This specification documents the detail requirements for space qualified product manufactured on Analog
Devices, Inc.’s QML certified line per MIL-PRF-38535 Level V except as modified herein. The manufacturing
flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to be considered a
part of this specification [Link] . This data sheet specifically details the space
grade version of this product. A more detailed operational description and a complete data sheet for
commercial product grades can be found at [Link]/SMP11.
The complete part number(s) of this specification follow:
Part Number Description
SMP11-803Y Low Droop Rate/Accurate Sample and Hold
.
Letter Descriptive designer Case Outline (Lead Finish per MIL-PRF-38535)
Y GDIP1-T14 14-Lead ceramic dual-in-line package (CERDIP)
N.C. 1 14 S/H
INPUT 2 13 VLC
NULL 3 12 N.C.
NULL 4 Top View 11 CH
V- 5 10 N.C
N.C. 6 9 V+
OUTPUT 7 8 N.C
Figure 1 - Terminal connections.
(TA = 25°C, unless otherwise noted)
Supply Voltage.............................................................................................................. ±36V
Power Dissipation ..................................................................................................... 500mW
Input Voltage................................................................................................. Supply Voltage
Logic and Logic Reference Voltage ............................................................. Supply Voltage
Output Short-Circuit Duration ................................................................................. Indefinite
Hold Capacitor Short-Circuit Duration ....................................................................... 60 sec.
Operating Temperature Range ................................................................... -55°C to +125°C
Storage Temperature Range ...................................................................... -65°C to +150°C
DICE Junction Temperature Range (TJ) ................................................................. +150°C
Lead Temperature (Soldering, 60 sec.) ................................................................... +300°C
Thermal Resistance, CERDIP (Y) Package
Junction-to-Case (4JC) = 29°C/W Max
Junction-to-Ambient (4JA) = 100 °C/W Max
P
' ' P
:
:
: P
TABLE I NOTES:
1 VS = ±15V, CH = 5000pF, VLC connected to ground, unless otherwise specified.
2 Subgroup 9 is sample tested.
TABLE II NOTES:
1/ PDA applies to Subgroup 1 only. No other subgroups are included in PDA.
2/ See table III for delta parameters. Exclude Delta’s from PDA.
5.1 HTRB is not applicable for this drawing.
5.2 Burn-in is per MIL-STD-883 Method 1015 test condition B.
5.3 Steady state life test is per MIL-STD-883 Method 1005.