CMOS
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
Source: [Link]
CMOS process (1)
N-well diffusion
Thin oxide growth
Si3N4 as a barrier
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
Source: [Link]
CMOS process (2)
N+ guarding implantation
P+ guarding implantation
Thick oxide junction isolation
LOCOS
(Local oxidation of silicon)
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
Source: [Link]
CMOS process (3)
Si3N4 barrier and
thin oxide strip
Growth of gate oxide
Poly-I as a gate electrode
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
Source: [Link]
CMOS process (4)
Formation of p-channel
drain and source
Formation of n-channel
drain and source
Growth of SiO2
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
Source: [Link]
CMOS process (5)
Etching of SiO2 for contacts
Deposit metal and
selective etching for
interconnection
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
Source: [Link]
Twin-well CMOS (1)
TiN barrier
W-plug
Salicide
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
CMP
Twin-well CMOS (2)
Global interconnection
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
BiCMOS
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee
Dielectric isolation
EE 7240 Integrated Circuit Engineering, Dr. J.B. Lee