RESEARCH ARTICLE
SAMRIDDHI Volume 14, Special Issue 2, 2022 Print ISSN : 2229-7111 Online ISSN : 2454-5767
External Portable Cooling System for Mobile Phones
S.V. Chaitanya1*, D.P. Gaikwad2, Hyder Ali3, Sudhanshu Gurav4, Harsh Thakur5, Advait Hatkhambkar6,
Rushikesh Horne7
1*
AISSMS College of Engineering, Pune, India; e-mail : svchaitanya@[Link]
2-7
Department of Civil Engineering, AISSMS College of Engineering, Pune, India.
A BS TR ACT
Basically, a cooler word depicts the meaning of cool or relief from heat. Same as above a phone cooler cool
down the phone or gives relief from heat which is radiated due to continuous use of phone. The working
principle of the cooler is so easy to understand. Now- a-days power dissipation levels in mobile phones are
continue to increase due to gaming, higher power apps and increased functionality associated with internet.
With this power dissipation level, products such as mobile phones will require active cooling to ensure that
the comfort and reliability perspectives. The current cooling methodologies of natural convection and radiation
limit the power dissipation within a mobile phone to between 1-2 w depending on size.
In this paper, the external portable mobile phone cooling system has proposed. This system does not need
any changes in designing of mobile phone. It can be used for any types of mobile phone. The proposed
cooling system is portable and reliable in cooling phones. The result of this project shows up to phone heating
can be controlled in any condition without any external higher power [Link] has very less limitations. If
the model is connected to phone to provide input power to it the fan and cool it, it will result in drainage of
battery of phone. It will not so comfortable to use it for long time less than two hours.
Keywords- Phone Cooling, Battery, Motherboard, Fan, Thermal Pad, DC motor.
SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology, (2022); DOI : 10.18090/samriddhi.v14spli02.6
INTR ODUCT ION Corresponding Author : S.V. Chaitanya, AISSMS College of
N ow-a-days, mobile devices are widely being used
for making calls, net browsing, gaming and social
Engineering, Pune,India; e-mail : svchaitanya@[Link]
How to cite this article : Chaitanya, S.V., Gaikwad, D.P.,
Ali, H., Gurav, S., Thakur, H., Hatkhambkar, A., Horne,
communication. For advance application and R. (2022). External Portable Cooling System for Mobile
functions mobile require a processor. It consists of
Phones.
different chips for other assistive application and all
of them dissipate power. The thermal management SAMRIDDHI : A Journal of Physical Sciences, Engineering
of phone become essential task. There are many and Technology, Volume 14, Special Issue (2), 235-238.
solutions for thermal management of phone, but Source of support : Nil
some solution creates issues that can affect nature and Conflict of interest : None
type of solution. Many researchers have discussed
thermal challenges of handheld phone devices. most important challenges in phone device. Mechanical
Thermal modelling and thermal control techniques stack up is thermal engineering in designing. Z-stack
are available in market for management of power. The up is consists of good thickness and have mechanical
solution for thermal management, some hardware rigidity. Temperature limit is thermal solution provided
and software power optimization found in [2]. To in phone. The study on thermal limiting factors should
increase reliability, temperature prediction and do carefully. Certain limitations should be kept on the
integration of design centric analysis is required [3]. junction temperature. This temperature depends on
Mechanical stack up and Temperature Limits are the
The Author(s). 2022 Open Access This article is distributed under the term of the Creative Commons Attribution 4.0 International License ([Link]
licenses/by/4.0/), which permits unrestricted use, distribution, and non-commercial reproduction in any medium, provided you give appropriate credit to the original
author(s) and the source, provide a link to the Creative Commons license, and indicate if change were made. The Creative Commons Public Domain Dedication waiver
([Link] applies to the data made available in this article, unless otherwise stated.
SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology, Volume 14, Special Issue 2 (2022) 235
235
External Portable Cooling System for Mobile Phones
package and design of mobile. Due to thickness, air cooling system which is useful for any kind of
moving devices cannotinstallwithin phone. Conductivity phone. Rest of paper is organized as below. Section
of casing is very important for transferring heat. The heat 2 describes methodology of the proposed cooling
of chips travels through stack up and then reaches to system for mobile. In section 3, detail explanation
outer casing. The thermal power management is of proposed cooling system has given. In section
important in both large scale application and phone 4, papers have concluded with future scope.
with less effort [4]. For achieving satisfactory thermal M E T H OD O LO GY OF P R OP OS ED M OB IL E
management, different cooling methods can be used
and are depends on the level of heat to be dissipated, P HO NE C O OLIN G S YS TEM
operating environment and use of phone [5]. Various Methodology
solutions on thermal power management have given The methodology of proposed mobile phone Cooling
in literature. The cooling system for mobile phone has system is given as below. All cooler models will be
studied in [6]. In [7], it is suggested that thermal coolers using active fan cooling. The fan will direct air at the
are controllable and compact which extract heat by back of the phone. The air will dissipate the heat. An
flowing cooling current. external powerbank will be used as the power source.
A centrifugal fan has implemented into Nokia phone • In addition to the fan, heatsinks and thermal pads
and its performance is measured in terms of surface have been added to the other two models to
temperature, aerodynamic characteristics and allowable increase their effectiveness.
phone heat dissipation [8]. The greedy techniques have
• Thermal pads will help to increase the thermal
used in cooling system which lead to fast elevation of
conductivity between the phone’s surface and the
temperature on other system components. This proposal
heatsink. Their flexibility and softness will
causes considerably suboptimal performance over
eliminate any gaps between the contacts hence
increased durations of phone activity [9]. Different
increasing the surface area in contact.
passive thermal management schemes are conversed
for a high power component in a handheld electronic • The fins of the heatsinks will help distribute heat
device [10]. Detail an analysis of fan exit angle given in over a larger surface area so that more heat can
this research work. In mobile phone, power dissipation be dissipated by air.
level increase when phone are used for game playing Materials and Thermal Analysis of the Proposed
and heavy social media uses. Therefore, mobile phone Cooling System
requires portable, comfortable, reliable and easy Following raw material and resources have used for
installing cooling system. implementation of the proposed cooling system. The
In this paper, the portable cooling systems have fan model is very cheap and efficiently too good as
proposed. The following are objectives of this research compared to other models. This model is made up of;
work. Fan (which runs on a DC motor)
This project idea was a truly a best solution for the Case, to hold a phone in comfortable position
problem faced by every youngster. By discussing Micro usb port, which connects the fan and phone
about the project, we studied about the various or any external input power source.
thermal processes. Thermal analysis of the proposed cooling system
The main objective to build such a wonderful is given as:
project was just to overcome the problems with The phone cooler is a cooling device which uses
heating of phone. the process of conduction and convection to cool the
The overheating of phone may cause battery heat dissipated by the phone. The model can be
damage, it can damage the internal parts on classified into three different types:
motherboard which are soldered, and it may also
Fan model
to a blast which can harm severely.
Fan with heat sink and thermal pad
Our model can cool the phone at a suitable Blower style fan with heat sink and thermal pad
temperature; it is too cheap and easy to carry.
P R OPOS ED M O BI LE C OO LI NG S YS TEM
The proposed cooling systems do not require any
Using a fan for cooling is a simple method. Adding a
modification of design of mobile. It is external
thermally conductive material and increasing the
236 SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology, Volume 14, Special Issue 2 (2022)
External Portable Cooling System for Mobile Phones
surface area of it helps heat dissipate heat much faster
and increases the efficiency of the cooling solution.
The cooling solution should not be bulky and annoying.
It should be easy to carry and use less power as input.
Three models have discussed in Figure 1 to 3. The 1st
model is basic in which fan is attached to the back of
the phone with a case and it is inputted power by an
adaptor which is connected phone. Figure 1 shows the
model 1 proposed cooling system. The 2nd on has a heat
sink on back of phone with thermal pad between the
heatsink and phone. Thermal pads are used for better
thermal conductivity. Figure 2 shows the model 2of
proposed cooling [Link] 3rd is similar as above but Figure 4: Fan on mobile phone
has a blower fan which will be attached onside of
heatsink. Figure 3 shows the model 3 of proposed Specification of Model
cooling system. In table 1, the specification of proposed mobile
phone is given.
5V DC Power bank
Table-1: Specification of cooling system
Details Specification
Length 70mm
Fan Width 70mm
Phone
Height 40mm
Weight 60g
Adjustable Clip
Fan 50mm
Figure 1: The proposed 1 model for phone cooling system
Power input port USB
Input voltage & current 5V 2A
Fan
5 V DC
Power Bank
Colour Black
Airflow
Heat Sink The manufacturing cast is given below. The fan model
Thermal Pad
will cost nearly about [Link] fan model with heat
Phone sink and thermal pad has a total cost of [Link]
blower fan with heat sink and thermal pad has an
Adjustable Clip expensive range of 1500. In Figure 5, the final product
Figure 2: The proposed 2nd model for phone cooling system of mobile phone cooling system is depicted.
5V DC
Fan
Adjustable Clip Power Bank
Heat Sink
Phone Thermal pad
Figure 3: The proposed 3st model for phone cooling system
Figure 5: Mobile Phone with the proposed cooling system
SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology, Volume 14, Special Issue 2 (2022) 237
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External Portable Cooling System for Mobile Phones
The limitations of the proposed cooling system are R EFERENCES
given below. It has very less limits.
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238 SAMRIDDHI : A Journal of Physical Sciences, Engineering and Technology, Volume 14, Special Issue 2 (2022)