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LEARNING OUTCOME # 4 PERFORM ELECTRONIC

PRODUCTS ASSEMBLY
ASSESSMENT CRITERIA:

1. Work instructions is followed based on job order or client requirements

2. Assembly procedures are performed in accordance with OH&S policies
and work instructions
3. Modules and accessories are connected/integrated into the final
product based on the client specifications.
4. Excess components and materials are disposed of based on WEEE
directives and 3Rs waste management program.

MODULE CONTENTS:

1. Assembly Procedures – AC-DC Regulated Power Supply

2. Soldering Technology
3. Proper Care and Use of Tools

CONDITIONS:

Trainees must be provided with the following:

1. WORKPLACE LOCATION
 Working area/bench
 Sufficient lighting and ventilation system
2. EQUIPMENT/TOOLS
 Soldering iron  Flashlight/headlamp
 Variable power supply  Cleaning brush
 Variable transformer  Soldering wire
 Solder  SMD soldering paste
 Pliers
 Stranded/solid/hook-up wires
 Cutters
 Hot air soldering  Assorted electronic
components
station
 Assorted PCB and wires
 De-soldering tools
 Screwdriver (assorted) E-Media:
 Multi-testers  Whiteboard
(analog/digital)  Computer/Laptop
 High-grade Projector
magnifying glass with
lamp
3. INSTRUCTIONAL MATERIALS
 Modules - Competency Based Learning Materials/E-CBLM
 Schematic diagrams
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 Sample circuits and design of PCB

 Reporting forms

METHODOLOGIES:

 Lecture/ Discussion
 Demonstration
 Viewing multimedia/Online Videos
 Hands on practice
 Project making/ laboratory exercises
 eLearning/ Blended learning program

ASSESSMENT METHODS:

 Interview/Online Interview
 Practical Demonstration w/ oral questioning
 Written exam/Online Examination
 Practical exam
 Observation in workplace
 Portfolio
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Information Sheet 1.4-1

LO4 Assembly Procedures

Learning Objectives:
After reading this INFORMATION SHEET, YOU MUST be able to:
1. Identify the proper procedures to be undertake in assembling
electronic products.
2. Perform electronic products assembly procedures.

You previously learned on the Learning Outcome 3, on how to properly

mount and solder the electronic components on the fabricated printed circuit
board, of the circuit you want to assemble. In this lesson you now will apply
all the skills you learn from the previous Learning Outcomes (LO1, LO2, LO3),
in order to perform a complete assembly procedure on a particular electronic
circuit.

Electronics Assembling Procedures

The following procedures are common tasks that should be perform when
assembling an electronic product;
1. Prepare the tools and equipment. Tools and equipment on the assembling
procedure must be on the workbench and in good condition.
Soldering iron
Variable power supply
Variable transformer
Solder/ Soldering wire
Pliers
Cutters
De-soldering tools
Screwdriver (assorted)
Multi-testers (analog/digital)
High-grade magnifying glass with lamp
Cleaning brush
Solder paste
Stranded/solid/hook-up wires
Electronic components required in the circuit

2. Identify the parts and component needed for assembly. This includes
interpreting the schematic diagram of the circuit, in order to identify the
components required.
 Prepare the Schematic Diagram
 Prepare and fill out a material checklist form, in order to ensure the
components are in good condition.
 Test the electronic components using the Multi-tester
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3. Prepare and Make the PCB Module for the circuit. This includes the
layout and design of the PCB based on the schematic diagram. Then Etching
the PCB for final fabrication. Lastly, drilling the holes on the PCB for the
through-hole assembly method.
4. Mount the electronic components. Mount the electronic components
properly on the component side of the PCB, considering the standard vertical
or horizontal mounting position.
5. Solder the electronic components. Perform safe and standard soldering
procedure, to securely solder the terminal of each component on the circuit.
6. Terminate and connect the wires needed in the circuit (inputs, outputs,
supply, grounds etc.).
7. Perform inspection on the assembled circuit. Check the solder joints,
terminal or component positions, and PCB layout traces (shorts or breaks).
8. Always observed and apply occupational and health safety procedures.
9. Perform proper waste disposal, cleaning and maintenance procedure.
After assembling your circuit always observe standard cleaning and disposal
procedures, before leaving the work area.
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JOB SHEET 1.4-1

Title: Assembling AC DC 5-Volt Regulated Linear Power Supply

Performance Objective: Given the resources needed, you should be able

to assemble an electronic product (AC-DC 5-
Volt Regulated Linear Power Supply).
Supplies/Materials: Variable transformer
Solder/ Soldering wire
Pliers
Cutters
De-soldering tools
Screwdriver (assorted)
Cleaning brush
Solder paste
Stranded/solid/hook-up wires
1 pcs. 2”x2” Copper Clad Board (PCB)
Masking Tape
Pen/Pencil
Cutter Blade
Plastic Basin
Ferric Chloride
Electronic components required in the circuit
-4 pcs. 1N4001 rectifier diode
-1 pcs. 1000uf/25Volts Electrolytic capacitor
-1 pcs. 1 Ohms / 1 Watts Resistor
-1 pcs. 0.1uf (104) Ceramic capacitor
-1 pcs. 7805 Fixed IC Regulator
Equipment: Soldering iron/Temperature Controlled
Soldering Station
Multi-testers (analog/digital)
Magnifying Glass with Lamp
Well Lighted Workbench/Work area
Steps/Procedures:
1. Prepare the tools and equipment.
2. Identify the parts and component needed for assembly.
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Schematic Diagram
Indicated above is the schematic diagram of 5Volt regulated
power supply that you will assemble in this job sheet. The
transformer is already excluded in the schematic. You will
connect the transformer as an external AC source for the
circuit once you finished assembling.
Accomplish the Materials Checklist Form attached below, before
fabricating the PCB design.
3. Prepare and Make the PCB Module for the circuit.

PCB Design (BOTTOM)

Component Placement (TOP)

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4. Mount the electronic components.

5. Solder the electronic components.

6. Terminate and connect the wires needed in the circuit (inputs, outputs,
supply, grounds etc.).
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7. Perform inspection on the assembled circuit.

8. Observed and apply occupational and health safety procedures.
9. Perform proper waste disposal, cleaning and maintenance procedure.

Assessment Method:
Performance Evaluation using the Performance Criteria Checklist.

MATERIALS CHECKLIST FORM

CONSUMABLE MATERIALS/SUPPLIES (Per Trainee unless specified)

5V REGULATED LINEAR POWER SUPPLY PARTS LIST

Actual Range
PARTS DESCRIPTION DESIGNATOR QTY. Remarks
Reading Use

1 7805 IC Voltage
U1 1
regulator
2 1000μf / Capacitor
C1 1
25V
3 0.1μf / Capacitor
C2 1
50V
4 1N4007 Diode D1,D2,D3,D4 4
5 1Ω / 1W Resistor R1 1
6 3.5-12 Transformer T1 1
Volt /
750mA
7 AC Cord 1
8 Stranded Red/Black 1
Wire #22 meter
9 Copper 2” X 3”
Clad 1
(PCB)
10 Ferric
1
Chloride
11 Plastic
1
Basin
12 Alligator Red/Black
4
Clip
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Performance Criteria Checklist 1.4-1

CRITERIA
YES NO
Did you….
A. Prepare the tools and equipment required for the circuit
assembly?
B. Identify the parts and component needed for assembly.
1. Identify components in the schematic diagram
including its identifiers/designator?
2. Find the actual components needed for the circuit and
prepare the multi-tester for testing procedure?
3. List down the components details on the material
checklist form and add the materials that will be needed
in order to test the circuit?
4. Test all of the electronic components and also the
materials listed on your Material Checklist Form with the
Multi-tester properly, following different test methods and
standard for each components?
5. Then write down the actual reading, range used in the
multi-tester and remarks/condition of each components?
C. Prepare and Make the PCB Module for the circuit.
1. Prepare the necessary tools and materials needed in
PCB etching?
2. Wear apron and surgical gloves?
3. Pour the ferric chloride in the plastic tray/basin?
4. Etch the PCB by immersing it in a basin filled with
ferric chloride until the uncovered part of the copper
clad is totally etched?
5. Check the PCB if all the parts needed to be removed
are totally etched?
6. Haul the PCB from the plastic basin using the
appropriate tool and wash it from flowing water?
7. Wipe the wet PCB, with a clean and dry piece of
cloth/paper?
8. Peel the masking tape on the PCB and scrub the PCB
copper to remove dirt and give it its shiny finish?
9. Inspect the PCB for possible hairline break or short?
10. Check and rebuild the markings on PCB drilling
holes?

11. Prepared all materials needed for boring?

12. Loosen the chuck using the long metal tool and change
the drill bit?
13. Inserted the drill bit and attach it to the chuck of the
unit?
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14. Turn the long metal tool clockwise to close the jaw of
the unit. Ensuring that the drill bit is well tightened
and secured to the chuck?
15. Turned off the unit before inserting the 12-volts
adaptor?
16. Test the rotation of the unit if it is well aligned?
17. Marked a sign where the hole should be drilled.
18. Bored the hole perpendicularly to the surface of the
PCB while using the mini drill?
19. Cleaned the surface of the PCB and look for open line
or short circuit?
20. Applied varnish on the clad surface to prevent it from
corrosion?
D. Mount and Solder the electronic components.
1. Prepare the fabricated PCB and ensure the joint
surfaces are clean and free from grease?
2. Mount the electronic components following proper
mounting procedures and standards?
3. Heat the joint and ensure the temperature of the solder
when making the joint is correct ?
4. Apply solder to joint and ensure the heat is applied to
the joint for the correct amount of time?
5. Remove the solder and then soldering iron and let the
solder joint cool down naturally.
6. Ensure the correct amount of solder is used?
7. Cut/snip the excess components lead terminal?
8. Inspect the joints closely for any defects/trouble?
9. Wipe the tip of the iron on a damp sponge to clean it
and put it back to the soldering stand after each use?
10. Unplug the soldering iron when it is not in use?
11. Apply safety precautions throughout soldering
process?
E. Terminate and connect the wires needed in the circuit
(inputs, outputs, supply, grounds etc.)?
F. Perform inspection on the assembled circuit (solder joints,
cold solder, PCB traces)?
G. Observed and apply occupational and health safety
procedures?
H. Perform proper waste disposal, cleaning and maintenance
procedure?
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Comments/Suggestions:

Trainee’s Signature______________________ Date ______________

Trainer’s Signature______________________ Date ______________

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Information Sheet 1.4-2

LO4 Soldering Technologies – Reflow Soldering

Learning Objectives:
After reading this INFORMATION SHEET, YOU MUST be able to:
1. List the key aspect on an effective reflow soldering process.
2. Identify the machine options that are available for reflow soldering.
3. Identify the Reflow Profile stages.
4. Enumerate the aspects that can affect how the reflow oven is
programmed.

You previously learned on the Assembling Procedures, on how practice and

apply your skills on preparation, making PCB modules, Mounting and
Soldering Electronic components on the circuit you want to assemble. In this
lesson you now will learn the other existing soldering technologies which is
presently used in manufacturing electronic products.

REFLOW SOLDERING PROCESS

Reflow soldering is the most widely used method of attaching surface mount
components to printed circuit boards (PCBs). The aim of the process is to
form acceptable solder joints by first pre-heating the components/PCB/solder
paste and then melting the solder without causing damage by overheating.
The key aspects that lead to an effective reflow soldering process are as
follows:
1. Suitable machine
2. Acceptable reflow profile
3. PCB/component footprint Design
4. Carefully printed PCB using well designed stencil
5. Repeatable placement of surface mount components
6. Good quality PCB, components and solder paste

Watch the following YouTube Links for the actual Reflow soldering process:
[Link]
[Link]

Suitable Machine
There are various types of reflow soldering machine available depending on
the required line speed and design/material of the PCB assemblies to be
processed. The selected oven needs to be of a suitable size to handle the
production rate of the pick and place equipment.
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The line speed can be calculated as shown below:

Line speed (minimum) = Boards per minute x Length per board

Load Factor (space between boards)
It is important to consider the repeatability of the process and so the ‘Load
Factor’ is usually specified by the machine manufacturer, calculation shown
below:

To be able to select the correct size reflow oven the process speed (defined
below) must be greater than the minimum calculated line speed.

Process speed = Oven chamber heated length

Process dwell time
Below is an example of calculation to establish the correct oven size:

An SMT assembler wants to produce 8-inch boards at a rate of 180 per hour.
The solder paste manufacturer recommends a 4 minute, three step profile.
How long an oven do I need to process boards at this throughput?

Boards per minute = 3 (180/hour)

Length per board = 8 inches
Load Factor = 0.8 (2-inch space between boards)
Process Dwell Time = 4 minutes

Calculate Line Speed: (3 boards/min) x (8 inches/board)

0.8

Line speed = 30 inches/minute

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Therefore, the reflow oven must have a process speed of at least 30 inches per
minute.

Determine oven chamber heated length with process speed equation:

30 in/min = Oven chamber heated length

4 minutes

Oven heated length = 120 inches (10 feet)

Note that the overall length of the oven will exceed 10 feet including the cooling
section and conveyor loading sections. The calculation is for HEATED
LENGTH – NOT OVERALL OVEN LENGTH.

Machine Options
The design of the PCB assembly will influence the machine selection and what
options are added to the specification. Machine options that are usually
available are as follows:
1. Conveyor type – It is possible to select a machine with mesh conveyor but
generally edge conveyors are specified to enable the oven to work in-line and
be able to process double sided assemblies. In addition to the edge conveyor
a center-board-support is usually included to stop the PCB from sagging
during the reflow process – see below. When processing double sided
assemblies using the edge conveyor system care must be taken to not disturb
components on the underside.

2. Closed loop control for speed of convection fans - There are certain
surface mount packages such as the SOD323 (see insert) which have a small
contact area to mass ratio which are susceptible to be disturbed during the
reflow process. Closed loop speed control of the convention fans is a
recommended option for assemblies using such parts.
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3. Automatic control of conveyor and center-board-support widths –

Some machines have manual width adjustment but if there are many different
assemblies to be processed with varying PCB widths then this option is
recommended to maintain a consistent process.

Acceptable Reflow Profile

In order to create an acceptable, reflow profile each assembly needs to be
considered separately as there are many different aspects that can affect how
the reflow oven is programmed. Factors such as:
1. Type of solder paste
2. PCB material
3. PCB thickness
4. Number of layers
5. Amount of copper within the PCB
6. Number of surface mount components
7. Type of surface mount components
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In order to create a reflow profile thermocouples are connected to a sample

assembly (usually with high temperature solder) in a number of locations to
measure the range of temperatures across the PCB. It is recommended to
have at least one thermocouple located on a pad towards the edge of the PCB
and one thermocouple located on a pad towards the middle of the PCB. Ideally
more thermocouples should be used to measure the full range of temperatures
across the PCB – known as ‘Delta T’.

Reflow Soldering Profile Stages

Within a typical reflow soldering profile there are usually four stages –
Preheat, soak, reflow and cooling. The main aim being to transfer enough
heat into the assembly to melt the solder and form the solder joints without
causing any damage to components or PCB.
Preheat – During this phase the components, PCB and solder are all heated
to a specified soak or dwell temperature being careful not to heat too quickly
(usually no more than 2ºC/second - check solder paste datasheet). Heating
too quickly can cause defects such as components to crack and the solder
paste to splatter causing solder balls during reflow.

Figure 2 Crack in capacitor Figure 1 Solder balls around resistor

Soak – The purpose of this phase is to ensure all components are up to the
required temperature before entering the reflow stage. Soak usually lasts for
between 60 and 120 seconds
depending on the 'mass
differential' of the assembly
and types of components
present. The more efficient the
heat transfer during the soak
phase the less time is needed.
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Care needs to be taken not to have an excessive soak temperature or time as

this may result in the flux becoming exhausted. Signs that the flux has
become exhausted are 'Graping' and 'Head-in-pillow'.

Figure 4 Head-in-Pillow effect Figure 3 Solder 'Graping'

Reflow – This is the stage where the temperature within the reflow oven is
increased above the melting point of the solder paste causing it to form a
liquid. The time the solder is held above its melting point (time above liquidus)
is important to ensure correct ‘wetting’ occurs between components and PCB.
The time is usually 30 to 60 seconds and shouldn’t be exceeded to avoid the
formation of brittle solder joints. It is important to control the peak
temperature during the reflow phase as some components can fail if exposed
to excessive heat.
While it is important not to apply too much heat during reflow it is equally
important for the reflow profile to be hot enough. If the reflow profile has
insufficient heat applied during the reflow stage, there will be solder joints
seen similar to the images below:

Figure 5 Solder not formed fillet with lead

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Figure 6 Not all solder balls melted

A common soldering defect after reflow is the formation of mid-chip solder

balls/beads as can be seen below. The solution to this defect is to modify the
stencil design - more details can be seen here.

The use of nitrogen during the reflow process should be considered due to the
trend of moving away from solder paste that contains strong fluxes. The issue
is really not the ability to reflow in nitrogen, but rather the ability to reflow in
the absence of oxygen. Heating solder in the presence of oxygen will create
oxides, which are generally non-solderable surfaces.

Cooling – This is simply the stage during which the assembly is cooled but it
is important to not cool the assembly too rapidly - usually the recommended
rate of cooling should not exceed 3ºC/second.
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PCB/Component Footprint Design

There are a number of aspects of PCB design that have an influence on how
well an assembly will reflow. An example being the size of tracks connecting
to a component footprint – if the track connecting to one side of a component
footprint is larger than the other this can lead to a thermal imbalance causing
the part to ‘tombstone’ as can be seen below:

Watch the YouTube video about “Reflow Soldering Defect”:

[Link]
Another example is ‘copper balancing’ – many PCB designs use large copper
areas and if the PCB is put into a panel to aid the manufacturing process it
can lead to an imbalance in copper. This can cause the panel to warp during
reflow and so the recommended solution is to add ‘copper balancing’ to the
waste areas of the panel as can be seen below:
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Carefully printed PCB using well designed stencil

The earlier process steps within surface mount assembly are critical to an
effective reflow soldering process. The solder paste printing process is key to
ensure a consistent deposit of solder paste onto the PCB. Any fault at this
stage will lead to undesired results and so complete control of this process
along with effective stencil design is needed.

Repeatable placement of surface mount components

Figure 7 Component placement variation

The placement of surface mount components must be repeatable and so a

reliable, well maintained pick and place machine is necessary. If component
packages are not taught in the correct way, it can cause the machines vision
system to not see each part in the same way and so variation in placement
will be observed. This will lead to inconsistent results after reflow soldering
process.
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Component placement programs can be created using the pick and place
machines but this process isn't as accurate as taking the centroid information
directly from the PCB Gerber data. Quite often this centroid data is exported
from the PCB design software but sometime is not available and so the service
to generate the centroid file from Gerber data is offered by Surface Mount
Process.

All components placement machines will have a ‘Placement Accuracy’

specified such as:
35um (QFPs) to 60um (chips) @ 3 sigma

It is also important for the correct nozzle to be selected for the component type
to be placed – a range of different component placement nozzles can be seen
below:

Good quality PCB, components and solder paste

The quality of all items used during the process must be high because
anything of a poor quality will lead to undesirable results. Depending on the
manufacturing process of the PCB’s and the way in which they have been
stored the finish of the PCB’s can lead to poor solderability during the reflow
soldering process. Below is an example of what can be seen when the surface
finish on a PCB is poor leading to a defect known as ‘Black Pad’:

Figure 8 GOOD QUALITY PCB FINISH

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Figure 10 Solder flowing to component and not PCB

Figure 9 TARNISHED PCB

In a similar way the quality of the surface mount component leads can be
poor depending on the manufacturing process and method of storage.

The quality of the solder

paste is greatly affected
by the storage and
handling. Poor quality
solder paste if used is
likely to give results as
can be seen below:
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Conclusion
The ideal reflow solder profile for each assembly does exist. The reflow
soldering process can be time consuming to setup but is essential to ensure
all components are fully soldered without being damaged. It is even more
important when profiling a lead-free assembly due to the acceptable
temperature range being reduced to that of a tin-lead assembly. Using a
carefully designed profile will result in a repeatable process which will
consistently deliver the required results - It is worth the extra time and effort.

An Increase in Efficiency and Productivity

It’s a shocking statistic to read that within the electronics industry many
surface mount operations, particularly within the sub-contract
manufacturing sector, run as low as 20% efficient.
There are many reasons that contribute to this figure but it fundamentally
means that only 20% of the capital investment is being utilized. Financially
speaking, this will lead to a higher cost of ownership and a slower return on
investment. For the customer, it can cause longer lead times for their product
and therefore the business will not be as competitive in the market place.
With production efficiencies at this level there will be many knock-on effects
that will have an impact on the business such as larger batch sizes, more
parts in stock, more assemblies in WIP (work in progress) and slower reaction
times to customer change requirements.
With all this in mind there is a strong incentive to improve efficiency while
maintaining quality.

Watch videos on the following YouTube links for further understanding on

Reflow soldering technology;
Reflow Soldering [Link]
SMD reflow at home (HD) [Link]
Reflow Soldering - Surface Mount Process [Link]
How to do SMD Reflow Soldering properly! || Hot Air VS Sand VS Reflow
Oven [Link]
Homemade SMD Pick and Place Machine - complete cycle
[Link]
PCB SMD Reflow Soldering Tutorial [Link]
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SELF-CHECK 1.4-2
LO4 Soldering Technologies – Reflow Soldering

I. Identification. Identify the following descriptions below.

_________1. During this phase the components, PCB and solder are all heated
to a specified soak or dwell temperature being careful not to heat too quickly
(usually no more than 2ºC/second - check solder paste datasheet).
_________2. This is simply the stage during which the assembly is cooled but
it is important to not cool the assembly too rapidly - usually the recommended
rate of cooling should not exceed 3ºC/second.
_________3. The purpose of this phase is to ensure all components are up to
the required temperature before entering the reflow stage.
_________4. This is the stage where the temperature within the reflow oven is
increased above the melting point of the solder paste causing it to form a
liquid.
_________5. It is possible to select a machine with mesh conveyor but generally
edge conveyors are specified to enable the oven to work in-line and be able to
process double sided assemblies.

II. Enumeration. List down the following. (in any order)

1 – 7.) Different aspects that can affect how the reflow oven is programmed.

8 – 13.) Key aspect on an effective reflow soldering process.

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Information Sheet 1.4-3

LO4 Soldering Technologies – Wave Soldering

Learning Objectives:
After reading this INFORMATION SHEET, YOU MUST be able to:
1. Identify wave soldering, technicalities and applications.
2. Enumerate the stages to be considered in wave soldering process.
3. Compare Wave soldering with Reflow soldering.
4. Identify wave soldering defects and problems.

Do you want to solder electronic components on your printed circuit board

quickly? Do you find it time-consuming to solder them using the soldering
irons manually? It is also unsafe to inhale smoke for a long time. So, who
would not want to look for an alternate way of soldering? You just got lucky
as there is another standard way of soldering and is super quick. Can you
guess what we are talking about? It is a wave soldering!
This process of soldering will allow you to make several printed circuit boards
in a short time. So, this topic is all about wave soldering.

Wave Soldering

What is Wave Soldering?

Back to the days when surface mount technology was not entirely developed,
“wave soldering” was a very famous soldering technique. Nearly every PCB
used wave soldering for the placement of electronic components. Wave
soldering is a mass soldering procedure that will permit you to make many
PCBs in a short time.

You will need to pass every PCB over a pan of liquefied solder. There, a
pump will create a surge of solder that will resemble a standing "wave." This
standing wave showers over the printed circuit board and the electronic
components will get soldered to the PCB. So, the contact between the solder
and the wave does the magic.

After that, the printed circuit board gets blowing air or water spray for safe
cooling. This cooling process will secure the components in their place.
Furthermore, wave soldering is usually done in a shielding gas environment
as nitrogen usage is helpful in mitigating solder defects. Figure below shows
electronic components placed on PCB and all ready to go under the soldering
machine.
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Technical Details about Wave Soldering

Technically, this soldering process utilizes a whole container of tin for
performing welding. Tin goes through high temperatures, which melt its bar
and molten tin is formed. The liquefied tin is taken as "lake water." It is called
"leveling wave” when the lake is static and horizontal. And, it is called
“spoiler wave” when there are waves in the lake.
The printed circuit board can be considered as a boat. It will float over the
rough or calm lake, permitting the tin to attach electronic parts to the board.
Then after the tin bath, you will see that it will cool rapidly and the solder will
do its job. And, what is that? Of course, it will solder the electronic
components to the PCB.
Moreover, you should make sure that temperatures are adequate during this
process. If temperature control is not enough, the circuit board can experience
mechanical stress. That, in turn, will lead to conductivity loss and cracks.
And, a low soldering temperature can cause improper solder thickness that
can further lead to board stress.

When to use Wave Soldering?

Luckily, wave soldering can be used for both surface mount and through-hole
printed circuit board assemblies. In surface mount, you will need to glue
electronic components onto the PCB surface using placement equipment.
After that, it will be ready to pass via the liquefied solder wave.
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In general, wave soldering is mostly used for welding of through-hole

electronic parts. Hence, in many large-scale applications, where surface
mount components are mostly used, you can use reflow soldering instead of
wave soldering. Now you must be wondering what reflow soldering is? Don't
worry; we will get to it shortly.
However, you can always use wave soldering for the applications which
broadly makes use of through-hole components. We hope that by now you
know the basic concept of wave soldering. In the next chapter, we have
described the wave soldering process in detail.

Wave Soldering Process

Wave Soldering Machine

In the market, you will encounter many kinds of wave soldering
machines. You can buy lead wave solder machines or lead-free wave solder
machines. It is all up to you. However, the main principles and fundamental
parts of all of these machines are alike. A conveyor is a fundamental part that
is used during this process. It takes printed circuit boards via various zones.
Next, you will see a pan of the solder and pump that is responsible for
generating the main wave. Furthermore, you will also get a flux sprayer and
a preheating pad. Hence, these four main parts make up a soldering machine.
The solder in wave soldering machines is mostly made up of metals’ mixture.
If the machine has leaded solder, it will contain 49.5% lead, 50% tin, and
0.5% antimony. However, in the latest machines, lead-free models are
available due to health concerns. So, tin-copper-nickel and tin-silver-copper
alloys are frequently used. Figure below illustrates a wave soldering machine.
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Wave Soldering Temperature

Currently, tin alloys for soldering are regularly using Sn 60/Pb40 and Sn
63/Pb37. Therefore, it is recommended that you should make sure that the
operating temperature stays around 260° ± 5°C. Nonetheless, you should also
take into account the overall weight of the PCB and the parts.
Practically, heavy components can be heated up to 280°C. And, lightweight
components, which are heat-sensitive, can be heated at a temperature as low
as 230 °C. Further, you should also consider preheating and the conveying
speed. Figure below shows a close up of melting tin.

However, it is best if you change the conveying speed rather than tin’s
temperature, because, the temperature change will damage the solder joints'
quality by affecting the fluidity of the liquefied tin. At high welding
temperatures, copper will start to dissolve, and this will ruin the quality
control of overall soldering.

Fluxing

During the wave soldering, you should apply liquid flux on the printed
circuit board surface. You will observe that fluxing will enhance the soldering
quality of the electronic components. These components, printed circuit
boards and also the tin liquid, when stored, are exposed to the atmosphere.
This exposure can make them oxidized and thus affects the soldering quality.
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Flux mainly removes dirt and oxides on the surface of the metal. Further, it
also creates a film to stop the air from reacting with the metal surface during
high-temperature setup. Thus, solder cannot get oxidized easily. Nonetheless,
you should use the liquefied tin for soldering during the wave soldering
process.
Currently, the melting point of the SAC305 lead-free solder is around 217 °C.
And, the flux cannot be exposed to such a high temperature for long. Hence,
if you wish to use flux, you should add it before the printed circuit board goes
through the tin solution.
Normally, flux can be applied by two means. First, you can use a foaming flux
and second, you can add it by spraying. In foaming flux, the flux gets attached
to the circuit board, which passes through it. The major downside of this way
is that you may observe that flux is not uniformly applied. Thus, poor
soldering can happen in the areas where flux doesn’t exist.
In the spraying method, the flux is sprayed through the nozzle as the circuit
board passes. The drawback of this method is that the flux can be easily
passed through the board gaps. And, flux can also directly pollute the
electronic components of the circuit board’s front. Further, if the flux is not
processed and only dropped straightly on the board, you can also observe the
corrosion of the board.

Preheating

Normally, preheating before the main wave welding process begins. It

can increase the upper plate's temperature to between 65 and 121°C with
heating rate lying between 2 °C /s and 40 °C /s. You will not be able to get
the best soldering results if preheating is insufficient. It is because flux may
not be able to reach every part of the PCB. On the other hand, if you set a
very high temperature for preheating, "no-clean" flux can suffer. Now, if you
are wondering what exactly a “no-clean” flux is, we have explained it in the
next sub-section.

Cleaning

The cleaning process washes a PCB with deionized water or with

solvents to get rid of flux remains. However, there exists a kind of flux which
doesn't need cleaning. Can you guess which one? Yes, of course, the "no-
clean" fluxes, their remains after the soldering process are benign.
But, you need to be careful; there are some applications which do not want
“no-clean” fluxes. It is simply because “no-clean” fluxes can be very sensitive
to the conditions of the process. Now that you know all about the wave
soldering process. The coming chapter will relate wave soldering with other
types of soldering.
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Types of Soldering

Dip Soldering vs. Wave Soldering

In simplest terms, dip soldering is a soldering process with limited scope. Just
like wave soldering, it can be used both for surface mount and through-hole
circuit board assemblies. Further, the solder rains over the bare metallic areas
of the printed circuit board. Thus, you will observe a reliable electrical and
mechanical connection. Finally, dip soldering is the manual version of the
automatic soldering process.

Reflow Soldering vs. Wave Soldering

Reflow soldering is the most famous way of fixing surface mount components
onto the printed circuit board. You will need to create a solder paste out of
flux and solder powder. And then, you will use that paste to fix electronic
components onto the contact pads. You will further heat the whole package
under an infrared lamp or in a reflow oven. The solder will then liquefy and
make connections between the joints.

On the other side, you can also solder different joints with a hot air pencil.
Figure below shows the printed circuit board assembling moving into the
reflow oven machine.
 P a g e | 31

Now, you must be wondering which technique should be used and when?
Generally, wave soldering is more complicated than reflow soldering. In wave
soldering, the time for which the PCB stays in the solder wave and PCB
temperature require careful monitoring. The printed circuit board can be
defective if the soldering environment is not right.

However, with reflow soldering, you don’t need to fret much about
environment control. But with this being true, you must know that wave
soldering is cheaper and faster than reflow soldering. And, in many
applications, wave solder is the only useful way of soldering components onto
the board.

You will notice that reflow is mostly used for small-scale applications. Such
applications do not need reliable, cheap and fast mass production of PCBs.
Surprisingly; you can also use a combination of reflow and wave solder. You
can solder components on one side with waves soldering and can use reflow
soldering on the other side.

So, these are some alternatives to wave soldering. However, there is still
another type of soldering technique that the next chapter compares with wave
soldering.

Selective Wave Soldering

Selective Soldering Machine

What if you have sensitive parts that can get damaged in the wave solder
process or reflow oven? What do you suggest should be done to avoid the high
temperatures? Would you want to try your luck with wave soldering or reflow
soldering? Or, would you wish for any other way? Well, fortunately, that is
where the selective wave soldering comes in.

You should go for selective soldering when you fear that your electronic
components will not survive reflow or wave soldering. You will find a wide
variety of selective wave solder machines in the market. There is nitrogen
inserted standard machines, solder pot type machines and many others.
Figure below demonstrates the selective waves soldering machine.
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Selective Wave Soldering Guidelines

When you buy a selective waves soldering machine, software and guidelines
will come with them. Generally, you will need to do the following three steps
to do work:

 You need to apply the liquid flux,

 You need to assemble the PCB or preheating,
 You need to solder using a “site-specific” solder nozzle.
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Selective Soldering problems

In selective soldering, you can encounter the following problems:

1. Copper pad dissolution: High temperature can dissolve the copper pad
into the molten solder.
2. Solder balling: Solder balls can be formed due to the sticking of the solder
mask at high temperature.
3. Solder bridging: Excess solder can make an additional connection between
two pins.
4. Solder Stringing: Solder remains across the solder nozzle can cause it.

Selective Wave Soldering Machine Cost

If you want to compare selective soldering machine with wave soldering

machine cost, you will be pleased to know that selective soldering will be five
times cheaper. It will be because of less electricity requirement, less flux and
solder consumption, no cleaning, less rework, and no protective taping.

Hopefully, you can now decide about the soldering technique that you want
to use. But before you make your final decision, we have also mentioned the
defects, cost, and problems of waves soldering in the next chapter.

Wave Soldering Defects and Problems

Wave Soldering Defects and Problems

If temperature and soldering environment are not properly controlled, you will
encounter the following defects after the wave soldering process:
 Cavities
 Cracks
 Poor Conductivity
 Inadequate solder thickness

And, these are the few problems with wave soldering:

 Higher consumption of electricity, flux, solder, and nitrogen
 Need for solder rework
 Extra sensitive points masking
 Extra cleaning of soldered assemblies waves solder aperture masks or
pallets
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Wave Soldering Cost

So, now after reading the whole article, can you guess the operating costs of
a wave soldering machine? You can guess concerning selective soldering.
Well, because of the problems mentioned above and defects, wave soldering
can be five times more expensive.

Watch videos on the following YouTube links for further understanding on Wave
soldering technology;
WAVE SOLDERING 1 [Link]
How the Wave Soldering Machine Works [Link]
What is WAVE SOLDERING? [Link]
Agrowtek Wave Soldering Process for Electronics Manufacturing
[Link]
C1 Production---PCB Wave Soldering Process Video
[Link]
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Information Sheet 1.4-3

LO4 Soldering Technologies – Wave Soldering

I. TRUE OR FALSE. Write TRUE if the statement is correct, but if the

statement is wrong write FALSE instead.
_______1. Wave soldering is a mass soldering procedure that will permit you
to make many PCBs in a short time.
_______2. Wave soldering process sometimes result Inadequate solder
thickness.
_______3. Wave soldering has higher consumption of electricity, flux, solder,
and nitrogen.
_______4. Wave soldering needs extra cleaning of soldered assemblies waves
solder aperture masks or pallets
_______5. Wave soldering cannot be used for both surface mount and through-
hole printed circuit board assemblies.

II. Enumeration. List down the following. (in order)

1 – 5.) Stages to be considered in Wave Soldering process.

III. Essay. Compare Wave soldering with Reflow soldering. (10 pts.)
 P a g e | 36

Information Sheet 1.4-4

LO4 Proper Care and Use of Tools

Learning Objectives:
After reading this INFORMATION SHEET, YOU MUST be able to:
1. Evaluate the correct procedure on cleaning and maintaining electronic
tools.
2. Identify the proper inspection and repairing of tools.

You previously learned on the Soldering technology, its fundamental process

and assembly procedures being applied to this modern electronics era. In this
lesson you now will learn the proper caring of tools that was used in the
assembly process and standard waste disposal in the work area.

Tips to Clean & Maintain Electronic Tools

Electronic tools and equipment are the first requirements for any project
undertaken. A selection of these tools is quite a tricky task but maintaining
and storing them carefully so that these tools can last longer is not at all easy.
Prevention is the systematic way of the protection of tools and equipment in
order to keep them in a safe, usable condition, limit downtime and extend
productivity. Maintaining these tools does not only make work smooth but
also prevent workers from hazardous situations. Hence, it is necessary to
understand ways for tools maintenance to ensure that these tools work
properly and prevent users from electrical risks. For better understanding,
check the points mentioned below:
CLEANING OF HAND TOOLS

The most basic category of tools used in the electronic industry is hand tools.
Some hand tools that are frequently used are pliers, wrenches, screwdrivers,
utility knife, hacksaw, wire strippers, and many more.
The simplest and effective way to clean hand tools is to wipe them with a clean
piece of cloth at the end of the job. Don’t be afraid to wash them. If the hand
tools are too dirty, wash them with soapy water to wipe away the grime.
Remember to dry these tools to avoid rusting and corrosion.
To maintain wooden handles of hand tools, it is required to wipe them with a
piece of cloth dampened in linseed oil. It will be helpful in keeping the handle
clean and sturdy for a longer time.
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CLEANING POWER TOOLS

When it comes to power tools, cleaning and maintenance can be a tricky task.
Before cleaning the power tools, make sure that these are switched off and
unplugged. Wipe all the dust off with a cloth piece or a brush. Use machine
oil to lubricate the moving parts of the tools to keep them in good working
condition.
KEEP THE TOOLBOX CLEAN
Along with keeping the tools clean, it is also important to take care of your
toolbox and to clean regularly. Empty the toolbox and wipe it off with a clean
cloth. If you use leather bags, make sure to do leather conditioning.
OILING ELECTRONIC TOOLS
The tools that have a cutting surface are necessary to be lightly oiled to
prevent rust. Also, examine these tools and their surfaces to make sure they
are in good condition.
STORING TOOLS SAFELY
If you don’t store tools properly, there is no use of cleaning them. For a big
collection of tools, a metal cabinet could be a good option. After using these
tools, store them in a sorted and organized manner. This way would not only
help you to access them quickly but also keep them safe.
Electronic tools should not rub against each other when stored. Keep all the
tools in the dry area and protect them from moisture, dust, and direct
sunlight. To prevent injuries, keep the sharpen tool in a tool holder.

INSPECT AND REPAIR TOOLS

It is recommended to keep checking your tools at regular intervals. If there is
any damage, repair them or replace them.
1. CRACKED OR LOOSE HANDLES: Damaged wooden handle is prone to
break while in use causing injuries. Hence, it is required to replace them.
However, if the handle is not partially damaged, sand it down. Sand till it gets
smooth enough for further use. Finish the process by coating it with linseed
oil.
2. MUSHROOMED HEADS ON WEDGES AND CHISELS: Mushroom head
implies that the striking edge has become malformed through use. In this
situation, the head of the tool can shatter on impact. To solve this problem,
keep it sharpened. Do it in every six months for better results.

For proper waste disposal and Managing waste from electrical and electronic
equipment (WEEE) please review the module Learning Outcome 1: “Prepare to
assemble electronic products”.
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SELF-CHECK 1.4-4
LO4 Proper Care and Use of Tools

I. TRUE OR FALSE. Write TRUE if the statement is correct, but if the

statement is wrong write FALSE instead.
_______1. The simplest and effective way to clean hand tools is to wipe them
with a clean piece of cloth at the end of the job.
_______2. Electronic tools should not rub against each other when stored.
Keep all the tools in the dry area and protect them from moisture, dust, and
direct sunlight.
_______3. The tools that have a cutting surface are necessary to be lightly oiled
to prevent rust. Also, examine these tools and their surfaces to make sure
they are in good condition.
_______4. When it comes to power tools, cleaning and maintenance can be a
tricky task. Before cleaning the power tools, make sure that these are plugged
in the outlet.
_______5. Along with keeping the tools clean, it is also important to take care
of your toolbox and to clean sometimes. Empty the toolbox and wipe it off with
a clean cloth.
_______6. Damaged wooden handle is prone to break while in use causing
injuries. Hence, it is required to replace them.
_______7. Mushroom head implies that the striking edge has become
malformed through use. In this situation, the head of the tool can shatter on
impact. To solve this problem, keep it sharpened. Do it in every once a year
for better results.
_______8. For a big collection of tools, a metal cabinet could be a good option.
After using these tools, store them in a sorted and organized manner. This
way would not only help you to access them quickly but also keep them safe.