Max 2870
Max 2870
Functional Diagram
MUX_OUT
MUX
MAX2870
LD
LOCK DETECT
VCO
INTEGER FRAC MODULUS
RFOUTA_P
DIV-BY- DIV-BY-
1/2/4/8/16 1/2/4/8 RFOUTA_N
RFOUT_EN
MAIN
MODULATOR RFOUTB_P
MUX RFOUTB_N
N COUNTER
MUX
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to [Link]/thermal-tutorial.
DC Electrical Characteristics
(Measured using MAX2870 EV Kit. VCC_ = 3V to 3.6V, VGND_ = 0V, fREF_IN = 50MHz, fPFD = 25MHz, TA = -40NC to +85NC. Typical
values measured at VCC_ = 3.3V; TA = +25NC; register settings (Reg 0:5) 00780000,20000141,01005E42,00000013,610F42
3C,01400005; unless otherwise noted.) (Note 2)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Supply Voltage 3 3.3 3.6 V
IRFOUT_, minimum output power, single channel 8.5
RFOUT_ Current Consumption mA
IRFOUT_, maximum output power, single channel 25 29
Total, including RFOUT, both
Both channels 144 180
channel (Note 3)
enabled,
Supply Current Each output divide-by-2 10 15 mA
maximum
output power ICCVCO + ICCRF (Note 3) 75 95
Low-power sleep mode 1
AC Electrical Characteristics
(Measured using MAX2870 EV Kit. VCC_ = 3V to 3.6V, VGND_ = 0V, fREF_IN = 50MHz, fPFD = 25MHz, fRFOUT_ = 6000MHz,
TA = -40NC to +85NC. Typical values measured at VCC_ = 3.3V, TA = +25NC, register settings (Reg 0:5) 00780000,20000141,01005E42
,00000013,610F423C,01400005; unless otherwise noted.) (Note 2)
PARAMETER CONDITIONS MIN TYP MAX UNITS
REFERENCE OSCILLATOR INPUT (REF_IN)
REF_IN Input Frequency Range 10 200 MHz
REF_IN Input Sensitivity 0.7 VCC_ VPP
REF_IN Input Capacitance 2 pF
REF_IN Input Current -60 +60 FA
PHASE DETECTOR
Integer-N mode 105
Phase Detector Frequency MHz
Fractional-N mode 50
Note 2: Production tested at TA = +25NC. Cold and hot are guaranteed by design and characterization.
Note 3: fREFIN = 100MHz, phase detector frequency = 25MHz, RF output = 6000MHz.
Register setting: 00780000, 20400061, 20011242, F8010003, 608001FC, 80440005
Note 4: Measured single ended with 27nH to VCC_RF into 50I load. Power measured with single output enabled. Unused output
has 27nH to VCC_RF with 50I termination.
Note 5: VCO phase noise is measured open loop.
Note 6: Measured at 200kHz using a 50MHz Bliley NV108C19554 OCVCXO with 2MHz loop bandwidth. Register setting
801E0000, 8000FFF9, 80005FC2, 6C10000B, 638E80FC, 400005. EV kit loop filter: C13 = 1500pF, C14 = 33pF, R1 = 0Ω,
R2 = 1100Ω, R0 = 0Ω, C12 = open.
Note 7: 1/f noise contribution to the in-band phase noise is computed by using 1/fnoise + 10log(10kHz/fOFFSET) +
20log(fRF/1GHz). Register setting: 803A0000,8000FFF9,81005F42,F4000013,6384803C,001500005
Note 8: fREFIN = 50MHz; fPFD = 25MHz; offset frequency = 10kHz; VCO frequency = 4227MHz, output divide-by-2 enabled.
RFOUT = 2113.5MHz; N = 169; loop BW = 40kHz, CP[3:0] = 1111; integer mode.
Note 9: fREFIN = 50MHz; fPFD = 50MHz; VCO frequency = 4400MHz, fRFOUT_ = 4400MHz; loop BW = 65kHz. Register setting:
002C0000, 200303E9, 80005642, 00000133, 638E82FC, 01400005. EV kit loop filter: C13 = 0.1µF, C14 = 0.012µF, R1 =
0Ω, R2 = 120Ω, R0 = 250Ω, C12 = 820pF.
3.0GHz VCO OPEN-LOOP PHASE NOISE 4.5GHz VCO OPEN-LOOP PHASE NOISE 6.0GHz VCO OPEN-LOOP PHASE NOISE
vs. FREQUENCY vs. FREQUENCY vs. FREQUENCY
-40 -40 -40
MAX2780 toc01
MAX2780 toc02
MAX2780 toc03
-50 -50 -50
-60 -60 -60
-70 -70 -70
PHASE NOISE (dBc/Hz)
3.0GHz CLOSED-LOOP PHASE NOISE 4.5GHz CLOSED-LOOP PHASE NOISE 6.0GHz CLOSED-LOOP PHASE NOISE
vs. FREQUENCY vs. FREQUENCY vs. FREQUENCY
-70 -70 -70
MAX2780 toc04
MAX2780 toc05
MAX2780 toc06
-80 DIV1 -80 DIV1 -80 DIV1
DIV2 DIV2 DIV2
-90 DIV4 -90 DIV4 -90 DIV4
PHASE NOISE (dBc/Hz)
904MHz INTEGER-N MODE PHASE NOISE 2687.5MHz INTEGER-N MODE PHASE NOISE 2113.5MHz FRACTIONAL-N PHASE NOISE
AND SPUR PERFOMANCE vs. FREQUENCY AND SPUR PERFOMANCE vs. FREQUENCY (LOW-NOISE MODE) vs. FREQUENCY
0 0 -70
MAX2780 toc07
MAX2780 toc08
MAX2780 toc09
-100
-60 -60
SPURS (dBc)
SPURS (dBc)
-110
-80 -80 -120
2113.5MHz FRACTIONAL-N PHASE NOISE 2679.4MHz FRACTIONAL-N PHASE NOISE 2679.4MHz FRACTIONAL-N PHASE NOISE
vs. FREQUENCY (LOW-SPUR MODE) vs. FREQUENCY (LOW-NOISE MODE) vs. FREQUENCY (LOW-SPUR MODE)
-70 -70 -70
MAX2780 toc10
MAX2780 toc11
MAX2780 toc12
-80 -80 -80
-90 -90 -90
PHASE NOISE (dBc/Hz)
MAX2780 toc14
MAX2780 toc15
TA = +85°C
130 TA = +25°C 230 170
210 160 TA = +25°C
120 TA = +85°C TA = +85°C
SUPPLY CURRENT (mA)
190 150
110 170 140
TA = +25°C TA = -40°C
100 TA = -40°C 150 130
MAX2780 toc16
MAX2780 toc17
280
260 3.06
TA = +85°C
SUPPLY CURRENT (mA)
240
FREQUENCY (GHz)
220 3.04
TA = +25°C FASTLOCK OFF
200
180 3.02
TA = -40°C
160
140 3.00
120 FASTLOCK ON
100 2.98
10 100 1k 10k 0 50 100 150 200
FREQUENCY (MHz) TIME (µs)
80B40000,
4.5GHz VCO 80000141, VCO bits set
OPEN-LOOP 0000405A, for 4.5GHz
N/A N/A N/A N/A N/A N/A N/A N/A
PHASE NOISE XX00013 output,
vs. FREQUENCY 648020FC, VAS_SHDN = 1
00000005
80B40000,
6.0GHz VCO 80000141 VCO bits set
OPEN-LOOP 0000405A for 6.0GHz
N/A N/A N/A N/A N/A N/A N/A N/A
PHASE NOISE XX00013, output,
vs. FREQUENCY 648020FC VAS_SHDN = 1
00000005
805A0000,
4.5GHz 80000141,
CLOSED-LOOP 00009E42,
50 25 40k 0.1F 120 0.012F 250 820p
PHASE NOISE E8000013,
vs. FREQUENCY 618160FC,
00400005
80780000,
6.0GHz 0080000141,
CLOSED-LOOP 00009E42,
50 25 40k 0.1F 120 0.012F 250 820p
PHASE NOISE EA000013,
vs. FREQUENCY 608C80FC,
00400005
82350000,
904MHz INTEGER-N
800007D1
MODE PHASE
E1065FC2,
NOISE AND SPUR 40 0.8 16k 0.1F 806 3300p 1201 470p
2C000013
PERFOMANCE
6020803C
vs. FREQUENCY
00400005
2687.5MHz 94FF0000,
INTEGER-N PHASE 803207D1,
NOISE 010A1E42,
40 0.5 5k 0.1F 1000 6800p 300 0.01F
AND SPUR B00000A3,
PERFORMANCE vs. 6090803C,
FREQUENCY 00400005
00548050,
2113.5MHz
400003E9,
FRACTIONAL-N
81005FC2,
PHASE NOISE 50 25 40k 0.1F 120 0.012F 250 820p
E8000013,
(LOW-NOISE MODE)
609C80FC,
vs. FREQUENCY
00400005
00548050,
2113.5MHz
400003E9,
FRACTIONAL-N
E1005FC2,
PHASE NOISE vs. 50 25 40k 0.1F 120 0.012F 250 820p
E8000013,
FREQUENCY
609C80FC,
(LOW-SPUR MODE)
00400005
00358160,
2679.4MHz
203207D1,
FRACTIONAL-N
41005E42,
PHASE NOISE vs. 50 25 40k 0.1F 120 0.012F 250 820p
B20000A3,
FREQUENCY
6010003C,
(LOW-SPUR MODE)
00400005
003C0000,
SUPPLY CURRENT
20000321,
vs. OUTPUT POWER
01005E42, APWR swept
SETTING 50 25
00000013, from 00 to 11
(ONE CHANNEL
610F423C,
ACTIVE, 3GHz)
01400005,
003C0000,
SUPPLY CURRENT
20000321,
vs. FREQUENCY N and F values
01005E42,
(ONE CHANNEL 50 25 changed for
00000013,
ACTIVE, MAXIMUM each frequency
610F423C,
OUTPUT POWER)
01400005
003C0000,
SUPPLY CURRENT 20000321,
APWR and
vs. OUTPUT POWER 01005E42,
50 25 BPWR swept
SETTING (TWO 00000013,
from 00 to 11
CHANNELS ACTIVE) 610F43FC,
01400005
003C0000,
SUPPLY CURRENT
20000321,
vs. FREQUENCY N and F values
01005E42,
(TWO CHANNELS 50 25 swept for each
00000013,
ACTIVE MAXIMUM frequency
610F43FC,
OUTPUT POWER)
01400005
00250120,
20320141,
00004042, CDM changed
PLL LOCK vs. TIME 40 40 40k 0.1F 120 0.012F 250 820p
000000A3, from 00 to 01
0184023C,
01400005
Pin Configuration
NOISE_FILT
GND_TUNE
GND_VCO
BIAS_FILT
VCC_VCO
TOP VIEW
TUNE
RSET
REG
24 23 22 21 20 19 18 17
LD 25 16 VCC_RF
RFOUT_EN 26 15 RFOUTB_N
GND_DIG 27 14 RFOUTB_P
VCC_DIG 28 13 RFOUTA_N
MUX_OUT 30 11 GND_RF
GND_SD 31 EP 10 VCC_PLL
+
VDD_SD 32 9 GND_PLL
1 2 3 4 5 6 7 8
CLK
DATA
LE
CE
SW
VCC_CP
CP_OUT
GND_CP
TQFN
Pin Description
PIN NAME FUNCTION
Serial Clock Input. The data is latched into the 32-bit shift register on the rising edge of the
1 CLK
CLK line.
2 DATA Serial Data Input. The serial data is loaded MSB first. The 3 LSBs identify the register address.
Load Enable Input. When LE goes high the data stored in the shift register is loaded into the
3 LE
appropriate latches.
Chip Enable. A logic-low powers the part down and the charge pump becomes high
4 CE
impedance.
Fast-Lock Switch. Connect to the loop filter when using the fast-lock mode. No connect in
5 SW
Normal mode
6 VCC_CP Power Supply for Charge Pump. Place decoupling capacitors as close as possible to the pin.
7 CP_OUT Charge-Pump Output. Connect to external loop filter input.
8 GND_CP Ground for Charge-Pump. Connect to board ground, not to the paddle.
9 GND_PLL Ground for PLL. Connect to main board ground plane, not to the paddle.
10 VCC_PLL Power Supply for PLL. Place decoupling capacitors as close as possible to the pin.
11 GND_RF Ground for RF Outputs. Connect to board ground plane, not to the paddle.
12 RFOUTA_P Open Collector Positive RF Output A. Connect to supply through RF choke or 50I load.
tLES tLEH
LE tCP
tLEW
tCL
CLK
tCH
tDS tDH
LE
tMH
CLK
1 29 30 31 32 33 34 35 36
MUX_OUT
tMS
For a clean clock at start up, after power on, follow this Read Sequence
sequence of programming: Register 0x06 can be read back through MUX_OUT.
• Register 5, Address 0X05. Wait 20ms The user must set MUX = 1100. To begin the read
sequence, set LE to logic-low, send 32 periods of CLK,
• Register 4, set bit 4 and 8 to 0 to keep RFOUT
and set LE to logic-high. While the CLK is running, the
disabled
DATA pin can be held at logic-high or logic-low for 29
• Register 3, Address 0X03 clocks, but the last 3 bits must be 110 to indicate regis-
• Register 2, Address 0X02 ter 6. Then finally, send 1 period of the clock. The MSB
• Register 1, Address 0X01 of register 0x06 appears on the falling edge of the next
clock and continues to shift out for the next 29 clock
• Register 0, Address 0X00
cycles (Figure 2). After the LSB of register 0x06 has
• Register 5, Address 0X05 been read, the user can reset MUX = 0000.
• Register 4, set bit 4 and 8 to 0 to keep RFOUT
Power Modes
disabled
The MAX2870 can be put into low-power mode by set-
• Register 3, Address 0X03 ting SHDN = 1 (register 2, bit 5) or by setting the CE pin
• Register 2, Address 0X02 to logic-low. In low-power mode, all blocks except SPI
• Register 1, Address 0X01 are off.
• Register 0, Address 0X00 After exiting low-power mode, allow at least 20ms for
external capacitors to charge to their final values before
To enable RFOUT, Register 4, Address 0X04, set bit 4
programming the final VCO frequency.
and 8 to 0.
Register programming order should be address 0x05, Reference Input
0x04, 0x03, 0x02, 0x01, and 0x00. Several bits are The reference input stage is configured as a CMOS
double-buffered to update the settings at the same time. inverter with shunt resistance from input to output. In
See the register descriptions for double-buffered settings. shutdown mode this input is set to high impedance to
prevent loading of the reference source.
The reference input signal path also includes optional x2
and ÷2 blocks. When the reference doubler is enabled
(DBR = 1), the maximum reference input frequency is lim-
ited to 100MHz. When the doubler is disabled, the refer-
ence input frequency is limited to 200MHz. The minimum
reference frequency is 10MHz. The minimum R counter
divide ratio is 1, and the maximum divide ratio is 1023.
MUX_OUT and Lock Detect 3/4th the total resistance. The larger resistor should be
MUX_OUT is a multipurpose test output for observing connected from SW to ground, and the smaller resistor
various internal functions of the MAX2870. MUX_OUT from SW to the loop filter capacitor. When CDM = 01
can also be configured as serial data output. Bits MUX (register 3, bits 16:15), fast-lock is active after the VAS
(register 2, bit 28:26) are used to select the desired has completed. During fast-lock, the charge pump is
MUX_OUT signal (see Table 6). increased to CP = 1111 and the shunt loop filter resis-
Lock detect can be monitored through the LD output by tance is set to 1/4th the total resistance by changing pin
setting the LD bits (register 5, bits 23:22). For digital lock SW from high impedance to ground. Fast-lock deacti-
detect, set LD = 01. The digital lock detect is dependent vates after a timeout set by the user. This timeout is loop
on the mode of the synthesizer. In frac-N mode set LDF = filter dependent, and is set by:
0, and in int-N mode set LDF = 1. To set the accuracy of tFAST-LOCK = M x CDIV/fPFD
the digital lock detect, see Table 1 and Table 2. where M is the modulus setting and CDIV is the clock
Analog lock detect can be set with LD = 10. In this mode, divider setting. The user must determine the CDIV setting
LD is an open-drain output and requires an external based on their loop filter time constant. The SW pin can
pullup resistor of typical value, 10KΩ. be left open/ no connect when fast lock mode is not used.
The lock detect output validity is dependent on many
factors. The lock detect output is not valid during the R3
VCO auto selection process. After the VCO auto selec- 7 CP_OUT
tion process has completed, the lock detect output is not C3 C2 C1
valid until the TUNE voltage has settled. TUNE voltage
MAX2870
settling time is dependent on loop filter bandwidth, and R2A
can be calculated using the EE-Sim Simulation tool found
at [Link]. 5 SW
R2B
Fast-Lock
The device uses a fast-lock mode to decrease lock time.
This mode requires that CP = 0000 (register 2, bits 12:9) 20 TUNE
and that the shunt resistive portion of the loop filter be
segmented into two parts, where one resistor (R2A) is
1/4th the total resistance, and the other resistor (R2B) is
Figure 4. Fast Lock Filter Topology
RFOUTA± and RFOUTB± BS = 1023. If fPFD is lower than 50kHz, then set BS = 1.
The device has dual differential open-collector RF out- The time needed to select the correct VCO is 10/fBS.
puts that require an external RF choke 50I resistor to The RETUNE (register 3, bit 24) bit is used to enable or
supply for each output. Each differential output can disable the VAS auto-retune function. Should the 3-bit
be independently enabled or disabled by setting bits TUNE ADC detect that the VCO control voltage (VTUNE)
RFA_EN (register 4, bit 5) and RFB_EN (register 4, bit 8). has drifted into the 000 or 111 state, the VAS will initiate
Both outputs are also controlled by applying a logic-high an auto-retune if RETUNE = 1. If RETUNE = 0, then this
(enabled) or logic-low (disabled) to pin RFOUT_EN. function is disabled.
The output power of each output can be individually If VAS_SHDN = 1, then the VCO can be manually
controlled with APWR (register 4, bits 4:3) for RFOUTA selected by bits VCO (register 3, bits 31:26). Refer to the
and BPWR (register 4, bits 7:6) for RFOUTB. The avail- Applications Information section for detailed implementation
able differential output power settings are from -4dBm of VCO manual selection.
to +5dBm, in 3dB steps with 50I pullup to supply. The
available single-ended output power ranges from -4dBm Phase Shift Mode
to +5dBm in 3dB steps with a RF choke to supply. Across After achieving lock, the phase of the MAX2870 device’s
the entire frequency range different pullup elements (L RF output can be changed in increments of P/M x 360N.
or R) are required for optimal output power. If the output The absolute phase cannot be determined, but it can be
is used single ended, the unused output should be termi- changed relative to the current phase.
nated in a corresponding load. To change the phase, do the following:
Voltage-Controlled Oscillator 1) Achieve lock at the desired frequency.
The fundamental VCO frequency of the device guarantees 2) Set the increment of phase relative to the current phase
gap-free coverage from 3.0GHz to 6.0GHz using four by setting P = M x {desired_phase_change}/360N.
individual VCO core blocks with 16 sub-bands within 3) Enable the phase change by setting CDM = 10.
each block. Connect the output of the loop filter to the
TUNE input. The TUNE input is used to control the VCO. 4) Reset CDM = 00.
The state machine clock, fBS, must be set to 50kHz. This 001 In-lock, 0.5V < VTUNE < 0.7V
is set by the BS bits. The formula for setting BS is: 010 In-lock, 0.7V < VTUNE < 1.3V
BS = fPFD/50kHz 011 Not used
where fPFD is the phase-detector frequency. The BS (regis- 100 Not used
ter 4, bits 19:12) value should be rounded to the nearest 101 In-lock, 1.3V < VTUNE < 2.1V
integer. If the calculated BS is higher than 1023, then set
110 In-lock, 2.1V < VTUNE < 2.5V
111 Out-of-lock, VTUNE > 2.5V
VCC_RF
GND_TUNE
NOISE_FILT
GND_VCO
BIAS_FILT
VCC_VCO
TUNE
RSET
REG
VCC_RF
24 23 22 21 20 19 18 17
LD VCC_RF
TO GPIO 25 16
RFOUT_EN RFOUTB_N
FROM GPIO 26 15
RFOUTB
GND_DIG RFOUTB_P
VCC_DIG 27 14
VCC_DIG RFOUTA_N
28 13
MAX2870 RFOUTA
REF_IN RFOUTA_P
29 12
MUX_OUT GND_RF
30 11
VCC_PLL
GND_SD VCC_PLL
31 EP 10
VCC_DIG
VDD_SD GND_PLL
32 9
VCC_RF
1 2 3 4 5 6 7 8
DATA
LE
CE
SW
VCC_CP
CP_OUT
GND_CP
CLK
VCC_PLL
R3
FROM
GPIO
C1 C2 C3
SPI
INTERFACE
R2A
Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
0 4/12 Initial release —
1 7/12 Updated Int, Frac, Mod and R Counter Relationship section; updated formula in 13, 15, 20
VCO Autoselect (VAS) State Machine section, updated Table 8
Updated Applications section, Note 3, Typical Operating Characteristics Testing
2 11/12 1, 4, 7, 12
Conditions Table, and Figure 1
Updated AC Electrical Characteristics table; updated SPI Characteristics, Pin
3 4/13 Description, Fast-Lock, and VCO Autoselect State Machine sections. Replaced 3, 4, 11, 12, 14
Figure 2
4 8/13 Updated Fast-Lock Section and Digital I/O Characteristics table 4, 14
Updated the Four-Wire Serial Interface, MUX_OUT and Lock Detect, Register and Bit
5 3/14 12–16, 21
Descriptions sections, and Table 9
6 4/17 Added VCO Manual Selection section and other general updates/corrections 1–3, 7–10, 12–24
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at [Link].
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2017 Maxim Integrated Products, Inc. │ 25