SPZB250

ZigBee® module

Features
■ Integrated 2.4 GHz, IEEE 802.15.4-compliant
transceiver, PHY and MAC
– 3 dBm nominal TX output power
– -95 dBm (typ) RX sensitivity
– + 5 dBm in boost mode
■ Integrated Murata antenna
■ 128 kb embedded Flash and 5 kb integrated
SRAM for program and data storage
■ 17 GPIO with alternate functions: GPIOs,
UART, I2C, SPI, ADC Description
■ 2 16-bit general purpose timers: one 16-bit SPZB250 is a low power consumption ZigBee®
sleep timer module based on EM250 ZigBee® system-on-
■ ADC, sigma-delta converter with 12-bit chip which integrates a 16 bit processor together
resolution with a 2.4 GHz, IEEE 802.15.4-compliant
transceiver as well as IEEE 802.15.4 PHY and
■ On board 24 MHz stable crystal MAC. It enables OEMs to easily add wireless
■ Selectable integrated RC oscillator networking capability to any electronic device.
(typ 10 kHz) or 32.768 kHz crystal for low Such a module is a very comprehensive solution
power operation to build wireless sensors with meshing and self
■ < 2 μA (typ) power consumption in deep sleep healing capability as required in a WSN scenario.
mode 24 MHz high stability crystal is integrated in the
■ Watchdog timer and power on reset module to perform the timing requirements as per
ZigBee® specifications. An additional
■ Pins available for non-intrusive debug interface
32.768 kHz crystal is provided for low power
(SIF)
operation.
■ Single supply voltage 2.1 to 3.6 Vdc
To support user defined applications, a number of
■ CE and FCC compliance. FCC ID:S9NZB250A peripherals such as GPIO, UART, I2C, ADC and
general purpose timers are available and user
Applications selectable.

■ Industrial controls The deep sleep mode with power consumption

less than 2 μA (typ) allows the use in applications
■ Sensor networking
where the battery life is a key constraint.
■ Monitoring of remote systems
For other information and details, please refer to
■ Home applications EM250 datasheet available at the Ember
■ Security systems Corporation website.
■ Lighting controls

May 2010 Doc ID 13919 Rev 6 1/18

[Link] 18
Contents SPZB250

Contents

1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3 Pin setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Appendix A FCC statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

A.1 Label instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
A.2 Special requirement for modular application . . . . . . . . . . . . . . . . . . . . . . . 15

8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2/18 Doc ID 13919 Rev 6

SPZB250 RoHS compliance

1 RoHS compliance

ST modules are RoHS compliant and being based on ST devices comply with ECOPACK®
norms implemented by ST.

2 Block diagram

Figure 1. Block diagram

6DD 2&
K(Z -(Z
ANTENNA
8TAL 8TAL

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'0)/ &ILTER
#/.423)'.

Doc ID 13919 Rev 6 3/18

Pin setting SPZB250

3 Pin setting

3.1 Pin connection

Figure 2. Pin connection diagram

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SPZB250 Pin setting

3.2 Pin description

Table 1. Pin description

Pin n Pin name Direction Description

GPIO6 I/O Digital I/O

ADC2 Analog ADC input 2
1
TMR2CLK I External clock input of timer 2
TMR1ENMSK I External enable mask of timer1
GPIO5 I/O Digital I/O
2 ADC1 Analog ADC input 1
PTI_DATA O Frame signal of PTI (packet trace interface)
GPIO4 I/O Digital I/O
3 ADC0 Analog ADC input 0
PTI_EN O Frame signal of PTI (packet trace interface)
GPIO3 I/O Digital I/O
4 SSEL I SPI slave select of serial controller SC2
TMR2IB.1 I Capture of input B of timer 1
5 RSTB I Active low reset (an internal pull-up of 30 kΩ typ is provided)
GPIO11 I/O Digital I/O
CTS I UART CTS handshake of serial controller SC1
6
MCLK O SPI master clock of serial controller SC1
TMR2IA.1 I Capture of input A of timer 2
GPIO12 I/O Digital I/O
7 RTS O UART RTS handshake of serial controller SC1
TMR2IB.1 I Capture of input B of timer 2
GPIO0 I/O Digital I/O
MOSI O SPI master data out of serial controller SC2
8
MOSI I SPI slave data in of serial controller SC2
TMR1IA.1 I Capture of input A of timer 1
GPIO1 I/O Digital I/O
MISO I SPI master data in of serial controller SC2
9 MISO O SPI slave data out of serial controller SC2
SDA I/O I2C data of serial controller SC2
TMR2IA.2 I Capture of input A of timer 2

Doc ID 13919 Rev 6 5/18

Pin setting SPZB250

Table 1. Pin description (continued)

Pin n Pin name Direction Description

GPIO2 I/O Digital I/O

MSCLK O SPI master clock of serial controller SC2
10 MSCLK I SPI slave clock of serial controller SC2
SCL I/O I2C clock of serial controller SC2
TMR2IA.2 I Capture of input B of timer 2
11 GND -- Ground
12 VDD Power Input power supply
GPIO7 I/O Digital I/O
13 ADC3 Analog ADC input 3
REG_EN O External regulator open collector output
GPIO8 I/O Digital I/O
VREF_OUT Analog ADC reference output
14 TMR1CLK I External clock input of timer 1
TMR2ENMSK I External enable mask of timer 2
IRQA I External interrupt source A
GPIO9 I/O Digital I/O
TXD O UART transmit data of serial controller SC1
15 MO O SPI master data out of serial controller SC1
MSDA I/O I2C data of serial controller SC1
TMR1IA.2 I Capture of input A of timer 2
GPIO10 I/O Digital I/O
RXD I UART receive data of serial controller SC1
16 MI I SPI master data in of serial controller SC1
MSCL I/O I2C clock of serial controller SC1
TMR1IB.2 I Capture of input B of timer 2
Non-intrusive debug interface
17 SIF_CLK I
Serial interface clock signal (internal pull-down)
Non-intrusive debug interface
18 SIF_MISO O
Serial interface master IN/ slave out
Non-intrusive debug interface
Serial interface master out/ slave in
19 SIF_MOSI I
To guarantee a proper signal level when in deep sleep mode
connect a 10kΩ resistor to GND
Non-intrusive debug interface
20 SIF_LOADB I/O Serial interface load strobe (Open collector with internal pull-up)
To improve noise immunity connect a 10 kΩ resistor to VDD

6/18 Doc ID 13919 Rev 6

SPZB250 Pin setting

Table 1. Pin description (continued)

Pin n Pin name Direction Description

GPIO16 I/O Digital I/O

TMR1OB O Waveform output B of timer 1
21
TMR2IB.3 I Capture of input B of timer 2
IRQD I External interrupt source D
GPIO15 I/O Digital I/O
TMR1OA O Waveform output A of timer 1
22
TMR2IA.3 I Capture of input A of timer 2
IRQC I External interrupt source C
GPIO14 I/O Digital I/O
TMR2OB O Waveform output B of timer 2
23
TMR1IB.3 I Capture of input B of timer 1
IRQB I External interrupt source B
GPIO13 I/O Digital I/O
24 TMR2OA O Waveform output A of timer 2
TMR1IA.3 I Capture of input A of timer 1

Doc ID 13919 Rev 6 7/18

Maximum ratings SPZB250

4 Maximum ratings

4.1 Absolute maximum ratings

Table 2. Absolute maximum ratings
Values
Symbol Parameter Unit
Min. Max.

VDD Module supply voltage -0.3 3.6 V

VIN Input voltage on any digital pin -0.3 Vdd+0.3 V
Tstg Storage temperature -40 +85 °C
Tsold Soldering temperature < 10 s 240

4.2 Operating ranges

Table 3. Operating ranges
Values
Symbol Parameter Conditions Unit
Min. Typ. Max.

VDD Module supply voltage - 40°C < T < 85 °C 2.1 3.3 3.6 V
Operating ambient
Tstg -40 +85 °C
temperature

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SPZB250 Electrical characteristics

5 Electrical characteristics

5.1 DC electrical characteristics

Table 4. DC electrical characteristics

Values
Symbol Parameter Conditions Unit
Min. Typ. Max.

IRX RX current (boost mode) Vdd = 3.0 V, T = 25 °C - 38 mA

IRX RX current (normal mode) Vdd = 3.0 V, T = 25 °C - 36 mA
ITX TX current (boost mode) Vdd = 3.0 V, T = 25 °C - 42 mA
ITX TX current (normal mode) Vdd = 3.0 V, T = 25 °C - 36 mA

Deep sleep current 2.1 < Vdd < 3.6 V

IDS - 2 4 μA
(RC oscillator) T = 25 °C
Deep sleep current 2.1 < Vdd < 3.6 V
IDS - 2 4.5 μA
(32.768 kHz oscillator) T = 25 °C

5.2 DC I/O specification

Table 5. DC input / output specification
Values
Symbol Parameter Conditions Unit
Min. Typ. Max.

VIL Low level input voltage 2.1 < Vdd < 3.6 V 0 0.2 x Vdd V
VIH High level input voltage 2.1 < Vdd < 3.6 V 0.8 x Vdd Vdd V
Iil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA
Iih Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mA
Ripu Input pull-up resistor 30 kW
Ripd Input pull-down resistor 30 kW
VOL Low level output voltage 0 0.18 x Vdd V
VOH High level output voltage 0.82 x Vdd Vdd V
IOHS Output source current (GPIO 12: 0) 4 mA
IOLS Output sink current (GPIO 12: 0) 4 mA
IOHH Output source current (GPIO 16: 13) 8 mA
IOLH Output sink current (GPIO 16: 13) 8 mA
IOTot Total output current for I/O 40 mA

Doc ID 13919 Rev 6 9/18

Electrical characteristics SPZB250

5.3 RF electrical characteristics

Table 6. RF electrical characteristics

Values
Symbol Parameter Conditions Unit
Min. Typ. Max.

Frequency range 2.1 < Vdd < 3.6 V 2405 2480 MHz
TX Output power Vdd = 3.0 V, F = 2450 MHz 3 dBm
RX Sensitivity Vdd = 3.0 V, 1% PER -95 dBm
CFE Carrier frequency error Vdd = 3.0 V -20 / + 70 °C -40 40 ppm
Error vector magnitude Normal / boost mode 15 25 %
+/- 5 MHz 35
Adjacent channel rejection dBm
+/- 10 MHZ 40

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SPZB250 Package mechanical dimensions

6 Package mechanical dimensions

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: [Link].
ECOPACK® is an ST trademark.

Figure 3. Mechanical dimensions

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Package mechanical dimensions SPZB250

Figure 4. Solder pad layout

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SPZB250 Soldering

7 Soldering

Soldering phase has to be execute with care: in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.

Table 7. Soldering
Profile feature PB free assembly

Average ramp up rate (TSMAX to TP) 3 °C / sec max

Preheat
Temperature min (TS MIN) 150 °C
Temperature max (TS MAX) 200 °C
Time (TS MIN to TS MAX) (tS) 60 – 100 sec
Time maintained above:
Temperature TL 217 °C
Time tL 40 – 70 sec
Peak temperature (Tp) 240+0 °C
Time within 5 °C of actual peak temperature (tP) 10 – 20 sec
Ramp down rate 6 °C / sec
Time from 25 °C to peak temperature 8 minutes max

Figure 5. Soldering

Doc ID 13919 Rev 6 13/18

FCC statement SPZB250

Appendix A FCC statement

This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a class B digital
device, pursuant to part 15 of the FCC rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
● Reorient or relocate the receiving antenna
● Increase the separation between the equipment and receiver
● Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected
Consult the dealer or an experienced radio/TV technician for help.

Antenna
Our module type SPZB250 is for OEM integrations only. The end-user product will be
professionally installed in such a manner that only the authorized antennas are used.

Caution
Any changes or modifications not expressed approved by the part responsible for
compliance could cause the module to cease to comply with FCC rules part 15, and thus
void the user’s authority to operate the equipment.

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SPZB250 FCC statement

A.1 Label instruction

Instruction manual for FCC ID labeling
Module type: ZigBee® module SPZB250
FCC-ID: S9NZB250A
This intends to inform you how to specify the FCC ID of our ZigBee® module SPZB250 on
your final product.
Based on the public notice from FCC, the product into which our transmitter module is
installed must display a label referring to the enclosed module.
The label should use wording such as “contains transmitter module FCC ID: S9NZB250A or
“contains FCC ID: S9NZB250A, any similar wording that expressed the same meaning may
be use.
It shows an example below

Contains FCC ID: S9NZB250A

A.2 Special requirement for modular application

The following requirements are fulfilled:
1. The modular transmitter must have its own RF shielding:
The RF module used on the board fulfils the emission requirements of the FCC rules
without additional shielding.
2. The modular transmitter must have buffered modulation/data inputs:
The module has a memory management unit inside of the IC. The processor
interfacing with the external application by means general purpose I/O (GPIO), Uart,
SPI. The processor interfaces also the RF part of the module exchanging data and
command with it. Inside the processor a Flash memory is available to download the
customer application and the ZigBee® profiles.
3. The modular transmitter must have its own power supply regulation:
The IC contains an own voltage regulation. In case of changes in the supply voltage
VCC (for example caused by temperature changes or other effects), the internal
voltage will be stabilized.
4. The modular transmitter must comply with the antenna requirements of section 15.203
and 15.204:
The RF module is for OEM (original equipment manufacturer) integration only. The end-
user product will be professionally installed in such a manner that only the authorized
antenna is used.
5. The modular transmitter must be tested in a stand-alone configuration:
The RF module was tested in a stand-alone configuration.
6. The modular transmitter must be labelled with its own FCC ID number:
The RF module will be labelled with its own FCC ID number. When the module is
installed inside the end-product, the label is not visible. The OEM manufacturer is
instructed how to apply the exterior label.

Doc ID 13919 Rev 6 15/18

FCC statement SPZB250

7. The modular transmitter must comply with any specific rule or operating requirements
applicable to the transmitter and the manufacturer must provide adequate instructions
along with the module to explain any such requirements:
The EUT is compliant with all applicable FCC rules. Detail instructions are given in the
product users guide.
8. The modular transmitter must comply with any applicable RF exposure requirements.
● Maximum measured power output: 3.08 mW
● Maximum antenna gain: 0.6 dBi = numeric gain 1,148 (see also FCC test report)
Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm².
The RF module operates at low power level so it does not exceed the commission’s RF
exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to
the section 15.247 are categorically excluded from routine environmental evaluation.

16/18 Doc ID 13919 Rev 6

SPZB250 Revision history

8 Revision history

Table 8. Document revision history

Date Revision Changes

08-Oct-2007 1 First release

Updated cover page, Table 1 on page 5, Table 4 on page 9
18-Mar-2008 2
Added new Section 7: Soldering on page 13
19-Jan-2009 3 Updated cover page and Table 6 on page 10
28-Apr-2009 4 Updated features and description in cover page
03-Nov-2009 5 Added Chapter 1 on page 3
27-May-2010 6 Updated cover page and Figure 1 on page 3

Doc ID 13919 Rev 6 17/18

 SPZB250

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18/18 Doc ID 13919 Rev 6