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Group6 Exp3 Code

The document outlines an experiment for simulating a two-dimensional NMOS transistor using Silvaco Athena and Atlas, focusing on the CMOS fabrication process. It details the steps for modeling, electrical simulations, and the impact of various process parameters on transistor characteristics. The provided code includes specific commands for defining mesh, oxidation, ion implantation, and electrical simulations to generate ID-VGS and ID-VDS characteristics.
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0% found this document useful (0 votes)
10 views6 pages

Group6 Exp3 Code

The document outlines an experiment for simulating a two-dimensional NMOS transistor using Silvaco Athena and Atlas, focusing on the CMOS fabrication process. It details the steps for modeling, electrical simulations, and the impact of various process parameters on transistor characteristics. The provided code includes specific commands for defining mesh, oxidation, ion implantation, and electrical simulations to generate ID-VGS and ID-VDS characteristics.
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

VLSI TECHNOLOGY & PROCESS MODELLING

LABORATORY (EC69214)
Dept. of Electronics and Electrical Communications Engineering
Indian Institute of Technology Kharagpur
29-01-2026

Experiment – 3 (Code)

Simulation of MOSFET using Silvaco Athena

Submitted by:
Group 06
Kalepu Keerthi Vallika Devi (22EC37007)
Shreya Shill (22EC37017)
Katrela Dedeepya (22EC37027)

1
Objective
The objective of this experiment is to design and simulate a two-dimensional NMOS
transistor using Silvaco Athena and Silvaco Atlas, illustrating the step-by-step CMOS
fabrication process. The experiment also aims to:

• To model the physical fabrication steps of an NMOS transistor such as oxidation,


ion implantation, diffusion, deposition, and etching using Silvaco Athena.

• To generate the two-dimensional device structure and define appropriate electrical


contacts.

• To perform electrical simulation using Silvaco Atlas to obtain:

– Drain current versus gate voltage (ID –VGS ) characteristics.


– Drain current versus drain voltage (ID –VDS ) characteristics.

• To study the effect of process parameters such as doping concentration, oxidation


conditions, temperature, and side-spacer thickness on the threshold voltage and
overall transistor characteristics.

2
Code
The changes made for different parts are mentioned through comments in the code.
go athena

# Defining mesh along x


line x loc =0.0 spac =0.1
line x loc =0.2 spac =0.01
line x loc =0.4 spac =0.01
line x loc =0.6 spac =0.01

# Defining mesh along y


line y loc =0.0 spac =0.01
line y loc =0.2 spac =0.01
line y loc =0.5 spac =0.05
line y loc =0.8 spac =0.15

# Defining initial substrate


init silicon orientation =100 c . phos =1 e14

# Oxidation
diffuse time =30 temp =1000 dryo2 press =1.00 hcl =3

# Etching Oxide
etch oxide thick =0.02

# Ion Implantation through Oxide to form p - well


implant boron dose =8 e12 energy =100 pearson

# Drive - in
diffuse temp =950 time =100 weto2 hcl =3
diffuse time =220 temp =1200 nitro press =1

# Etching remaining Oxide


etch oxide all

# Gate oxide growth // change this for part 2 as Vth changes


through this
diffuse time =11 temp =925 dryo2 press =1.00 hcl =3
# diffuse time =9 temp =925 dryo2 press =1.00 hcl =3
# diffuse time =13 temp =925 dryo2 press =1.00 hcl =3

3
# diffuse time =11 temp =950 dryo2 press =1.00 hcl =3
# diffuse time =9 temp =950 dryo2 press =1.00 hcl =3
# diffuse time =13 temp =950 dryo2 press =1.00 hcl =3
# diffuse time =11 temp =900 dryo2 press =1.00 hcl =3
# diffuse time =9 temp =900 dryo2 press =1.00 hcl =3
# diffuse time =13 temp =900 dryo2 press =1.00 hcl =3

# Ion Implantation through oxide for the p - well for the second
time
# Changed this for part 1
implant boron dose =9.5 e11 energy =10 pearson
# implant boron dose =9.5 e10 energy =10 pearson
# implant boron dose =9.5 e12 energy =10 pearson

# Deposition and Etching of Polysilicon Gate


depo poly thick =0.2 division =10
etch poly left p1 . x =0.35

# Formation of n + region in p - well by ion implantation and drive -


in
implant phosphor dose =2.0 e13 energy =20 pearson

# Spacer // Change this for part 3


# depo oxide thick =0.06 divisions =8 // thinner spacer
# etch oxide dry thick =0.06

depo oxide thick =0.12 divisions =8


etch oxide dry thick =0.12

# depo oxide thick =0.18 divisions =8 // thicker spacer


# etch oxide dry thick =0.18

#/ Spacer

implant arsenic dose =5.0 e15 energy =50 pearson


diffuse time =1 temp =900 nitro press =1.0
etch oxide left p1 . x =0.2

# Defining methods for Oxidation


method fermi compress

4
# Metal Deposition and Etching
deposit aluminum thick =0.03 division =2
etch aluminum right p1 . x =0.18

# Creating Mirror Image on the right


structure mirror right

# Naming the contact


electrode name = gate x =0.5 y =0.1
electrode name = source x =0.1
electrode name = drain x =1.1
electrode name = substrate backside

# Saving the Structure


structure outfile = MOSFET . str
tonyplot MOSFET . str

# Electrical Simulation ( Using Silvaco Atlas )


go atlas
models cvt srh print
contact name = gate n . poly
method newton
solve init

# ID - VGS Characteristics
solve vdrain =0.1
log outf = ID_VGS . log
solve vgate =0 vstep =0.25 vfinal =2.0 name = gate
log off
tonyplot ID_VGS . log

# Family of ID - VDS Curves


solve init
solve vgate =0.1
log outf = ID_VDS1 . log
solve vdrain =0 vstep =0.25 vfinal =2.0 name = drain
log off

solve vgate =0.6


log outf = ID_VDS2 . log
solve vdrain =0 vstep =0.25 vfinal =2.0 name = drain

5
log off
tonyplot ID_VDS2 . log
solve vgate =1.2
log outf = ID_VDS3 . log
solve vdrain =0 vstep =0.25 vfinal =2.0 name = drain
log off
solve vgate =1.8
log outf = ID_VDS4 . log
solve vdrain =0 vstep =0.25 vfinal =2.0 name = drain
log off
tonyplot overlay ID_VDS1 . log ID_VDS2 . log ID_VDS3 . log ID_VDS4 .
log
quit

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