
tosu(TX_CTL-TXC) Output setup time(1),
RGMII[x]_TX_CTL valid to 10Mbps 1.2 ns
RGMII[x]_TXC high/low
100Mbps 1.2 ns
1000Mbps 1.2 ns
RGMII10 toh(TXC-TD) Output hold time(1), RGMII[x]_TD[3:0] valid after 10Mbps 1.2 ns
RGMII[x]_TXC high/low
100Mbps 1.2 ns
1000Mbps 1.2 ns
toh(TXC-TX_CTL) Output hold time(1),
RGMII[x]_TX_CTL valid after 10Mbps 1.2 ns
RGMII[x]_TXC high/low
100Mbps 1.2 ns
1000Mbps 1.2 ns

(1) Output setup/hold times are defining a delay relationship of the transmit data and control outputs relative to the transmit clock output,
but this output relationship is being presented as the minimum setup/hold times provided to the attached receiver. This approach
matches how the output timing relationships are defined in the RGMII specification.
RGMII6

RGMII7
RGMII8
(A)
RGMII[x]_TXC

RGMII9
(B)
RGMII[x]_TD[3:0] 1st Half-byte 2nd Half-byte

RGMII10
(B)
RGMII[x]_TX_CTL TXEN TXERR

A. TXC is delayed internally before being driven to the RGMII[x]_TXC pin. This internal delay is always enabled.
B. Data and control information is received using both edges of the clocks. RGMII[x]_TD[3:0] carries data bits 3-0 on the rising edge of
RGMII[x]_TXC and data bits 7-4 on the falling edge of RGMII[x]_TXC. Similarly, RGMII[x]_TX_CTL carries TXEN on rising edge of
RGMII[x]_TXC and TXERR on falling edge of RGMII[x]_TXC.

Figure 6-31. CPSW3G RGMII[x]_TXC, RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics

- RGMII Mode

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[Link] CPTS
Table 6-40, Table 6-41, Figure 6-32, Table 6-42, and Figure 6-33 present timing conditions, timing requirements,
and switching characteristics for CPTS.
Table 6-40. CPTS Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.5 5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 10 pF

Table 6-41. CPTS Timing Requirements

see Figure 6-32
NO. PARAMETER DESCRIPTION MIN MAX UNIT
T1 tw(HWTSPUSHH) Pulse duration, HWnTSPUSH high 12P(1) + 2 ns
T2 tw(HWTSPUSHL) Pulse duration, HWnTSPUSH low 12P(1) +2 ns
T3 tc(RFT_CLK) Cycle time, RFT_CLK 5 8 ns
T4 tw(RFT_CLKH) Pulse duration, RFT_CLK high 0.45T(2) ns
T5 tw(RFT_CLKL) Pulse duration, RFT_CLK low 0.45T(2) ns

(1) P = functional clock period in ns.

(2) T = RFT_CLK cycle time in ns.
T1 T2

HWn_TSPUSH

T3 T4 T5
RFT_CLK

Figure 6-32. CPTS Timing Requirements

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Table 6-42. CPTS Switching Characteristics

see Figure 6-33
NO. PARAMETER DESCRIPTION SOURCE MIN MAX UNIT
T6 tw(TS_COMPH) Pulse duration, TS_COMP high 36P(1) - 2 ns
T7 tw(TS_COMPL) Pulse duration, TS_COMP low 36P(1) -2 ns
T8 tw(TS_SYNCH) Pulse duration, TS_SYNC high 36P(1) - 2 ns
T9 tw(TS_SYNCL) Pulse duration, TS_SYNC low 36P(1) -2 ns
T10 tw(SYNC_OUTH) Pulse duration, SYNCn_OUT high TS_SYNC 36P(1) - 2 ns
GENF 5P(1) - 2 ns
T11 tw(SYNC_OUTL) Pulse duration, SYNCn_OUT low TS_SYNC 36P(1) -2 ns
GENF 5P(1) - 2 ns

(1) P = functional clock period in ns.

T6 T7

TS_COMP

T8 T9

TS_SYNC

T10 T11

SYNCn_OUT

Figure 6-33. CPTS Switching Characteristics

For more information, see Common Platform Time Sync (CPTS) chapter in the device TRM.
[Link] CSI-2

Note
For more information, see the Camera Serial Interface Receiver (CSI_RX_IF) section in the device
TRM. The CSI_RX_IF is connected to device port instances named CSIRXn, where n is the instance
number.

The CSI_RX_IF and associated D-PHY implements a CSI-2 port (CSIRX0) compliant with the MIPI D-PHY
specification v1.2 and the MIPI CSI-2 specification v1.3, with 4 differential data lanes plus 1 differential clock
lane operating in synchronous double data rate mode. For CSI-2 timing details, see the respective MIPI
specifications mentioned above.
• Support for 1-, 2-, 3- or 4-lane data transfer modes up to 1.5Gbps per lane.

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[Link] DDRSS
For more details about features and additional description information on the device (LP)DDR4 Memory
Interface, see the corresponding subsections within Signal Descriptions and Detailed Description sections.
Table 6-43 and Figure 6-34 present switching characteristics for DDRSS.
Table 6-43. DDRSS Switching Characteristics
see Figure 6-34
NO. PARAMETER DDR TYPE MIN MAX UNIT

tc(DDR_CKP/ LPDDR4 1.25(1) 20 ns

1 Cycle time, DDR_CKP and DDR_CKN
DDR_CKN) DDR4 1.25(1) 1.6 ns

(1) Minimum DDR clock Cycle time will be limited based on the specific memory type (vendor) used in a system and by PCB
implementation. Refer to DDR Board Design and Layout Guidelines for the proper PCB implementation to achieve maximum DDR
frequency.

DDR0_CKP

DDR0_CKN

Figure 6-34. DDRSS Switching Characteristics

For more information, see DDR Subsystem (DDRSS) section in Memory Controllers chapter in the device TRM.

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[Link] DSS
Table 6-44, Table 6-45, Figure 6-35, Table 6-46 and Figure 6-36 present timing conditions, timing requirements,
and switching characteristics for DSS.
Table 6-44. DSS Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1.44 26.4 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 1.5 5 pF
PCB CONNECTIVITY REQUIREMENTS
td(Trace Mismatch Delay) Propagation delay mismatch across all traces 100 ps

Table 6-45. DSS External Pixel Clock Timing Requirements

see Figure 6-35
NO. MIN MAX UNIT
D6 tc(extpclkin) Cycle time, VOUT(x)_EXTPCLKIN(2) 6.06 ns
D7 tw(extpclkinL) Pulse duration, VOUT(x)_EXTPCLKIN(2) low 0.475P(1) ns
D8 tw(extpclkinH) Pulse duration, VOUT(x)_EXTPCLKIN(2) high 0.475P(1) ns

(1) P = VOUT(x)_EXTPCLKIN cycle time in ns

(2) x in VOUT(x) = 0

D6 D8
Falling-edge Clock Reference

VOUT(x)_EXTPCLKIN
Rising-edge Clock Reference

VOUT(x)_EXTPCLKIN
DPI_TIMING_02

Figure 6-35. DSS External Pixel Clock Timing Requirements

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Table 6-46. DSS Switching Characteristics

see Figure 6-36
NO. PARAMETER MODE MIN MAX UNIT
D1 tc(pclk) Cycle time, VOUT(x)_PCLK(2) 6.06 ns
Internal PLL 0.475P(1) - 0.3 ns
D2 tw(pclkL) Pulse duration, VOUT(x)_PCLK(2) low
EXTPCLKIN Y(3) - 0.45 ns
Internal PLL 0.475P(1) -0.3 ns
D3 tw(pclkH) Pulse duration, VOUT(x)_PCLK(2) high
EXTPCLKIN Z(4) - 0.45 ns

Delay time, VOUT(x)_PCLK(2) transition to Internal PLL -0.68 1.78 ns

D4 td(pclkV-dataV)
VOUT(x)_DATA[23:0](2) transition EXTPCLKIN -0.68 1.78 ns
Delay time, VOUT(x)_PCLK(2) transition to control signals Internal PLL -0.68 1.78 ns
D5 td(pclkV-ctrlL) VOUT(x)_VSYNC(2), VOUT(x)_HSYNC(2), VOUT(x)_DE(2)
falling edge EXTPCLKIN -0.68 1.78 ns

(1) P = VOUT(x)_PCLK cycle time in ns

(2) x in VOUT(x) = 0
(3) Y = tw(extpclkinL), parameter D7 from Table 6-45, DSS External Pixel Clock Timing Requirements
(4) Z = tw(extpclkinH), parameter D8 from Table 6-45, DSS External Pixel Clock Timing Requirements

D1 D3
Falling-edge Clock Reference

VOUT(x)_PCLK
Rising-edge Clock Reference

VOUT(x)_PCLK

D5
VOUT(x)_VSYNC

VOUT(x)_HSYNC
D4

VOUT(x)_DATA[23:0] data_1 data_2 data_n

VOUT(x)_DE
DPI_TIMING_01

A. The assertion of data can be programmed to occur on the falling or rising edge of the pixel clock. Refer to Display Subsystem (DSS)
section in Peripherals chapter in the device TRM.
B. The polarity and pulse width of VOUT(x)_HSYNC and VOUT(x)_VSYNC are programmable, refer to Display Subsystem (DSS) section
in Peripherals chapter in the device TRM.
C. The VOUT(x)_PCLK frequency is configurable, refer to Display Subsystem section in Peripherals chapter in the device TRM.

Figure 6-36. DSS Switching Characteristics

For more information, see Display Subsystem (DSS) and Peripherals section in Peripherals chapter of the
device TRM.

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[Link] ECAP
Table 6-47, Table 6-48, Figure 6-37, Table 6-49, and Figure 6-38 present timing conditions, timing requirements,
and switching characteristics for ECAP.
Table 6-47. ECAP Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1 4 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 7 pF

Table 6-48. ECAP Timing Requirements

see Figure 6-37
NO. PARAMETER DESCRIPTION MIN MAX UNIT
CAP1 tw(CAP) Pulse duration, CAP (asynchronous) 2P(1) + 2 ns

(1) P = MAIN_SYSCLK0/4 period in ns.

CAP1

CAP

EPERIPHERALS_TIMNG_01

Figure 6-37. ECAP Timings Requirements

Table 6-49. ECAP Switching Characteristics

see Figure 6-38
NO. PARAMETER DESCRIPTION MIN MAX UNIT
CAP2 tw(APWM) Pulse duration, APWMx high/low 2P(1) -2 ns

(1) P = MAIN_SYSCLK0/4 period in ns.

CAP2

APWM

EPERIPHERALS_TIMNG_02

Figure 6-38. ECAP Switching Characteristics

For more information, see Enhanced Capture (ECAP) Module section in Peripherals chapter in the device TRM.

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[Link] Emulation and Debug

For more details about features and additional description information on the device Trace and JTAG interfaces,
see the corresponding subsections within Signal Descriptions and Detailed Description sections.
[Link].1 Trace
Table 6-50. Trace Timing Conditions
PARAMETER MIN MAX UNIT
OUTPUT CONDITIONS
CL Output load capacitance 2 5 pF
PCB CONNECTIVITY REQUIREMENTS
td(Trace Mismatch) Propagation delay mismatch across all traces 200 ps

Table 6-51. Trace Switching Characteristics

NO. PARAMETER MIN MAX UNIT
1.8V Mode
DBTR1 tc(TRC_CLK) Cycle time, TRC_CLK 6.83 ns
DBTR2 tw(TRC_CLKH) Pulse width, TRC_CLK high 2.66 ns
DBTR3 tw(TRC_CLKL) Pulse width, TRC_CLK low 2.66 ns
tosu(TRC_DATAV-
DBTR4 Output setup time, TRC_DATA valid to TRC_CLK edge 0.85 ns
TRC_CLK)

DBTR5 toh(TRC_CLK-TRC_DATAI) Output hold time, TRC_CLK edge to TRC_DATA invalid 0.85 ns
DBTR6 tosu(TRC_CTLV-TRC_CLK) Output setup time, TRC_CTL valid to TRC_CLK edge 0.85 ns
DBTR7 toh(TRC_CLK-TRC_CTLI) Output hold time, TRC_CLK edge to TRC_CTL invalid 0.85 ns
3.3V Mode
DBTR1 tc(TRC_CLK) Cycle time, TRC_CLK 8.78 ns
DBTR2 tw(TRC_CLKH) Pulse width, TRC_CLK high 3.64 ns
DBTR3 tw(TRC_CLKL) Pulse width, TRC_CLK low 3.64 ns
tosu(TRC_DATAV-
DBTR4 Output setup time, TRC_DATA valid to TRC_CLK edge 1.10 ns
TRC_CLK)

DBTR5 toh(TRC_CLK-TRC_DATAI) Output hold time, TRC_CLK edge to TRC_DATA invalid 1.10 ns
DBTR6 tosu(TRC_CTLV-TRC_CLK) Output setup time, TRC_CTL valid to TRC_CLK edge 1.10 ns
DBTR7 toh(TRC_CLK-TRC_CTLI) Output hold time, TRC_CLK edge to TRC_CTL invalid 1.10 ns

DBTR1
DBTR2 DBTR3

TRC_CLK
(Worst Case 1)
(Ideal)
(Worst Case 2)
DBTR4 DBTR5 DBTR4 DBTR5
DBTR6 DBTR7 DBTR6 DBTR7

TRC_DATA
TRC_CTL

SPRSP08_Debug_01

Figure 6-39. Trace Switching Characteristics

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[Link].2 JTAG
Table 6-52. JTAG Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.5 2.0 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 5 15 pF
PCB CONNECTIVITY REQUIREMENTS
td(Trace Delay) Propagation delay of each trace 83.5 1000(1) ps
td(Trace Mismatch Delay) Propagation delay mismatch across all traces 100 ps

(1) Maximum propagation delay associated with the JTAG signal traces has a significant impact on maximum TCK operating frequency. It
may be possible to increase the trace delay beyond this value, but the operating frequency of TCK must be reduced to account for the
additional trace delay.

Table 6-53. JTAG Timing Requirements

see Figure 6-40
NO. MIN MAX UNIT
J1 tc(TCK) Cycle time minimum, TCK 40(1) ns
J2 tw(TCKH) Pulse width minimum, TCK high 0.4P(2) ns
J3 tw(TCKL) Pulse width minimum, TCK low 0.4P(2) ns
tsu(TDI-TCK) Input setup time minimum, TDI valid to TCK high 2 ns
J4
tsu(TMS-TCK) Input setup time minimum, TMS valid to TCK high 2 ns
th(TCK-TDI) Input hold time minimum, TDI valid from TCK high 3 ns
J5
th(TCK-TMS) Input hold time minimum, TMS valid from TCK high 3 ns

(1) The maximum TCK operating frequency assumes the following timing requirements and switching characteristis for the attached
debugger. The operating frequency of TCK must be reduced to provide appropriate timing margin if the debugger exceeds any of these
assumptions.
• Minimum TDO setup time of 2ns relative to the rising edge of TCK
• TDI and TMS output delay in the range of -12.9ns to 13.9ns relative to the falling edge of TCK
(2) P = TCK cycle time in ns

Table 6-54. JTAG Switching Characteristics

see Figure 6-40
NO. PARAMETER MIN MAX UNIT
J6 td(TCKL-TDOI) Delay time minimum, TCK low to TDO invalid 0 ns
J7 td(TCKL-TDOV) Delay time maximum, TCK low to TDO valid 12 ns

J1
J2 J3

TCK
J4 J5 J4 J5

TDI / TMS

J7
J6

TDO

Figure 6-40. JTAG Timing Requirements and Switching Characteristics

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[Link] EPWM
Table 6-55, Table 6-56, Figure 6-41, Table 6-57, Figure 6-42, Figure 6-43, and Figure 6-44 present timing
conditions, timing requirements, and switching characteristics for EPWM.
Table 6-55. EPWM Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1 4 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 7 pF

Table 6-56. EPWM Timing Requirements

see Figure 6-41
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PWM6 tw(SYNCIN) Pulse duration, EHRPWM_SYNCI 2P(1) + 2 ns
PWM7 tw(TZ) Pulse duration, EHRPWM_TZn_IN low 3P(1) +2 ns

(1) P = MAIN_SYSCLK0/2 period in ns.

PWM6

EHRPWM_SYNCI

PWM7

EHRPWM_TZn_IN

EPERIPHERALS_TIMNG_07

Figure 6-41. EPWM Timing Requirements

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Table 6-57. EPWM Switching Characteristics

see Figure 6-42, Figure 6-43, and Figure 6-44
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PWM1 tw(PWM) Pulse duration, EHRPWM_A/B high/low P(1) - 3 ns
PWM2 tw(SYNCOUT) Pulse duration, EHRPWM_SYNCO P(1) -3 ns
PWM3 td(TZ-PWM) Delay time, EHRPWM_TZn_IN active to EHRPWM_A/B forced 11 ns
high/low
PWM4 td(TZ-PWMZ) Delay time, EHRPWM_TZn_IN active to EHRPWM_A/B Hi-Z 11 ns
PWM5 tw(SOC) Pulse duration, EHRPWM_SOCA/B output P(1) - 3 ns

(1) P = MAIN_SYSCLK0/2 period in ns.

PWM1

EHRPWM_A/B

PWM1
PWM2

EHRPWM_SYNCO

PWM5

EHRPWM_SOCA/B

EPERIPHERALS_TIMNG_04

Figure 6-42. EHRPWM Switching Characteristics

PWM3

EHRPWM_A/B

EHRPWM_TZn_IN
EPERIPHERALS_TIMING_05

Figure 6-43. EHRPWM_TZn_IN to EHRPWM_A/B Forced Switching Characteristics

PWM4

EHRPWM_A/B

EHRPWM_TZn_IN

Figure 6-44. EHRPWM_TZn_IN to EHRPWM_A/B Hi-Z Switching Characteristics

For more information, see Enhanced Pulse Width Modulation (EPWM) Module section in Peripherals chapter in
the device TRM.

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[Link] EQEP
Table 6-58, Table 6-59, Figure 6-45, and Table 6-60 present timing conditions, timing requirements, and
switching characteristics for EQEP.
Table 6-58. EQEP Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1 4 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 7 pF

Table 6-59. EQEP Timing Requirements

see Figure 6-45
NO. PARAMETER DESCRIPTION MIN MAX UNIT
QEP1 tw(QEP) Pulse duration, QEP_A/B 2P(1) + 2 ns
QEP2 tw(QEPIH) Pulse duration, QEP_I high 2P(1) +2 ns
QEP3 tw(QEPIL) Pulse duration, QEP_I low 2P(1) + 2 ns
QEP4 tw(QEPSH) Pulse duration, QEP_S high 2P(1) +2 ns
QEP5 tw(QEPSL) Pulse duration, QEP_S low 2P(1) + 2 ns

(1) P = MAIN_SYSCLK0/4 period in ns.

QEP1

QEP_A/B

QEP2

QEP_I

QEP3
QEP4

QEP_S

QEP5 EPERIPHERALS_TIMNG_03

Figure 6-45. EQEP Timing Requirements

Table 6-60. EQEP Switching Characteristics

NO. PARAMETER DESCRIPTION MIN MAX UNIT
QEP6 td(QEP-CNTR) Delay time, external clock to counter increment 24 ns

For more information, see Enhanced Quadrature Encoder Pulse (EQEP) Module section in Peripherals chapter
in the device TRM.

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[Link] GPIO
Table 6-61, Table 6-62, and Table 6-63 present timing conditions, timing requirements, and switching
characteristics for GPIO.
The device has three instances of the GPIO module.
• MCU_GPIO0
• GPIO0
• GPIO1

Note
GPIOn_x is generic name used to describe a GPIO signal, where n represents the specific GPIO
module and x represents one of the input/output signals associated with the module.
For additional description information on the device GPIO, see the corresponding subsections within
Signal Descriptions and Detailed Description sections.

Table 6-61. GPIO Timing Conditions

PARAMETER BUFFER TYPE MIN MAX UNIT
INPUT CONDITIONS
LVCMOS
0.0018 6.6 V/ns
(VDD(1) = 1.8V)
LVCMOS
0.0033 6.6 V/ns
(VDD(1) = 3.3V)
SRI Input slew rate
I2C OD FS
0.0018 6.6 V/ns
(VDD(1) = 1.8V)
I2C OD FS
0.0033 0.08 V/ns
(VDD(1) = 3.3V)
OUTPUT CONDITIONS
LVCMOS 3 10 pF
CL Output load capacitance
I2C OD FS 3 100 pF

(1) VDD stands for corresponding power supply. For more information on the power supply name and the corresponding ball(s), see
POWER column of the Pin Attributes table.

Table 6-62. GPIO Timing Requirements

NO. PARAMETER DESCRIPTION MIN MAX UNIT
GPIO1 tw(GPIO_IN) Pulse width, GPIOn_x 2P(1) + 30 ns

(1) P = functional clock period in ns.

Table 6-63. GPIO Switching Characteristics

NO. PARAMETER DESCRIPTION BUFFER TYPE MIN MAX UNIT
0.975P(1) -
LVCMOS ns
GPIO2 tw(GPIO_OUT) Pulse width, GPIOn_x 3.6
I2C OD FS 160 ns

(1) P = functional clock period in ns.

For more information, see General-Purpose Interface (GPIO) section in Peripherals chapter in the device TRM.

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[Link] GPMC
For more details about features and additional description information on the device General-Purpose Memory
Controller, see the corresponding subsections within Signal Descriptions and Detailed Description sections.
Table 6-64 presents timing conditions for GPMC.
Table 6-64. GPMC Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1.65 4 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 20 pF
PCB CONNECTIVITY REQUIREMENTS
133MHz Synchronous Mode 140 360 ps
td(Trace Delay) Propagation delay of each trace
All other modes 140 720 ps
td(Trace Mismatch
Propagation delay mismatch across all traces 200 ps
Delay)

For more information, see General-Purpose Memory Controller (GPMC) section in Peripherals chapter in the
device TRM.
[Link].1 GPMC and NOR Flash — Synchronous Mode
Table 6-65 and Table 6-66 present timing requirements and switching characteristics for GPMC and NOR Flash -
Synchronous Mode.
Table 6-65. GPMC and NOR Flash Timing Requirements — Synchronous Mode
see Figure 6-46, Figure 6-47, and Figure 6-50
NO. PARAMETER DESCRIPTION MIN MAX UNIT
F12 tsu(dV-clkH) Setup time, GPMC_AD[15:0] valid before GPMC_CLK 0.92 ns
high
F13 th(clkH-dV) Hold time, GPMC_AD[15:0] valid after GPMC_CLK high 2.09 ns
F21 tsu(waitV-clkH) Setup time, GPMC_WAIT[j](1) (2) valid before GPMC_CLK 0.92 ns
high
F22 th(clkH-waitV) Hold time, GPMC_WAIT[j](1) (2) valid after GPMC_CLK 2.09 ns
high

(1) In GPMC_WAIT[j], j is equal to 0 or 1.

(2) Wait monitoring support is limited to a WaitMonitoringTime value > 0. For a full description of wait monitoring feature, see General-
Purpose Memory Controller (GPMC) section in the device TRM.

Table 6-66. GPMC and NOR Flash Switching Characteristics – Synchronous Mode
see Figure 6-46, Figure 6-47, Figure 6-48, Figure 6-49, and Figure 6-50
NO. PARAMETER DESCRIPTION MIN MAX UNIT
F0 tc(clk) Cycle time, GPMC_CLK(16) 7.52 ns
F1 tw(clkH) Typical pulse duration, GPMC_CLK high 0.475P(13) - ns
0.3
F1 tw(clkL) Typical pulse duration, GPMC_CLK low 0.475P(13) - ns
0.3
F2 td(clkH-csnV) Delay time, GPMC_CLK rising edge to GPMC_CSn[i] F(5) - 2.2 F(5) + 3.75 ns
transition(12)
F3 td(clkH-CSn[i]V) Delay time, GPMC_CLK rising edge to GPMC_CSn[i] D(4) - 2.2 D(4) + 4.5 ns
invalid(12)
F4 td(aV-clk) Delay time, GPMC_A[27:1] valid to GPMC_CLK first edge B(2) - 2.3 B(2) + 4.5 ns
F5 td(clkH-aIV) Delay time, GPMC_CLK rising edge to GPMC_A[27:1] invalid -2.3 4.5 ns

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Table 6-66. GPMC and NOR Flash Switching Characteristics – Synchronous Mode (continued)
see Figure 6-46, Figure 6-47, Figure 6-48, Figure 6-49, and Figure 6-50
NO. PARAMETER DESCRIPTION MIN MAX UNIT
F6 td(be[x]nV-clk) Delay time, GPMC_BE0n_CLE, GPMC_BE1n valid to B(2) - 2.3 B(2) + 1.9 ns
GPMC_CLK first edge
F7 td(clkH-be[x]nIV) Delay time, GPMC_CLK rising edge to GPMC_BE0n_CLE, D(4) - 2.3 D(4) + 1.9 ns
GPMC_BE1n invalid
F8 td(clkH-advn) Delay time, GPMC_CLK rising edge to GPMC_ADVn_ALE G(6) - 2.3 G(6) + 4.5 ns
transition
F9 td(clkH-advnIV) Delay time, GPMC_CLK rising edge to GPMC_ADVn_ALE D(4) - 2.3 D(4) + 4.5 ns
invalid
F10 td(clkH-oen) Delay time, GPMC_CLK rising edge to GPMC_OEn_REn H(7) - 2.3 H(7) + 3.5 ns
transition
F11 td(clkH-oenIV) Delay time, GPMC_CLK rising edge to GPMC_OEn_REn D(4) - 2.3 D(4) + 3.5 ns
invalid
F14 td(clkH-wen) Delay time, GPMC_CLK rising edge to GPMC_WEn transition I(8) - 2.3 I(8) + 4.5 ns
F15 td(clkH-do) Delay time, GPMC_CLK rising edge to GPMC_AD[15:0] - 2.3 + 2.7 ns
transition(9)
F15 td(clkL-do) Delay time, GPMC_CLK falling edge to GPMC_AD[15:0] data - 2.3 + 2.7 ns
bus transition(10)
F15 td(clkL-do). Delay time, GPMC_CLK falling edge to GPMC_AD[15:0] data - 2.3 + 2.7 ns
bus transition(11)
F17 td(clkH-be[x]n) Delay time, GPMC_CLK rising edge to GPMC_BE0n_CLE, - 2.3 + 1.9 ns
GPMC_BE1n transition(9)
F17 td(clkL-be[x]n) Delay time, GPMC_CLK falling edge to GPMC_BE0n_CLE, - 2.3 + 1.9 ns
GPMC_BE1n transition(10)
F17 td(clkL-be[x]n). Delay time, GPMC_CLK falling edge to GPMC_BE0n_CLE, - 2.3 + 1.9 ns
GPMC_BE1n transition(11)
F18 tw(csnV) Pulse duration, GPMC_CSn[i](12) low A(1) ns
F19 tw(be[x]nV) Pulse duration, GPMC_BE0n_CLE, GPMC_BE1n low C(3) ns
F20 tw(advnV) Pulse duration, GPMC_ADVn_ALE low K(14) ns

(1) For single read: A = (CSRdOffTime - CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)

For single write: A = (CSWrOffTime - CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For burst read: A = (CSRdOffTime - CSOnTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For burst write: A = (CSWrOffTime - CSOnTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
With n being the page burst access number.
(2) Address bus / Byte Enables become valid at start of cycle, GPMC_CLK activation time may be delayed after start of cycle B =
ClkActivationTime × GPMC_FCLK(15)
(3) For single read: C = RdCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For single write: C = WrCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For burst read: C = (RdCycleTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For burst write: C = (WrCycleTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
With n being the page burst access number.
(4) For single read: D = (RdCycleTime - RdAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For single write: D = (WrCycleTime - WrAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For burst read: D = (RdCycleTime - RdAccessTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For burst write: D = (WrCycleTime - WrAccessTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
With n being the page burst access number.
(5) For CSn falling edge (CS activated):
• Case GPMCFCLKDIVIDER = 0:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and CSOnTime are odd) or (ClkActivationTime and
CSOnTime are even)
– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15) if ((CSOnTime - ClkActivationTime) is a multiple of 3)

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– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) if ((CSOnTime - ClkActivationTime - 1) is a multiple of 3)

– F = (2 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) if ((CSOnTime - ClkActivationTime - 2) is a multiple of 3)

For CSn rising edge (CS deactivated) in Reading mode:

• Case GPMCFCLKDIVIDER = 0:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and CSRdOffTime are odd) or (ClkActivationTime and
CSRdOffTime are even)
– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15) if ((CSRdOffTime - ClkActivationTime) is a multiple of 3)
– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) if ((CSRdOffTime - ClkActivationTime - 1) is a multiple of 3)
– F = (2 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) if ((CSRdOffTime - ClkActivationTime - 2) is a multiple of 3)

For CSn rising edge (CS deactivated) in Writing mode:

• Case GPMCFCLKDIVIDER = 0:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and CSWrOffTime are odd) or (ClkActivationTime and
CSWrOffTime are even)
– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– F = 0.5 × CSExtraDelay × GPMC_FCLK(15) if ((CSWrOffTime - ClkActivationTime) is a multiple of 3)
– F = (1 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) if ((CSWrOffTime - ClkActivationTime - 1) is a multiple of 3)
– F = (2 + 0.5 × CSExtraDelay) × GPMC_FCLK(15) if ((CSWrOffTime - ClkActivationTime - 2) is a multiple of 3)
(6) For ADV falling edge (ADV activated):
• Case GPMCFCLKDIVIDER = 0:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and ADVOnTime are odd) or (ClkActivationTime and
ADVOnTime are even)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15) if ((ADVOnTime - ClkActivationTime) is a multiple of 3)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) if ((ADVOnTime - ClkActivationTime - 1) is a multiple of 3)
– G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) if ((ADVOnTime - ClkActivationTime - 2) is a multiple of 3)

For ADV rising edge (ADV deactivated) in Reading mode:

• Case GPMCFCLKDIVIDER = 0:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and ADVRdOffTime are odd) or (ClkActivationTime and
ADVRdOffTime are even)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15) if ((ADVRdOffTime - ClkActivationTime) is a multiple of 3)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) if ((ADVRdOffTime - ClkActivationTime - 1) is a multiple of 3)
– G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) if ((ADVRdOffTime - ClkActivationTime - 2) is a multiple of 3)

For ADV rising edge (ADV deactivated) in Writing mode:

• Case GPMCFCLKDIVIDER = 0:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:

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– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and ADVWrOffTime are odd) or (ClkActivationTime and
ADVWrOffTime are even)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– G = 0.5 × ADVExtraDelay × GPMC_FCLK(15) if ((ADVWrOffTime - ClkActivationTime) is a multiple of 3)
– G = (1 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) if ((ADVWrOffTime - ClkActivationTime - 1) is a multiple of 3)
– G = (2 + 0.5 × ADVExtraDelay) × GPMC_FCLK(15) if ((ADVWrOffTime - ClkActivationTime - 2) is a multiple of 3)
(7) For OE falling edge (OE activated) and IO DIR rising edge (Data Bus input direction):
• Case GPMCFCLKDIVIDER = 0:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and OEOnTime are odd) or (ClkActivationTime and
OEOnTime are even)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(15) if ((OEOnTime - ClkActivationTime) is a multiple of 3)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(15) if ((OEOnTime - ClkActivationTime - 1) is a multiple of 3)
– H = (2 + 0.5 × OEExtraDelay) × GPMC_FCLK(15) if ((OEOnTime - ClkActivationTime - 2) is a multiple of 3)

For OE rising edge (OE deactivated):

• Case GPMCFCLKDIVIDER = 0:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and OEOffTime are odd) or (ClkActivationTime and
OEOffTime are even)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– H = 0.5 × OEExtraDelay × GPMC_FCLK(15) if ((OEOffTime - ClkActivationTime) is a multiple of 3)
– H = (1 + 0.5 × OEExtraDelay) × GPMC_FCLK(15) if ((OEOffTime - ClkActivationTime - 1) is a multiple of 3)
– H = (2 + 0.5 × OEExtraDelay) × GPMC_FCLK(15) if ((OEOffTime - ClkActivationTime - 2) is a multiple of 3)
(8) For WE falling edge (WE activated):
• Case GPMCFCLKDIVIDER = 0:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(15)
• Case GPMCFCLKDIVIDER = 1:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and WEOnTime are odd) or (ClkActivationTime and
WEOnTime are even)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(15) if ((WEOnTime - ClkActivationTime) is a multiple of 3)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(15) if ((WEOnTime - ClkActivationTime - 1) is a multiple of 3)
– I = (2 + 0.5 × WEExtraDelay) × GPMC_FCLK(15) if ((WEOnTime - ClkActivationTime - 2) is a multiple of 3)

For WE rising edge (WE deactivated):

• Case GPMCFCLKDIVIDER = 0:
– I = 0.5 × WEExtraDelay × GPMC_FCLK (13)
• Case GPMCFCLKDIVIDER = 1:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(15) if (ClkActivationTime and WEOffTime are odd) or (ClkActivationTime and
WEOffTime are even)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(15) otherwise
• Case GPMCFCLKDIVIDER = 2:
– I = 0.5 × WEExtraDelay × GPMC_FCLK(15) if ((WEOffTime - ClkActivationTime) is a multiple of 3)
– I = (1 + 0.5 × WEExtraDelay) × GPMC_FCLK(15) if ((WEOffTime - ClkActivationTime - 1) is a multiple of 3)
– I = (2 + 0.5 × WEExtraDelay) × GPMC_FCLK(15) if ((WEOffTime - ClkActivationTime - 2) is a multiple of 3)
(9) Case CLK DIV 1 mode, first transfer only: Data and byte enables transition on rise edge of GPMC_CLK
• Non-multiplexed mode: data transition at start of cycle

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• Multiplexed mode: data transition at WRDATAONADMUXBUS × (TimeParaGranularity + 1) × GPMC_FCLK(15)

(10) Case CLK DIV 1 mode, all data and byte enables after initial transfer: Data and byte enables transition on fall edge of GPMC_CLK
(Half cycle of GPMC_CLK)
(11) Case modes other than CLK DIV 1 mode (GPMC_CLK divided down from GPMC_FCLK): All data and byte enables transition on
fall edge of GPMC_CLK (Half cycle of GPMC_CLK). ClkActivationTime, GPMCFCLKDIVIDER, RDACCESSTIME/WRACCESSTIME,
and PAGEBURSTACCESSTIME configuration must be configured to enforce data and byte enables transition on falling edge of
GPMC_CLK (to be latched on rise edge of GPMC_CLK)
(12) In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
(13) P = GPMC_CLK period in ns
(14) For read: K = (ADVRdOffTime - ADVOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
For write: K = (ADVWrOffTime - ADVOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(15)
(15) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.
(16) Related to the GPMC_CLK output clock maximum and minimum frequencies programmable in the GPMC module by setting the
GPMC_CONFIG1_i configuration register bit field GPMCFCLKDIVIDER.

F1
F0 F1
GPMC_CLK
F2 F3
F18
GPMC_CSn[i]
F4
GPMC_A[MSB:1] Valid Address
F6 F7
F19
GPMC_BE0n_CLE
F19
GPMC_BE1n
F6 F8 F8
F20 F9
GPMC_ADVn_ALE
F10 F11

GPMC_OEn_REn
F13
F12
GPMC_AD[15:0] D0

GPMC_WAIT[j]
GPMC_01

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
B. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-46. GPMC and NOR Flash — Synchronous Single Read (GPMCFCLKDIVIDER = 0)

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F1
F0 F1
GPMC_CLK
F2 F3
GPMC_CSn[i]
F4
GPMCA[MSB:1] Valid Address
F6 F7
GPMC_BE0n_CLE
F7
GPMC_BE1n
F6 F8 F8 F9

GPMC_ADVn_ALE
F10 F11
GPMC_OEn_REn
F13 F13
F12 F12
GPMC_AD[15:0] D0 D1 D2 D3
F21 F22
GPMC_WAIT[j]
GPMC_02

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
B. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-47. GPMC and NOR Flash — Synchronous Burst Read — 4x16–bit (GPMCFCLKDIVIDER = 0)

F1
F1 F0
GPMC_CLK
F2 F3
GPMC_CSn[i]
F4
GPMC_A[MSB:1] Valid Address
F17
F6 F17 F17
GPMC_BE0n_CLE
F17
F17 F17
GPMC_BE1n
F6 F8 F8 F9
GPMC_ADVn_ALE
F14 F14
GPMC_WEn
F15 F15 F15
GPMC_AD[15:0] D0 D1 D2 D3
GPMC_WAIT[j]
GPMC_03

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.

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B. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-48. GPMC and NOR Flash—Synchronous Burst Write (GPMCFCLKDIVIDER = 0)

F1
F0 F1
GPMC_CLK
F2 F3
GPMC_CSn[i]
F6 F7
GMPC_BE0n_CLE Valid
F6 F7
GPMC_BE1n Valid
F4
GPMC_A[27:17] Address (MSB)
F12
F4 F5 F13 F12
GPMC_AD[15:0] Address (LSB) D0 D1 D2 D3
F8 F8 F9
GPMC_ADVn_ALE
F10 F11
GPMC_OEn_REn

GPMC_WAIT[j]
GPMC_04

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
B. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-49. GPMC and Multiplexed NOR Flash — Synchronous Burst Read

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F1
F1 F0
GPMC_CLK
F2 F3
F18
GPMC_CSn[i]
F4
GPMC_A[27:17] Address (MSB)
F17
F6 F17 F17
GPMC_BE1n
F17
F6 F17 F17
BPMC_BE0n_CLE
F8 F8
F20 F9
GPMC_ADVn_ALE

F14 F14
GPMC_WEn
F15 F15 F15
GPMC_AD[15:0] Address (LSB) D0 D1 D2 D3
F22 F21
GPMC_WAIT[j]
GPMC_05

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
B. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-50. GPMC and Multiplexed NOR Flash — Synchronous Burst Write

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[Link].2 GPMC and NOR Flash — Asynchronous Mode

Table 6-67 and Table 6-68 present timing requirements and switching characteristics for GPMC and NOR Flash
— Asynchronous Mode.
Table 6-67. GPMC and NOR Flash Timing Requirements – Asynchronous Mode
see Figure 6-51, Figure 6-52, Figure 6-53, and Figure 6-55
NO. PARAMETER DESCRIPTION MIN MAX UNIT
FA5(1) tacc(d) Data access time H(5) ns
FA20(2) tacc1-pgmode(d) Page mode successive data access time P(4) ns
FA21(3) tacc2-pgmode(d) Page mode first data access time H(5) ns

(1) The FA5 parameter illustrates the amount of time required to internally sample input data. It is expressed in number of GPMC
functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data is internally sampled by active
functional clock edge. FA5 value must be stored inside the AccessTime register bit field.
(2) The FA20 parameter illustrates amount of time required to internally sample successive input page data. It is expressed in number of
GPMC functional clock cycles. After each access to input page data, next input page data is internally sampled by active functional
clock edge after FA20 functional clock cycles. The FA20 value must be stored in the PageBurstAccessTime register bit field.
(3) The FA21 parameter illustrates amount of time required to internally sample first input page data. It is expressed in number of GPMC
functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input page data is internally sampled by
active functional clock edge. FA21 value must be stored inside the AccessTime register bit field.
(4) P = PageBurstAccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(6)
(5) H = AccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(6)
(6) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.

Table 6-68. GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
see Figure 6-51, Figure 6-52, Figure 6-53, Figure 6-54, Figure 6-55, and Figure 6-56
NO. PARAMETER DESCRIPTION MIN MAX UNIT
FA0 tw(be[x]nV) Pulse duration, output lower-byte enable and command latch enable N(12) ns
GPMC_BE0n_CLE, output upper-byte enable GPMC_BE1n valid
time
FA1 tw(csnV) Pulse duration, output chip select GPMC_CSn[i](13) low A(1) ns
FA3 td(csnV-advnIV) Delay time, output chip select GPMC_CSn[i](13)
valid to output B(2) -2 B(2) +2 ns
address valid and address latch enable GPMC_ADVn_ALE invalid
FA4 td(csnV-oenIV) Delay time, output chip select GPMC_CSn[i](13) valid to output C(3) - 2 C(3) + 2 ns
enable GPMC_OEn_REn invalid (Single read)
FA9 td(aV-csnV) Delay time, output address GPMC_A[27:1] valid to output chip J(9) - 2 J(9) + 2 ns
select GPMC_CSn[i](13) valid
FA10 td(be[x]nV-csnV) Delay time, output lower-byte enable and command latch enable J(9) - 2 J(9) + 2 ns
GPMC_BE0n_CLE, output upper-byte enable GPMC_BE1n valid to
output chip select GPMC_CSn[i](13) valid
FA12 td(csnV-advnV) Delay time, output chip select GPMC_CSn[i](13) valid to output K(10) - 2 K(10) + 2 ns
address valid and address latch enable GPMC_ADVn_ALE valid
FA13 td(csnV-oenV) Delay time, output chip select GPMC_CSn[i](13) valid to output L(11) - 2 L(11) + 2 ns
enable GPMC_OEn_REn valid
FA16 tw(aIV) Pulse duration output address GPMC_A[26:1] invalid between 2 G(7) ns
successive read and write accesses
FA18 td(csnV-oenIV) Delay time, output chip select GPMC_CSn[i](13) valid to output I(8) - 2 I(8) + 2 ns
enable GPMC_OEn_REn invalid (Burst read)
FA20 tw(aV) Pulse duration, output address GPMC_A[27:1] valid - 2nd, 3rd, and D(4) ns
4th accesses
FA25 td(csnV-wenV) Delay time, output chip select GPMC_CSn[i](13) valid to output write E(5) - 2 E(5) + 2 ns
enable GPMC_WEn valid
FA27 td(csnV-wenIV) Delay time, output chip select GPMC_CSn[i](13) valid to output write F(6) - 2 F(6) + 2 ns
enable GPMC_WEn invalid
FA28 td(wenV-dV) Delay time, output write enable GPMC_WEn valid to output data 2 ns
GPMC_AD[15:0] valid

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Table 6-68. GPMC and NOR Flash Switching Characteristics – Asynchronous Mode (continued)
see Figure 6-51, Figure 6-52, Figure 6-53, Figure 6-54, Figure 6-55, and Figure 6-56
NO. PARAMETER DESCRIPTION MIN MAX UNIT
FA29 td(dV-csnV) Delay time, output data GPMC_AD[15:0] valid to output chip select J(9) - 2 J(9) + 2 ns
GPMC_CSn[i](13) valid
FA37 td(oenV-aIV) Delay time, output enable GPMC_OEn_REn valid to output address 2 ns
GPMC_AD[15:0] phase end

(1) For single read: A = (CSRdOffTime - CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)

For single write: A = (CSWrOffTime - CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst read: A = (CSRdOffTime - CSOnTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst write: A = (CSWrOffTime - CSOnTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
with n being the page burst access number
(2) For reading: B = ((ADVRdOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay - CSExtraDelay)) ×
GPMC_FCLK(14)
For writing: B = ((ADVWrOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay - CSExtraDelay)) ×
GPMC_FCLK(14)
(3) C = ((OEOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
(4) D = PageBurstAccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
(5) E = ((WEOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
(6) F = ((WEOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
(7) G = Cycle2CycleDelay × GPMC_FCLK(14)
(8) I = ((OEOffTime + (n - 1) × PageBurstAccessTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay - CSExtraDelay))
× GPMC_FCLK(14)
(9) J = (CSOnTime × (TimeParaGranularity + 1) + 0.5 × CSExtraDelay) × GPMC_FCLK(14)
(10) K = ((ADVOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
(11) L = ((OEOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
(12) For single read: N = RdCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For single write: N = WrCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst read: N = (RdCycleTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst write: N = (WrCycleTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
(13) In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
(14) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.

GPMC_FCLK
GPMC_CLK
FA5
FA1
GPMC_CSn[i]
FA9
GPMC_A[MSB:1] Valid Address
FA0
FA10
GPMC_BE0n_CLE Valid
FA0
GPMC_BE1n Valid
FA10
FA3
FA12
GPMC_ADVn_ALE
FA4
FA13
GPMC_OEn_REn
GPMC_AD[15:0] Data IN 0 Data IN 0

GPMC_WAIT[j]
GPMC_06

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], jis equal to 0 or 1.

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B. FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock
cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally sampled by active functional clock
edge. FA5 value must be stored inside AccessTime register bits field.
C. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.

Figure 6-51. GPMC and NOR Flash — Asynchronous Read — Single Word

GPMC_FCLK

GPMC_CLK
FA5 FA5
FA1 FA1
GPMC_CSn[i]
FA16
FA9 FA9

GPMC_A[MSB:1] Address 0 Address 1

FA0 FA0
FA10 FA10

GPMC_BE0n_CLE Valid Valid

FA0 FA0
GPMC_BE1n Valid Valid
FA10 FA10

FA3 FA3
FA12 FA12
GPMC_ADCn_ALE
FA4 FA4
FA13 FA13
GPMC_OEn_REn
GPMC_AD[15:0] Data Upper

GPMC_WAIT[j]
GPMC_07

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-52. GPMC and NOR Flash — Asynchronous Read — 32–Bit

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GPMC_FCLK

GPMC_CLK
FA21 FA20 FA20 FA20
FA1
GPMC_CSn[i]
FA9
GPMC_A[MSB:1] Add0 Add1 Add2 Add3 Add4
FA0
FA10
GPMC_BE0n_CLE
FA0
FA10
GPMC_BE1n
FA12

GPMC_ADVn_ALE
FA18
FA13
GPMC_OEn_REn
GPMC_AD[15:0] D0 D1 D2 D3 D3

GPMC_WAIT[j]
GPMC_08

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0 or 1.

B. FA21 parameter illustrates amount of time required to internally sample first input page data. It is expressed in number of GPMC
functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input page data will be internally sampled by
active functional clock edge. FA21 calculation must be stored inside AccessTime register bits field.
C. FA20 parameter illustrates amount of time required to internally sample successive input page data. It is expressed in number of GPMC
functional clock cycles. After each access to input page data, next input page data will be internally sampled by active functional clock
edge after FA20 functional clock cycles. FA20 is also the duration of address phases for successive input page data (excluding first
input page data). FA20 value must be stored in PageBurstAccessTime register bits field.
D. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.

Figure 6-53. GPMC and NOR Flash — Asynchronous Read — Page Mode 4x16–Bit

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GPMC_FCLK

GPMC_CLK
FA1
GPMC_CSn[i]
FA9
GPMC_A[MSB:1] Valid Address
FA0
FA10

GPMC_BE0n_CLE
FA0
FA10

GPMC_BE1n
FA3
FA12

GPMC_ADVn_ALE
FA27
FA25

GPMC_WEn
FA29
GPMC_AD[15:0] Data OUT

GPMC_WAIT[j]
GPMC_09

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-54. GPMC and NOR Flash — Asynchronous Write — Single Word

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GPMC_FCLK

GPMC_CLK
FA1
FA5
GPMC_CSn[i]
FA9
GPMC_A[27:17] Address (MSB)
FA0
FA10
GPMC_BE0n_CLE Valid
FA0
FA10
GPMC_BE1n Valid
FA3
FA12
GPMC_ADVn_ALE
FA4
FA13
GPMC_OEn_REn
FA29 FA37
GPMC_AD[15:0] Address (LSB) Data IN Data IN

GPMC_WAIT[j]
GPMC_10

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-55. GPMC and Multiplexed NOR Flash — Asynchronous Read — Single Word

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GPMC_FCLK

GPMC_CLK
FA1
GPMC_CSn[i]
FA9
GPMC_A[27:17] Address (MSB)
FA0
FA10
GPMC_BE0n_CLE
FA0
FA10
GPMC_BE1n
FA3
FA12
GPMC_ADVn_ALE
FA27
FA25
GPMC_WEn
FA29 FA28
GPMC_AD[15:0] Valid Address (LSB) Data OUT

GPMC_WAIT[j]
GPMC_11

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-56. GPMC and Multiplexed NOR Flash — Asynchronous Write — Single Word

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[Link].3 GPMC and NAND Flash — Asynchronous Mode

Table 6-69 and Table 6-70 present timing requirements and switching characteristics for GPMC and NAND Flash
— Asynchronous Mode.
Table 6-69. GPMC and NAND Flash Timing Requirements – Asynchronous Mode
see Figure 6-59
NO. PARAMETER DESCRIPTION MIN MAX UNIT
GNF12(1) tacc(d) Access time, input data GPMC_AD[15:0] J(2) ns

(1) The GNF12 parameter illustrates the amount of time required to internally sample input data. It is expressed in number of GPMC
functional clock cycles. From start of the read cycle and after GNF12 functional clock cycles, input data is internally sampled by the
active functional clock edge. The GNF12 value must be stored inside AccessTime register bit field.
(2) J = AccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(3)
(3) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.

Table 6-70. GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
see Figure 6-57, Figure 6-58, Figure 6-59 and Figure 6-60
NO. PARAMETER MIN MAX UNIT
GNF0 tw(wenV) Pulse duration, output write enable GPMC_WEn valid A(1) ns
GNF1 td(csnV-wenV) Delay time, output chip select GPMC_CSn[i](13) valid to output write B(2) - 2 B(2) + 2 ns
enable GPMC_WEn valid
GNF2 tw(cleH-wenV) Delay time, output lower-byte enable and command latch enable C(3) - 2 C(3) + 2 ns
GPMC_BE0n_CLE high to output write enable GPMC_WEn valid
GNF3 tw(wenV-dV) Delay time, output data GPMC_AD[15:0] valid to output write D(4) - 2 D(4) + 2 ns
enable GPMC_WEn valid
GNF4 tw(wenIV-dIV) Delay time, output write enable GPMC_WEn invalid to output data E(5) - 2 E(5) + 2 ns
GPMC_AD[15:0] invalid
GNF5 tw(wenIV-cleIV) Delay time, output write enable GPMC_WEn invalid to output F(6) - 2 F(6) + 2 ns
lower-byte enable and command latch enable GPMC_BE0n_CLE
invalid
GNF6 tw(wenIV-CSn[i]V) Delay time, output write enable GPMC_WEn invalid to output chip G(7) - 2 G(7) + 2 ns
select GPMC_CSn[i](13) invalid
GNF7 tw(aleH-wenV) Delay time, output address valid and address latch enable C(3) - 2 C(3) + 2 ns
GPMC_ADVn_ALE high to output write enable GPMC_WEn valid
GNF8 tw(wenIV-aleIV) Delay time, output write enable GPMC_WEn invalid to output F(6) - 2 F(6) + 2 ns
address valid and address latch enable GPMC_ADVn_ALE invalid
GNF9 tc(wen) Cycle time, write H(8) ns
GNF10 td(csnV-oenV) Delay time, output chip select GPMC_CSn[i](13) valid to output I(9) -2 I(9) +2 ns
enable GPMC_OEn_REn valid
GNF13 tw(oenV) Pulse duration, output enable GPMC_OEn_REn valid K(10) ns
GNF14 tc(oen) Cycle time, read L(11) ns
GNF15 tw(oenIV-CSn[i]V) Delay time, output enable GPMC_OEn_REn invalid to output chip M(12) -2 M(12) +2 ns
select GPMC_CSn[i](13) invalid

(1) A = (WEOffTime - WEOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)

(2) B = ((WEOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
(3) C = ((WEOnTime - ADVOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay - ADVExtraDelay)) × GPMC_FCLK(14) Note: For
DeviceType: NAND
• During Command Latch Cycle: CLE signal is controlled by the ADVOnTime and ADVWrOffTime timing parameters
• During Address Latch Cycle: ALE signal is controlled by the ADVOnTime and ADVWrOffTime timing parameters.
(4) D = (WEOnTime × (TimeParaGranularity + 1) + 0.5 × WEExtraDelay) × GPMC_FCLK(14)
(5) E = ((WrCycleTime - WEOffTime) × (TimeParaGranularity + 1) - 0.5 × WEExtraDelay) × GPMC_FCLK(14)
(6) F = ((ADVWrOffTime - WEOffTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay - WEExtraDelay)) × GPMC_FCLK(14) Note:
For DeviceType: NAND
• During Command Latch Cycle: CLE signal is controlled by the ADVOnTime and ADVWrOffTime timing parameters
• During Address Latch Cycle: ALE signal is controlled by the ADVOnTime and ADVWrOffTime timing parameters.
(7) G = ((CSWrOffTime - WEOffTime) × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay - WEExtraDelay)) × GPMC_FCLK(14)
(8) H = WrCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK(14)

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(9) I = ((OEOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)

(10) K = (OEOffTime - OEOnTime) × (1 + TimeParaGranularity) × GPMC_FCLK(14)
(11) L = RdCycleTime × (1 + TimeParaGranularity) × GPMC_FCLK(14)
(12) M = ((CSRdOffTime - OEOffTime) × (TimeParaGranularity + 1) + 0.5 × (CSExtraDelay - OEExtraDelay)) × GPMC_FCLK(14)
(13) In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
(14) GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.

GPMC_FCLK
GNF1 GNF6
GPMC_CSn[i]
GNF2 GNF5
GPMC_BE0n_CLE

GPMC_ADCn_ALE

GPMC_OEn_REn
GNF0
GPMC_WEn
GNF3 GNF4
GPMC_AD[15:0] Command
GPMC_12

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.

Figure 6-57. GPMC and NAND Flash — Command Latch Cycle

GPMC_FCLK
GNF1 GNF6
GPMC_CSn[i]

GPMC_BE0n_CLE
GNF7 GNF8
GPMC_ADVn_ALE

GPMC_OEn_REn
GNF9
GNF0
GPMC_WEn
GNF3 GNF4
GPMC_AD[15:0] Address
GPMC_13

A. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.

Figure 6-58. GPMC and NAND Flash — Address Latch Cycle

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GPMC_FCLK
GNF12
GNF10 GNF15
GPMC_CSn[i]

GPMC_BE0n_CLE

GPMC_ADVn_ALE
GNF14
GNF13
GPMC_OEn_REn

GPMC_AD[15:0] DATA

GPMC_WAIT[j]
GPMC_14

A. GNF12 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional
clock cycles. From start of read cycle and after GNF12 functional clock cycles, input data will be internally sampled by active functional
clock edge. GNF12 value must be stored inside AccessTime register bits field.
B. GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
C. In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0 or 1.

Figure 6-59. GPMC and NAND Flash — Data Read Cycle

GPMC_FCLK
GNF1 GNF6
GPMC_CSn[i]

GPMC_BE0n_CLE

GPMC_ADVn_ALE

GPMC_OEn_REn
GNF9
GNF0
GPMC_WEn
GNF3 GNF4
GPMC_AD[15:0] DATA
GPMC_15

A. `In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.

Figure 6-60. GPMC and NAND Flash — Data Write Cycle

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[Link] I2C
The device contains six multicontroller Inter-Integrated Circuit (I2C) controllers. Each I2C controller was
designed to be compliant to the Philips I2C-bus™ specification version 2.1. However, the device IOs are not
fully compliant to the I2C electrical specification. The speeds supported and exceptions are described per IO
buffer type. See the BUFFER TYPE column of the Pin Attributes table to determine which IO buffer type is
associated with a specific I2C instance.
• LVCMOS or SDIO
– Speeds:
• Standard-mode (up to 100Kbits/s)
– 1.8V
– 3.3V
• Fast-mode (up to 400Kbits/s)
– 1.8V
– 3.3V
– Exceptions:
• The IOs associated with these ports are not compliant to the fall time requirements defined in the I2C
specification because they are implemented with higher performance LVCMOS push-pull IOs that were
designed to support other signal functions that could not be implemented with I2C compatible IOs. The
LVCMOS IOs being used on these ports are connected such they emulate open-drain outputs. This
emulation is achieved by forcing a constant low output and disabling the output buffer to enter the Hi-Z
state.
• The I2C specification defines a maximum input voltage VIH of (VDDmax + 0.5V), which exceeds the
absolute maximum ratings for the device IOs. The system must be designed to ensure the I2C signals
never exceed the limits defined in the Absolute Maximum Ratings section of this datasheet.
• I2C OD FS
– Speeds:
• Standard-mode (up to 100Kbits/s)
– 1.8V
– 3.3V
• Fast-mode (up to 400Kbits/s)
– 1.8V
– 3.3V
• Hs-mode (up to 3.4Mbits/s)
– 1.8V
– Exceptions:
• The IOs associated with these ports were not design to support Hs-mode while operating at 3.3V. So
Hs-mode is limited to 1.8V operation.
• The rise and fall times of the I2C signals connected to these ports must not exceed a slew rate of
0.08V/ns (or 8E+7V/s). This limit is more restrictive than the minimum fall time limits defined in the I2C
specification. Therefore, it may be necessary to add additional capacitance to the I2C signals to slow
the rise and fall times such that they do not exceed a slew rate of 0.08V/ns.
• The I2C specification defines a maximum input voltage VIH of (VDDmax + 0.5V), which exceeds the
absolute maximum ratings for the device IOs. The system must be designed to ensure the I2C signals
never exceed the limits defined in the Absolute Maximum Ratings section of this datasheet.

Note
I2C3 have one or more signals which can be multiplexed to more than one pin. Timing requirements
and switching characteristics defined in this section are only valid for specific pin combinations known
as IOSETs. Valid pin combinations or IOSETs for this interface are defined in the SysConfig-PinMux
Tool.

Refer to the Philips I2C-bus specification version 2.1 for timing details.

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For more details about features and additional description information on the device Inter-Integrated Circuit, see
the corresponding subsections within Signal Descriptions and Detailed Description sections.

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[Link] MCAN
Table 6-71 and Table 6-72 presents timing conditions and switching characteristics for MCAN.
For more details about features and additional description information on the device Controller Area Network
Interface, see the corresponding subsections within Signal Descriptions and Detailed Description sections.

Note
The device has multiple MCAN modules. MCANn is a generic prefix applied to MCAN signal names,
where n represents the specific MCAN module.

Table 6-71. MCAN Timing Conditions

PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 2 15 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 5 20 pF

Table 6-72. MCAN Switching Characteristics

NO. PARAMETER DESCRIPTION MIN MAX UNIT
MCAN1 td(MCAN_TX) Delay time, transmit shift register to MCANn_TX 10 ns
MCAN2 td(MCAN_RX) Delay time, MCANn_RX to receive shift register 10 ns

For more information, see Modular Controller Area Network (MCAN) section in Peripherals chapter in the device
TRM.

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[Link] MCASP

Note
MCASP1 and MCASP2 have one or more signals which can be multiplexed to more than one pin.
Timing requirements and switching characteristics defined in this section are only valid for specific pin
combinations known as IOSETs. Valid pin combinations or IOSETs for this interface are defined in the
SysConfig-PinMux Tool.

Table 6-73, Table 6-74, Figure 6-61, Table 6-75, and Figure 6-62 present timing conditions, timing requirements,
and switching characteristics for MCASP.
Table 6-73. MCASP Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.7 5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 1 10 pF
PCB CONNECTIVITY REQUIREMENTS
td(Trace Delay) Propagation delay of each trace 100 1100 ps
td(Trace Mismatch Delay) Propagation delay mismatch across all traces 100 ps

Table 6-74. MCASP Timing Requirements

see Figure 6-61
NO. MODE(1) MIN MAX UNIT
ASP1 tc(AHCLKRX) Cycle time, MCASP[x]_AHCLKR/X(4) 20 ns
0.5P(2) - ns
ASP2 tw(AHCLKRX) Pulse duration, MCASP[x]_AHCLKR/X(4) high or low
1.53
ASP3 tc(ACLKRX) Cycle time, MCASP[x]_ACLKR/X(4) 20 ns
0.5R(3)- ns
ASP4 tw(ACLKRX) Pulse duration, MCASP[x]_ACLKR/X(4) high or low
1.53

Setup time, MCASP[x]_AFSR/X(4) input valid before ACLKR/X int 9.29 ns

ASP5 tsu(AFSRX-ACLKRX)
MCASP[x]_ACLKR/X(4) ACLKR/X ext in/out 4

Hold time, MCASP[x]_AFSR/X(4) input valid after ACLKR/X int -1 ns

ASP6 th(ACLKRX-AFSRX)
MCASP[x]_ACLKR/X(4) ACLKR/X ext in/out 1.6

Setup time, MCASP[x]_AXR(4) input valid before ACLKR/X int 9.29 ns

ASP7 tsu(AXR-ACLKRX)
MCASP[x]_ACLKR/X(4) ACLKR/X ext in/out 4

Hold time, MCASP[x]_AXR(4) input valid after ACLKR/X int -1 ns

ASP8 th(ACLKRX-AXR)
MCASP[x]_ACLKR/X(4) ACLKR/X ext in/out 1.6

(1) ACLKR internal: [Link]=1, [Link] = 1

ACLKR external input: [Link]=0, [Link]=0
ACLKR external output: [Link]=0, [Link]=1
ACLKX internal: [Link]=1, [Link] = 1
ACLKX external input: [Link]=0, [Link]=0
ACLKX external output: [Link]=0, [Link]=1
(2) P = AHCLKR/X period in ns. For details on AHCLKR/X clock source options, see the McASP Clocks table in the Multichannel Audio
Serial Port (MCASP) section of the Module Integration chapter found in the Technical Reference Manual.
(3) R = ACLKR/X period in ns.
(4) x in MCASP[x]_* is 0, 1 or 2

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ASP2
ASP1
ASP2
MCASP[x]_AHCLKR/X (Falling Edge Priority)

MCASP[x]_AHCLKR/X (Rising Edge Polarity)

ASP4
ASP3 ASP4
(A)
MCASP[x]_ACLKR/X (CLKRP = CLKXP = 0)

(B)
MCASP[x]_ACLKR/X (CLKRP = CLKXP = 1)

ASP6
ASP5
MCASP[x]_AFSR/X (Bit Width, 0 Bit Delay)

MCASP[x]_AFSR/X (Bit Width, 1 Bit Delay)

MCASP[x]_AFSR/X (Bit Width, 2 Bit Delay)

MCASP[x]_AFSR/X (Slot Width, 0 Bit Delay)

MCASP[x]_AFSR/X (Slot Width, 1 Bit Delay)

MCASP[x]_AFSR/X (Slot Width, 2 Bit Delay)

ASP8
ASP7
MCASP[x]_AXR[x] (Data In/Receive)

A0 A1 A30 A31 B0 B1 B30 B31 C0 C1 C2 C3 C31

A. For CLKRP = CLKXP = 0, the MCASP transmitter is configured for rising edge (to shift data out) and the MCASP receiver is configured
for falling edge (to shift data in).
B. For CLKRP = CLKXP = 1, the MCASP transmitter is configured for falling edge (to shift data out) and the MCASP receiver is configured
for rising edge (to shift data in).

Figure 6-61. MCASP Timing Requirements

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Table 6-75. MCASP Switching Characteristics

see Figure 6-62
NO. PARAMETER DESCRIPTION MODE(1) MIN MAX UNIT
ASP9 tc(AHCLKRX) Cycle time, MCASP[x]_AHCLKR/X(4) 20 ns
ASP10 tw(AHCLKRX) Pulse duration, MCASP[x]_AHCLKR/X(4) high or low 0.5P(2) -2 ns
ASP11 tc(ACLKRX) Cycle time, MCASP[x]_ACLKR/X(4) 20 ns
ASP12 tw(ACLKRX) Pulse duration, MCASP[x]_ACLKR/X(4) high or low 0.5R(3) -2 ns

Delay time, MCASP[x]_ACLKR/X(4)

transmit edge to ACLKR/X int -1 7.25
ASP13 td(ACLKRX-AFSRX) ns
MCASP[x]_AFSR/X(4) output valid ACLKR/X ext in/out -15.29 12.84

Delay time, MCASP[x]_ACLKX(4) transmit edge to ACLKR/X int -1 7.25

ASP14 td(ACLKX-AXR) ns
MCASP[x]_AXR(4) output valid ACLKR/X ext in/out -15.29 12.84

Disable time, MCASP[x]_ACLKX(4) transmit edge to ACLKR/X int -1 7.25

ASP15 tdis(ACLKX-AXR) ns
MCASP[x]_AXR(4) output high impedance ACLKR/X ext in/out -14.9 14

(1) ACLKR internal: [Link]=1, [Link] = 1

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ASP10
ASP9 ASP10

MCASP[x]_AHCLKR/X (Falling Edge Priority)

MCASP[x]_AHCLKR/X (Rising Edge Polarity)

ASP12
ASP11
ASP12
(A)
MCASP[x]_ACLKR/X (CLKRP = CLKXP = 1)

(B)
MCASP[x]_ACLKR/X (CLKRP = CLKXP = 0)

ASP13 ASP13
ASP13 ASP13
MCASP[x]_AFSR/X (Bit Width, 0 Bit Delay)

MCASP[x]_AFSR/X (Bit Width, 1 Bit Delay)

MCASP[x]_AFSR/X (Bit Width, 2 Bit Delay)

ASP13 ASP13 ASP13

MCASP[x]_AFSR/X (Slot Width, 0 Bit Delay)

MCASP[x]_AFSR/X (Slot Width, 1 Bit Delay)

MCASP[x]_AFSR/X (Slot Width, 2 Bit Delay) ASP14

ASP15

MCASP[x]_AXR[x] (Data Out/Transmit)

A0 A1 A30 A31 B0 B1 B30 B31 C0 C1 C2 C3 C31

A. For CLKRP = CLKXP = 1, the MCASP transmitter is configured for falling edge (to shift data out) and the MCASP receiver is configured
for rising edge (to shift data in).
B. For CLKRP = CLKXP = 0, the MCASP transmitter is configured for rising edge (to shift data out) and the MCASP receiver is configured
for falling edge (to shift data in).

Figure 6-62. MCASP Switching Characteristics

For more information, see Multichannel Audio Serial Port (MCASP) section in Peripherals chapter in the device
TRM.

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[Link] MCSPI

Note
MCSPI1, MCSPI2, MCU_MCSPI0, and MCU_MCSPI1 have one or more signals which can be
multiplexed to more than one pin. Timing requirements and switching characteristics defined in this
section are only valid for specific pin combinations known as IOSETs. Valid pin combinations or
IOSETs for this interface are defined in the SysConfig-PinMux Tool.

For more details about features and additional description information on the device Serial Port Interface, see
the corresponding subsections within Signal Descriptions and Detailed Description sections.
Table 6-76 presents timing conditions for MCSPI.
Table 6-76. MCSPI Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 2 8.5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 6 12 pF

For more information, see Multichannel Serial Peripheral Interface (MCSPI) section in Peripherals chapter in the
device TRM.

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[Link].1 MCSPI — Controller Mode

Table 6-77, Figure 6-63, Table 6-78, and Figure 6-64 present timing requirements and switching characteristics
for SPI – Controller Mode.
Table 6-77. MCSPI Timing Requirements – Controller Mode
see Figure 6-63
NO. PARAMETER DESCRIPTION MIN MAX UNIT
SM4 tsu(POCI-SPICLK) Setup time, SPIn_D[x] valid before SPIn_CLK active edge 2.8 ns
SM5 th(SPICLK-POCI) Hold time, SPIn_D[x] valid after SPIn_CLK active edge 3 ns

PHA=0
EPOL=1
SPI_CS[i] (OUT)
SM1
SM3
SM8 SM2 SM9
SPI_SCLK (OUT) POL=0

SM1
SM3
SM2
POL=1
SPI_SCLK (OUT)
SM5
SM5

SM4 SM4

SPI_D[x] (IN) Bit n-1 Bit n-2 Bit n-3 Bit n-4 Bit 0

PHA=1
EPOL=1
SPI_CS[i] (OUT)
SM2
SM1
SM8 SM3 SM9
SPI_SCLK (OUT) POL=0
SM1
SM2
SM3
POL=1
SPI_SCLK (OUT)

SM5
SM4
SM4 SM5

SPI_D[x] (IN) Bit n-1 Bit n-2 Bit n-3 Bit 1 Bit 0

SPRSP08_TIMING_McSPI_02

Figure 6-63. SPI Controller Mode Receive Timing

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Table 6-78. MCSPI Switching Characteristics - Controller Mode

see Figure 6-64
NO. PARAMETER MIN MAX UNIT
SM1 tc(SPICLK) Cycle time, SPIn_CLK 20 ns
(1)
SM2 tw(SPICLKL) Pulse duration, SPIn_CLK low 0.5P - 1 ns
(1)
SM3 tw(SPICLKH) Pulse duration, SPIn_CLK high 0.5P - 1 ns
SM6 td(SPICLK-PICO) Delay time, SPIn_CLK active edge to SPIn_D[x] -3 2.5 ns
SM7 td(CS-PICO) Delay time, SPIn_CSi active edge to SPIn_D[x] 5 ns
(2)
SM8 td(CS-SPICLK) Delay time, SPIn_CSi active to SPIn_CLK first edge PHA = 0 B-4 ns
(3)
PHA = 1 A-4 ns
(4)
SM9 td(SPICLK-CS) Delay time, SPIn_CLK last edge to SPIn_CSi inactive PHA = 0 A-4 ns
(5)
PHA = 1 B-4 ns

(1) P = SPIn_CLK period in ns.

(2) T_ref is the period of the McSPI functional clock in ns. Fratio is the divide ratio of McSPI functional clock frequency to SPIn_CLK
clock frequency, controlled by the CLKD and CLKG bit fields in the MCSPI_CH(i)CONF register and the EXTCLK bit field in the
MCSPI_CH(i)CTRL register. TCS(i) is the value programmed into the chip select time control bit field of the MCSPI_CH(i)CONF
register.
• When Fratio = 1; B = (TCS(i) + 0.5) * T_ref.
• When Fratio ≥ 2 and even value; B = (TCS(i) + 0.5) * Fratio * T_ref.
• When Fratio ≥ 3 and odd value; B = ((TCS(i) * Fratio) + ((Fratio + 1) / 2 )) * T_ref.
(3) T_ref is the period of the McSPI functional clock. Fratio is the divide ratio of McSPI functional clock frequency to SPIn_CLK
clock frequency, controlled by the CLKD and CLKG bit fields in the MCSPI_CH(i)CONF register and the EXTCLK bit field in the
MCSPI_CH(i)CTRL register. TCS(i) is the value programmed into the chip select time control bit field of the MCSPI_CH(i)CONF
register.
• When Fratio = 1; A = (TCS(i) + 1) * T_ref.
• When Fratio ≥ 2 and even value; A = (TCS(i) + 0.5) * Fratio * T_ref.
• When Fratio ≥ 3 and odd value; A = ((TCS(i) * Fratio) + ((Fratio - 1) / 2 )) * T_ref.
(4) T_ref is the period of the McSPI functional clock. Fratio is the divide ratio of McSPI functional clock frequency to SPIn_CLK
clock frequency, controlled by the CLKD and CLKG bit fields in the MCSPI_CH(i)CONF register and the EXTCLK bit field in the
MCSPI_CH(i)CTRL register. TCS(i) is the value programmed into the chip select time control bit field of the MCSPI_CH(i)CONF
register.
• When Fratio = 1; A = (TCS(i) + 1) * T_ref.
• When Fratio ≥ 2 and even value; A = (TCS(i) + 0.5) * Fratio * T_ref.
• When Fratio ≥ 3 and odd value; A = ((TCS(i) * Fratio) + ((Fratio + 1) / 2 )) * T_ref.
(5) T_ref is the period of the McSPI functional clock. Fratio is the divide ratio of McSPI functional clock frequency to SPIn_CLK
clock frequency, controlled by the CLKD and CLKG bit fields in the MCSPI_CH(i)CONF register and the EXTCLK bit field in the
MCSPI_CH(i)CTRL register. TCS(i) is the value programmed into the chip select time control bit field of the MCSPI_CH(i)CONF
register.
• When Fratio = 1; B = (TCS(i) + 0.5) * T_ref.
• When Fratio ≥ 2 and even value; B = (TCS(i) + 0.5) * Fratio * T_ref.
• When Fratio ≥ 3 and odd value; B = ((TCS(i) * Fratio) + ((Fratio - 1) / 2 )) * T_ref.

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PHA=0
EPOL=1
SPI_CS[i] (OUT)
SM1
SM3
SM8 SM2 SM9
SPI_SCLK (OUT) POL=0

SM1

SM3
POL=1 SM2
SPI_SCLK (OUT)

SM7 SM6 SM6

SPI_D[x] (OUT) Bit n-1 Bit n-2 Bit n-3 Bit n-4 Bit 0

PHA=1
EPOL=1
SPI_CS[i] (OUT)

SM1
SM2
SM8 SM3 SM9
SPI_SCLK (OUT) POL=0

SM1
SM2

POL=1 SM3
SPI_SCLK (OUT)

SM6 SM6 SM6 SM6

SPI_D[x] (OUT) Bit n-1 Bit n-2 Bit n-3 Bit 1 Bit0

SPRSP08_TIMING_McSPI_01

Figure 6-64. SPI Controller Mode Transmit Timing

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[Link].2 MCSPI — Peripheral Mode

Table 6-79, Figure 6-65, Table 6-80, and Figure 6-66 present timing requirements and switching characteristics
for SPI – Peripheral Mode.
Table 6-79. MCSPI Timing Requirements – Peripheral Mode
see Figure 6-65
NO. PARAMETER DESCRIPTION MIN MAX UNIT
SS1 tc(SPICLK) Cycle time, SPIn_CLK 20 ns
(1)
SS2 tw(SPICLKL) Pulse duration, SPIn_CLK low 0.45P ns
(1)
SS3 tw(SPICLKH) Pulse duration, SPIn_CLK high 0.45P ns
SS4 tsu(PICO-SPICLK) Setup time, SPIn_D[x] valid before SPIn_CLK active edge 5 ns
SS5 th(SPICLK-PICO) Hold time, SPIn_D[x] valid after SPIn_CLK active edge 5 ns
SS8 tsu(CS-SPICLK) Setup time, SPIn_CSi valid before SPIn_CLK first edge 5 ns
SS9 th(SPICLK-CS) Hold time, SPIn_CSi valid after SPIn_CLK last edge 5 ns

(1) P = SPIn_CLK period in ns.

PHA=0
EPOL=1
SPI_CS[i] (IN)

SS1
SS2
SS8 SS3 SS9
SPI_SCLK (IN) POL=0

SS1
SS2
POL=1 SS3
SPI_SCLK (IN)

SS5 SS4
SS4 SS5

SPI_D[x] (IN) Bit n-1 Bit n-2 Bit n-3 Bit n-4 Bit 0

PHA=1
EPOL=1
SPI_CS[i] (IN)

SS1
SS2
SS8 SS3 SS9
POL=0
SPI_SCLK (IN)

SS1
SS3
POL=1 SS2
SPI_SCLK (IN)

SS4
SS5
SS4 SS5

SPI_D[x] (IN) Bit n-1 Bit n-2 Bit n-3 Bit 1 Bit 0

SPRSP08_TIMING_McSPI_04

Figure 6-65. SPI Peripheral Mode Receive Timing

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Table 6-80. MCSPI Switching Characteristics – Peripheral Mode

see Figure 6-66
NO. PARAMETER DESCRIPTION MIN MAX UNIT
SS6 td(SPICLK-POCI) Delay time, SPIn_CLK active edge to SPIn_D[x] 2 17.12 ns
SS7 tsk(CS-POCI) Delay time, SPIn_CSi active edge to SPIn_D[x] 20.95 ns

PHA=0
EPOL=1
SPI_CS[i] (IN)

SS1
SS2
SS8 SS3 SS9
SPI_SCLK (IN) POL=0

SS1
SS2
POL=1 SS3
SPI_SCLK (IN)

SS7 SS6 SS6

SPI_D[x] (OUT) Bit n-1 Bit n-2 Bit n-3 Bit n-4 Bit 0

PHA=1
EPOL=1
SPI_CS[i] (IN)

SS1
SS2
SS8 SS3 SS9
POL=0
SPI_SCLK (IN)

SS1
SS3
POL=1 SS2
SPI_SCLK (IN)

SS6 SS6 SS6 SS6

SPI_D[x] (OUT)
Bit n-1 Bit n-2 Bit n-3 Bit 1 Bit 0

SPRSP08_TIMING_McSPI_03

Figure 6-66. SPI Peripheral Mode Transmit Timing

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[Link] MMCSD
The MMCSD Host Controller provides an interface to embedded Multi-Media Card (MMC), Secure Digital (SD),
and Secure Digital IO (SDIO) devices. The MMCSD Host Controller deals with MMC/SD/SDIO protocol at
transmission level, data packing, adding cyclic redundancy checks (CRCs), start/end bit insertion, and checking
for syntactical correctness.
For more details about MMCSD interfaces, see the corresponding MMC0, MMC1, and MMC2 subsections within
Signal Descriptions and Detailed Description sections.

Note
Some operating modes require software configuration of the MMC DLL delay settings, as shown in
Table 6-81 and Table 6-100.
The modes which show a value of "Tuning" in the ITAPDLYSEL column of Table 6-81 and Table 6-100
require a tuning algorithm to be used for optimizing input timing. Refer to the MMCSD Programming
Guide in the device TRM for more information on the tuning algorithm and configuration of input
delays required to optimize input timing.

For more information, see Multi-Media Card/Secure Digital (MMCSD) Interface section in Peripherals chapter in
the device TRM.

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(1) NA means this register field has no function when operating with half-cycle timing, which is required for this mode.
(2) Tuning means this mode requires a tuning algorithm to be used to determine optimal input timing

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Table 6-82 presents timing conditions for MMC0.

Table 6-82. MMC0 Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
Legacy SDR @ 3.3V
High Speed SDR @ 3.3V
0.69 2.06 V/ns
Default Speed
High Speed

SRI Input slew rate Legacy SDR @ 1.8V

0.14 1.44 V/ns
UHS-I SDR12
High Speed SDR @ 1.8V
0.3 1.34 V/ns
UHS-I SDR25
UHS-I DDR50 1 2 V/ns
OUTPUT CONDITIONS
HS200
1 10 pF
CL Output load capacitance UHS-I SDR104
All other modes 1 12 pF
PCB CONNECTIVITY REQUIREMENTS
Legacy SDR
High Speed SDR 126 756 ps
HS200
Default Speed
High Speed
td(Trace Delay) Propagation delay of each trace
UHS-I SDR12
126 1386 ps
UHS-I SDR25
UHS-I SDR50
UHS-I SDR104
UHS-I DDR50 239 1134 ps
High Speed SDR
HS200
8 ps
High Speed
td(Trace Mismatch Propagation delay mismatch across all
UHS-I SDR104
Delay) traces
UHS-I DDR50 20 ps
All other modes 100 ps

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[Link].1.1 Legacy SDR Mode

Table 6-83, Figure 6-67, Table 6-84, and Figure 6-68 present timing requirements and switching characteristics
for MMC0 – Legacy SDR Mode.
Table 6-83. MMC0 Timing Requirements – Legacy SDR Mode
see Figure 6-67
IO
NO. Operating MIN MAX UNIT
Voltage
1.8V 4.2 ns
LSDR1 tsu(cmdV-clkH) Setup time, MMC0_CMD valid before MMC0_CLK rising edge
3.3V 2.15 ns
1.8V 0.87 ns
LSDR2 th(clkH-cmdV) Hold time, MMC0_CMD valid after MMC0_CLK rising edge
3.3V 1.67 ns
1.8V 4.2 ns
LSDR3 tsu(dV-clkH) Setup time, MMC0_DAT[7:0] valid before MMC0_CLK rising edge
3.3V 2.15 ns
1.8V 0.87 ns
LSDR4 th(clkH-dV) Hold time, MMC0_DAT[7:0] valid after MMC0_CLK rising edge
3.3V 1.67 ns

Figure 6-67. MMC0 – Legacy SDR – Receive Mode

Table 6-84. MMC0 Switching Characteristics – Legacy SDR Mode

see Figure 6-68
IO
NO. PARAMETER Operating MIN MAX UNIT
Voltage
fop(clk) Operating frequency, MMC0_CLK 25 MHz
LSDR5 tc(clk) Cycle time, MMC0_CLK 40 ns
LSDR6 tw(clkH) Pulse duration, MMC0_CLK high 18.7 ns
LSDR7 tw(clkL) Pulse duration, MMC0_CLK low 18.7 ns
1.8V -2.1 2.1 ns
LSDR8 td(clkL-cmdV) Delay time, MMC0_CLK falling edge to MMC0_CMD transition
3.3V -1.8 2.2 ns
1.8V -2.1 2.1 ns
LSDR9 td(clkL-dV) Delay time, MMC0_CLK falling edge to MMC0_DAT[7:0] transition
3.3V -1.8 2.2 ns

Figure 6-68. MMC0 – Legacy SDR – Transmit Mode

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[Link].1.2 High Speed SDR Mode

Table 6-85, Figure 6-69, Table 6-86, and Figure 6-70 present timing requirements and switching characteristics
for MMC0 – High Speed SDR Mode.
Table 6-85. MMC0 Timing Requirements – High Speed SDR Mode
see Figure 6-69
IO
NO. Operating MIN MAX UNIT
Voltage
1.8V 2.15 ns
HSSDR1 tsu(cmdV-clkH) Setup time, MMC0_CMD valid before MMC0_CLK rising edge
3.3V 2.24 ns
1.8V 1.27 ns
HSSDR2 th(clkH-cmdV) Hold time, MMC0_CMD valid after MMC0_CLK rising edge
3.3V 1.66 ns
1.8V 2.15 ns
HSSDR3 tsu(dV-clkH) Setup time, MMC0_DAT[7:0] valid before MMC0_CLK rising edge
3.3V 2.24 ns
1.8V 1.27 ns
HSSDR4 th(clkH-dV) Hold time, MMC0_DAT[7:0] valid after MMC0_CLK rising edge
3.3V 1.66 ns

Figure 6-69. MMC0 – High Speed SDR Mode – Receive Mode

Table 6-86. MMC0 Switching Characteristics – High Speed SDR Mode

see Figure 6-70
IO
NO. PARAMETER Operating MIN MAX UNIT
Voltage
fop(clk) Operating frequency, MMC0_CLK 50 MHz
HSSDR5 tc(clk) Cycle time, MMC0_CLK 20 ns
HSSDR6 tw(clkH) Pulse duration, MMC0_CLK high 9.2 ns
HSSDR7 tw(clkL) Pulse duration, MMC0_CLK low 9.2 ns
1.8V -1.55 3.05 ns
HSSDR8 td(clkL-cmdV) Delay time, MMC0_CLK falling edge to MMC0_CMD transition
3.3V -1.8 2.2 ns
1.8V -1.55 3.05 ns
HSSDR9 td(clkL-dV) Delay time, MMC0_CLK falling edge to MMC0_DAT[7:0] transition
3.3V -1.8 2.2 ns

Figure 6-70. MMC0 – High Speed SDR Mode – Transmit Mode

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[Link].1.3 HS200 Mode

Table 6-87, Figure 6-71, Table 6-88, and Figure 6-72 present both timing requirements and switching
characteristics for MMC0 – HS200 Mode.
Table 6-87. MMC0 Timing Requirements – HS200 Mode
see Figure 6-71
NO. MIN MAX UNIT
HS2004 tDVW Input data valid window, MMC0_CMD and MMC0_DAT[7:0] 2.0(1) ns

(1) This parameter defines the minimum data valid window required by the host, where any data valid window presented to the host
greater than this value ensures the host is able to capture valid data. The value defined by this parameter is smaller than the smallest
possible data valid window defined for any eMMC device operating in HS200 mode.

HS2004

VIH
MMC0_CMD Valid
MMC0_DAT[7:0] Window
VIL

Figure 6-71. MMC0 – HS200 – Receive Mode

Table 6-88. MMC0 Switching Characteristics – HS200 Mode

see Figure 6-72
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 200 MHz
HS2005 tc(clk) Cycle time, MMC0_CLK 5 ns
HS2006 tw(clkH) Pulse duration, MMC0_CLK high 2.12 ns
HS2007 tw(clkL) Pulse duration, MMC0_CLK low 2.12 ns
HS2008 td(clkL-cmdV) Delay time, MMC0_CLK rising edge to MMC0_CMD transition 1.07 3.21 ns
HS2009 td(clkL-dV) Delay time, MMC0_CLK rising edge to MMC0_DAT[7:0] transition 1.07 3.21 ns

Figure 6-72. MMC0 – HS200 Mode – Transmit Mode

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[Link].1.4 Default Speed Mode

Table 6-89, Figure 6-73, Table 6-90, and Figure 6-74 present timing requirements and switching characteristics
for MMC0 – Default Speed Mode.
Table 6-89. Timing Requirements for MMC0 – Default Speed Mode
see Figure 6-73
NO. MIN MAX UNIT
DS1 tsu(cmdV-clkH) Setup time, MMC0_CMD valid before MMC0_CLK rising edge 2.15 ns
DS2 th(clkH-cmdV) Hold time, MMC0_CMD valid after MMC0_CLK rising edge 1.67 ns
DS3 tsu(dV-clkH) Setup time, MMC0_DAT[3:0] valid before MMC0_CLK rising edge 2.15 ns
DS4 th(clkH-dV) Hold time, MMC0_DAT[3:0] valid after MMC0_CLK rising edge 1.67 ns

MMC[x]_CLK

DS1 DS2

MMC[x]_CMD

DS3 DS4

MMC[x]_DAT[3:0]

Figure 6-73. MMC0 – Default Speed – Receive Mode

Table 6-90. Switching Characteristics for MMC0 – Default Speed Mode

see Figure 6-74
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 25 MHz
DS5 tc(clk) Cycle time, MMC0_CLK 40 ns
DS6 tw(clkH) Pulse duration, MMC0_CLK high 18.7 ns
DS7 tw(clkL) Pulse duration, MMC0_CLK low 18.7 ns
DS8 td(clkL-cmdV) Delay time, MMC0_CLK falling edge to MMC0_CMD transition - 1.8 2.2 ns
DS9 td(clkL-dV) Delay time, MMC0_CLK falling edge to MMC0_DAT[3:0] transition - 1.8 2.2 ns

DS5

DS6 DS7

MMC[x]_CLK

D S8

MMC[x]_CMD

D S9

MMC[x]_DAT[3:0]

Figure 6-74. MMC0 – Default Speed – Transmit Mode

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[Link].1.5 High Speed Mode

Table 6-91, Figure 6-75, Table 6-92, and Figure 6-76 present timing requirements and switching characteristics
for MMC0 – High Speed Mode.
Table 6-91. Timing Requirements for MMC0 – High Speed Mode
see Figure 6-75
NO. MIN MAX UNIT
HS1 tsu(cmdV-clkH) Setup time, MMC0_CMD valid before MMC0_CLK rising edge 2.24 ns
HS2 th(clkH-cmdV) Hold time, MMC0_CMD valid after MMC0_CLK rising edge 1.66 ns
HS3 tsu(dV-clkH) Setup time, MMC0_DAT[3:0] valid before MMC0_CLK rising edge 2.24 ns
HS4 th(clkH-dV) Hold time, MMC0_DAT[3:0] valid after MMC0_CLK rising edge 1.66 ns

MMC[x]_CLK

HS1 H S2

MMC[x]_CMD

HS3 H S4

MMC[x]_DAT[3:0]

Figure 6-75. MMC0 – High Speed – Receive Mode

Table 6-92. Switching Characteristics for MMC0 – High Speed Mode

see Figure 6-76
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 50 MHz
HS5 tc(clk) Cycle time. MMC0_CLK 20 ns
HS6 tw(clkH) Pulse duration, MMC0_CLK high 9.2 ns
HS7 tw(clkL) Pulse duration, MMC0_CLK low 9.2 ns
HS8 td(clkL-cmdV) Delay time, MMC0_CLK falling edge to MMC0_CMD transition -1.8 2.2 ns
HS9 td(clkL-dV) Delay time, MMC0_CLK falling edge to MMC0_DAT[3:0] transition -1.8 2.2 ns

HS5

HS6 HS7

MMC[x]_CLK

H S8

MMC[x]_CMD

H S9

MMC[x]_DAT[3:0]

Figure 6-76. MMC0 – High Speed – Transmit Mode

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[Link].1.6 UHS–I SDR12 Mode

Table 6-93, Figure 6-77, Table 6-94, and Figure 6-78 present timing requirements and switching characteristics
for MMC0 – UHS-I SDR12 Mode.
Table 6-93. Timing Requirements for MMC0 – UHS-I SDR12 Mode
see Figure 6-77
NO. MIN MAX UNIT
SDR121 tsu(cmdV-clkH) Setup time, MMC0_CMD valid before MMC0_CLK rising edge 4.2 ns
SDR122 th(clkH-cmdV) Hold time, MMC0_CMD valid after MMC0_CLK rising edge 0.87 ns
SDR123 tsu(dV-clkH) Setup time, MMC0_DAT[3:0] valid before MMC0_CLK rising edge 4.2 ns
SDR124 th(clkH-dV) Hold time, MMC0_DAT[3:0] valid after MMC0_CLK rising edge 0.87 ns

MMC[x]_CLK

SDR121 SDR122

MMC[x]_CMD

SDR123 SDR124

MMC[x]_DAT[3:0]

Figure 6-77. MMC0 – UHS-I SDR12 – Receive Mode

Table 6-94. Switching Characteristics for MMC0 – UHS-I SDR12 Mode

see Figure 6-78
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 25 MHz
SDR125 tc(clk) Cycle time, MMC0_CLK 40 ns
SDR126 tw(clkH) Pulse duration, MMC0_CLK high 18.7 ns
SDR127 tw(clkL) Pulse duration, MMC0_CLK low 18.7 ns
SDR128 td(clkL-cmdV) Delay time, MMC0_CLK rising edge to MMC0_CMD transition 1.5 8.6 ns
SDR129 td(clkL-dV) Delay time, MMC0_CLK rising edge to MMC0_DAT[3:0] transition 1.5 8.6 ns

SDR125

SDR126 SDR127

MMC[x]_CLK

SDR128 SDR128

MMC[x]_CMD

SDR129 SDR129

MMC[x]_DAT[3:0]

Figure 6-78. MMC0 – UHS-I SDR12 – Transmit Mode

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[Link].1.7 UHS–I SDR25 Mode

Table 6-95, Figure 6-79, Table 6-96, and Figure 6-80 present timing requirements and switching characteristics
for MMC0 – UHS-I SDR25 Mode.
Table 6-95. Timing Requirements for MMC0 – UHS-I SDR25 Mode
see Figure 6-79
NO. MIN MAX UNIT
SDR251 tsu(cmdV-clkH) Setup time, MMC0_CMD valid before MMC0_CLK rising edge 2.15 ns
SDR252 th(clkH-cmdV) Hold time, MMC0_CMD valid after MMC0_CLK rising edge 1.27 ns
SDR253 tsu(dV-clkH) Setup time, MMC0_DAT[3:0] valid before MMC0_CLK rising edge 2.15 ns
SDR254 th(clkH-dV) Hold time, MMC0_DAT[3:0] valid after MMC0_CLK rising edge 1.27 ns

MMC[x]_CLK

SDR251 SDR252

MMC[x]_CMD

SDR253 SDR254

MMC[x]_DAT[3:0]

Figure 6-79. MMC0 – UHS-I SDR25 – Receive Mode

Table 6-96. Switching Characteristics for MMC0 – UHS-I SDR25 Mode

see Figure 6-80
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 50 MHz
SDR255 tc(clk) Cycle time, MMC0_CLK 20 ns
SDR256 tw(clkH) Pulse duration, MMC0_CLK high 9.2 ns
SDR257 tw(clkL) Pulse duration, MMC0_CLK low 9.2 ns
SDR258 td(clkL-cmdV) Delay time, MMC0_CLK rising edge to MMC0_CMD transition 2.4 8.1 ns
SDR259 td(clkL-dV) Delay time, MMC0_CLK rising edge to MMC0_DAT[3:0] transition 2.4 8.1 ns

SDR255

SDR256 SDR257

MMC[x]_CLK

SDR258 SDR258

MMC[x]_CMD

SDR259 SDR259

MMC[x]_DAT[3:0]

Figure 6-80. MMC0 – UHS-I SDR25 – Transmit Mode

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[Link].1.8 UHS–I SDR50 Mode

Table 6-97 and Figure 6-81 presents switching characteristics for MMC0 – UHS-I SDR50 Mode.
Table 6-97. Switching Characteristics for MMC0 – UHS-I SDR50 Mode
see Figure 6-81
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 100 MHz
SDR505 tc(clk) Cycle time, MMC0_CLK 10 ns
SDR506 tw(clkH) Pulse duration, MMC0_CLK high 4.45 ns
SDR507 tw(clkL) Pulse duration, MMC0_CLK low 4.45 ns
SDR508 td(clkL-cmdV) Delay time, MMC0_CLK rising edge to MMC0_CMD transition 1.2 6.35 ns
SDR509 td(clkL-dV) Delay time, MMC0_CLK rising edge to MMC0_DAT[3:0] transition 1.2 6.35 ns

SDR505

SDR506 SDR507

MMC[x]_CLK

SDR508 SDR508

MMC[x]_CMD

SDR509 SDR509

MMC[x]_DAT[3:0]

Figure 6-81. MMC0 – UHS-I SDR50 – Transmit Mode

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[Link].1.9 UHS–I DDR50 Mode

Table 6-98 and Figure 6-82 present switching characteristics for MMC0 – UHS-I DDR50 Mode.
Table 6-98. Switching Characteristics for MMC0 – UHS-I DDR50 Mode
see Figure 6-82
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 50 MHz
DDR505 tc(clk) Cycle time, MMC0_CLK 20 ns
DDR506 tw(clkH) Pulse duration, MMC0_CLK high 9.2 ns
DDR507 tw(clkL) Pulse duration, MMC0_CLK low 9.2 ns
DDR508 td(clk-cmdV) Delay time, MMC0_CLK rising edge to MMC0_CMD transition 1.12 6.43 ns
DDR509 td(clk-dV) Delay time, MMC0_CLK transition to MMC0_DAT[3:0] transition 1.12 6.43 ns

DDR505
DDR506 DDR507
MMC[x]_CLK
DDR508
MMC[x]_CMD

DDR509 DDR509
MMC[x]_DAT[3:0]

Figure 6-82. MMC0 – UHS-I DDR50 – Transmit Mode

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[Link].1.10 UHS–I SDR104 Mode

Table 6-99 and Figure 6-83 present switching characteristics for MMC0 – UHS-I SDR104 Mode.
Table 6-99. Switching Characteristics for MMC0 – UHS-I SDR104 Mode
see Figure 6-83
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMC0_CLK 200 MHz
SDR1045 tc(clk) Cycle time, MMC0_CLK 5 ns
SDR1046 tw(clkH) Pulse duration, MMC0_CLK high 2.12 ns
SDR1047 tw(clkL) Pulse duration, MMC0_CLK low 2.12 ns
SDR1048 td(clkL-cmdV) Delay time, MMC0_CLK rising edge to MMC0_CMD transition 1.07 3.21 ns
SDR1049 td(clkL-dV) Delay time, MMC0_CLK rising edge to MMC0_DAT[3:0] transition 1.07 3.21 ns

SDR1045

SDR1046 SDR1047

MMC[x]_CLK

SDR1048 SDR1048

MMC[x]_CMD

SDR1049 SDR1049

MMC[x]_DAT[3:0]

Figure 6-83. MMC0 – UHS-I SDR104 – Transmit Mode

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Table 6-101 presents timing conditions for MMC1.

Table 6-101. MMC1/MMC2 Timing Conditions
PARAMETER MIN MAX UNIT
Input Conditions
Default Speed
0.69 2.06 V/ns
High Speed
SRI Input slew rate UHS–I SDR12
0.34 1.34 V/ns
UHS–I SDR25
UHS–I DDR50 1 2 V/ns
Output Conditions
CL Output load capacitance All modes 1 10 pF
PCB Connectivity Requirements
UHS–I DDR50 239 1134 ps
td(Trace Delay) Propagation delay of each trace
All other modes 126 1386 ps
High Speed
8 ps
UHS–I SDR104
td(Trace Mismatch Propagation delay mismatch across all
Delay) traces UHS–I DDR50 20 ps
All other modes 100 ps

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[Link].2.1 Default Speed Mode

Table 6-102, Figure 6-84, Table 6-103, and Figure 6-85 present timing requirements and switching
characteristics for MMC1/MMC2 – Default Speed Mode.
Table 6-102. Timing Requirements for MMC1/MMC2 – Default Speed Mode
see Figure 6-84
NO. MIN MAX UNIT
DS1 tsu(cmdV-clkH) Setup time, MMCx_CMD valid before MMCx_CLK rising edge 2.15 ns
DS2 th(clkH-cmdV) Hold time, MMCx_CMD valid after MMCx_CLK rising edge 1.67 ns
DS3 tsu(dV-clkH) Setup time, MMCx_DAT[3:0] valid before MMCx_CLK rising edge 2.15 ns
DS4 th(clkH-dV) Hold time, MMCx_DAT[3:0] valid after MMCx_CLK rising edge 1.67 ns

MMC[x]_CLK

DS1 DS2

MMC[x]_CMD

DS3 DS4

MMC[x]_DAT[3:0]

Figure 6-84. MMC1/MMC2 – Default Speed – Receive Mode

Table 6-103. Switching Characteristics for MMC1/MMC2 – Default Speed Mode

see Figure 6-85
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMCx_CLK 25 MHz
DS5 tc(clk) Cycle time, MMCx_CLK 40 ns
DS6 tw(clkH) Pulse duration, MMCx_CLK high 18.7 ns
DS7 tw(clkL) Pulse duration, MMCx_CLK low 18.7 ns
DS8 td(clkL-cmdV) Delay time, MMCx_CLK falling edge to MMCx_CMD transition - 1.8 2.2 ns
DS9 td(clkL-dV) Delay time, MMCx_CLK falling edge to MMCx_DAT[3:0] transition - 1.8 2.2 ns

DS5

DS6 DS7

MMC[x]_CLK

D S8

MMC[x]_CMD

D S9

MMC[x]_DAT[3:0]

Figure 6-85. MMC1/MMC2 – Default Speed – Transmit Mode

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[Link].2.2 High Speed Mode

Table 6-104, Figure 6-86, Table 6-105, and Figure 6-87 present timing requirements and switching
characteristics for MMC1/MMC2 – High Speed Mode.
Table 6-104. Timing Requirements for MMC1/MMC2 – High Speed Mode
see Figure 6-86
NO. MIN MAX UNIT
HS1 tsu(cmdV-clkH) Setup time, MMCx_CMD valid before MMCx_CLK rising edge 2.24 ns
HS2 th(clkH-cmdV) Hold time, MMCx_CMD valid after MMCx_CLK rising edge 1.66 ns
HS3 tsu(dV-clkH) Setup time, MMCx_DAT[3:0] valid before MMCx_CLK rising edge 2.24 ns
HS4 th(clkH-dV) Hold time, MMCx_DAT[3:0] valid after MMCx_CLK rising edge 1.66 ns

MMC[x]_CLK

HS1 H S2

MMC[x]_CMD

HS3 H S4

MMC[x]_DAT[3:0]

Figure 6-86. MMC1/MMC2 – High Speed – Receive Mode

Table 6-105. Switching Characteristics for MMC1/MMC2 – High Speed Mode

see Figure 6-87
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMCx_CLK 50 MHz
HS5 tc(clk) Cycle time. MMCx_CLK 20 ns
HS6 tw(clkH) Pulse duration, MMCx_CLK high 9.2 ns
HS7 tw(clkL) Pulse duration, MMCx_CLK low 9.2 ns
HS8 td(clkL-cmdV) Delay time, MMCx_CLK falling edge to MMCx_CMD transition - 1.8 2.2 ns
HS9 td(clkL-dV) Delay time, MMCx_CLK falling edge to MMCx_DAT[3:0] transition - 1.8 2.2 ns

HS5

HS6 HS7

MMC[x]_CLK

H S8

MMC[x]_CMD

H S9

MMC[x]_DAT[3:0]

Figure 6-87. MMC1/MMC2 – High Speed – Transmit Mode

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].2.3 UHS–I SDR12 Mode

Table 6-106, Figure 6-88, Table 6-107, and Figure 6-89 present timing requirements and switching
characteristics for MMC1/MMC2 – UHS-I SDR12 Mode.
Table 6-106. Timing Requirements for MMC1/MMC2 – UHS-I SDR12 Mode
see Figure 6-88
NO. MIN MAX UNIT
SDR121 tsu(cmdV-clkH) Setup time, MMCx_CMD valid before MMCx_CLK rising edge 4.2 ns
SDR122 th(clkH-cmdV) Hold time, MMCx_CMD valid after MMCx_CLK rising edge 0.87 ns
SDR123 tsu(dV-clkH) Setup time, MMCx_DAT[3:0] valid before MMCx_CLK rising edge 4.2 ns
SDR124 th(clkH-dV) Hold time, MMCx_DAT[3:0] valid after MMCx_CLK rising edge 0.87 ns

MMC[x]_CLK

SDR121 SDR122

MMC[x]_CMD

SDR123 SDR124

MMC[x]_DAT[3:0]

Figure 6-88. MMC1/MMC2 – UHS-I SDR12 – Receive Mode

Table 6-107. Switching Characteristics for MMC1/MMC2 – UHS-I SDR12 Mode

see Figure 6-89
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMCx_CLK 25 MHz
SDR125 tc(clk) Cycle time, MMCx_CLK 40 ns
SDR126 tw(clkH) Pulse duration, MMCx_CLK high 18.7 ns
SDR127 tw(clkL) Pulse duration, MMCx_CLK low 18.7 ns
SDR128 td(clkL-cmdV) Delay time, MMCx_CLK rising edge to MMCx_CMD transition 1.5 8.6 ns
SDR129 td(clkL-dV) Delay time, MMCx_CLK rising edge to MMCx_DAT[3:0] transition 1.5 8.6 ns

SDR125

SDR126 SDR127

MMC[x]_CLK

SDR128 SDR128

MMC[x]_CMD

SDR129 SDR129

MMC[x]_DAT[3:0]

Figure 6-89. MMC1/MMC2 – UHS-I SDR12 – Transmit Mode

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

[Link].2.4 UHS–I SDR25 Mode

Table 6-108, Figure 6-90, Table 6-109, and Figure 6-91 present timing requirements and switching
characteristics for MMC1/MMC2 – UHS-I SDR25 Mode.
Table 6-108. Timing Requirements for MMC1/MMC2 – UHS-I SDR25 Mode
see Figure 6-90
NO. MIN MAX UNIT
SDR251 tsu(cmdV-clkH) Setup time, MMCx_CMD valid before MMCx_CLK rising edge 2.15 ns
SDR252 th(clkH-cmdV) Hold time, MMCx_CMD valid after MMCx_CLK rising edge 1.27 ns
SDR253 tsu(dV-clkH) Setup time, MMCx_DAT[3:0] valid before MMCx_CLK rising edge 2.15 ns
SDR254 th(clkH-dV) Hold time, MMCx_DAT[3:0] valid after MMCx_CLK rising edge 1.27 ns

MMC[x]_CLK

SDR251 SDR252

MMC[x]_CMD

SDR253 SDR254

MMC[x]_DAT[3:0]

Figure 6-90. MMC1/MMC2 – UHS-I SDR25 – Receive Mode

Table 6-109. Switching Characteristics for MMC1/MMC2 – UHS-I SDR25 Mode

see Figure 6-91
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMCx_CLK 50 MHz
SDR255 tc(clk) Cycle time, MMCx_CLK 20 ns
SDR256 tw(clkH) Pulse duration, MMCx_CLK high 9.2 ns
SDR257 tw(clkL) Pulse duration, MMCx_CLK low 9.2 ns
SDR258 td(clkL-cmdV) Delay time, MMCx_CLK rising edge to MMCx_CMD transition 2.4 8.1 ns
SDR259 td(clkL-dV) Delay time, MMCx_CLK rising edge to MMCx_DAT[3:0] transition 2.4 8.1 ns

SDR255

SDR256 SDR257

MMC[x]_CLK

SDR258 SDR258

MMC[x]_CMD

SDR259 SDR259

MMC[x]_DAT[3:0]

Figure 6-91. MMC1/MMC2 – UHS-I SDR25 – Transmit Mode

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].2.5 UHS–I SDR50 Mode

Table 6-110 and Figure 6-92 presents switching characteristics for MMC1/MMC2 – UHS-I SDR50 Mode.
Table 6-110. Switching Characteristics for MMC1/MMC2 – UHS-I SDR50 Mode
see Figure 6-92
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMCx_CLK 100 MHz
SDR505 tc(clk) Cycle time, MMCx_CLK 10 ns
SDR506 tw(clkH) Pulse duration, MMCx_CLK high 4.45 ns
SDR507 tw(clkL) Pulse duration, MMCx_CLK low 4.45 ns
SDR508 td(clkL-cmdV) Delay time, MMCx_CLK rising edge to MMCx_CMD transition 1.2 6.35 ns
SDR509 td(clkL-dV) Delay time, MMCx_CLK rising edge to MMCx_DAT[3:0] transition 1.2 6.35 ns

SDR505

SDR506 SDR507

MMC[x]_CLK

SDR508 SDR508

MMC[x]_CMD

SDR509 SDR509

MMC[x]_DAT[3:0]

Figure 6-92. MMC1/MMC2 – UHS-I SDR50 – Transmit Mode

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

[Link].2.6 UHS–I DDR50 Mode

Table 6-111 and Figure 6-93 present switching characteristics for MMC1/MMC2 – UHS-I DDR50 Mode.
Table 6-111. Switching Characteristics for MMC1/MMC2 – UHS-I DDR50 Mode
see Figure 6-93
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMCx_CLK 50 MHz
DDR505 tc(clk) Cycle time, MMCx_CLK 20 ns
DDR506 tw(clkH) Pulse duration, MMCx_CLK high 9.2 ns
DDR507 tw(clkL) Pulse duration, MMCx_CLK low 9.2 ns
DDR508 td(clk-cmdV) Delay time, MMCx_CLK rising edge to MMCx_CMD transition 1.12 6.43 ns
DDR509 td(clk-dV) Delay time, MMCx_CLK transition to MMCx_DAT[3:0] transition 1.12 6.43 ns

DDR505
DDR506 DDR507
MMC[x]_CLK
DDR508
MMC[x]_CMD

DDR509 DDR509
MMC[x]_DAT[3:0]

Figure 6-93. MMC1/MMC2 – UHS-I DDR50 – Transmit Mode

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].2.7 UHS–I SDR104 Mode

Table 6-112 and Figure 6-94 present switching characteristics for MMC1/MMC2 – UHS-I SDR104 Mode.
Table 6-112. Switching Characteristics for MMC1/MMC2 – UHS-I SDR104 Mode
see Figure 6-94
NO. PARAMETER MIN MAX UNIT
fop(clk) Operating frequency, MMCx_CLK 200 MHz
SDR1045 tc(clk) Cycle time, MMCx_CLK 5 ns
SDR1046 tw(clkH) Pulse duration, MMCx_CLK high 2.12 ns
SDR1047 tw(clkL) Pulse duration, MMCx_CLK low 2.12 ns
SDR1048 td(clkL-cmdV) Delay time, MMCx_CLK rising edge to MMCx_CMD transition 1.07 3.21 ns
SDR1049 td(clkL-dV) Delay time, MMCx_CLK rising edge to MMCx_DAT[3:0] transition 1.07 3.21 ns

SDR1045

SDR1046 SDR1047

MMC[x]_CLK

SDR1048 SDR1048

MMC[x]_CMD

SDR1049 SDR1049

MMC[x]_DAT[3:0]

Figure 6-94. MMC1/MMC2 – UHS-I SDR104 – Transmit Mode

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

[Link] OLDI
[Link].1 OLDI0 Switching Characteristics
Table 6-113 and Figure 6-95 present switching characteristics for OLDI0.
Table 6-113. OLDI0 Switching Characteristics
NO. PARAMETER MODE MIN TYP MAX UNIT
Rise time, OLDI0_CLK[1:0]P, Slow(1) 0.5 ns
OLDI1 tt(LHTT) OLDI0_CLK[1:0]N, OLDI0_A[7:0]P,
and OLDI0_A[7:0]N Fast(2) 0.25 ns

Fall time, OLDI0_CLK[1:0]P, Slow(1) 0.5 ns

OLDI2 tt(HLTT) OLDI0_CLK[1:0]N, OLDI0_A[7:0]P,
and OLDI0_A[7:0]N Fast(2) 0.25 ns

OLDI3 tc(CLK) Cycle time, OLDI0_CLK[1:0]P and OLDI0_CLK[1:0]N 6.06 110.01 ns

OLDI4 tw(BIT) Bit width, OLDI0_A[7:0]P and OLDI0_A[7:0]N (1/7)OLDI3 ns
Bit 1 delay time, OLDI0_CLK[1:0]P and
OLDI5 td(BIT1) OLDI0_CLK[1:0]N to OLDI0_A[7:0]P and - (0.1)OLDI4 (0.1)OLDI4 ns
OLDI0_A[7:0]N
Bit 0 delay time, OLDI0_CLK[1:0]P and
(1/7)OLDI3 (1/7) OLDI3
OLDI6 td(BIT0) OLDI0_CLK[1:0]N to OLDI0_A[7:0]P and ns
- (0.1)OLDI4 + (0.1)OLDI4
OLDI0_A[7:0]N
Bit 6 delay time, OLDI0_CLK[1:0]P and
(2/7)OLDI3 (2/7) OLDI3
OLDI7 td(BIT6) OLDI0_CLK[1:0]N to OLDI0_A[7:0]P and ns
- (0.1)OLDI4 + (0.1)OLDI4
OLDI0_A[7:0]N
Bit 5 delay time, OLDI0_CLK[1:0]P and
(3/7)OLDI3 (3/7) OLDI3
OLDI8 td(BIT5) OLDI0_CLK[1:0]N to OLDI0_A[7:0]P and ns
- (0.1)OLDI4 + (0.1)OLDI4
OLDI0_A[7:0]N
Bit 4 delay time, OLDI0_CLK[1:0]P and
(4/7)OLDI3 (4/7) OLDI3
OLDI9 td(BIT4) OLDI0_CLK[1:0]N to OLDI0_A[7:0]P and ns
- (0.1)OLDI4 + (0.1)OLDI4
OLDI0_A[7:0]N
Bit 3 delay time, OLDI0_CLK[1:0]P and
(5/7)OLDI3 (5/7) OLDI3
OLDI10 td(BIT3) OLDI0_CLK[1:0]N to OLDI0_A[7:0]P and ns
- (0.1)OLDI4 + (0.1)OLDI4
OLDI0_A[7:0]N
Bit 2 delay time, OLDI0_CLK[1:0]P and
(6/7)OLDI3 (6/7) OLDI3
OLDI11 td(BIT2) OLDI0_CLK[1:0]N to OLDI0_A[7:0]P and ns
- (0.1)OLDI4 + (0.1)OLDI4
OLDI0_A[7:0]N
Skew, OLDI0_A[7:0]P and OLDI0_A[7:0]N relative to
OLDI12 tsk(TCCS) 50 ps
any other OLDI0_A[7:0]P and OLDI0_A[7:0]N

(1) Slow mode: TXDRV[3:0] = 0100b without back termination (RTERM_EN = 0b with 100Ω differential termination on far-end only)
(2) Fast mode: TXDRV[3:0] = 1000b with back termination (RTERM_EN = 1b with 100Ω differential termination on far-end only, or
RTERM_EN = 0b with 100Ω differential termination on near-end and far-end)

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

OLDI3

OLDI1, OLDI2

OLDI0_CLK[1:0]P 80%
20%

80%
OLDI0_CLK[1:0]N
20%

OLDI11
OLDI10
OLDI9
OLDI8
OLDI7
OLDI6
OLDI5

OLDI4
OLDI1, OLDI2
OLDI0_A[7:0]P 80%
bit 1 bit 0 bit 6 bit 5 bit 4 bit 3 bit 2
OLDI0_A[7:0]N 20%

Figure 6-95. OLDI0 Switching Characteristics

For more information, see Display Subsystem (DSS) and Peripherals section in Peripherals chapter in the device
TRM.

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

[Link] OSPI
OSPI0 offers two data capture modes, PHY mode and Tap mode.
PHY mode uses an internal reference clock to transmit and receive data via a DLL based PHY, where each
reference clock cycle produces a single cycle of OSPI0_CLK for Single Data Rate (SDR) transfers or a half
cycle of OSPI0_CLK for Double Data Rate (DDR) transfers. PHY mode supports four clocking topologies
for the receive data capture clock. Internal PHY Loopback - uses the internal reference clock as the PHY
receive data capture clock. Internal Pad Loopback - uses OSPI0_LBCLKO looped back into the PHY from the
OSPI0_LBCLKO pin as the PHY receive data capture clock. External Board Loopback - uses OSPI0_LBCLKO
looped back into the PHY from the OSPI0_DQS pin as the PHY receive data capture clock. DQS - uses the DQS
output from the attached device as the PHY receive data capture clock. SDR transfers are not supported when
using the Internal Pad Loopback and DQS clocking topologies. DDR transfers are not supported when using the
Internal PHY Loopback or Internal Pad Loopback clocking topologies.
Tap mode uses an internal reference clock with selectable taps to adjusted data transmit and receive capture
delays relative to OSPI0_CLK, which is a divide by 4 of the internal reference clock for SDR transfers or a divide
by 8 of the internal reference clock for DDR transfers. Tap mode only supports one clocking topology for the
receive data capture clock. No Loopback - uses the internal reference clock as the Tap receive data capture
clock. This clocking topology supports a maximum internal reference clock rate of 200MHz, which produces an
OSPI0_CLK rate up to 50MHz for SDR mode or 25MHz for DDR mode.
For more information, see Octal Serial Peripheral Interface (OSPI) section in Peripherals chapter in the device
TRM.
For more details about features and additional description information on the device Octal Serial Peripheral
Interface, see the corresponding subsections within Signal Descriptions and Detailed Description sections.
Section [Link].1 defines timing requirements and switching characteristics associated with PHY mode and
Section [Link].2 defines timing requirements and switching characteristics associated with Tap mode.
Table 6-114 presents timing conditions for OSPI0.
Table 6-114. OSPI0 Timing Conditions
PARAMETER MODE MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1 6 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 3 10 pF
PCB CONNECTIVITY REQUIREMENTS
No Loopback
Propagation delay of OSPI0_CLK trace Internal PHY Loopback 450 ps
Internal Pad Loopback
td(Trace Delay)
Propagation delay of OSPI0_LBCLKO
External Board Loopback 2L(1) - 30 2L(1) + 30 ps
trace
Propagation delay of OSPI0_DQS trace DQS L(1) - 30 L(1) + 30 ps
Propagation delay mismatch of
td(Trace Mismatch
OSPI0_D[7:0] and OSPI0_CSn[3:0] All modes 60 ps
Delay)
relative to OSPI0_CLK

(1) L = Propagation delay of OSPI0_CLK trace

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].1 OSPI0 PHY Mode

[Link].1.1 OSPI0 With PHY Data Training

Read and write data valid windows will shift due to variation in process, voltage, temperature, and operating
frequency. A data training method may be implemented to dynamically configure optimal read and write timing.
Implementing data training enables proper operation across temperature with a specific process, voltage, and
frequency operating condition, while achieving a higher operating frequency.
Data transmit and receive timing parameters are not defined for the data training use case since they are
dynamically adjusted based on the operating condition.
Table 6-115 defines DLL delays required for OSPI0 with Data Training. Table 6-116, Figure 6-96, Figure 6-97,
Table 6-117, Figure 6-98, and Figure 6-99 present timing requirements and switching characteristics for OSPI0
with Data Training.
Table 6-115. OSPI0 DLL Delay Mapping for PHY Data Training
MODE REGISTER BIT FIELD DELAY VALUE
OSPI_PHY_CONFIGURATION_REG
Transmit
All modes PHY_CONFIG_TX_DLL_DELAY_FLD (1)

Receive
All modes PHY_CONFIG_RX_DLL_DELAY_FLD (2)

PHY_MASTER_CONTROL_REG
All modes PHY_MASTER_PHASE_DETECT_SELECTOR_FLD 0x3

(1) Transmit DLL delay value determined by training software

(2) Receive DLL delay value determined by training software

Table 6-116. OSPI0 Timing Requirements – PHY Data Training

see Figure 6-96, and Figure 6-97
NO. MODE MIN MAX UNIT
Setup time, OSPI0_D[7:0] valid before (1)
O15 tsu(D-LBCLK) DDR with DQS ns
active OSPI0_DQS edge
Hold time, OSPI0_D[7:0] valid after active (1)
O16 th(LBCLK-D) DDR with DQS ns
OSPI0_DQS edge
Setup time, OSPI0_D[7:0] valid before (1)
O21 tsu(D-LBCLK) SDR with External Board Loopback ns
active OSPI0_DQS edge
Hold time, OSPI0_D[7:0] valid after active (1)
O22 th(LBCLK-D) SDR with External Board Loopback ns
OSPI0_DQS edge
1.8V, DDR with DQS 1.6 ns
Data valid window (O15 + O16)
3.3V, DDR with DQS 2.2 ns
tDVW
1.8V, SDR with External Board Loopback 2.3 ns
Data valid window (O21 + O22)
3.3V, SDR with External Board Loopback 2.9 ns

(1) Minimum setup and hold time requirements for OSPI0_D[7:0] inputs are not defined when Data Training is used to find the optimum
data valid window. The tDVW parameter defines the minimum data invalid window required. This parameter is provided in lieu of
minimum setup and minimum hold times, where it must be used to check compatibility with the data valid window provided by an
attached device.

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

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OSPI_DQS

O15 O16 O15 O16

OSPI_D[i:0]

OSPI_TIMING_04

Figure 6-96. OSPI0 Timing Requirements – PHY Data Training, DDR with DQS

OSPI_DQS

O21 O22

OSPI_D[i:0]

OSPI_TIMING_06

Figure 6-97. OSPI0 Timing Requirements – PHY Data Training, SDR with External Board Loopback

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

Table 6-117. OSPI Switching Characteristics – PHY Data Training

See Figure 6-98 and Figure 6-99
NO. PARAMETER MODE MIN MAX UNIT
1.8V, DDR 6.0 10 ns
O1
3.3V, DDR 7.5 10 ns
tc(CLK) Cycle time, OSPI0_CLK
1.8V, SDR 6.0 10 ns
O7
3.3V, SDR 7.5 10 ns
O2 DDR
tw(CLKL) Pulse duration, OSPI0_CLK low ((0.475P(1)) - 0.3) ns
O8 SDR
O3 DDR
tw(CLKH) Pulse duration, OSPI0_CLK high ((0.475P(1)) - 0.3) ns
O9 SDR
O4 DDR ((0.475P(1)) + ((0.525P(1)) +
Delay time, OSPI0_CSn[3:0] active edge
td(CSn-CLK) (0.975M(2)R(4)) + (1.025M(2)R(4)) + ns
O10 to OSPI0_CLK rising edge SDR (0.04TD(5)) - 1) (0.11TD(5)) + 1)
O5 DDR ((0.475P(1)) + ((0.525P(1)) +
Delay time, OSPI0_CLK rising edge to
td(CLK-CSn) (0.975N(3)R(4)) - (1.025N(3)R(4)) - ns
O11 OSPI0_CSn[3:0] inactive edge SDR (0.11TD(5)) - 1) (0.04TD(5)) + 1)
O6 Delay time, OSPI0_CLK active edge to DDR
td(CLK-D) (6) (6) ns
O12 OSPI0_D[7:0] transition SDR
Data invalid window (O6 Max - Min) DDR
tDIVW 1.6 ns
Data invalid window (O12 Max - Min) SDR

(1) P = SCLK cycle time in ns = OSPI0_CLK cycle time in ns

(2) M = OSPI_DEV_DELAY_REG[D_INIT_FLD]
(3) N = OSPI_DEV_DELAY_REG[D_AFTER_FLD]
(4) R = reference clock cycle time in ns
(5) TD = PHY_CONFIG_TX_DLL_DELAY_FLD
(6) Minimum and maximum delay times for OSPI0_D[7:0] outputs are not defined when Data Training is used to find the optimum data
valid window. The tDIVW parameter defines the maximum data invalid window. This parameter is provided in lieu of minimum and
maximum delay times, where it must be used to check compatibility with the data valid window requirements of an attached device.

OSPI_CSn

O4 O3 O5

OSPI_CLK

O2
O6 O6
O1

OSPI_D[i:0]

OSPI_TIMING_01

Figure 6-98. OSPI0 Switching Characteristics – PHY DDR Data Training

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OSPI_CSn

O10 O7 O11

OSPI_CLK O9 O8

O12

OSPI_D[i:0]

OSPI_TIMING_02

Figure 6-99. OSPI0 Switching Characteristics – PHY SDR Data Training

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].1.2 OSPI0 Without Data Training

Note
Timing parameters defined in this section are only applicable when data training is not implemented
and DLL delays are configured as described in Table 6-118 and Table 6-121.

[Link].1.2.1 OSPI0 PHY SDR Timing

Table 6-118 defines DLL delays required for OSPI0 PHY SDR Mode. Table 6-119, Figure 6-100, Figure 6-101,
Table 6-120, and Figure 6-102 present timing requirements and switching characteristics for OSPI0 PHY SDR
Mode.
Table 6-118. OSPI0 DLL Delay Mapping for PHY SDR Timing Modes
MODE REGISTER BIT FIELD DELAY VALUE
OSPI_PHY_CONFIGURATION_REG
Transmit
All modes PHY_CONFIG_TX_DLL_DELAY_FLD 0x0
Receive
All modes PHY_CONFIG_RX_DLL_DELAY_FLD 0x0
PHY_MASTER_CONTROL_REG
All modes PHY_MASTER_PHASE_DETECT_SELECTOR_FLD 0x3

Table 6-119. OSPI0 Timing Requirements – PHY SDR Mode

see Figure 6-100 and Figure 6-101
NO. MODE MIN MAX UNIT

Setup time, OSPI0_D[7:0] valid before 1.8V, SDR with Internal PHY Loopback 4.8 ns
O19 tsu(D-CLK)
active OSPI0_CLK edge 3.3V, SDR with Internal PHY Loopback 5.19 ns

Hold time, OSPI0_D[7:0] valid after active 1.8V, SDR with Internal PHY Loopback -0.5 ns
O20 th(CLK-D)
OSPI0_CLK edge 3.3V, SDR with Internal PHY Loopback -0.5 ns

Setup time, OSPI0_D[7:0] valid before 1.8V, SDR with External Board Loopback 0.6 ns
O21 tsu(D-LBCLK)
active OSPI0_DQS edge 3.3V, SDR with External Board Loopback 0.9 ns

Hold time, OSPI0_D[7:0] valid after active 1.8V, SDR with External Board Loopback 1.7 ns
O22 th(LBCLK-D)
OSPI0_DQS edge 3.3V, SDR with External Board Loopback 2.0 ns

OSPI_CLK

O19 O20

OSPI_D[i:0]

OSPI_TIMING_05

Figure 6-100. OSPI0 Timing Requirements – PHY SDR with Internal PHY Loopback

OSPI_DQS

O21 O22

OSPI_D[i:0]

OSPI_TIMING_06

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AM625, AM625-Q1, AM623, AM620-Q1
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Table 6-120. OSPI0 Switching Characteristics – PHY SDR Mode

see Figure 6-102
NO. PARAMETER MODE MIN MAX UNIT
1.8V 7 ns
O7 tc(CLK) Cycle time, OSPI0_CLK
3.3V 6.03 ns
O8 tw(CLKL) Pulse duration, OSPI0_CLK low ((0.475P(1)) - 0.3) ns
O9 tw(CLKH) Pulse duration, OSPI0_CLK high ((0.475P(1)) - 0.3) ns
((0.475P(1)) + ((0.525P(1)) +
Delay time, OSPI0_CSn[3:0] active edge
O10 td(CSn-CLK) (0.975M(2)R(4)) + (1.025M(2)R(4)) + ns
to OSPI0_CLK rising edge
(0.04TD(5)) - 1) (0.11TD(5)) + 1)
((0.475P(1)) + ((0.525P(1)) +
Delay time, OSPI0_CLK rising edge to
O11 td(CLK-CSn) (0.975N(3)R(4)) - (1.025N(3)R(4)) - ns
OSPI0_CSn[3:0] inactive edge
(0.11TD(5)) - 1) (0.04TD(5)) + 1)

Delay time, OSPI0_CLK active edge to 1.8V -1.16 1.25 ns

O12 td(CLK-D)
OSPI0_D[7:0] transition 3.3V -1.33 1.51 ns

(1) P = SCLK cycle time in ns = OSPI0_CLK cycle time in ns

(2) M = OSPI_DEV_DELAY_REG[D_INIT_FLD]
(3) N = OSPI_DEV_DELAY_REG[D_AFTER_FLD]
(4) R = reference clock cycle time in ns
(5) TD = PHY_CONFIG_TX_DLL_DELAY_FLD

OSPI_CSn

O10 O7 O11

OSPI_CLK O9 O8

O12

OSPI_D[i:0]

OSPI_TIMING_02

Figure 6-102. OSPI0 Switching Characteristics – PHY SDR

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].1.2.2 OSPI0 PHY DDR Timing

Table 6-121 defines DLL delays required for OSPI0 PHY DDR Mode. Table 6-122, Figure 6-103, Table 6-123,
and Figure 6-104 present timing requirements and switching characteristics for OSPI0 PHY DDR Mode.
Table 6-121. OSPI0 DLL Delay Mapping for PHY DDR Timing Modes
MODE REGISTER BIT FIELD DELAY VALUE
OSPI_PHY_CONFIGURATION_REG
Transmit
1.8V PHY_CONFIG_TX_DLL_DELAY_FLD 0x46
3.3V PHY_CONFIG_TX_DLL_DELAY_FLD 0x43
Receive
1.8V, DQS PHY_CONFIG_RX_DLL_DELAY_FLD 0x15
3.3V, DQS PHY_CONFIG_RX_DLL_DELAY_FLD 0x3A
All other modes PHY_CONFIG_RX_DLL_DELAY_FLD 0x0
PHY_MASTER_CONTROL_REG
All modes PHY_MASTER_PHASE_DETECT_SELECTOR_FLD 0x3

Table 6-122. OSPI0 Timing Requirements – PHY DDR Mode

see Figure 6-103
NO. MODE MIN MAX UNIT
1.8V, DDR with External Board Loopback 0.53 ns

Setup time, OSPI0_D[7:0] valid before 1.8V, DDR with DQS -0.46 ns
O15 tsu(D-LBCLK)
active OSPI0_DQS edge 3.3V, DDR with External Board Loopback 1.23 ns
3.3V, DDR with DQS -0.66 ns
1.8V, DDR with External Board Loopback 1.24(1) ns

Hold time, OSPI0_D[7:0] valid after active 1.8V, DDR with DQS 3.59 ns
O16 th(LBCLK-D)
OSPI0_DQS edge 3.3V, DDR with External Board Loopback 1.44(1) ns
3.3V, DDR with DQS 7.92 ns

(1) This Hold time requirement is larger than the Hold time provided by a typical OSPI/QSPI/SPI device. Therefore, the trace length
between the SoC and attached OSPI/QSPI/SPI device must be sufficiently long enough to ensure that the Hold time is met at the SoC.
The length of the SoC's external loopback clock (OSPI0_LBCLKO to OSPI0_DQS) may need to be shortened to compensate.

OSPI_DQS

O15 O16 O15 O16

OSPI_D[i:0]

OSPI_TIMING_04

Figure 6-103. OSPI0 Timing Requirements – PHY DDR with External Board Loopback or DQS

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 6-123. OSPI0 Switching Characteristics – PHY DDR Mode

see Figure 6-104
NO. PARAMETER MODE MIN MAX UNIT
O1 tc(CLK) Cycle time, OSPI0_CLK 19 ns
O2 tw(CLKL) Pulse duration, OSPI0_CLK low ((0.475P(1)) - 0.3) ns
O3 tw(CLKH) Pulse duration, OSPI0_CLK high ((0.475P(1)) - 0.3) ns
((0.475P(1)) + ((0.525P(1)) +
Delay time, OSPI0_CSn[3:0] active edge
O4 td(CSn-CLK) (0.975M(2)R(4)) + (1.025M(2)R(4)) + ns
to OSPI0_CLK rising edge
(0.04TD(5)) - 1) (0.11TD(5)) + 1)
((0.475P(1)) + ((0.525P(1)) +
Delay time, OSPI0_CLK rising edge to
O5 td(CLK-CSn) (0.975N(3)R(4)) - (1.025N(3)R(4)) - ns
OSPI0_CSn[3:0] inactive edge
(0.11TD(5)) - 1) (0.04TD(5)) + 1)

Delay time, OSPI0_CLK active edge to 1.8V -7.71 -1.56 ns

O6 td(CLK-D)
OSPI0_D[7:0] transition 3.3V -7.71 -1.56 ns

(1) P = SCLK cycle time in ns = OSPI0_CLK cycle time in ns

(2) M = OSPI_DEV_DELAY_REG[D_INIT_FLD]
(3) N = OSPI_DEV_DELAY_REG[D_AFTER_FLD]
(4) R = reference clock cycle time in ns
(5) TD = PHY_CONFIG_TX_DLL_DELAY_FLD

OSPI_CSn

O4 O3 O5

OSPI_CLK

O2
O6 O6
O1

OSPI_D[i:0]

OSPI_TIMING_01

Figure 6-104. OSPI0 Switching Characteristics – PHY DDR

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].2 OSPI0 Tap Mode

[Link].2.1 OSPI0 Tap SDR Timing

Table 6-124, Figure 6-105, Table 6-125, and Figure 6-106 present timing requirements and switching
characteristics for OSPI0 Tap SDR Mode.
Table 6-124. OSPI0 Timing Requirements – Tap SDR Mode
see Figure 6-105
NO. MODE MIN MAX UNIT
Setup time, OSPI0_D[7:0] valid before (15.4 -
O19 tsu(D-CLK) No Loopback ns
active OSPI0_CLK edge (0.975T(1)R(2)))
Hold time, OSPI0_D[7:0] valid after active (- 4.3 +
O20 th(CLK-D) No Loopback ns
OSPI0_CLK edge (0.975T(1)R(2)))

(1) T = OSPI_RD_DATA_CAPTURE_REG[DELAY_FLD]
(2) R = reference clock cycle time in ns

OSPI_CLK

O19 O20

OSPI_D[i:0]

OSPI_TIMING_05

Figure 6-105. OSPI0 Timing Requirements – Tap SDR, No Loopback

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 6-125. OSPI0 Switching Characteristics – Tap SDR Mode

see Figure 6-106
NO. PARAMETER MODE MIN MAX UNIT
O7 tc(CLK) Cycle time, OSPI0_CLK 20 ns
O8 tw(CLKL) Pulse duration, OSPI0_CLK low ((0.475P(1)) - 0.3) ns
O9 tw(CLKH) Pulse duration, OSPI0_CLK high ((0.475P(1)) - 0.3) ns
Delay time, OSPI0_CSn[3:0] active edge ((0.475P(1)) + ((0.525P(1))+
O10 td(CSn-CLK) ns
to OSPI0_CLK rising edge (0.975M(2)R(4)) - 1) (1.025M(2)R(4)) + 1)
Delay time, OSPI0_CLK rising edge to ((0.475P(1)) + ((0.525P(1)) +
O11 td(CLK-CSn) ns
OSPI0_CSn[3:0] inactive edge (0.975N(3)R(4)) - 1) (1.025N(3)R(4)) + 1)
Delay time, OSPI0_CLK active edge to
O12 td(CLK-D) - 4.25 7.25 ns
OSPI0_D[7:0] transition

(1) P = SCLK cycle time in ns = OSPI0_CLK cycle time in ns

(2) M = OSPI_DEV_DELAY_REG[D_INIT_FLD]
(3) N = OSPI_DEV_DELAY_REG[D_AFTER_FLD]
(4) R = reference clock cycle time in ns

OSPI_CSn

O10 O7 O11

OSPI_CLK O9 O8

O12

OSPI_D[i:0]

OSPI_TIMING_02

Figure 6-106. OSPI0 Switching Characteristics – Tap SDR, No Loopback

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].2.2 OSPI0 Tap DDR Timing

Table 6-126, Figure 6-107, Table 6-127, and Figure 6-108 present timing requirements and switching
characteristics for OSPI0 Tap DDR Mode.
Table 6-126. OSPI0 Timing Requirements – Tap DDR Mode
see Figure 6-107
NO. MODE MIN MAX UNIT
Setup time, OSPI0_D[7:0] valid before (17.04 -
O13 tsu(D-CLK) No Loopback ns
active OSPI0_CLK edge (0.975T(1)R(2)))
Hold time, OSPI0_D[7:0] valid after active (- 3.16 +
O14 th(CLK-D) No Loopback ns
OSPI0_CLK edge (0.975T(1)R(2)))

(1) T = OSPI_RD_DATA_CAPTURE_REG[DELAY_FLD]
(2) R = reference clock cycle time in ns

OSPI_CLK

O13 O14 O13 O14

OSPI_D[i:0]

OSPI_TIMING_03

Figure 6-107. OSPI0 Timing Requirements – Tap DDR, No Loopback

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
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Table 6-127. OSPI0 Switching Characteristics – Tap DDR Mode

see Figure 6-108
NO. PARAMETER MODE MIN MAX UNIT
O1 tc(CLK) Cycle time, OSPI0_CLK 40 ns
O2 tw(CLKL) Pulse duration, OSPI0_CLK low ((0.475P(1)) - 0.3) ns
O3 tw(CLKH) Pulse duration, OSPI0_CLK high ((0.475P(1)) - 0.3) ns
Delay time, OSPI0_CSn[3:0] active edge ((0.475P(1)) + ((0.525P(1))
+
O4 td(CSn-CLK) ns
to OSPI0_CLK rising edge ((0.975M(2)R(5)) - 1) ( 1.025M(2)R(5)) + 1)
Delay time, OSPI0_CLK rising edge to ((0.475P(1)) + ((0.525P(1)) +
O5 td(CLK-CSn) ns
OSPI0_CSn[3:0] inactive edge (0.975N(3)R(5)) - 1) (1.025N(3)R(5)) + 1)
(- 5.04 + (3.64 +
Delay time, OSPI0_CLK active edge to
O6 td(CLK-D) (0.975(T(4) + 1)R(5)) (1.025(T(4) + 1)R(5)) ns
OSPI0_D[7:0] transition
- (0.525P(1))) - (0.475P(1)))

(1) P = SCLK cycle time in ns = OSPI0_CLK cycle time in ns

(2) M = OSPI_DEV_DELAY_REG[D_INIT_FLD]
(3) N = OSPI_DEV_DELAY_REG[D_AFTER_FLD]
(4) T = OSPI_RD_DATA_CAPTURE_REG[DDR_READ_DELAY_FLD]
(5) R = reference clock cycle time in ns

OSPI_CSn

O4 O3 O5

OSPI_CLK

O2
O6 O6
O1

OSPI_D[i:0]

OSPI_TIMING_01

Figure 6-108. OSPI0 Switching Characteristics – Tap DDR, No Loopback

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link] PRUSS
The device has a single Programmable Real-Time Unit Subsystem (PRUSS), which includes two PRU cores.
The programmable nature of the PRU cores, along with their access to pins, events and all device resources,
provides flexibility in implementing fast real-time responses, specialized data handling operations, custom
peripheral interfaces, and off-loading of tasks from the other processor cores in the device.
For more details about features and additional description information on the device PRUSS, see the
corresponding sections within Signal Descriptions and Detailed Description.

Note
PRUSS contains a second layer of peripheral signal multiplexing to enable additional functionality on
the PRU GPO and GPI signals. This peripheral multiplexing is described in the PRUSS chapter in the
device TRM.

Note
PRUSS has one or more signals which can be multiplexed to more than one pin. Timing requirements
and switching characteristics defined in this section are only valid for specific pin combinations known
as IOSETs. Valid pin combinations or IOSETs for this interface are defined in the SysConfig-PinMux
Tool.

[Link].1 PRUSS Programmable Real-Time Unit (PRU)

Note
PRUSS signals have different functionality depending on the mode of operation. The signal naming in
this section matches the naming used in the PRU Module Interface section in the device TRM.

Table 6-128. PRUSS PRU Timing Conditions

PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1 3 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 30 pF

[Link].1.1 PRUSS PRU Direct Output Mode Timing

Table 6-129. PRUSS PRU Switching Characteristics – Direct Output Mode
see Figure 6-109
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PRDO1 tsk(GPO-GPO) Skew, GPO to GPO 2 ns

GPO[n:0]
PRDO1 PRU_TIMING_02

A. n in GPO[n:0] = 19.

Figure 6-109. PRUSS PRU Direct Output Timing

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AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

[Link].1.2 PRUSS PRU Parallel Capture Mode Timing

Table 6-130. PRUSS PRU Timing Requirements – Parallel Capture Mode
see Figure 6-110 and Figure 6-111
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PRPC1 tc(CLOCK) Cycle time, CLOCKIN 20 ns
PRPC2 tw(CLOCKL) Pulse duration, CLOCKIN low 0.45P(1) ns
PRPC3 tw(CLOCKH) Pulse duration, CLOCKIN high 0.45P(1) ns
PRPC4 tsu(DATAIN-CLOCK) Setup time, DATAIN valid before CLOCKIN active edge 4 ns
PRPC5 th(CLOCK-DATAIN) Hold time, DATAIN valid after CLOCKIN active edge 0 ns

(1) P = CLOCKIN cycle time in ns

PRPC1
PRPC3
PRPC2

CLOCKIN

DATAIN

PRPC5
PRPC4 PRU_TIMING_03

Figure 6-110. PRUSS PRU Parallel Capture Timing Requirements – Rising Edge Mode

PRPC1
PRPC3
PRPC2
CLOCKIN

DATAIN

PRPC5
PRPC4 PRU_TIMING_04

Figure 6-111. PRUSS PRU Parallel Capture Timing Requirements – Falling Edge Mode

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].1.3 PRUSS PRU Shift Mode Timing

Table 6-131. PRUSS PRU Timing Requirements – Shift In Mode
see Figure 6-112
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PRSI1 tw(DATAINH) Pulse duration, DATAIN high 2P(1) + 2 ns
PRSI2 tw(DATAINL) Pulse duration, DATAIN low 2P(1) + 2 ns

(1) P = Internal shift in clock period in ns, defined by PRUn_GPI_DIV0 and PRUn_GPI_DIV1 bit fields in the GPCFGn_REG register,
where PRUn represents the respective PRU0 or PRU1 instance.

PRSI1
PRSI2

DATAIN

PRU_TIMING_05

Figure 6-112. PRUSS PRU Shift In Timing

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

Table 6-132. PRUSS PRU Switching Characteristics – Shift Out Mode

see Figure 6-113
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PRSO1 tc(CLOCKOUT) Cycle time, CLOCKOUT 10 ns
PRSO2L tw(CLOCKOUTL) Pulse duration, CLOCKOUT low 0.475P(1)Z(2)- ns
0.3
PRSO2H tw(CLOCKOUTH) Pulse duration, CLOCKOUT high 0.475P(1)Y(3) - ns
0.3
PRSO3 td(CLOCKOUT-DATAOUT) Delay time, CLOCKOUT to DATAOUT valid 0 3 ns

(1) P = Software programmable shift out clock period in ns, defined by PRUn_GPO_DIV0 and PRUn_GPO_DIV1 bit fields in the
GPCFGn_REG register, where PRUn represents the respective PRU0 or PRU1 instance.
(2) The Z parameter is defined as follows, where PRUn represents the respective PRU0 or PRU1 instance.
a. If PRUn_GPI_DIV0 and PRUn_GPI_DIV1 are INTEGERS -or- if PRUn_GPI_DIV0 is a NON-INTEGER and PRUn_GPI_DIV1 is
an EVEN INTEGER then, Z equals (PRUn_GPI_DIV0 * PRUn_GPI_DIV1).
b. If PRUn_GPI_DIV0 is a NON-INTEGER and PRUn_GPI_DIV1 is an ODD INTEGER then, Z equals (PRUn_GPI_DIV0 *
PRUn_GPI_DIV1 + 0.5).
c. If PRUn_GPI_DIV0 is an INTEGER and PRUn_GPI_DIV1 is a NON-INTEGER then, Z equals (PRUn_GPI_DIV0 *
PRUn_GPI_DIV1 + 0.5 * PRUn_GPI_DIV0).
d. If PRUn_GPI_DIV0 and PRUn_GPI_DIV1 are NON-INTEGERS then, Z equals (PRUn_GPI_DIV0 * PRUn_GPI_DIV1 + 0.25 *
PRUn_GPI_DIV0).

(3) The Y parameter is defined as follows, where PRUn represents the respective PRU0 or PRU1 instance.
a. If PRUn_GPI_DIV0 and PRUn_GPI_DIV1 are INTEGERS -or- if PRUn_GPI_DIV0 is a NON-INTEGER and PRUn_GPI_DIV1 is
an EVEN INTEGER then, Y equals (PRUn_GPI_DIV0 * PRUn_GPI_DIV1).
b. If PRUn_GPI_DIV0 is a NON-INTEGER and PRUn_GPI_DIV1 is an ODD INTEGER then, Y equals (PRUn_GPI_DIV0 *
PRUn_GPI_DIV1 - 0.5).
c. If PRUn_GPI_DIV0 is an INTEGER and PRUn_GPI_DIV1 is a NON-INTEGER then, Y equals (PRUn_GPI_DIV0 *
PRUn_GPI_DIV1 - 0.5 * PRUn_GPI_DIV0).
d. If PRUn_GPI_DIV0 and PRUn_GPI_DIV1 are NON-INTEGERS then, Y1 equals (PRUn_GPI_DIV0 * PRUn_GPI_DIV1 - 0.25 *
PRUn_GPI_DIV0) and Y2 equals (PRUn_GPI_DIV0 * PRUn_GPI_DIV1 + 0.25 * PRUn_GPI_DIV0), where Y1 is the first high
pulse and Y2 is the second high pulse.

PRSO1
PRSO2H PRSO2L

CLOCKOUT

DATAOUT

PRSO3
PRU_TIMING_06

Figure 6-113. PRUSS PRU Shift Out Timing

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AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].2 PRUSS Industrial Ethernet Peripheral (IEP)

Table 6-133. PRUSS IEP Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1 3 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 3 10 pF

[Link].2.1 PRUSS IEP Timing

Table 6-134. PRUSS IEP Switching Characteristics – Digital IOs
see Figure 6-114
NO. PARAMETER DESCRIPTION MIN MAX UNIT
IEPIO4 tsk(EDIO_DATA_OUT) EDIO_DATA_OUT skew 5 ns

EDIO_DATA_OUT

IEPIO4 PRU_EDIO_DATA_OUT_TIMING_00

Figure 6-114. PRUSS IEP Digital IOs Timing Requirements

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

[Link].3 PRUSS Universal Asynchronous Receiver Transmitter (UART)

Table 6-135. PRUSS UART Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.5 5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 1 30(1) pF

(1) This value represents an absolute maximum load capacitance. As the UART baud rate increases, it may be necessary to reduce the
load capacitance to a value less than this maximum limit to provide enough timing margin for the attached device. The output rise/fall
times increase as capacitive load increases, which decreases the time data is valid for the receiver of the attached devices. Therefore,
it is important to understand the minimum data valid time required by the attached device at the operating baud rate. Then use the
device IBIS models to verify the actual load capacitance on the UART signals does not increase the rise/fall times beyond the point
where the minimum data valid time of the attached device is violated.

[Link].3.1 PRUSS UART Timing

Table 6-136. PRUSS UART Timing Requirements
see Figure 6-115
NO. PARAMETER DESCRIPTION MIN MAX UNIT
0.95U(1) 1.05U(1)
1 tw(RXD) Pulse width, receive data bit high or low (2) (2) ns

0.95U(1)
2 tw(RXDS) Pulse width, receive start bit low (2) ns

(1) U = UART baud time in ns = 1/programmed baud rate.

(2) This value defines the data valid time, where the input voltage is required to be above VIH or below VIL.

Table 6-137. PRUSS UART Switching Characteristics

see Figure 6-115
NO. PARAMETER DESCRIPTION MIN MAX UNIT
f(baud) Programmed baud rate 12 Mbps
3 tw(TXD) Pulse width, transmit data bit high or low U(1) - 2 U(1) + 2 ns
4 tw(TXDS) Pulse width, transmit start bit low U(1) - 2 U(1) + 2 ns

(1) U = UART baud time in ns = 1/actual baud rate, where the actual baud rate is defined in the UART Baud Rate Settings table of the
device TRM.

2
1

Start
Bit VIH
PRGi_UART0_RXD
VIL
Data Bits

4
3
Start
Bit
PRGi_UART0_TXD
Data Bits
PRU_UART_TIMING_01_RCVRVIHVIL

Figure 6-115. PRUSS UART Timing Requirements and Switching Characteristics

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link].4 PRUSS Enhanced Capture Peripheral (ECAP)

Table 6-138. PRUSS ECAP Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 1 3 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 7 pF

[Link].4.1 PRUSS ECAP Timing

Table 6-139. PRUSS ECAP Timing Requirements
see Figure 6-116
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PREP1 tw(CAP) Pulse Duration, CAP (asynchronous) 2P(1) +2 ns
PREP2 tw(SYNCI) Pulse Duration, SYNCI (asynchronous) 2P(1) + 2 ns

(1) P = CORE_CLK period in ns.

PREP1

CAP

PREP2

SYNCI

Figure 6-116. PRUSS ECAP Timing

Table 6-140. PRUSS ECAP Switching Characteristics

see Figure 6-117
NO. PARAMETER DESCRIPTION MIN MAX UNIT
PREP3 tw(APWM) Pulse Duration, APWM high/low 2P(1) - 2 ns
PREP4 tw(SYNCO) Pulse Duration, SYNCO (asynchronous) P(1) -2 ns

(1) P = CORE_CLK period in ns.

PREP3

APWM

PREP4

SYNCO

Figure 6-117. PRUSS ECAP Switching Characteristics

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

[Link] Timers
For more details about features and additional description information on the device Timers, see the
corresponding subsections within Signal Descriptions and Detailed Description sections.
Table 6-141. Timer Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.5 5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 2 10 pF

Table 6-142. Timer Input Timing Requirements

see Figure 6-118
NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
T1 tw(TINPH) Pulse duration, high CAPTURE 4P(1)+ ns
2.5
T2 tw(TINPL) Pulse duration, low CAPTURE 4P(1)+ ns
2.5

(1) P = functional clock period in ns.

Table 6-143. Timer Output Switching Characteristics

see Figure 6-118
NO. PARAMETER DESCRIPTION MODE MIN MAX UNIT
T3 tw(TOUTH) Pulse duration, high PWM 4P(1) - ns
2.5
T4 tw(TOUTL) Pulse duration, low PWM 4P(1) - ns
2.5

(1) P = functional clock period in ns.

T1 T2

TIMER_IOx (inputs)

T3 T4

TIMER_IOx (outputs)

TIMER_01

Figure 6-118. Timer Timing Requirements and Switching Characteristics

For more information, see Timers section in Peripherals chapter in the device TRM.

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

[Link] UART
For more details about features and additional description information on the device Universal Asynchronous
Receiver Transmitter, see the corresponding subsections within Signal Descriptions and Detailed Description
sections.
Table 6-144. UART Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.5 5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 1 30(1) pF

Table 6-145. UART Timing Requirements

see Figure 6-119
NO. PARAMETER DESCRIPTION MIN MAX UNIT
0.95U(1) 1.05U(1)
1 tw(RXD) Pulse width, receive data bit high or low (2) (2) ns

0.95U(1)
2 tw(RXDS) Pulse width, receive start bit low (2) ns

(1) U = UART baud time in ns = 1/programmed baud rate.

(2) This value defines the data valid time, where the input voltage is required to be above VIH or below VIL.

Table 6-146. UART Switching Characteristics

see Figure 6-119
NO. PARAMETER DESCRIPTION MIN MAX UNIT
Programmable baud rate for Main Domain UARTs 12 Mbps
f(baud)
Programmable baud rate for MCU and WKUP Domain UARTs 3.7 Mbps
3 tw(TXD) Pulse width, transmit data bit high or low U(1) -2 U(1) +2 ns
4 tw(TXDS) Pulse width, transmit start bit low U(1) - 2 ns

(1) U = UART baud time in ns = 1/actual baud rate, where the actual baud rate is defined in the UART Baud Rate Settings table of the
device TRM.

2
1

Start
VIH
UARTi_RXD Bit
VIL
Data Bits

4
3
Start
UARTi_TXD Bit

Data Bits
UART_TIMING_01_RCVRVIHVIL

Figure 6-119. UART Timing Requirements and Switching Characteristics

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For more information, see Universal Asynchronous Receiver/Transmitter (UART) section in Peripherals chapter
in the device TRM.
[Link] USB
The USB 2.0 subsystem is compliant with the Universal Serial Bus (USB) Specification, revision 2.0. Refer to the
specification for timing details.
For more details about features and additional description information on the device Universal Serial Bus
Subsystem (USB), see the corresponding subsections within Signal Descriptions and Detailed Description
sections.

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7 Detailed Description
7.1 Overview
The low-cost AM62x Sitara™ MPU family of application processors are built for Linux® application development.
With scalable Arm® Cortex®-A53 performance and embedded features, such as dual-display support and 3D
graphics acceleration, along with an extensive set of peripherals, making the AM62x device well-suited for a
broad range of industrial and automotive applications while offering intelligent features and optimized power
architecture.
Functional safety requirements can be addressed using the integrated Cortex-M4F cores and dedicated
peripherals, which can all be isolated from the rest of the AM62x processor.
The 3-port Gigabit Ethernet switch has one internal port and two external ports with Time-Sensitive Networking
(TSN) capable. An additional PRU module on the device enables real-time I/O capability for customer’s own use
cases. In addition, the extensive set of peripherals included in AM62x enable system-level connectivity, such
as USB, MMC/SD, Camera interface, OSPI, CAN-FD and GPMC for parallel host interface to an external ASIC/
FPGA. The AM62x device also supports secure boot for IP protection with the built-in Hardware Security Module
(HSM) and employs advanced power management support for portable and power-sensitive applications.

Note
For more information on features, subsystems, and architecture of superset device System on Chip
(SoC), see the device TRM.

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7.2 Processor Subsystems

7.2.1 Arm Cortex-A53 Subsystem (A53SS)
The SoC implements one cluster of quad-core Arm® Cortex®-A53 MPCore™, with 32KB L1 instruction, 32KB L1
data, per core and 512KB L2 shared cache.

The Cortex®-A53 cores are general-purpose processors that can be used for running customer applications.
The A53SS is built around the Cortex®-A53 MPCore™ (Arm®-A53 Cluster), which is provided by Arm and
configured by TI. It is based on the symmetric multiprocessor (SMP) architecture, and thus, it delivers high
performance and optimal power management, debug and emulation capabilities.
The A53 processor is a multi-issue out-of-order superscalar execution engine with integrated L1 Instruction
and Data Caches, compatible with Arm®v8-A architecture. It delivers significantly more performance than its
predecessors at a higher level of power efficiency.
The Arm®v8-A architecture brings a number of new features. These include 64-bit data processing, extended
virtual addressing and 64-bit general purpose registers. The A53 processor is Arm’s first Arm®v8-A processor
aimed at providing power-efficient 64-bit processing. It features an in-order, 8-stage, dual-issue pipeline, and
improved integer, Arm® Neon™, Floating-Point Unit (FPU) and memory performance.
The A53 CPU supports two execution states: AArch32 and AArch64. The AArch64 state gives the A53 CPU its
ability to execute 64-bit applications, while the AArch32 state allows the processor to execute existing Arm®v7-A
applications.
The A53SS integrates advanced features including Arm®v8 Cryptography Extensions, GICv3 architecture,
ECC and parity protection for caches, dedicated watchdog timers per core, high-throughput 256-bit VBUSM
interfaces, and a PBIST controller with BISOR for built-in self-test and reliability.
For more information, see Arm Cortex-A53 Subsystem section in Processors and Accelerators chapter in the
device TRM.
7.2.2 Device/Power Manager
The WKUP_R5FSS is a single-core implementation of the Arm® Cortex®-R5F processor that acts as the
Device Manager responsible for boot, resource management, and power management functions. It also includes
accompanying memories (L1 caches and tightly-coupled memories), standard Arm® CoreSight™ debug and
trace architecture, integrated vectored interrupt manager (VIM), ECC aggregators, and various other modules for
protocol conversion and address translation for easy integration into the SoC.
For more information, see Device Manager Cortex R5F Subsystem section in Processors and Accelerators
chapter in the device TRM.
7.2.3 Arm Cortex-M4F
The MCU_M4FSS is an Arm® Cortex®-M4F based subsystem that can run safety processing or be used as
a general purpose MCU. During the boot process, the MCU_M4FSS will be configured by an initial software
running on a different core. Following configuration, software will release the safety processor (M4F) out of reset,
and at this point safety processor code or general purpose code can start execution.

Note
The Cortex-M4F processor is a Cortex-M4 processor that includes the optional floating point unit
(FPU) extension.

For more information, see Cortex-M4F Subsystem section in Processors and Accelerators chapter in the device
TRM.

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7.3 Accelerators and Coprocessors

7.3.1 Graphics Processing Unit (GPU)
The GPU is an area optimized Graphics Core supporting OpenGL ES 3.1 and Vulkan 1.2.
For more information, see Graphics Processing Unit section in Processors and Accelerators chapter in the
device TRM.
7.3.2 Programmable Real-Time Unit Subsystem (PRUSS)
The PRUSS consists of:
• Two 32-bit load/store RISC CPU cores — Programmable Real-Time Units (PRU0 and PRU1)
• Data RAMs per PRU core (DRAM)
• Instruction RAMs per PRU core (IRAM)
• Shared RAM (SRAM)
• Peripheral modules: UART0, ECAP0, IEP0, MDIO
• Interrupt Controller (INTC) per core
The PRU cores are programmed with a small, deterministic instruction set. Each PRU can operate
independently or in coordination with each other and can also work in coordination with the device-level host
CPU. This interaction between processors is determined by the nature of the firmware loaded into the PRU’s
instruction memory.
The programmable nature of the PRU cores, along with their access to pins, events and all device resources,
provides flexibility in implementing fast real-time responses, specialized data handling operations, custom
peripheral interfaces, and in offloading tasks from the other processor cores of the device.
For more information, see Programmable Real-Time Unit Subsystem section in Processors and Accelerators
chapter in the device TRM.

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7.4 Other Subsystems

7.4.1 Dual Clock Comparator (DCC)
The Dual Clock Comparator (DCC) is used to determine the accuracy of a clock signal during the time
execution of an application. Specifically, the DCC is designed to detect drifts from the expected clock frequency.
The desired accuracy can be programed based on calculation for each application. The DCC measures the
frequency of a selectable clock source using another input clock as a reference.
For more information, see Dual Clock Comparator section in Peripherals chapter in the device TRM.
7.4.2 Data Movement Subsystem (DMSS)
The DMSS module provides data movement (DMA) and bridges between crossbar module CBASS switched
interconnect and the packet streaming fabric (network on chip) on the device.
The Data Movement Subsystem (DMSS) consists of DMA/Queue Management components and Peripherals:
• Packet DMA (PKTDMA)
• Block Copy DMA (BCDMA)
• Ring Accelerator
• Packet Streaming Interface (PSILSS)
• Infrastructure components such as CBASS, secure proxy, and an interrupt aggregator
For more information, see Data Movement Architecture Overview section in Peripherals chapter in the device
TRM.
7.4.3 Memory Cyclic Redundancy Check (MCRC)
VBUSM CRC controller is a module which is used to perform CRC (Cyclic Redundancy Check) to verify the
integrity of a memory system. A signature representing the contents of the memory is obtained when the
contents of the memory are read into MCRC Controller. The responsibility of MCRC controller is to calculate
the signature for a set of data and then compare the calculated signature value against a pre-determined good
signature value. MCRC controller provides four channels to perform CRC calculation on multiple memories in
parallel and can be used on any memory system.
For more information, see Memory Cyclic Redundancy Check section in Peripherals chapter in the device TRM.
7.4.4 Peripheral DMA Controller (PDMA)
The Peripheral DMA is a simple DMA which has been architected to specifically meet the data transfer needs
of peripherals, which perform data transfers using memory mapped registers (MMRs) accessed via a standard
non-coherent bus fabric. The PDMA module is located close to one or more peripherals which require an
external DMA for data movement.
The PDMA is only responsible for performing the data movement transactions which interact with the peripherals
themselves. Data which is read from a given peripheral is packed by a PDMA source channel into a PSI-L data
stream which is then sent to a remote peer DMSS destination channel which then performs the movement of the
data into memory. Likewise, a remote DMSS source channel fetches data from memory and transfers it to a peer
PDMA destination channel over PSI-L which then performs the writes to the peripheral.
The PDMA architecture is intentionally heterogeneous (DMSS + PDMA) to right size the data transfer complexity
at each point in the system to match the requirements of whatever is being transferred to or from. Peripherals
are typically FIFO based and do not require multi-dimensional transfers beyond their FIFO dimensioning
requirements, so the PDMA transfer engines are kept simple with only a few dimensions (typically for sample
size and FIFO depth), hardcoded address maps, and simple triggering capabilities.
Multiple source and destination channels are provided within the PDMA which allow multiple simultaneous
transfer operations to be ongoing. The DMA controller maintains state information for each of the channels and
employs round-robin scheduling between channels in order to share the underlying DMA hardware.

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Each peripheral with PDMA support has its own dedicated state machine to track the transmit and receives of
the data for each peripheral.
For more information, see Data Movement Architecture Overview section in Peripherals chapter in the device
TRM.
7.4.5 Real-Time Clock (RTC)
The basic purpose for the RTC is to keep time of day. The other equally important purpose of RTC is for Digital
Rights management. Some degree of tamper proofing is needed to ensure that simply stopping, resetting, or
corrupting the RTC does not go unnoticed so that if this occurs, the application can re-acquire the time of day
from a trusted source.
For more information, see Real-Time Clock section in Peripherals chapter in the device TRM.

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7.5 Peripherals
7.5.1 Gigabit Ethernet Switch (CPSW3G)
The 3-port Gigabit Ethernet Switch (CPSW3G) subsystem provides Ethernet packet communication for the
device and can be configured as an Ethernet switch. It supports two external 10/100/1000Mbps Ethernet ports
with selectable RGMII and RMII interfaces and one internal Communications Port Programming Interface (CPPI)
port.
For more information, see Gigabit Ethernet Switch section in Peripherals chapter in the device TRM.
7.5.2 Camera Serial Interface Receiver (CSI_RX_IF)
The integration of the CSI_RX_IF module allows the device to stream video inputs from multiple cameras to
internal memory.
For more information, see Camera Serial Interface Receiver section in Peripherals chapter in the device TRM.
7.5.3 DDR Subsystem (DDRSS)
DDRSS0 supports LPDDR4 and DDR4 memory types up to 1600MT/s with a 16-bit bus and in-line ECC,
addressing up to 4GB (LPDDR4) and 8GB (DDR4). It features a 128-bit system interface, advanced scheduling
and refresh control, full command coherency, and JEDEC-compliant low-power modes for efficient and reliable
operation across extended temperature ranges.
For more information, see DDR Subsystem section in Peripherals chapter in the device TRM.
7.5.4 Display Subsystem (DSS)
The Display Subsystem (DSS) is a flexible, multi-pipeline subsystem that supports high-resolution display
outputs. DSS includes input pipelines providing multi-layer blending with transparency to enable on-the-fly
composition. Various pixel processing capabilities are supported, such as color space conversion and scaling,
among others. DSS includes a DMA engine, which allows direct access to the frame buffer (device system
memory). Display outputs can connect seamlessly to an Open LVDS Display Interface transmitter (OLDITX), or
can directly drive device pads as a Display Parallel Interface (DPI).
For more information, see Display Subsystem section in Peripherals chapter in the device TRM.
7.5.5 Enhanced Capture (ECAP)
The Enhanced Capture (ECAP) module is a timing peripheral designed to accurately capture and measure
external signal characteristics such as period, frequency, duty cycle, or pulse width. ECAP operates using a
32-bit time-stamp counter and up to four 32-bit capture registers. Captured values can be used to calculate
timing intervals, generate interrupts, or trigger other peripherals.
The module can generate interrupts on any of the capture events and supports both absolute time-capture
and delta-time stamp capture modes, programmable edge polarity for each capture event, and can operate in
auxiliary PWM (APWM) mode to generate a PWM output when not used for capture. The ECAP also supports
one-shot capture mode of up to four time-stamp events, and continuous capture mode of time stamps in a
four-deep circular buffer.
These capabilities make the ECAP module useful for speed measurement, position sensing, and precise input
signal monitoring control applications.
For more information, see Enhanced Capture (ECAP) Module section in Peripherals chapter in the device TRM.
7.5.6 Error Location Module (ELM)
The Error Location Module (ELM) operates in conjunction with the General-Purpose Memory Controller (GPMC)
to support error detection and correction for NAND flash memories. It processes syndrome polynomials
generated during NAND page reads using a Bose–Chaudhuri–Hocquenghem (BCH) algorithm to identify error
locations within a data block. The ELM supports 4-, 8-, and 16-bit error correction per 512-byte block, with
interrupt generation upon completion and register-based access to error count and location data.

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For more information, see Error Location Module (ELM) section in Peripherals chapter in the device TRM.
7.5.7 Enhanced Pulse Width Modulation (EPWM)
Enhanced Pulse Width Modulation (EPWM) module is a highly flexible timer-based peripheral used for
generating precise pulse-width modulated waveforms for motor control, digital power, and general-purpose
timing applications.
The EPWM module provides programmable period, duty cycle, and phase control, with features such as dead-
band generation with independent rising- and falling-edge delay control, trip-zone inputs for fault handling,
time-base synchronization input/output signals for synchronization with other EPWM modules, and ability to
generate events to trigger CPU interrupts and ADC conversions, thus enabling precise synchronization between
control loops and waveform generation.
Additional capabilities include PWM chopping by a high-frequency carrier signal to reduce EMI and improve
signal quality, and programmable event prescaling functionality for fine-grained control over how often PWM
events trigger actions.
For more information, see Enhanced Pulse Width Modulation (EPWM) section in Peripherals chapter in the
device TRM.
7.5.8 Error Signaling Module (ESM)
The Error Signaling Module (ESM) aggregates events and/or errors from throughout the device into one location.
It can signal both low and high priority interrupts to a processor to deal with an event and/or manipulate an I/O
error pin to signal an external hardware that an error has occurred. Therefore an external controller is able to
reset the device or keep the system in a safe, known state.
For more information, see Error Signaling Module section in Peripherals chapter in the device TRM.
7.5.9 Enhanced Quadrature Encoder Pulse (EQEP)
The Enhanced Quadrature Encoder Pulse (EQEP) peripheral is used to interface with quadrature-encoded
signals from rotary or linear encoders, commonly used in high performance motion and position control systems,
providing accurate position, direction, and speed information.
The EQEP module supports decoding of A-phase and B-phase signals, along with index signal (QEPI) for
absolute position reference.
The 32-bit EQEP module features a position counter and control unit for position measurement with
programmable reset, a quadrature edge-capture unit for low-speed measurement, a unit time base for real-time
speed measurement, along with a watchdog timer for loss of encoder activity. The EQEP also generates
interrupts on compare, overflow/underflow, and index events, supporting flexible motion control algorithms.
For more information, see Enhanced Quadrature Encoder Pulse (EQEP) section in Peripherals chapter in the
device TRM.
7.5.10 General-Purpose Interface (GPIO)
The General-Purpose Input/Output (GPIO) peripheral provides dedicated general-purpose pins that can be
configured as either inputs or outputs. When configured as an output, the user can write to an internal register to
control the state driven on the output pin. When configured as an input, user can obtain the state of the input by
reading the state of an internal register.
A GPIO module supports up to 144 dedicated signals distributed in 9 banks, each one comprising up to 16 GPIO
signals.
Interrupt generation can be enabled independently for each bank of 16 GPIO signals. Interrupts can be triggered
by rising and/or falling edge, specified for each interrupt capable GPIO signal.
In addition, the GPIO peripheral can produce DMA synchronization events in different event generation modes.
GPIO signals set/clear functionality is also available.

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For more information, see General-Purpose Interface section in Peripherals chapter in the device TRM.
7.5.11 General-Purpose Memory Controller (GPMC)
The General-Purpose Memory Controller is a unified memory controller dedicated for interfacing with external
memory devices like:
• Asynchronous SRAM-like memories and application-specific integrated circuit (ASIC) devices
• Asynchronous, synchronous, and page mode (available only in non-multiplexed mode) burst NOR flash
devices
• NAND flash
• Pseudo-SRAM devices
For more information, see General-Purpose Memory Controller section in Peripherals chapter in the device
TRM.
7.5.12 Global Timebase Counter (GTC)
The GTC module is a 64-bit free-running up-counter compliant with Arm®v8 system counter requirments, with
no rollover over the device lifetime when the full 64-bit counter is used, and support of selectable counter-bit
outputs as a push events.
The GTC provides a unified time reference across all cores and peripherals for consistent timestamping and
synchronization.
For more information, see Global Timebase Counter section in Peripherals chapter in the device TRM.
7.5.13 Inter-Integrated Circuit (I2C)
The Inter-Integrated Circuit (I2C) controller provides an interface between a local host (LH), such as an Arm and
any I2C-bus-compatible device that connects via the I2C serial bus. External components attached to the I2C bus
can serially transmit and receive up to 8 bits of data to and from the LH device through the 2-wire I2C interface.
Each multicontroller I2C module can be configured to act like a target or controller I2C-compatible device.
The I2C instances are implemented with I2C compliant, open-drain I/O buffers, or with standard push-pull I/O
buffers. The I2C instances associated with I2C open-drain I/O buffers can support HS-mode (up to 3.4Mbps
when operating at 1.8V, and limited to 400kbps when operating at 3.3V).
The I2C instances associated with standard push-pull I/O buffers can support Fast-mode (up to 400kbps). The
standard push-pull I/O buffers being used on these ports are connected such they emulate open-drain outputs.
This emulation is achieved by forcing a constant low output and disabling the output buffer to enter the Hi-Z
state.
For more information, see Inter-Integrated Circuit section in Peripherals chapter in the device TRM.
7.5.14 Modular Controller Area Network (MCAN)
The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed
real-time control with a high level of security. CAN has high immunity to electrical interference and the ability
to self-diagnose and repair data errors. In a CAN network, many short messages are broadcast to the entire
network, which provides for data consistency in every node of the system.
The MCAN module supports both classic CAN and CAN FD (CAN with Flexible Data-Rate) specifications. CAN
FD feature allows high throughput and increased payload per data frame. The classic CAN and CAN FD devices
can coexist on the same network without any conflict.
CAN and CAN FD devices connect to the physical layer of the CAN network through external (for the device)
transceivers. Each MCAN module supports flexible bit rates greather than 1Mbps and is compliant to ISO
11898-1:2015.
For more information, see Modular Controller Area Network (MCAN) section in Peripherals chapter in the device
TRM.

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7.5.15 Multichannel Audio Serial Port (MCASP)

The MCASP functions as a general-purpose audio serial port, optimized for the requirements of various audio
applications. The MCASP module can operate in both transmit and receive modes. The MCASP is useful for
time-division multiplexed (TDM) stream, Inter-IC Sound (I2S) protocols reception and transmission as well as
for an inter-component digital audio interface transmission (DIT). The MCASP has the flexibility to gluelessly
connect to a Sony/Philips digital interface (S/PDIF) transmit physical layer component.
Although inter-component digital audio interface reception (DIR) mode (this is, S/PDIF stream receiving) is not
natively supported by the MCASP module, a specific TDM mode implementation for the MCASP receivers allows
an easy connection to external DIR components (for example, S/PDIF to I2S format converters).
For more information, see Multichannel Audio Serial Port section in Peripherals chapter in the device TRM.
7.5.16 Multichannel Serial Peripheral Interface (MCSPI)
The MCSPI is an enhanced SPI module that supports multichannel transmit/receive communication and can
operate in both controller and peripheral modes. In controller mode the module can interface with up to four
channels, while in peripheral mode supports a single channel.
Each channel supports two independent DMA requests (one for read and one for write) and one interrupt for
efficient data transfer, a programmable start-bit (Last Output Stop Start Insertion (LOSSI) mode) to ensure
proper framing and synchronization in multi-channel communication, a built-in FIFO for data throughput and
word access efficiency, and a serial clock with programmable frequency, polarity and phase.
The MCSPI module supports configurable SPI word length in the range of 4 to 32 bits. Additionally,
programmable shift operations and timing control between chip select and external clock generation are
provided.
For more information, see Multichannel Serial Peripheral Interface section in Peripherals chapter in the device
TRM.
7.5.17 Multi-Media Card Secure Digital (MMCSD)
The MMCSD Host Controller provides an interface to embedded Multi-Media Card (MMC), Secure Digital
(SD), and Secure Digital IO (SDIO) devices. The MMC/SD controller deals with MMC/SD/SDIO protocol at
transmission level — packing data, adding CRC, start/end bit, and checking for syntactical correctness.
The MMCSD Host Controller has been implemented as a 4-bit subsystem and 8-bit subsystem. The 4-bit
subsystem supports removable SD cards compliant with the SD Physical Layer Specification v3.01, and
embedded SDIO devices compliant with the SDIO Specification v3.00. The 8-bit subsystem supports eMMC
devices compliant with the JEDEC eMMC electrical standard v5.1 (JESD84-B51), and embedded SDIO devices
compliant with the SDIO Specification v3.00.
For more information, see Multi-Media Card Secure Digital (MMCSD) Interface section in Peripherals chapter in
the device TRM.
7.5.18 Octal Serial Peripheral Interface (OSPI)
The Octal Serial Peripheral Interface (OSPI) module is a Serial Peripheral Interface (SPI) module which allows
single, dual, quad or octal read and write access to external flash devices with dual (DDR) or single (SDR)
data rate. This module has a memory mapped register interface, which provides a direct memory interface for
accessing data from external flash devices, simplifying software requirements.
The module supports DDR and DTR protocols (including Octal DDR with DQS), XIP (continuous mode),
programmable device sizes and delays, and write protection regions. Additional features include bidirectional
CRC, ECC error handling, programmable interrupt generation, and a programmable data decoder for continuous
addressing and device boundary detection.
For more information, see Octal Serial Peripheral Interface (OSPI) section in Peripherals chapter in the device
TRM.

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7.5.19 Timers
The general-purpose timer (TIMER) is a 32-bit module that supports timer mode for periodic event generation,
capture mode for precise timestamping of external events, and compare mode for match-based interrupts.
TIMER modules support cascading two 32-bit timers to form a 64-bit counter.
TIMER contains a free running upward counter with auto reload capability on overflow and can be read and
written on the fly (while counting). TIMER supports interrupts generated on overflow, compare and capture
events. All internal timer interrupt sources are merged in one module interrupt line and one wake-up line and
each internal interrupt source can be independently enabled or disabled.
TIMER modules can generate 1-ms tick with 32768-Hz functional clock.
For more information, see Timers section in Peripherals chapter in the device TRM.
7.5.20 Universal Asynchronous Receiver/Transmitter (UART)
The UART is a peripheral that utilizes the DMA for data transfer or interrupt polling via host CPU. All UART
modules support IrDA and CIR modes when 48MHz function clock is used. Each UART can be used for
configuration and data exchange with a number of external peripheral devices or interprocessor communication
between devices.
The UART module supports high-speed communication up to 3.6Mbps with a 64-byte FIFO buffer for both
transmission and reception, and includes advanced features like auto flow control, configurable data formats,
sleep mode, and extended modem control signals. It also offers programmable interrupt levels, auto-baud
detection, and internal loopback for testing.
For more information, see Universal Synchronous/Asynchronous Receiver/Transmitter section in Peripherals
chapter in the device TRM.
7.5.21 Universal Serial Bus Subsystem (USBSS)
The Universal Serial Bus Subsystem (USBSS) provides a connectivity solution for numerous consumer portable
devices by implementing a mechanism for data transfer between USB devices.
USBSS features Dual Role Device (DRD) functionality, enabling operation in Host mode at High-Speed
(480Mbps), Full-Speed (12Mbps), or Low-Speed (1.5Mbps), and Peripheral mode at High-Speed (480Mbps)
or Full-Speed (12Mbps), offering flexible operation and integrated VBUS detection. The subsystem is compliant
with the xHCI 1.1 specification for host controller interface compatibility.
For more information, see Universal Serial Bus Subsystem (USBSS) section in Peripherals chapter in the device
TRM.

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8 Applications, Implementation, and Layout

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.

8.1 Device Connection and Layout Fundamentals

8.1.1 Power Supply
[Link] Power Supply Designs
The TPS65219 Power Management IC (PMIC) is recommended for an integrated AM62x power solution. This
cost and space optimized solution is designed to power the AM62 processor and its principal peripherals. For the
full application note and operational details, refer to Powering the AM62x with the TPS65219 PMIC
List of benefits when using TPS65219 PMIC to power AM62x:
• Full device performance entitlement as validated on TI Evaluation boards
• Factory programmed configurations support power rail load steps, supply voltage accuracies and maximum
load currents with margins
• Factory programmed configurations support LPDDR4 and DDR4 memory
• Meets all AM62x voltage and sequencing requirements, refer to Section 6.5, Recommended Operating
Conditions and Section [Link], Power Supply Sequencing
[Link] Power Distribution Network Implementation Guidance
The Sitara Processor Power Distribution Networks: Implementation and Analysis provides guidance for
successful implementation of the power distribution network. This includes PCB stackup guidance as well as
guidance for optimizing the selection and placement of the decoupling capacitors. TI only supports designs that
follow the board design guidelines contained in the application report.
8.1.2 External Oscillator
For more information about External Oscillators, see the Clock Specifications section.
8.1.3 JTAG, EMU, and TRACE
Texas Instruments supports a variety of eXtended Development System (XDS™) JTAG controllers with various
debug capabilities beyond only JTAG support. A summary of this information is available in the XDS Target
Connection Guide.
For recommendations on JTAG, EMU, and TRACE routing, see the Emulation and Trace Headers Technical
Reference Manual
8.1.4 Unused Pins
For more information about Unused Pins, see Section 5.4, Pin Connectivity Requirements

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8.2 Peripheral- and Interface-Specific Design Information

8.2.1 DDR Board Design and Layout Guidelines
The goal of the AM62x DDR Board Design and Layout Guidelines is to make the DDR system implementation
straightforward for all designers. Requirements have been distilled down to a set of layout and routing rules that
allow designers to successfully implement a robust design for the topologies that TI supports. TI only supports
board designs using DDR4 or LPDDR4 memories that follow the guidelines in this document.

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8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines

The following section details the PCB routing guidelines that must be observed when connecting OSPI, QSPI, or
SPI devices.
[Link] No Loopback, Internal PHY Loopback, and Internal Pad Loopback
• The OSPI[x]_CLK output pin must be connected to the CLK input pin of the attached OSPI/QSPI/SPI device
• The signal propagation delay from the OSPI[x]_CLK pin to the attached OSPI/QSPI/SPI device CLK pin (A to
B) must be ≤ 450ps (~7cm as stripline or ~8cm as microstrip)
• The signal propagation delay of each OSPI[x]_D[y] and OSPI[x]_CSn[z] pin to the corresponding attached
OSPI/QSPI/SPI device data and control pin (E to F, or F to E) must be approximately equal to the signal
propagation delay from the OSPI[x]_CLK pin to the attached OSPI/QSPI/SPI device CLK pin (A to B)
• 50Ω PCB routing is recommended along with series terminations, as shown in Figure 8-1
• Propagation delays and matching:
– (A to B) ≤ 450ps
– (E to F, or F to E) = ((A to B) ± 60ps)

A B
R1

0 Ω*

OSPI/QSPI/SPI
OSPI[x]_CLK
Device Clock Input

OSPI[x]_LBCLKO

OSPI[x]_DQS OSPI Device DQS

E F

OSPI[x]_D[y], OSPI/QSPI/SPI
OSPI[x]_CSn[z] Device IO[y], CS#
OSPI_Board_01

* 0Ω resistor (R1), located as close as possible to the OSPI[x]_CLK pin, is placeholder for fine tuning, if needed.

Figure 8-1. OSPI Connectivity Schematic for No Loopback, Internal PHY Loopback, and Internal Pad
Loopback

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[Link] External Board Loopback

• The OSPI[x]_CLK output pin must be connected to the CLK input pin of the attached OSPI/QSPI/SPI device
• The OSPI[x]_LBCLKO output pin must be looped back to the OSPI[x]_DQS input pin
• The signal propagation delay of the OSPI[x]_LBCLKO pin to the OSPI[x]_DQS pin (C to D) must be
approximately twice the propagation delay of the OSPI[x]_CLK pin to the attached OSPI/QSPI/SPI device
CLK pin (A to B)
• The signal propagation delay of each OSPI[x]_D[y] and OSPI[x]_CSn[z] pin to the corresponding attached
OSPI/QSPI/SPI device data and control pin (E to F, or F to E) must be approximately equal to the signal
propagation delay from the OSPI[x]_CLK pin to the attached OSPI/QSPI/SPI device CLK pin (A to B)
• 50Ω PCB routing is recommended along with series terminations, as shown in Figure 8-2
• Propagation delays and matching:
– (C to D) = 2 x ((A to B) ± 30ps), see the exception note below.
– (E to F, or F to E) = ((A to B) ± 60ps)

Note
The External Board Loopback hold time requirement (defined by parameter number O16 in the OSPI0
Timing Requirements - PHY DDR Mode section) may be larger than the hold time provided by a
typical OSPI/QSPI/SPI device. In this case, the propagation delay of OPSI[x]_LBCLKO pin to the
OSPI[x]_DQS pin (C to D) can be reduced to provide additional hold time.

A B
R1

0 Ω*

OSPI/QSPI/SPI
OSPI[x]_CLK
Device Clock Input

C
R1

0 Ω*

OSPI[x]_LBCLKO

OSPI[x]_DQS OSPI Device DQS

E F

OSPI[x]_D[y], OSPI/QSPI/SPI
OSPI[x]_CSn[z] Device IO[y], CS#
OSPI_Board_02

* 0Ω resistor (R1), located as close as possible to the OSPI[x]_CLK and OSPI[x]_LBCLKO pins, is a placeholder for fine tuning, if
needed.

Figure 8-2. OSPI Connectivity Schematic for External Board Loopback

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[Link] DQS (only available in Octal SPI devices)

• The OSPI[x]_CLK output pin must be connected to the CLK input pin of the attached OSPI/QSPI/SPI device
• The DQS pin of the attached OSPI/QSPI/SPI device must be connected to OSPI[x]_DQS pin
• The signal propagation delay from the attached OSPI/QSPI/SPI device DQS pin to the OSPI[x]_DQS pin (D
to C) must be approximately equal to the signal propagation delay from the OSPI[x]_CLK pin to the attached
OSPI/QSPI/SPI device CLK pin (A to B)
• The signal propagation delay of each OSPI[x]_D[y] and OSPI[x]_CSn[z] pin to the corresponding attached
OSPI/QSPI/SPI device data and control pin (E to F, or F to E) must be approximately equal to the signal
propagation delay from the OSPI[x]_CLK pin to the attached OSPI/QSPI/SPI device CLK pin (A to B)
• 50Ω PCB routing is recommended along with series terminations, as shown in Figure 8-3
• Propagation delays and matching:
– (D to C) = ((A to B) ± 30ps)
– (E to F, or F to E) = ((A to B) ± 60ps)

A B
R1

0 Ω*

OSPI/QSPI/SPI
OSPI[x]_CLK
Device Clock Input

OSPI[x]_LBCLKO

C D

OSPI[x]_DQS OSPI Device DQS

E F

OSPI[x]_D[y], OSPI/QSPI/SPI
OSPI[x]_CSn[z] Device IO[y], CS#
OSPI_Board_03

* 0Ω resistor (R1), located as close as possible to the OSPI[x]_CLK pin, is a placeholder for fine tuning, if needed.

Figure 8-3. OSPI Connectivity Schematic for DQS

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8.2.3 USB VBUS Design Guidelines

The USB 3.1 specification allows the VBUS voltage to be as high as 5.5V for normal operation, and as high as
20V when the Power Delivery addendum is supported. Some automotive applications require a max voltage to
be 30V.
The device requires the VBUS signal voltage be scaled down using an external resistor divider (as shown in
the Figure 8-4), which limits the voltage applied to the actual device pin (USB0_VBUS). The tolerance of these
external resistors should be equal to or less than 1%, and the leakage current of Zener diode at 5V should be
less than 100nA.

Device

USBn_VBUS

16.5 kΩ 3.48 kΩ
±1% ±1%
VBUS signal

10 kΩ
±1% 6.8V
(BZX84C6V8 or equivalent)

VSS VSS
J7ES_USB_VBUS_01

Figure 8-4. USB VBUS Detect Voltage Divider / Clamp Circuit

The USB0_VBUS pin can be considered to be fail-safe because the external circuit in Figure 8-4 limits the input
current to the actual device pin in a case where VBUS is applied while the device is powered off.
8.2.4 System Power Supply Monitor Design Guidelines
The VMON_VSYS pin provides a way to monitor a system power supply. This system power supply is typically
a single pre-regulated power source for the entire system and can be connected to the VMON_VSYS pin via
and external resistor divider circuit. This system supply is monitored by comparing the external voltage divider
output voltage to an internal voltage reference, where a power fail event is triggered when the voltage applied
to VMON_VSYS drops below the internal reference voltage. The actual system power supply voltage trip point
is determined by the system designer when selecting component values used to implement the external resistor
voltage divider circuit.
When designing the resistor divider circuit the designer must understand various factors which contribute to
variability in the system power supply monitor trip point. The first thing to consider is the initial accuracy of
the VMON_VSYS input threshold which has a nominal value of 0.45V, with a variation of ±3%. Precision
1% resistors with similar thermal coefficient are recommended for implementing the resistor voltage divider.
This minimizes variability contributed by resistor value tolerances. Input leakage current associated with
VMON_VSYS must also be considered since any current flowing into the pin creates a loading error on the
voltage divider output. The VMON_VSYS input leakage current can be in the range of 10nA to 2.5µA when
applying 0.45V.

Note
The resistor voltage divider shall be designed such that the output voltage never exceeds the
maximum value defined in the Recommended Operating Conditions section, during normal operating
conditions.

Figure 8-5 presents an example, where the system power supply is nominally 5V and the maximum trigger
threshold is 5V - 10%, or 4.5V.

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For this example, the designer must understand which variables effect the maximum trigger threshold when
selecting resistor values. A device which has a VMON_VSYS input threshold of 0.45V + 3% needs to be
considered when trying to design a voltage divider that doesn’t trip until the system supply drops 10%. The effect
of resistor tolerance and input leakage also needs to be considered, but the contribution to the maximum trigger
point is not obvious. When selecting component values which produce a maximum trigger voltage, the system
designer must consider a condition where the value of R1 is 1% low and the value of R2 is 1% high combined
with a condition where input leakage current for the VMON_VSYS pin is 2.5µA. When implementing a resistor
divider where R1 = 4.81KΩ and R2 = 40.2KΩ, the result is a maximum trigger threshold of 4.517V.
Once component values have been selected to satisfy the maximum trigger voltage as described above, the
system designer can determine the minimum trigger voltage by calculating the applied voltage that produces an
output voltage of 0.45V - 3% when the value of R1 is 1% high and the value of R2 is 1% low, and the input
leakage current is 10nA, or zero. Using an input leakage of zero with the resistor values given above, the result
is a minimum trigger threshold of 4.013V.
This example demonstrates a system power supply voltage trip point that ranges from 4.013V to 4.517V.
Approximately 250mV of this range is introduced by VMON_VSYS input threshold accuracy of ±3%,
approximately 150 mV of this range is introduced by resistor tolerance of ±1%, and approximately 100mV of
this range is introduced by loading error when VMON_VSYS input leakage current is 2.5µA.
The resistor values selected in this example produces approximately 100µA of bias current through the resistor
divider when the system supply is 4.5V. The 100mV of loading error mentioned above can be reduced to about
10mV by increasing the bias current through the resistor divider to approximately 1mA. So resistor divider bias
current vs loading error is something the system designer needs to consider when selecting component values.
The system designer must also consider implementing a noise filter on the voltage divider output since
VMON_VSYS has minimum hysteresis and a high-bandwidth response to transients. This can be done by
installing a capacitor across R1 as shown in Figure 8-5. However, the system designer must determine the
response time of this filter based on system supply noise and expected response to transient events.

Device

VMON_VSYS

R2
VSYS
40.2 kΩ ±1% (System Power Supply)
R1 4.81 kΩ
C1
±1%
Value = Determined by system designer

VSS
SPRSP56_VMON_ER_MON_01

Figure 8-5. System Supply Monitor Voltage Divider Circuit

VMON_1P8_SOC pin provides a way to monitor external 1.8V power supplies. This pin must be connected
directly to their respective power source. An internal resistor divider with software control is implemented inside
the SoC for each of these pins. Software can program each internal resistor divider to create appropriate under
voltage and over voltage interrupts.
VMON_3P3_SOC pin provides a way to monitor external 3.3V power supplies. This pin must be connected
directly to their respective power source. An internal resistor divider with software control is implemented inside
the SoC for each of these pins. Software can program each internal resistor divider to create appropriate under
voltage and over voltage interrupts.

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8.2.5 High Speed Differential Signal Routing Guidance

The High Speed Interface Layout Guidelines provides guidance for successful routing of the high speed
differential signals. This includes PCB stackup and materials guidance as well as routing skew, length and
spacing limits. TI supports only designs that follow the board design guidelines contained in the application note.
8.2.6 Thermal Solution Guidance
The Thermal Design Guide for DSP and ARM Application Processors provides guidance for successful
implementation of a thermal solution for system designs containing this device. This document provides
background information on common terms and methods related to thermal solutions. TI only supports designs
that follow system design guidelines contained in the application note.

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8.3 Clock Routing Guidelines

8.3.1 Oscillator Routing
When designing the printed-circuit board:
• Place all crystal circuit components as close as possible to the respective device pins.
• Route the crystal circuit traces on the outer layer of the PCB and minimize trace lengths to reduce parasitic
capacitance and minimize crosstalk from other signals.
• Place a continuous ground plane on the adjacent layer of the PCB such that it is under all crystal circuit
components and crystal circuit traces.
• Route a ground guard around the crystal circuit components to shield it from any adjacent signals routed on
the same layer as the crystal circuit traces. Insert multiple vias to stitch down the ground guard such that it
does not have any unterminated stubs.
• Route a ground guard between the MCU_OSC0_XI and MCU_OSC0_XO signals to shield the
MCU_OSC0_XI signal from the MCU_OSC0_X0 signal. Insert multiple vias to stitch down the ground guard
such that it does not have any unterminated stubs.
• Connect all crystal circuit ground connections and ground guard connections directly to the adjacent layer
ground plane, and the device VSS ground plane if they are implemented separately on different layers of the
PCB.

Note
Implementing a ground guard between the MCU_OSC0_XI and MCU_OSC0_XO signals is critical
to minimize shunt capacitance between the two signals. Routing these two signals adjacent to each
other without a ground guard between them will effectively reduce the gain of the oscillator amplifier,
which reduces its ability to start oscillation.

GND vias

Device

GND plane MCU_OSC0_XI

Cap
Crystal

Cap

GND guard
MCU_OSC0_XO

GND vias
Figure 8-6. MCU_OSC0 PCB requirements

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9 Device and Documentation Support

9.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for
example, AM6254ATCGGAALW). Texas Instruments recommends two of three possible prefix designators for
related support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development
from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).
Device development evolutionary flow:

X Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P Prototype device that is not necessarily the final silicon die and may not necessarily meet final
electrical specifications.
null (BLANK) Production version of the silicon die that is fully qualified and meets final electrical specifications.

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
For orderable part numbers of AM62x devices in the ALW or AMC package types, see the Package Option
Addendum at the end of this document, the TI website ([Link]), or contact your TI sales representative.

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9.1.1 Standard Package Symbolization

Note
Some devices may have a cosmetic circular marking visible on the top of the device package which
results from the production test process. In addition, some devices may also show a color variation in
the package substrate which results from the substrate manufacturer. These differences are cosmetic
only with no reliability impact.

SITARA
SITARA aBBBBBBr
aBBBBBBr ZfYytPPPQ1
ZfYytPPPQ1
XXXXXXX
XXXXXXX
A1 (PIN ONE INDICATOR) YYY G1 A1 (PIN ONE INDICATOR)

YYY ZZZ G1
O O

Figure 9-1. Printed Device Reference

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9.1.2 Device Naming Convention

FIELD PARAMETER FIELD DESCRIPTION VALUE DESCRIPTION
X Prototype
a Device evolution stage P Preproduction (production test flow, no reliability data)
BLANK(1) Production
AM6254
AM6252
AM6251
AM6234
Base production part
BBBBBB AM6232 See Table 4-1, Device Comparison
number
AM6231
AM6204
AM6202
AM6201
A SR1.0
r Device revision
B SR1.1
G
K
Z Device Speed Grade See Table 6-1, Device Speed Grades
S
T

Features G Base, no additional Features

f
(see Table 4-1) C Base, plus PRU Subsystem (PRUSS) enabled
G Non-Functional Safety
Y Functional Safety
F Functional Safety
G Non-Secure
y Security
Other Secure
–40°C to 105°C - Extended Industrial (see Section 6.5, Recommended
A
Operation Conditions)
0°C to 95°C - Commercial (see Section 6.5, Recommended Operation
t Temperature(2) H
Conditions)
–40°C to 125°C - Automotive (see Section 6.5, Recommended
I
Operation Conditions)
ALW FCCSP BGA (425-pin)
PPP Package Designator
AMC FCBGA (441-pin)
Q1 Automotive Qualified (AEC - Q100)
Q1 Automotive Designator
BLANK(1) Standard
xxxxxxx Lot Trace Code (LTC)
YYY Production Code, For TI use only
ZZZ Production Code, For TI use only
O Pin one designator
G1 ECAT - Green package designator

(1) BLANK in the symbol or part number is collapsed so there are no gaps between characters.
(2) Applies to device max junction temperature.

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9.2 Tools and Software

The following Development Tools support development for TI's Embedded Processing platforms:
Development Tools
Code Composer Studio™ Integrated Development Environment Code Composer Studio (CCS) Integrated
Development Environment (IDE) is a development environment that supports TI's Microcontroller and Embedded
Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded
applications. The tool includes an optimizing C/C++ compiler, source code editor, project build environment,
debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking you through
each step of the application development flow. Familiar tools and interfaces allow users to get started faster
than ever before. Code Composer Studio combines the advantages of the Eclipse® software framework with
advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment
for embedded developers.
SysConfig Tool The System Configuration tool provides a graphical user interface (GUI) that simplifies device
configuration. The tool is designed to simplify hardware and software configuration challenges to accelerate
software development. SysConfig is available as part of the Code Composer Studio™ integrated development
environment as well as a standalone application. Additionally SysConfig can be run in the cloud by visiting the TI
developer zone.
SysConfig allows developers to configure pins, peripherals, and other components, and automatically detects,
exposes, and resolves conflicts to speed software development. In addition, the clock tree tool provides a visual
implementation of the device clock connectivity.
The SysConfig tool generates output C header/code files that can be imported into software development kits
(SDKs), enabling customers to configure their software in alignment with the specific hardware requirements.
For a complete listing of development-support tools for the processor platform, visit the Texas Instruments
website at [Link]. For information on pricing and availability, contact the nearest TI field sales office or authorized
distributor.
9.3 Documentation Support
To receive notification of documentation updates, navigate to the device product folder on [Link]. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
The following documents describe the AM62x devices.
Technical Reference Manual
AM62x Sitara Processors Technical Reference Manual: Details the integration, the environment, the
functional description, and the programming models for each peripheral and subsystem in the AM62x family
of devices.
Errata
AM62x Sitara Processors Silicon Errata: Describes the known exceptions to the functional specifications for
the device.
9.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
9.5 Trademarks
MPCore™, Neon™, and CoreSight™ are trademarks of Arm Limited (or its subsidiaries) in the US and/or
elsewhere.

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XDS™, Code Composer Studio™, and TI E2E™ are trademarks of Texas Instruments.
Arm®, Cortex®, and TrustZone® are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or
elsewhere.
MIPI® is a registered trademark of MIPI Alliance.
Secure Digital® and SD® are registered trademarks of SD Card Association.
Eclipse® is a registered trademark of Eclipse Foundation AISBL.
All trademarks are the property of their respective owners.
9.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

9.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

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10 Revision History

Changes from June 15, 2023 to October 31, 2025 (from Revision B (JUNE 2023) to Revision C
(OCTOBER 2025)) Page
• Global: Removed references to Industrial functional safety.............................................................................. 1
• Global: Updated the introductory sentence in 10 timing sections......................................................................1
• (Features): Added "/SDIO" to the Multi-Media Card/Secure Digital bullet in Media and Data Storage.............. 1
• (Features): Removed the "Trace over USB supported" bullet from High-Speed Interfaces............................... 1
• Global: Moved the Revision History section to the back of the document.........................................................1
• (Description): Removed the list of applications and corrected typographical errors...........................................4
• (Description): Removed sentence describing package options..........................................................................4
• (Package Information): Added 13mm×13mm ALW package options for AM625-Q1 and AM620-Q1................ 4
• (Device Comparison): Updated total number of available external General-Purpose I/Os in the device from
170 to 168...........................................................................................................................................................7
• (Device Comparison): Updated the name of the JTAG User ID register............................................................ 7
• (Device Comparison): Changed "Up to 1GB" to "Up to 128MB" in the General-Purpose Memory Controller
description.......................................................................................................................................................... 7
• (Device Comparison): Changed "LVDS" to "OLDI (LVDS)" in the Display Subsystem description.................... 7
• (Device Comparison): Added row to indicate GTC support................................................................................7
• (Related Products): Added links to products for design completion................................................................... 8
• (ALW FCCSP Pin Diagram): Changed the figure from a bottom view a top view............................................ 10
• (AMC FCBGA Pin Diagram): Changed the figure from a bottom view a top view............................................10
• (EPWM0 Signal Descriptions): Updated the EHRPWM0_SYNCO description................................................ 60
• (MMC2 Signal Descriptions): Added Note 2 to the MMC2_SDCD and MMC2_SDWP signals....................... 72
• (Power Supply Signal Descriptions): Updated the table notes associated with the CAP_VDDSx pins to clarify
the need for capacitance derating and describe additional connectivity options .............................................73
• (Power Supply Signal Descriptions): Updated the description of several power rails to clarify their function.. 73
• (MCU System Signal Descriptions): Updated the description of the MCU_PORz signal function................... 80
• (UART1 Signal Descriptions): Corrected the description for UART1_DCDn....................................................81
• (Pin Connectivity Requirements): Updated the connectivity requirements description for MCU_I2C0 and
WKUP_I2C0 balls to allow connecting external pull-down resistors when selecting a GPIO signal function...84
• (Connectivity Requirements): Updated the Connection Requirements descriptions for CSI0 balls to clarify
connectivity expectations when not using all four lanes................................................................................... 84
• (Pin Connectivity Requirements): Updated the VMON_3P3_SOC connectivity requirements.........................84
• (Absolute Maximum Ratings): Updated the description of several power rails to clarify their function............ 88
• (ESD Ratings): Added ALW corner pins to ESD Ratings section for AEC-Q100 qualified devices..................90
• (Recommended Operating Conditions): Updated the description of several power rails to clarify their
function............................................................................................................................................................. 91
• (I2C Open-Drain, and Fail-Safe Electrical Characteristics) Added a table note to the Input Leakage Current
parameter......................................................................................................................................................... 94
• (I2C Open-Drain, and Fail-Safe Electrical Characteristics) Separated the Input Leakage Current Test
Conditions into two rows...................................................................................................................................94
• (Fail-Safe Reset Electrical Characteristics) Added a table note to the Input Leakage Current parameter.......95
• (Fail-Safe Reset Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two
rows.................................................................................................................................................................. 95
• (High-Frequency Oscillator Electrical Characteristics) Added a table note to the Input Leakage Current
parameter......................................................................................................................................................... 95
• (High-Frequency Oscillator Electrical Characteristics) Separated the Input Leakage Current Test Conditions
into two rows.....................................................................................................................................................95
• (Low-Frequency Oscillator Electrical Characteristics) Added a table note to the Input Leakage Current
parameter......................................................................................................................................................... 95

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

• (Low-Frequency Oscillator Electrical Characteristics) Separated the Input Leakage Current Test Conditions
into two rows.....................................................................................................................................................95
• (SDIO Electrical Characteristics) Added a table note to the Input Leakage Current parameter.......................96
• (SDIO Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rows.......... 96
• (SDIO Electrical Characteristics): Changed VDDSHV5 power rail name used to define the VIL/VILSS/VIH/
VIHSS/VOL/VOH parameter values by referencing a generic power rail name (VDD), where applicable, and
added an associated table note........................................................................................................................96
• (LVCMOS Electrical Characteristics) Added a table note to the Input Leakage Current parameter................ 97
• (LVCMOS Electrical Characteristics) Separated the Input Leakage Current Test Conditions into two rows....97
• (Recommended Operating Conditions for OTP eFuse Programming): Removed the OPP NOM (BOOT)
reference from the VDD_CORE parameter description, and changed the VPP Slew Rate description to clarify
it only applies to power-up................................................................................................................................99
• (Impact to Your Hardware Warranty): Updated/Changed the "Consequently, TI will have no …" sentence in
the paragraph................................................................................................................................................... 99
• (Thermal Resistance Characteristics): Added Note....................................................................................... 100
• (Thermal Resistance Characteristics for ALW and AMC Package): Updated the thermal parameter values for
the ALW package that is not AEC - Q100 qualified, and added thermal parameter values for the ALW
package that is AEC - Q100 qualified.............................................................................................................100
• (Temperature Sensor Characteristics): Added new section to define Voltage and Temperature Module (VTM)
on die temperature sensor characteristics......................................................................................................101
• (Power-Up Sequencing): Added note to clarify power rails must decay below 300mv before initiating a new
power-up sequence........................................................................................................................................ 105
• (Power-Up Sequencing): Added the missing VDDA_1P8_OLDI0 power rail to Waveform C in the Power-Up
Sequencing - Supply / Signal Assignments table........................................................................................... 105
• (Power-Down Sequencing): Added note to clarify power rails must decay below 300mv before initiating a new
power-up sequence........................................................................................................................................ 108
• (Power-Down Sequencing): Added the missing VDDA_1P8_OLDI0 power rail to Waveform C in the Power-
Down Sequencing - Supply / Signal Assignments table.................................................................................108
• (Power-Down Sequencing – Supply / Signal Assignments): Changed VDDSHV_CANUART to
VDD_CANUART in table note 4..................................................................................................................... 108
• (Power-Down Sequencing): Updated the Power-Down Sequence diagram to account for a use case where
the system power remains turned on while the device power management solution is turned off. Also included
an option that allows the ramp-down of IO power rails to be extended until the last core power rail ramps
down and it is possible for MCU_PORz to be asserted before the supplies begin to sequence off...............108
• (Reset Timing Conditions): Changed the Input slew rate minimum values for VDD = 1.8V and VDD = 3.3V
(original values were swapped).......................................................................................................................111
• (BOOTMODE Timing Requirements): Updated the description for parameters RST23 and RST24.............. 111
• (Input Clocks / Oscillators): Added VOUT0_EXTPCLKIN...............................................................................119
• (MCU_OSC0 LVCMOS Digital Clock Source): Added additional notes and the new MCU_OSC0 LVCMOS
Digital Clock Source Requirements table....................................................................................................... 123
• (WKUP_LFOSC0 Crystal Electrical Characteristics) Included a new parameter that defines the maximum
Crystal Frequency Stability and Tolerance..................................................................................................... 125
• (PLLs): Updated the PLL names to include it's number reference used in the TRM......................................128
• (CPSW3G MDIO Timing): Changed the minimum setup time value (parameter MDIO1) from "90" to "45". Also
changed the minimum and maximum output delay time values (parameter MDIO7) from "-150" and "150" to
"-10" and "10" respectively............................................................................................................................. 130
• (CPSW3G MDIO Timing Conditions): Added propagation delay and propagation delay mismatch timing
parameters......................................................................................................................................................130
• (CPSW3G RMII Timing Conditions): Changed the maximum input slew rate for both operating voltages.... 131
• (CPSW3G RGMII Timing Conditions): Added operating voltage conditions to the Input Slew Rate parameter
to allow a relaxed slew rate when operating at 1.8V...................................................................................... 133
• (CPTS): Updated reference name for the TRM section under the timing tables............................................ 136

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

• (CSI-2): Included a comment in the note that explains port instance name relationship and removed the first
paragraph since it didn't contain any information related to Timing and Switching Characteristics............... 137
• (ECAP – Timing Requirements and Switching Characteristics): Updated the clock source referenced in table
note 1..............................................................................................................................................................141
• (EPWM – Timing Requirements and Switching Characteristics): Updated the clock source referenced in table
note 1..............................................................................................................................................................144
• (EQEP – Timing Requirements): Updated the clock source referenced in table note 1.................................146
• (GPIO Timing Conditions): Updated the Input slew rate parameter to include operating voltage with relaxed
minimum values and corrected a typographical error on the maximum value of the I2C OD FS buffer type
operating at 3.3V. The previous maximum value of 0.8V/ns should have been 0.08V/ns for it to be equivalent
to the maximum value of 8E+7 defined in the Electrical Characteristics table for the I2C OD FS buffer....... 147
• (GPIO Timing Requirements): Removed the voltage conditions in the MODE column and changed the
minimum value to accommodate the reduced minimum Input Slew Rate values in the GPIO Timing
Conditions table..............................................................................................................................................147
• (GPMC and NOR Flash Timing Requirements — Synchronous Mode): Removed the GPMC_FCLK=100MHz
column timing values and the associated not_div_by_1_mode timing values for GPMC_FCLK=133MHz.
Simplified several parameter descriptions. Also removed two table notes, one that described register
configuration for GPMC_FCLK selection, and another that described register configuration for
div_by_1_mode.............................................................................................................................................. 148
• (GPMC and NOR Flash Switching Characteristics – Synchronous Mode): Removed the
GPMC_FCLK=100MHz column timing values and the associated not_div_by_1_mode timing values for
GPMC_FCLK=133MHz. Simplified several parameter descriptions. Changed the timing variable in
parameters F3 and F11 to "D". Removed the "J" timing variable from the F15 and F17 parameters. Updated
the table notes................................................................................................................................................ 148
• (GPMC and NOR Flash Timing Requirements – Asynchronous Mode): Removed the MODE column and the
table note that described register configuration for div_by_1_mode. Added the correct table note for
parameter FA21 .............................................................................................................................................156
• (GPMC and NOR Flash Switching Characteristics – Asynchronous Mode): Removed the MODE column and
redundant rows. Also removed the table note that described register configuration for div_by_1_mode...... 156
• (GPMC and NAND Flash Timing Requirements – Asynchronous Mode): Removed the MODE column and the
table note that described register configuration for div_by_1_mode.............................................................. 163
• (GPMC and NAND Flash Switching Characteristics – Asynchronous Mode): Removed the MODE column and
the table note that described register configuration for div_by_1_mode. Added table notes and associated
reference links for timing variables B, C, D, E, F, G, H, I, K, L, and M........................................................... 163
• (I2C): Changed the maximum slew rate value from 0.8V/ns to 0.08V/ns and added "when operating at 3.3V"
to clarify the exception is not applicable to 1.8V operation.............................................................................166
• (I2C): Changed the supported speeds and exception descriptions so they are organized based on IO buffer
type rather than I2C port instance.................................................................................................................. 166
• (MCAN): Updated reference name for the TRM section under the timing tables........................................... 168
• (MCASP): Changed the IOSET note that explains timing limitations associated with valid pin combinations.....
........................................................................................................................................................................169
• (MCSPI): Changed the IOSET note that explains timing limitations associated with valid pin combinations.173
• (MCSPI Switching Characteristics - Controller Mode): Replaced previous table notes 2 and 3 with new table
notes 2, 3, 4, and 5.........................................................................................................................................174
• (MMC0 - eMMC/SD/SDIO Interface): Clarified the Default Speed, High Speed, UHS-I SDR12, and UHS-I
SDR25 modes are only available for connectivity to embedded SDIO devices, and removed the UHS-I
SDR50, UHS-I DDR50, and UHS-I SDR104 modes...................................................................................... 180
• (MMC0 DLL Delay Mapping for all Timing Modes): Changed the register name, changed the OTAPDLYENA
and OTAPDLYSEL values for Legacy SDR, High Speed SDR, Default Speed, and High Speed modes, and
removed the CLKBUFSEL column because this register bit field doesn't provide any function.....................180
• (HS200 Mode): Added "MMC0 Timing Requirements....................................................................................184
• (MMC1/MMC2 DLL Delay Mapping for all Timing Modes): Changed the register names, and changed the
OTAPDLYENA and OTAPDLYSEL values for Default Speed and High Speed modes..................................192

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

• (MMC1/MMC2 DLL Delay Mapping for all Timing Modes): Removed the CLKBUFSEL column because this
register bit field doesn't provide any function................................................................................................. 192
• (OLDI0 Switching Characteristics): Changed the formulas in parameters OLDI5 through OLDI11............... 201
• (OSPI0 DLL Delay Mapping for PHY Data Training): Added a delay value for the
"PHY_MASTER_PHASE_DETECT_SELECTOR_FLD" register bit field.......................................................204
• (OSPI0 Timing Requirements – PHY Data Training): Added three new timing parameters. Two that define
timing parameters associated with SRD with External Board Loopback, and one that defines the minimum
input data valid window for each mode. Also updated Note 1 to clarify the purpose of the new data valid
window parameter.......................................................................................................................................... 204
• (OSPI0 Timing Requirements – PHY Data Training, SDR with External Board Loopback): Added a new timing
requirements diagram for SDR with External Board Loopback...................................................................... 204
• (OSPI Switching Characteristics – PHY Data Training): Added seven new timing parameters. Six that define
timing parameters associated with SRD with External Board Loopback, and one that defines the maximum
output data valid window for each mode........................................................................................................ 204
• (OSPI Switching Characteristics – PHY Data Training): Corrected the formulas associated with timing
parameters O5 and O11................................................................................................................................. 204
• (OSPI0 Switching Characteristics – PHY SDR Data Training): Added a new switching characteristics diagram
for SDR with External Board Loopback.......................................................................................................... 204
• (OSPI0 DLL Delay Mapping for PHY SDR Timing Modes): Added a delay value for the
"PHY_MASTER_PHASE_DETECT_SELECTOR_FLD" register bit field.......................................................208
• (OSPI0 Switching Characteristics – PHY SDR Mode): Corrected the formulas associated with timing
parameters O10 and O11............................................................................................................................... 208
• (OSPI0 DLL Delay Mapping for PHY DDR Timing Modes): Added a delay value for the
"PHY_MASTER_PHASE_DETECT_SELECTOR_FLD" register bit field.......................................................210
• (OSPI0 Switching Characteristics – PHY DDR Mode): Corrected the formulas associated with timing
parameters O4 and O5...................................................................................................................................210
• (Overview): Removed the list of applications and corrected typographical errors..........................................226
• (Overview): Removed sentence describing package options.........................................................................226
• (Detailed Description – A53SS): Added clarification regarding the A53SS features supported by the device.....
........................................................................................................................................................................227
• (Detailed Description – DMSS): Added reference to the TRM to ensure consistency with the structure and
formatting of other sections in the datasheet..................................................................................................229
• (Detailed Description – PDMA): Added clarification regarding the PDMA features supported by the device.229
• (Detailed Description – CPSW3G): Added clarification regarding the CPSW3G features supported by the
device............................................................................................................................................................. 231
• (Detailed Description – DDRSS): Added clarification regarding the DDRSS features supported by the
device............................................................................................................................................................. 231
• (Detailed Description – ECAP): Added clarification regarding the ECAP features supported by the device..231
• (Detailed Description – ELM): Added clarification regarding the ELM features supported by the device...... 231
• (Detailed Description – EPWM): Added clarification regarding the EPWM features supported by the device.....
........................................................................................................................................................................232
• (Detailed Description – EQEP): Added clarification regarding the EQEP features supported by the device. 232
• (Detailed Description – GPIO): Added clarification regarding the GPIO features supported by the device... 232
• (Detailed Description – GTC): Added clarification regarding the GTC features supported by the device...... 233
• (Detailed Description – I2C): Updated the first sentence to ensure consistency with the structure and
formatting of other sections in the datasheet and updated the I/O buffer references.....................................233
• (Detailed Description – MCAN): Added clarification regarding the MCAN features supported by the device......
........................................................................................................................................................................233
• (Detailed Description – McASP): Removed the first sentence to ensure consistency with the structure and
formatting of other sections in the document..................................................................................................234
• (Detailed Description – MCSPI): Added clarification regarding the MCSPI features supported by the device.....
........................................................................................................................................................................234

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
AM625, AM625-Q1, AM623, AM620-Q1
SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025 [Link]

• (Detailed Description – MMCSD): Added clarification regarding the MMCSD features supported by the
device............................................................................................................................................................. 234
• (Detailed Descriprion - OSPI): Added clarification regarding the OSPI features supported by the device.....234
• (Detailed Description – Timers): Added clarification regarding the Timers features supported by the device235
• (Detailed Description – UART): Added clarification regarding the UART features supported by the device..235
• (Detailed Description – USBSS): Added clarification regarding the USBSS features supported by the
device............................................................................................................................................................. 235
• (USB VBUS Design Guidelines): Changed the 3.5kΩ resistor value to 3.48kΩ since 3.5kΩ is not a standard
value for 1% resistors..................................................................................................................................... 241
• (Clock Routing Guidelines): Added new section............................................................................................ 244
• (Device Naming Convention): Added Device revision B................................................................................ 247
• (Tools and Software): Added clarification regarding the SysConfig features..................................................248

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1

AM625, AM625-Q1, AM623, AM620-Q1
[Link] SPRSP58C – JUNE 2022 – REVISED OCTOBER 2025

11 Mechanical, Packaging, and Orderable Information

11.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: AM625 AM625-Q1 AM623 AM620-Q1
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

AM6201ASGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6201A
SGFHIAMCQ1
131
AM6201ASGFHIAMCRQ1.B Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6201A
SGFHIAMCQ1
131
AM6201BSGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 01BSGFHI
AM6201BSGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 01BSGFHI Q1
AM6201BTGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 01BTGFHI
AM6201BTGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 01BTGFHI Q1
AM6202ATGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6202A
TGFHIAMCQ1
131
AM6202ATGFHIAMCRQ1.B Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6202A
TGFHIAMCQ1
131
AM6202BSGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 02BSGFHI
AM6202BSGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 02BSGFHI Q1
AM6202BTGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 02BTGFHI
AM6202BTGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 02BTGFHI Q1
AM6204ASGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6204A
SGFHIAMCQ1
131
AM6204ASGFHIAMCRQ1.B Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6204A
SGFHIAMCQ1
131
AM6204BSGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 04BSGFHI
AM6204BSGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 04BSGFHI Q1
AM6204BTGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 04BTGFHI
AM6204BTGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 04BTGFHI Q1
AM6231AKGGHHALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR 0 to 95 AM6231A
TRAY (10+1) KGGHHALW
131

Addendum-Page 1
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

AM6231AKGGHHALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR 0 to 95 AM6231A
TRAY (10+1) KGGHHALW
131
AM6231ASGGGAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TRAY (10+1) SGGGAALW
131
AM6231ASGGGAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TRAY (10+1) SGGGAALW
131
AM6231ASGGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TRAY (10+1) SGGHAALW
131
AM6231ASGGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TRAY (10+1) SGGHAALW
131
AM6231ASGGHIALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6231A
SGGHIALW
131
AM6231ASGGHIALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6231A
SGGHIALW
131
AM6231ATCGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TRAY (10+1) TCGHAALW
131
AM6231ATCGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TRAY (10+1) TCGHAALW
131
AM6231ATGGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TGGHAALW
131
AM6231ATGGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6231A
TGGHAALW
131
AM6231ATGGHIALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6231A
TGGHIALW
131

Addendum-Page 2
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

AM6231ATGGHIALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6231A
TGGHIALW
131
AM6232ASCGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
SCGHAALW
131
AM6232ASCGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
SCGHAALW
131
AM6232ASGGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TRAY (10+1) SGGHAALW
131
AM6232ASGGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TRAY (10+1) SGGHAALW
131
AM6232ATCGGAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TRAY (10+1) TCGGAALW
131
AM6232ATCGGAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TRAY (10+1) TCGGAALW
131
AM6232ATCGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TRAY (10+1) TCGHAALW
131
AM6232ATCGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TRAY (10+1) TCGHAALW
131
AM6232ATGGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TGGHAALW
131
AM6232ATGGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6232A
TGGHAALW
131
AM6232ATGGHIALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6232A
TGGHIALW
131

Addendum-Page 3
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

AM6232ATGGHIALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6232A
TGGHIALW
131
AM6234ASCGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
SCGHAALW
131
AM6234ASCGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
SCGHAALW
131
AM6234ASGGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
SGGHAALW
131
AM6234ASGGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
SGGHAALW
131
AM6234ATCGGAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
TRAY (10+1) TCGGAALW
131
AM6234ATCGGAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
TRAY (10+1) TCGGAALW
131
AM6234ATCGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
TRAY (10+1) TCGHAALW
131
AM6234ATCGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
TRAY (10+1) TCGHAALW
131
AM6234ATGGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
TRAY (10+1) TGGHAALW
131
AM6234ATGGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6234A
TRAY (10+1) TGGHAALW
131
AM6234ATGGHIALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6234A
TGGHIALW
131

Addendum-Page 4
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

AM6234ATGGHIALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6234A
TGGHIALW
131
AM6251ASGGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6251A
SGGHAALW
131
AM6251ASGGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6251A
SGGHAALW
131
AM6251ATCGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6251A
TRAY (10+1) TCGHAALW
131
AM6251ATCGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6251A
TRAY (10+1) TCGHAALW
131
AM6251ATGGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6251A
TGGHAALW
131
AM6251ATGGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6251A
TGGHAALW
131
AM6251BSGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 51BSGFHI
AM6251BSGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 51BSGFHI Q1
AM6252ASGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6252A
SGFHIAMCQ1
131
AM6252ASGFHIAMCRQ1.B Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6252A
SGFHIAMCQ1
131
AM6252ASGGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
SGGHAALW
131
AM6252ASGGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
SGGHAALW
131

Addendum-Page 5
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

AM6252ATCGGAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
TRAY (10+1) TCGGAALW
131
AM6252ATCGGAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
TRAY (10+1) TCGGAALW
131
AM6252ATCGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
TRAY (10+1) TCGHAALW
131
AM6252ATCGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
TRAY (10+1) TCGHAALW
131
AM6252ATGGHAALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
TGGHAALW
131
AM6252ATGGHAALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 105 AM6252A
TGGHAALW
131
AM6252BSGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 52BSGFHI Q1
AM6252BTCFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 52BTCFHI
AM6252BTGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 52BTGFHI
AM6252BTGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 52BTGFHI Q1
AM6254ASGGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) SGGHAALW
131
AM6254ASGGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) SGGHAALW
131
AM6254ATCGGAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) TCGGAALW
131
AM6254ATCGGAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) TCGGAALW
131

Addendum-Page 6
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

AM6254ATCGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) TCGHAALW
131
AM6254ATCGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) TCGHAALW
131
AM6254ATCGHIALWR Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6254A
TCGHIALW
131
AM6254ATCGHIALWR.B Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 AM6254A
TCGHIALW
131
AM6254ATGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6254A
TGFHIAMCQ1
131
AM6254ATGFHIAMCRQ1.B Active Production FCBGA (AMC) | 441 500 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 AM6254A
TGFHIAMCQ1
131
AM6254ATGGHAALW Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) TGGHAALW
131
AM6254ATGGHAALW.B Active Production FCCSP (ALW) | 425 119 | JEDEC Yes Call TI Level-3-260C-168 HR -40 to 105 AM6254A
TRAY (10+1) TGGHAALW
131
AM6254BSGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 54BSGFHI Q1
AM6254BTCFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-260C-168 HR -40 to 125 54BTCFHI
AM6254BTGFHIALWRQ1 Active Production FCCSP (ALW) | 425 1000 | LARGE T&R Yes Call TI Level-3-250C-168 HR -40 to 125 54BTGFHI
AM6254BTGFHIAMCRQ1 Active Production FCBGA (AMC) | 441 500 | LARGE T&R - Call TI Level-3-250C-168 HR -40 to 125 54BTGFHI Q1

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

Addendum-Page 7
PACKAGE OPTION ADDENDUM

[Link] 10-Dec-2025

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF AM625, AM625-Q1 :

• Catalog : AM625
• Automotive : AM625-Q1

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 8
PACKAGE MATERIALS INFORMATION

[Link] 20-Nov-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
AM6201ASGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6201BSGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6201BSGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6201BTGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6202ATGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6202BSGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6202BSGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6202BTGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6202BTGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6204ASGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6204BSGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6204BSGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6204BTGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6204BTGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6231ASGGHIALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6231ATGGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1

Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

[Link] 20-Nov-2025

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
AM6231ATGGHIALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6232ASCGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6232ATGGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6232ATGGHIALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6234ASCGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6234ASGGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6234ATGGHIALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6251ASGGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6251ATGGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6251BSGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6251BSGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6252ASGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6252ASGGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6252ATGGHAALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6252BSGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6252BTCFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6252BTGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6252BTGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6254ATCGHIALWR FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6254ATGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6254BSGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1
AM6254BTCFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6254BTGFHIALWRQ1 FCCSP ALW 425 1000 330.0 24.4 13.25 13.25 1.8 16.0 24.0 Q1
AM6254BTGFHIAMCRQ1 FCBGA AMC 441 500 330.0 32.4 17.6 17.6 3.74 24.0 32.0 Q1

Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION

[Link] 20-Nov-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM6201ASGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6201BSGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6201BSGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6201BTGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6202ATGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6202BSGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6202BSGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6202BTGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6202BTGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6204ASGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6204BSGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6204BSGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6204BTGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6204BTGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6231ASGGHIALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6231ATGGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6231ATGGHIALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6232ASCGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3

Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION

[Link] 20-Nov-2025

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM6232ATGGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6232ATGGHIALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6234ASCGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6234ASGGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6234ATGGHIALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6251ASGGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6251ATGGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6251BSGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6251BSGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6252ASGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6252ASGGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6252ATGGHAALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6252BSGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6252BTCFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6252BTGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6252BTGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6254ATCGHIALWR FCCSP ALW 425 1000 336.6 336.6 41.3
AM6254ATGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6254BSGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3
AM6254BTCFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6254BTGFHIALWRQ1 FCCSP ALW 425 1000 336.6 336.6 41.3
AM6254BTGFHIAMCRQ1 FCBGA AMC 441 500 336.6 336.6 41.3

Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION

[Link] 20-Nov-2025

TRAY

L - Outer tray length without tabs KO -

Outer
tray
height

W-
Outer
tray
width
Text

P1 - Tray unit pocket pitch

CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device Package Package Pins SPQ Unit array Max L (mm) W K0 P1 CL CW
Name Type matrix temperature (mm) (µm) (mm) (mm) (mm)
(°C)
AM6201BTGFHIALWRQ1 ALW FCCSP 425 1000 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231AKGGHHALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231AKGGHHALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231ASGGGAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231ASGGGAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231ASGGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231ASGGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231ATCGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6231ATCGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6232ASGGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6232ASGGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6232ATCGGAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6232ATCGGAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6232ATCGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6232ATCGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6234ATCGGAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6234ATCGGAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9

Pack Materials-Page 5
PACKAGE MATERIALS INFORMATION

[Link] 20-Nov-2025

Device Package Package Pins SPQ Unit array Max L (mm) W K0 P1 CL CW

Name Type matrix temperature (mm) (µm) (mm) (mm) (mm)
(°C)
AM6234ATCGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6234ATCGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6234ATGGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6234ATGGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6251ATCGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6251ATCGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6252ATCGGAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6252ATCGGAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6252ATCGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6252ATCGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ASGGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ASGGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ATCGGAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ATCGGAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ATCGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ATCGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ATGGHAALW ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9
AM6254ATGGHAALW.B ALW FCCSP 425 119 07x17 150 315 135.9 7620 18.1 12.7 12.9

Pack Materials-Page 6
PACKAGE OUTLINE
ALW0425A SCALE 1.000
FCCSP - 0.89 mm max height
PLASTIC BALL GRID ARRAY

13.1
B A
12.9

BALL A1
CORNER

13.1
12.9
0.15 C

0.89 MAX 0.2 C C

SEATING PLANE
0.08 C
0.273
12 TYP
0.150
(0.5)
SYMM

AD
AC (0.5)
AB
AA
Y
W
V
U
T
R
P SYMM
12 TYP N
M
L
K
J
H
G
F
E
D 0.35
425X
C 0.25
B 0.15 C A B
A
1 3 5 7 9 11 13 15 17 19 21 23 25
0.08 C
2 4 6 8 10 12 14 16 18 20 22 24
0.5 TYP

0.5 TYP

4227026/C 04/2025

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

[Link]
EXAMPLE BOARD LAYOUT
ALW0425A FCCSP - 0.89 mm max height
PLASTIC BALL GRID ARRAY

(0.5) TYP
425X ( 0.25)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

(0.5) TYP A
B
C
D
E
F
G
H
J
K
L
M
SYMM
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 8X

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND METAL UNDER
EXPOSED METAL SOLDER MASK

( 0.25) ( 0.25)
SOLDER MASK EXPOSED METAL
METAL EDGE SOLDER MASK
OPENING
OPENING
NON-SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE

4227026/C 04/2025
NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SPRAA99 ([Link]/lit/spraa99).

[Link]
EXAMPLE STENCIL DESIGN
ALW0425A FCCSP - 0.89 mm max height
PLASTIC BALL GRID ARRAY

(0.5) TYP
425X ( 0.25)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

(0.5) TYP A
B
C
D
E
F
G
H
J
K
L
M
SYMM
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 8X

4227026/C 04/2025

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

[Link]
PACKAGE OUTLINE
AMC0441A SCALE 0.900
FCBGA - 2.57 mm max height
BALL GRID ARRAY

17.3 A
B
17.1

BALL A1 CORNER

PIN 1 ID
(OPTIONAL) 17.3
17.1
( 12.8)
0.1 C

( 11)
( 16.8)

2.57 0.2 C (1.45)

2.29
C

SEATING PLANE
(0.577)
0.15 C
0.5
TYP
0.3
16 TYP
(0.6) TYP
0.8 TYP SYMM
(0.6) TYP

AA
Y
W
V
U
T
R
P
N
SYMM M
L 16
K
J TYP
H
G
F
E
D
0.55 C
441X
0.45 B
0.25 C A B A
1 2 3 4 5 6 7 8 9 10 12 14 16 18 20
0.1 C 11 13 15 17 19 21
0.8 TYP

4228316/A 12/2021
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.

[Link]
EXAMPLE BOARD LAYOUT
AMC0441A FCBGA - 2.57 mm max height
BALL GRID ARRAY

441X ( 0.4) (0.8) TYP

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

(0.8) TYP A
B
C
D
E
F
G
H
J
K
SYMM
L
M
N
P
R
T
U
V
W
Y
AA
SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SNOWN
SCALE:6X

0.07 MAX
( 0.4) 0.07 MIN METAL UNDER
METAL SOLDER MASK
EXPOSED METAL

SOLDER MASK ( 0.4)

EXPOSED METAL SOLDER MASK
OPENING
OPENING
NON-SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE
4228316/A 12/2021

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 ([Link]/lit/spru811).

[Link]
EXAMPLE STENCIL DESIGN
AMC0441A FCBGA - 2.57 mm max height
BALL GRID ARRAY

441X 0.4 (0.8) TYP

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

(0.8) TYP A
B
C
D
E
F
G
H
J
K SYMM
L
M
N
P
R
T
U
V
W
Y
AA

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.15 mm THICK STENCIL
SCALE: 6X

4228316/A 12/2021

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

[Link]
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you fully
indemnify TI and its representatives against any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale, TI’s General Quality Guidelines, or other applicable terms available either on
[Link] or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products. Unless TI explicitly designates a product as custom or customer-specified, TI products
are standard, catalog, general purpose devices.
TI objects to and rejects any additional or different terms you may propose.
IMPORTANT NOTICE

Last updated 10/2025

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