Features * Qualified for Bluetooth v4.2 specifications + Supports HFP 1,6, HSP 1.2, A2DP 1.3, SPP 1.2 and AVRCP 1.6 + Supports Bluetooth 4,2 dual-mode (BDR/EDR/ BLE) specifications (FW dependent) + Stand-alone module with on-board PCB antenna and Bluetooth stack + Supports high resolution up to 24-bit, 96 kHz audio data format + Supports to connect two hosts with HFP/A2DP profiles simultaneously + Transparent UART mode for seamless serial data over UART interface + Supports virtual UART communication between host MCU and smartphone applications by Bluetooth SPP or BLE link + Easy to configure with Windows® GUL or dircetly by external MCU + Supports firmware field upgrade + Supports one microphone Compact surface mout stellated surface mount pads for easy and reliable host PCB mounting + RoHS compliant + Ideal for portable battery operated devices + Internal battery regulator circuitry DSP Audio Processing + Supports 64 kbps A-Law, — -Law PCM format Continuous Variable Slope Delta (CVSD) modulation for ‘SCO channel operation + Supports 8/16 kHz noise suppression + Supports 8/16 kHz echo cancellation + Supports Modified Sub-Band Coding (MSBC) for wide band speech + Built-in High Definition Clean Audio (HCA) algorithms for both narrow band and wide band speech processing + Packet loss concealment (PLC) + Built-in audio effect algorithms to enhance audio streaming rodule:32 x 15 x 2.7 mm Peripherals * Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA) + Integrated 1.8V and 3V configurable switching. regulator and low-dropout (LDO) regulator * Builtein ADC for battery monitoring and voltage * Built-in ADC for charger thermal * Built-in undervoltage protection (UVP) + An AUX-In port for extemal audio input + Two LED drivers + Multiple 1/0 pins for control and status rotection HCI Interface + High-speed HCI-UART interface (supports up to 921,600 bps) Product Specification BM64C1 BT4.2 Stereo Audio Module @Buetooth Qualifie 182064GM (This Protos are for reference only) RF/Analog + Frequency spectrum: 2.402 GHz to 2.480 GHz + Receive sensitivity: -90 dBm (2 Mbps EDR) + Output Power + BM64 Class 1: +15 dBm typical - BM64 Class 2: +2 dBm typical Audio Codec + Sub-band Coding (SBC) and optional Advanced Audio Coding (AAC) decoding + 20-bit digital-to-analog converter (DAC) with 98 dB SNR + 16-bit analogeto-digital converter (ADC) with 92 dB SNR + Supports up to 24-bit, 96 kHz 12S digital audio MAC/Baseband Processor + Supports Bluetooth 4.2 dual-mode (FW dependent) - BDR/EDR transport for audio, voice, and SPP data exchange = BLE transport for proprietary transparent service and Apple Notification Center Service (ANCS) data exchange Operating Condition + Operating voltage: 3.2V to 4.2V + Operating temperature: -20°C to +70°C Description The BM64 Stereo Audio module is a fully qualified Bluctooth 4.2 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications to their products. The BM64 module is a Bluetooth Special Interest Group (SIG) certified module that provides a complete wireless solution with Bluetooth stack, integrated PCB antenna, and worldwide radio certifications in a ‘compact surface-mount package. ‘The BM64 module has several SKUs. The BM64 module is, available in both Class 1 and Class 2 versions. Applications * Soundbar and Subwoofer (FW dependent) + Bluetooth portable speaker phone * Multi-speaker (FW dependent) Spec-BM64-V0.3 Page 1 of 32 [Link]stan ® Brite = tet Specification LO DEVICE OVERVIEW The BM BNI64 Stereo Autio modules ar built around Mierochip Technology 152064 SoCs respectively The 182064 SoC integrates the Bluetooth 42 doal mode radio tansciver Power Management Unit (PMU), 2 esta and DSP. Users can configure the BM64 module by using the Ul tool and DSP tol, a Windows-based tlt. Note: Tho Ut and DSP tools are avalabe ‘or download from the Microchip web site at ‘yw. microchip. com/BM4, Figure 1-1 illustrates a typical example of the Class 1 BM64 module which is connected to an external MCU and a DSPicodec. FIGURE 1-1: APPLICATION USING BM64 MODULE = “ee Mecrophone Oo Jd " Figure 1-2 illustrates the Soundbar and Subwoofer applications using the BM64 module. FIGURE 1-2: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64 MODULE Po rr Figure 1-3 illustrates the Soundbar and Subwoofer applications using the BM64 module and smartphone, FIGURE 1-3: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64 MODULE AND SMARTPHONE i) Spec-BM64-V0.3 Page 2 of 32 [Link]Brite® = Product Spe Figure 1-4 illustrates the Multi-speaker application using the BM64 module. FIGURE 1-4: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64 MODULE AND SMARTPHONE rents i) Table 1-1 provid the key features of the BM64 module. TABLE 1-1: BM62/64 KEY FEATURES Feature BM64CLASS2 | BM64CLASS1 Application Multi-speaker/Soundbar/Subwoofer Stereo/mono Stereo Stereo Pin count 43 43 Dimensions (mm?) 15x32 15x 32 PCB antenna Yes Yes Tx power (typical) 208m Bm Audio DAC output 2 Channel 2 Channel DAC (single-ended) SNR al 2.8V (dB) “98 -98 DAC (caploss) SNR at 2.8V (dB) 98 “98 ‘ADC SNR at 2.8V (dB) “92 “82 PS digital interface Yes Yes ‘Analog AUX-In Yos Yes Mono MIC 1 1 Extemal audio amplifier interface Yes Yes UART Yes Yes USB Yes Yes LED driver 2 2 Intemal DC-DC step down regulator Yes Yes DC 5V adapler input Yes Yes Battery charger (350 mA max) Yes Yes ‘ADC for thermal charger protection Yes Yes Undervoltage protection (UVP) Yes Yes GPIO 12 12 Button support 6 6 NEC (triggered by oxternal NEC) Yes Yes EEPROM Yes Yes Spec-BM64-V0.3 Page 3 of 32 [Link]Product Specification Feature BM64CLASS2 | BM64CLASS1 Customized voice prompt 8K Sampling Rate, Stored in EEPROM with approximately 800 bytes/second Muli-tone Yes Yes DSP sound effect Yes Yes BLE Yes Yes Bluetooth profiles HFP. 16 16 AVRCP, 1.6 16 ‘A20P. 13 13 HSP 12 12 SPP. 12 1.2 Figure 1-5 illustrates the pin diagram of the BM64 module. FIGURE 1.5: M64 MODULE PIN DIAGRAM ano P20 Poe pas Poa pas P30 Pos. om EAN Poo Pas Par LED: Leva Pts 78 RxD 19 NFB 26 HCLTxD 20 voD.10 21 BATIN 22 ADAPIN 23 ‘ANG_DET 25 SyS_pWR 24 Spec-BM64-V0.3 Page 4 of 32 [Link]Brite => Produet Specification M64 MODULE PIN DESCRIPTION Pin No Pin Type | PinName Description 1 10) DRO [FPS interface: digital lefvright data 2 vO RFS) [JS interface: leftfnght clock 3 vO SCLKO _|/?S interface. bit clock 4 vO DTD __ [PS interface. digital lefvright data 6 o AOHPR __|Righi-channel, analog headphone output @ o AOHPM [Headphone common mode outputisense input 7 oO AOHPL __[Left-channel, analog headphone oulput 2 P BAT_IN [Battery input. Voltage range: 82V to 4 2V. When an extemal ower supply is connected to the ADAP_IN pin, the BAT_IN pin can be left open if battery is not confected 23 P ADAP_IN _|5V power adagier input 24 P SYS_PWR_| System power output derived from ADAP_IN or BAT_IN 25 P ‘AMB_DET_ [Analog input for ambient temperature detection 28 T MFB | Mull-Function Button and power-on key + UART RX_IND, active-hich (used by hast MCU to wakeup the Bluetooth system) 2 T LED2_ [LED diver? 28 T LED! [LED diver 1 Legend: I= Input pin O= Output pin /O= Input/Output pin P= Power pin Note: All /O pins can be configured using the UI tool, a Windows utility Spec-BM64-V0.3 Page 5 of 32 [Link]Brite = Product Specification BM64 MODULE PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name Description z = Se (Internally pulled-up, if configured as an input) Geer arate oe Caeity Re ore |wakeup the hast MCU) 5 o FS oot ons a naatonpe Re min rome meenene se a a wo an |Gaeeste cinta Ree mn aldeerbid det inveche Goa fl zi i El —cestie erases Sys conguctin pan wth he P2_Oard P24 os Seale rear me hoes ape ree (ral operon + Test mode (to change EEPROM values) Ee HEL Sok kad aud eae ae ite mete pi ls Bed ac ES 3 uo DM [Differential data minus USB 34 uo DP [Differential data plus USB Et 0 PO_5 [Configurable control or indication pin internally pulled-up, if configured as an input) Volume-down key (default), active-low 38 0 P3_0 [Configurable control or indication pin (internally pulled-up, if configured as an input) [Link] detector, active-low a7 0 P_1 [Configurable control or indication pin ~— |(iniemally puled-up, if configured as an input) REV key (default), activeow 38 0 P3_8 [Configurable control or indication pin (internally pulled-up, if configured as an input) FWD key (default), active-ow 38 0 P3_6 [Configurable control or indication pin internally pulled-up, if configured as an input) Mult-SPK Master/Slave mode contol (FW dependent) 40 ir 0.2 [Configurable control or indication pin [internally pulled-up, if configured as an input) Play/Pause key (default) a 10 P2_0 [System configuration pin along with P2_4 and EAN pins used to set the module in any one of the following modes: + Application mode (for normal operation) }+ Test mode (to change EEPROM values) + \write Flash mode (to load a new firmware into the mod le), refer to Table 61 a2 v0 P27 [Configurable control or indication pin [internally [Link], if configured 2s an input) Volume-up key (default), active-low a P GND [Ground reference Legend: I= Input pin O= Output pin /O= Input/Output pin P= Power pin Note: All 1/0 pins can be configured using the UI tool, a Windows utility Spec-BM64-V0.3 Page 6 of 32 [Link]Brritec’ = 2.0 AUDIO ‘The input and output audios have different stages and each stage can be programmed to vary the gain response characteristies. For microphone, both single ended inputs and differential inputs are supported, ‘To maintain a high quality signal, a stable bias voltage source to the condenser microphone’s FET is provided. ‘The DC blocking capacitors can be used at both positive and negative sides of a input, Internally, this analog signal is converted to 16-bit, 8/16 kHz linear PCM data, Product Specification 2.1 Digital Signal Processor ‘A Digital Signal Processor (DSP) is used to perform speech and audio processing, The advanced speech features, such as acoustic echo cancellation and noise reduction are inbuilt. To reduce nonlinear distortion and to help echo cancellation, an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of speaker output or microphone input, Adaptive filtering is also applied to rack the echo path impulse in response to provide echo free and full-duplex user experience, ‘The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs captured by the microphones and improves mutual understanding in communication, The advanced audio features, such as multi-band dynamic range control, parametric multi-band equalizer, audio widening and virtual bass are inbuilt. The audio effect algorithms are to improve the user's audio listening experience in terms of better audio quality after audio signal processing. Figure 2-1 and Figure 2-2 illustrate the processing flow of speakerphone applications for speech and audio signal processing. FIGURE 2-1: ‘SPEECH SIGNAL PROCESSING oF vl reaae re {m=} = eH Peis] BG) ES SEH FIGURE 2.2: AUDIO SIGNAL PROCESSING BMe2/64 ce I) Dosedors f= al Spec-BM64-V0.3 Page 7 of 32 [Link]Brito” — Product Specification ‘The DSP parameters can be configured using the DSP tool, For additional information on the DSP tool, refer to the “18206X DSP Application Note” Note: The DSP tool and “/S206X DSP Applica- tion Note” document, are available for download from the Microchip web site at: www microchip. com/BM64 2.2 Codec ‘The built-in codec has a high signal-to-noise ratio (SNR) performance and it consists of an ADC, a DAC and an additional analog circuitry. Note: The internal codec supports 16-bit resolu- tion, by adding trailing zeros in LSBs 24-bit FS port requirements can be met. Figure 2-3 through Figure 2-6 llustrate the dynamic range and frequency response of the codec FIGURE 2.3: CODEC DAC DYNAMIC RANGE —Single160_cH1 —Single160_cH2 —Capless160_CH1 —Capless160_cH2 -100 -90 -80 -70 -60 -50 -40 -20 -20 -10 0 Input power (dBFS) Note: The data corresponds to the 16 Ohm load with 2.8V operating voltage at +25°C room temperature. FIGURE 2-4 ‘CODEC DAC THDIN VERSUS INPUT POWER —Single160_cH1 —Single160_cH2 —Capless16q_cH1 THD+N (dBV) —Capless160_cH2 2990p -60 -55 -50-45 -40 -35 -30-25-20-15-10 -5 0 Input power (dBFS) Note: The data corresponds to the 18 Ohm load with 2.8V operating voltage at +26°C room temperature. Spec-BM64-V0.3 Page 8 of 32 [Link]wear | maer [zoe ents 2a i in nee Wa Funet cht 48 100 senl™—slyy Frequency He al Pek Teweanl na owed cits st Waka sn |e [cn] Note: The DAC trequency response carrespands ingle-endied made with a 47 pF DG block capacitor. Spec-BM64-V0.3 Page 9 of 32Brritec’ = 2.3 Auxiliary Port ‘The BM64 module supports one analog (line-in) signal from the external audio souree, The analog (line-in) signal can be processed by the DSP to generate different sound effects (Multi-band dynamic range compression and audio widening), which can be configured by using the DSP tool, Product Specification 2.4 Analog Speaker Output ‘The BM62i64 module supports the following analog speaker output modes: + Capless mode — Recommended far headphone applications in which capless output connection helps to save the BOM cost by avoiding a large DC blocking capacitor. Figure 2-7 illustrates the analog speaker output eapless mode + Single-ended mode — Used for driving an external audio amplifier where a DC blocking capacitor is required. Figure 2-8 illustrates the analog speaker output single-ended mode FIGURE 2-7: ANALOG SPEAKER OUTPUT CAPLESS MODE S BM62/64 1 Aouer \ c )—— AOHPM I AQHPL ie “16132 Ohm Speaker FIGURE 2-8: ANALOG SPEAKER OUTPUT SINGLE-ENDED MODE tL BM62/64 j4 [-— AOHPR A Audio Amplifier L AOHPL 3.0 TRANSCEIVER ‘The BM64 module is designed and optimized for Bluetooth 2.4 GHz system. It contains @ complete radio frequency transmitter/receiver seotion. An internal synthesizer generates a sable clock for synchronizing with another device, 3.1 Transmitter ‘The internal power amplifier (PA) has a maximum output power of +4 dBm. This is applied for Class 2 or Class 3 radios without an external RF PA, The transmitter performs the IQ conversion to minimize the frequency dri. Spec-BM64-V0.3 Page 10 of 32 [Link]Product Specification 3.2 Re ‘The low-noise amplifier (LNA) operates with TR-combined mode for single port application, It can save a pin on the package without having an external Tx/Rx switch ‘The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysis, A channel filter has been integrated into the receiver channel before the ADC, which is used to reduce the external ‘component count and increase the anti-interference capability. ‘The image rejection filter is used to reject the image frequency for low-IF architecture, This filler for low-IF architecture is intented to reduce external Band Pass Filter (BPF) component for a super heterodyne architecture, ‘The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF ouput power to make a good trade-off for effective distance and current consumption. 3.3 Synthesizer ‘A synthesizer generates a clock for radio transceiver operation. There is a VCO inside with a tunable internal LC tank that can reduce variation for components, Acrystal oscillator with an internal digital trimming circuitprovides a stable clock for the synthesizer. 3.4 Modem For Bluetooth 1.2 specification and below, 1 Mbps was the standard data rate based on the Gaussian Frequeney Shift Keying (GFSK) modulation scheme. This basic rate modem meets Basic Data Rate (BDR) requirements of Bluetooth 2.0 with Enhanced Data Rate (EDR) specifications. For Bluetooth 2.0 and above specifications, EDR has been introduced to provide the data rates of 1/2/3 Mbps. For baseband, both BDR and EDR utilize the same | MHz symbol rate and 1.6 kHz slot rate. For BDR, symbol | represents 1 -bit, However, each symbol in the payload part of EDR packet represents 2/3 bits. This is achieved by using two different modulations, + /4 DQPSK and 8 DPSK. 3.5 Adaptive Frequency Hopping(AFH) The BM62/64 module has an AFH function to avoid RF interference. It has an algorithm to check the nearby interference and to choose clear channel for transceiver Bluetooth signal 4.0 POWER MANAGEMENT UNIT The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulator A power switch is used to switch over the power source between the battery and an adapter, Also, the PMU provides current to drive two LEDs. 4.1 Charging a Battery The BM62/64 module has a built-in battery charger which is optimized for lithium-ion and lithium-polymer batteries. ‘The battery charger includes a current sensor for charging control, user programmable current regulation, and high accuracy voltage regulation. The charging current parameters are configured by the UL tool. Reviving, pre-charging, constant current and constant voltage modes, and re-charging functions are included. The maximum charging current is 350 mA. Figure 4-1 illustrates the charging curve of a battery. Spec-BM64-V0.3 Page 11 of 32 [Link]Brritec’ = Product Specification FIGURE 4-1: BATTERY CHARGING CURVE mayen’ [nisi] casemate | cower voiagebag ‘or Mode CV Voluge 429 Mode Recap Voli als CC coment 15 CC Votiase 309 Rechang> earene 26 Precharge Vologe Treciange Curent Reviving Cure 4.2 Voltage Monitoring A 10-bit, successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage level detection. The waming level can be programmed by using the Ul tool. The ADC provides a granular resolution to enable the external MCU to take control over the charging process, 4.3 LED Driver ‘Two dedicated LED drivers control the LEDs. They provide enough sink current (16 step control and 0.35 mA for each step), thus LEDs can be connected directly with the BM62/64 module. The LED settings can be configured using the UL to0l Figure 4-2 illustrates the LED drivers in the BM62/64 module, FIGURE 4-2: LED DRIVER BM62/64 SYS_PWR 4.4 Under Voltage Protection ‘When the voltage of the SYS_PWR pin drops below the voltage level of 2.9V, the system will shutdown automatically 4.8 Ambient Detection The BM64 module has a built-in ADC for charger thermal protection. Figure 4-3 illustrates the suggested circuit and thermistor, Murata NCP1SWF104F. The charger thermal protection can avoid battery charge in restricted temperature range. The upper and lower limits for temperature values ean be configured by using the Ul tool Spec-BM64-V0.3 Page 12 of 32 [Link]Product Specification Note: Thermistor must be placed close to the battery in the user application for accurate temperature measurements and to enable thermal shutdown feature. FIGURE 4.3: AMBIENT DETECTION VDD_IO RL 1M/1% AMB_DET a. R2 fF a “yv 86.6K/1% jurata NCP 1S5WF104F 5.0 APPLICATION INFORMATION 5.1 Host MCU Interface The BM64 module supports UART commands. The UART commands enable an external MCU to control the BM64 module. Figure 5-1 illustrates the UART interface between the BM64 module and an external MCU. FIGURE 5-1 HOST MCU INTERFACE OVER UART MCU BM62/64 PO_0 (for BM62) P3_7 (for BM64) MCU_WAKE UP. }~—— | UART Interface UART_RX HCI_TXD UART_TX UAT lnneyiaos HCI_RXD. BT_WAKE UP |}——_____»| An external MCU can control the BM64 module over the UART interface and wakeup the module with the MFB, P3_7 Spec-BM64-V0.3 Page 13 of 32 [Link]Brito” — Product Specification pins Refer to the “UART_CommandSet” document for list of Funetions the BM64 module supports and how to use the UI tool to configure the UART and UART Command Set too! Note: The UART Command set tool (SPKCom- mandSetTool [Link]) and “UART_Com- mandSet" document are available for download from the Microchip web site at: [Link]/BM64. Figure 5-2 through Figure 5-7 illustrate the timing sequences of various UART control signals, FIGURES2: __POWER-ONIOFF SEQUENCE 1 pe : fe | age erase SE — . (Sofa 53) (seerowesd) FIGURE 5-3: TIMING SEQUENCE OF RX INDICATION AFTER POWER-ON STATE Resume 32 kHz mode MB pulse must be longer than the 7 UART command slot time 150 ms + MFB (PWR) NCU sends UART command ' UART Command 2ms_ 2ms Enter 32 kHz mode 4ms Spec-BM64-V0.3 Page 14 of 32 [Link]Product Specification FIGURE 5-4: TIMING SEQUENCE OF POWER-OFF STATE BM6ZI64 sends power-off ACK. BAT_IN+4V MFB (PWR) MCU sends RST_N BK_OUT \031_vo UART bus, 23°45 Note 1: EEPROM clock = 100 kHz, 2: For abyte write: 0.01 ms x 32 clock x2 = 640 ps, 3: It is recommended to have ramp-down time more than 640 us during the power-off sequence to ensure safe operation of the device. FIGURE 5-5: TIMING SEQUENCE OF POWER-ON (NACK) +s ; y par 4 ; SYS PWR ae Feweran y Neustaw sini Ee 400 ms 200 ms Fi < + + * any « MB (PWR) + ‘ ’ ‘8k oUTiLDO31_vo eons ’ ere SB MCU sends UART commani e ‘cman [BNs2164 UART_ FO) « e wok ne ‘862/64 response UART state ’ " (ez UART 7) Retry, ACK i nt received Set "Power-on Dict" beot Maximum: § tires (1s) Spec-BM64-V0.3 Page 15 of 32 [Link]Product Specification FIGURE 5-7: TIMING SEQUENCE OF POWER DROP PROTECTION Power BAT_IN74V Reset IC RST_N from Reset IC our vo) GND MCU Reset Noto 4: tis recommended to use the battory to provide the power supply at BAT_IN in io tho module. 2: Ian extemal power source o* a power adapter is uilized io provide power fo the module (ADAP_IN), it is recommended to use a voltage supervisor IC. 3: The Reset IC oulput pin, RST_N, mustbe “Open drain’ wih delay time = 1 ms and the recommended partis G691L203T73, 5.2 128 Mode Application The BM64 module provides an 12S digital audio output interface to connect with the external codec or DSP. It provides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling rates for 16-bit and 24-bit data formats. The 12S setting can be configured by using the Ul and DSP tools, Figure 5-8 and Figure 5-9 illustrate the 12S signal connectionbetween the BM64 module and an external DSP. Use the DSP tool to configure the BM64 module as a Master/Slave. For additional information on timing specifications, refer to Spec-BM64-V0.3 Page 16 of 32 [Link]Brito” — Product Specification 8.2 “Timing specifications”. FIGURE 5-8: BM64 MODULE IN ?S MASTIER MODE External DSP/ BM64 Codec BCLK + SCLKo DACLRC. L¢—__| RFSO ADCDAT >} DRO DACDAT |«#——________ oT 5.3 Reset The BM64 module provides a watchdog timer (WDT) to reset the chip. It has an integrated Power-on Reset (POR) circuit that will eset all circuits to a known Power-on state, This action can also be driven by an external Reset signal which is used to control the device externally by forcing it into a POR state, The RST_N signal input is active-low and rng connection is required in most applications. 5.4 External Configuration and Programming The BM64 module can be configured by using an external configuration tool (EEPROM tool) and the firmware is programmed by using a programming tool (Flash tool). Note: The EEPROM and Flash tools are avail- able for dovinioad from the Microchip web www microchip. com/BM64 Figure 5-15 through Figure 5-18 illustrate the BM64 reference circuit for a stereo headset application Spec-BM64-V0.3 Page 17 of 32 [Link]Brite’ — Product Specification FIGURE S.15: _ BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION [864 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION TEST POINTs en SPIO Deserntion nez_rxp So apap Renee a PLAY PAUSE wez_2xD oxo es Te vous a ae vou. = = te SLIDE SWITCH —_ AMP_EN; NFC Reser wmo_20 7 iain wren LE gomaren same nv “— gormor “Ss on wo ‘AUP EN, SLIDE swiTcH ‘Single Double aeting 73.6 | Single /Double setting System Configuration System Configuration Spec-BM64-V0.3 Page 18 of 32 ‘www [Link]Brite’ = Product Specification FIGURE 5-17: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION RESET AMB_DET NOP1SWF104F03 STEREO AUX LINE INPUT STEREO SPK JACK +090 tow Active a MIC INPUT Te Spec-BM64-V0.3 Page 19 of 32 ‘www [Link]Brite’ = FIGURE 5.18: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET APPLICATION Product Specification SLIDE SWITCH RESERVE For BLUETOOTH DEBUG BAT wo. = $ mH aa) DC POWER SOURCE BATTERY CONNECTOR 2 6.0 PRINTED ANTENNA INFORMATION 6.1 Antenna Radiation Pattern ‘The BM64 module is integrated with one PCB printed antenna, see Figure 6-1 Spec-BM64-V0.3 Page 20 of 32 ‘www [Link]